[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP2641268A4 - Polishing pad comprising transmissive region - Google Patents

Polishing pad comprising transmissive region Download PDF

Info

Publication number
EP2641268A4
EP2641268A4 EP11841143.8A EP11841143A EP2641268A4 EP 2641268 A4 EP2641268 A4 EP 2641268A4 EP 11841143 A EP11841143 A EP 11841143A EP 2641268 A4 EP2641268 A4 EP 2641268A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
transmissive region
transmissive
region
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11841143.8A
Other languages
German (de)
French (fr)
Other versions
EP2641268A2 (en
Inventor
Kelly Newell
Abaneshwar Prasad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP2641268A2 publication Critical patent/EP2641268A2/en
Publication of EP2641268A4 publication Critical patent/EP2641268A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP11841143.8A 2010-11-18 2011-11-18 Polishing pad comprising transmissive region Withdrawn EP2641268A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41501510P 2010-11-18 2010-11-18
PCT/US2011/061312 WO2012068428A2 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Publications (2)

Publication Number Publication Date
EP2641268A2 EP2641268A2 (en) 2013-09-25
EP2641268A4 true EP2641268A4 (en) 2017-01-25

Family

ID=46084662

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11841143.8A Withdrawn EP2641268A4 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Country Status (8)

Country Link
US (1) US20130237136A1 (en)
EP (1) EP2641268A4 (en)
JP (1) JP5918254B2 (en)
KR (1) KR101602544B1 (en)
CN (1) CN103222034B (en)
MY (1) MY166716A (en)
SG (1) SG190249A1 (en)
WO (1) WO2012068428A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
CN106853610B (en) 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 Polishing pad and its monitoring method and monitoring system
KR101829542B1 (en) * 2016-07-27 2018-02-23 신우유니온(주) Manufacturing method of buffer for nails
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11260495B2 (en) 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7317440B2 (en) * 2019-04-15 2023-07-31 株式会社ディスコ dressing tool
JP7220130B2 (en) * 2019-07-11 2023-02-09 株式会社クラレ Polishing pad and polishing pad manufacturing method
KR102593117B1 (en) * 2021-07-02 2023-10-24 에스케이엔펄스 주식회사 Polishing pad and preparing method of semiconductor device using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030129931A1 (en) * 2001-10-26 2003-07-10 Jsr Corporation Window member for chemical mechanical polishing and polishing pad
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6071177A (en) * 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6358130B1 (en) * 1999-09-29 2002-03-19 Rodel Holdings, Inc. Polishing pad
JP2001110762A (en) * 1999-10-04 2001-04-20 Asahi Kasei Corp Polishing pad
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP4131632B2 (en) * 2001-06-15 2008-08-13 株式会社荏原製作所 Polishing apparatus and polishing pad
KR100541545B1 (en) * 2003-06-16 2006-01-11 삼성전자주식회사 Polishing table of a chemical mechanical polishing apparatus
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
KR101324644B1 (en) * 2005-08-22 2013-11-01 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7210980B2 (en) * 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
US7601050B2 (en) * 2006-02-15 2009-10-13 Applied Materials, Inc. Polishing apparatus with grooved subpad
JP5110677B2 (en) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 Polishing pad
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP2008226911A (en) * 2007-03-08 2008-09-25 Jsr Corp Chemical and mechanical polishing pad, lamination pad for chemical mechanical polishing, and chemical and mechanical polishing method
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8662957B2 (en) * 2009-06-30 2014-03-04 Applied Materials, Inc. Leak proof pad for CMP endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US20030129931A1 (en) * 2001-10-26 2003-07-10 Jsr Corporation Window member for chemical mechanical polishing and polishing pad

Also Published As

Publication number Publication date
KR101602544B1 (en) 2016-03-10
MY166716A (en) 2018-07-18
US20130237136A1 (en) 2013-09-12
JP5918254B2 (en) 2016-05-18
SG190249A1 (en) 2013-06-28
WO2012068428A2 (en) 2012-05-24
CN103222034B (en) 2016-03-09
KR20130116892A (en) 2013-10-24
WO2012068428A3 (en) 2012-08-16
JP2013542863A (en) 2013-11-28
EP2641268A2 (en) 2013-09-25
CN103222034A (en) 2013-07-24

Similar Documents

Publication Publication Date Title
EP2641268A4 (en) Polishing pad comprising transmissive region
EP2619645B8 (en) User interface
IL220649A0 (en) Cmp pad with local area transparency
SG11201400614RA (en) Polishing pad
GB201006323D0 (en) Leakage-reducing dressing
EP2679342A4 (en) Polishing composition
EP2607019A4 (en) Polishing pad for a polishing system
ZA201204089B (en) Spice grinder
EP2628567A4 (en) Polishing composition
EP2613748A4 (en) Cooling medical pad
EP2645915A4 (en) Spice grinders
EP2585254A4 (en) Nonwoven abrasive wheel
GB201010306D0 (en) Grinding aid
EP2613344A4 (en) Polishing composition
TWI561578B (en) Creep-resistant polishing pad window
SG11201400637XA (en) Polishing pad
EP2732917A4 (en) Polishing pad
EP2517669A4 (en) Grinding chip
EP2570061A4 (en) Disposable grinder
EP2611572A4 (en) Flexibly carried grinding disc
PL2347894T3 (en) Pressure pad
TWM387728U (en) Adsorption type knife grinder
GB0918663D0 (en) Sanding disk applicator
SI2454978T1 (en) Spice grinder
AU2010902908A0 (en) Hygepad - Hygienic Positioning Pad

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130515

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20161222

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 37/20 20120101AFI20161216BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170601