JP2013129063A - Mask cleaning method in screen printing machine, and screen printing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask cleaning method in a screen printing machine that prevents paste on a mask cleaner side from entering a non-cleaning region set as a region where a lower surface of a mask is not cleaned, and to provide the screen printing machine.SOLUTION: In a region setting step of setting a cleaning region S1 where the lower surface of the mask 15 in contact with an upper surface of a substrate 2 is cleaned and the non-cleaning region S2 where the lower surface is not cleaned, if the non-cleaning region S2 is set, a mask cleaner 18 is moved in a direction getting away from the non-cleaning region S2 and thereby the cleaning region S1 is cleaned.

Description

  The present invention relates to a mask cleaning method and a screen printer in a screen printer that prints a paste such as solder on a substrate by sliding a squeegee on the mask.

  A screen printing machine is a device that prints a paste such as solder on electrodes on a substrate held by a substrate holder, and the electrodes and pattern holes match a mask in which pattern holes are formed according to the arrangement of electrodes on the substrate. After the contact with the substrate, the squeegee is slid on the mask supplied with the paste to scrape the paste, and the paste is transferred to the electrode of the substrate through the pattern hole of the mask.

  In such a screen printing machine, when the screen printing operation on the substrate proceeds, the printing state may be deteriorated due to the influence of the paste attached to the lower surface of the mask, so the cleaning surface is brought into contact with the lower surface of the mask. A mask cleaner is provided that moves the paper member relative to the mask and wipes off the paste adhered to the lower surface of the mask to remove (clean) it.

  In mask cleaning using such a mask cleaner, there may be a case where an area for cleaning the lower surface of the mask (cleaning area) and an area for no cleaning (non-cleaning area) are set. Is set, only the cleaning area is cleaned by the mask cleaner (for example, Patent Document 1).

  As described above, the area set as the non-cleaning area in the mask cleaning is the area where the paste is not printed, and when the area is cleaned, the paste adhered to the cleaning surface of the mask cleaner is rubbed. On the other hand, it is a region where inconvenience occurs (for example, a region where gold pads are dispersedly disposed), and care must be taken so that paste does not adhere to the non-cleaning region during cleaning.

JP-A-11-165402

  However, conventionally, when cleaning the cleaning area, when the mask cleaner is moved to the end of the non-cleaning area, the paste adhering to the cleaning surface of the mask cleaner may enter the non-cleaning area. There is a problem that printing defects may occur due to this.

  Therefore, the present invention provides a mask cleaning method and a screen printer in a screen printer that do not allow the paste on the mask cleaner side to enter a non-cleaning region set as a region where the lower surface of the mask is not cleaned. Objective.

  The mask cleaning method according to claim 1, a mask that is in contact with the upper surface of the substrate, a squeegee that slides on the mask that is in contact with the upper surface of the substrate and transfers the paste supplied on the mask to the substrate, A mask cleaning method in a screen printing machine, comprising: a mask cleaner that cleans paste adhered to the lower surface of the mask by moving the cleaning surface relative to the mask in a state where the cleaning surface is in contact with the lower surface of the mask. An area setting process for setting a cleaning area for cleaning the lower surface and a non-cleaning area for which cleaning is not performed, and when a non-cleaning area is set in the area setting process, the mask cleaner is moved in a direction away from the non-cleaning area. Cleaning to clean the cleaning area And a line process.

  The mask cleaning method according to claim 2 is the mask cleaning method of the screen printing machine according to claim 1, wherein the non-cleaning region is set to a region where a pattern hole corresponding to the electrode on the substrate is not formed. Is done.

  The screen printing machine according to claim 3, a mask that is in contact with the upper surface of the substrate, a squeegee that slides on the mask that is in contact with the upper surface of the substrate and transfers the paste supplied on the mask to the substrate, A mask cleaner that cleans the paste adhered to the lower surface of the mask by moving the cleaning surface relative to the mask in contact with the lower surface of the mask, a cleaning area that cleans the lower surface of the mask, and no cleaning An area setting means for setting a cleaning area and a cleaning execution means for cleaning the cleaning area by moving the mask cleaner away from the non-cleaning area when the non-cleaning area is set by the area setting means. .

  A screen printer according to a fourth aspect is the screen printer according to the third aspect, wherein the non-cleaning region is set to a region where a pattern hole corresponding to the electrode on the substrate is not formed.

  In the present invention, when a non-cleaning area is set as an area where the lower surface of the mask is not cleaned, the cleaning area is cleaned by moving the mask cleaner away from the non-cleaning area. The paste does not enter the non-cleaning area from the cleaning surface of the cleaner, and the occurrence of printing defects can be prevented.

The perspective view of the principal part of the screen printer in one embodiment of this invention The side view of the principal part of the screen printer in one embodiment of this invention The top view of the mask hold | maintained at the mask holder with which the screen printing machine in one embodiment of this invention is equipped, and a mask holder The flowchart which shows the execution procedure of the screen printing operation by the screen printer in one embodiment of this invention (A) (b) Explanatory drawing of the execution procedure of the screen printing work by the screen printer in one embodiment of this invention (A) (b) Explanatory drawing of the execution procedure of the screen printing work by the screen printer in one embodiment of this invention (A) (b) Explanatory drawing of the execution procedure of the screen printing work by the screen printer in one embodiment of this invention (A)-(e) The figure which shows the execution procedure of the mask cleaning in the screen printer in one embodiment of this invention (A)-(e) The figure which shows the execution procedure of the mask cleaning in the screen printer in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. 1 and 2, a screen printing machine 1 is a device that performs a screen printing operation in which a paste Pt such as solder is screen printed on each of a large number of electrodes 3 provided on a substrate 2. The substrate carry-in conveyor 11, the substrate holding unit 12 and the substrate carry-out conveyor 13, the mask holder 14 provided above the substrate holding unit 12, the mask 15 held in a horizontal posture by the mask holder 14, and above the mask 15 A squeegee head 16 provided on the camera 15, a camera unit 17 and a mask cleaner 18 provided below the mask 15, and a control device 19 provided in the base 10 for controlling the operation of each part.

  The substrate carry-in conveyor 11 carries the substrate 2 loaded from the outside of the screen printing machine 1 (arrow R1 shown in FIG. 1) and delivers it to the substrate holding unit 12. The substrate carry-out conveyor 13 carries the substrate 2 received from the substrate holding unit 12 out of the screen printer 1 (arrow R2 shown in FIG. 1). That is, the board | substrate 2 is conveyed in order of the board | substrate carrying-in conveyor 11, the board | substrate holding unit 12, and the board | substrate carrying-out conveyor 13, and let the moving direction of this board | substrate 2 be the X-axis direction (left-right direction seeing from operator OP). Further, the horizontal plane direction orthogonal to the X-axis direction is defined as the Y-axis direction (front-rear direction as viewed from the operator OP), and the vertical direction is defined as the Z-axis direction.

  The substrate holding unit 12 is attached to the unit base 21 and the unit base 21 which can be moved (including rotation) in the XY plane and moved in the Z-axis direction by a unit moving mechanism 12A composed of an XYZ robot. A pair of conveyors 22 for carrying in the X-axis direction and positioning to a predetermined work position (the position shown in FIG. 1), a lower part lift cylinder 23 provided on the unit base 21, and a lower receiver lift cylinder 23. The substrate 2 positioned at the working position by the conveyor 22 is lifted and supported from below so that both ends of the substrate 2 are spaced upward from the conveyor 22 and provided so as to be openable and closable in the Y-axis direction. A pair of clamps for holding (clamping) both sides of the substrate 2 lifted and supported by the portion 24 from the Y-axis direction It is equipped with a wood 25.

  In FIG. 3, a mask 15 is a mask body 15a made of a rectangular metal plate having a large number of pattern holes 15h provided corresponding to the arrangement of the electrodes 3 on the substrate 2, and a resin provided around the mask body 15a. It consists of a mesh-shaped film member 15b made of (for example, polyester) and a rectangular frame-shaped mask frame 15w that supports the outer periphery of the film member 15b.

  In FIG. 3, the mask holder 14 is composed of a pair of left and right rail members 14a having an L-shaped cross section extending above the base 10 in the Y-axis direction, and the mask 15 is moved in the X-axis direction by the pair of left and right rail members 14a. Opposite left and right sides are supported from below.

  1 and 2, a squeegee head 16 is attached to a plate-like base member 41 and a base member 41 which are provided so as to be movable in the Y-axis direction in an upper region of a mask 15 held by a mask holder 14. Two squeegee lifting cylinders 42 with rods 42a projecting below the base member 41, squeegee holders 43 attached to the lower ends of the piston rods 42a of the squeegee lifting cylinders 42 and extending in the X-axis direction, and squeegee holders 43 Are provided with two squeegees 44 each made of a thin plate member having an upper end held and extending obliquely downward.

  1 and 2, the camera unit 17 includes a lower imaging camera 17a having an imaging field of view directed downward and an upper imaging camera 17b having an imaging field of view directed upward. The camera unit 17 is moved in the horizontal plane in the area below the mask 15 by a camera unit moving mechanism 17A including an actuator (not shown).

  1 and 2, the mask cleaner 18 extends in the X-axis direction as a whole, and is provided so as to be movable in one direction (Y-axis direction) and up-down direction (Z-axis direction) in a horizontal plane parallel to the mask 15. The paper member 32 is stretched over the upper end portion of the nozzle portion 31 made of a cylindrical member having a rectangular cross section in plan view. The portion of the paper member 32 that spans the upper end of the nozzle portion 31 is in contact with the lower surface of the mask 15 (mask main body 15a) to form a cleaning surface 18a that wipes off the remaining residue of the paste Pt that has adhered to the lower surface of the mask 15. Yes.

  The mask cleaner 18 wipes the paste Pt adhering to the lower surface of the mask 15 by moving in the Y-axis direction with the paper member 32 being pressed against the lower surface of the mask 15 by the upper end portion of the nozzle portion 31. The cleaning surface 18 a of the paper member 32 can be updated by winding the paper member 32 with a pair of roller members 33.

  In FIG. 2, an air suction pipe (not shown) is provided in the nozzle portion 31, and the paste Pt by the paper member 32 is obtained by sucking air into the air suction pipe through the cleaning surface 18 a of the paper member 32. Can be efficiently wiped off.

  The substrate holding unit 12 conveys the substrate 2 by the conveyor 22 and positions the substrate 2 at the work position. The substrate receiving unit 24 is positioned at the work position by the lower receiving portion 24 and the clamp member 25 is clamped by the control device 19. 2 is performed by controlling the operation of the substrate holding mechanism 12B (FIG. 2) including an actuator including the lower receiving part raising / lowering cylinder 23, and the movement operation in the horizontal plane direction and the vertical direction of the substrate holding unit 12 holding the substrate 2 is performed. The control device 19 performs the operation control of the unit moving mechanism 12A described above. Further, the control device 19 also performs the operation of carrying in the substrate 2 by the substrate carry-in conveyor 11 and the operation of carrying out the substrate 2 by the substrate carry-out conveyor 13.

  In FIG. 2, the reciprocating movement of the squeegee head 16 (base member 41) in the Y-axis direction is performed when the control device 19 controls the operation of a squeegee head moving mechanism 16M (FIG. 2) including an actuator (not shown). The raising / lowering operation of each squeegee 44 with respect to the base member 41 is performed by the control device 19 performing the operation control of the squeegee raising / lowering cylinder 42 corresponding to the squeegee 44 to move the squeegee holder 43 up and down.

  In FIG. 2, the movement operation of the camera unit 17 in the horizontal plane is performed by the control device 19 controlling the operation of the camera unit movement mechanism 17A. Control of the imaging operation by the lower imaging camera 17a and the imaging operation by the upper imaging camera 17b are respectively performed by the control device 19, and obtained by the image data obtained by the imaging operation of the lower imaging camera 17a and the imaging operation of the upper imaging camera 17b. The received image data is transmitted to the control device 19 and subjected to image recognition processing in the image recognition unit 19a of the control device 19.

  The mask cleaner 18 is moved in the horizontal plane and moved up and down by the control device 19 by controlling the operation of a cleaner moving mechanism 18A including an actuator (not shown). In addition, the winding operation of the paper member 32 provided in the mask cleaner 18 and the suction operation of the paste Pt through the paper member 32 are performed by a cleaning operation mechanism 19b (FIG. 2) of the controller 19 including an actuator (not shown). This is done by performing the operation control of 18B (FIG. 2).

  When the screen printing machine 1 having such a configuration performs a screen printing operation, the control device 19 first detects that the substrate 2 has been sent from another device on the upstream process side and the substrate carry-in conveyor 11. After the conveyor 22 of the substrate holding unit 12 is operated and the substrate 2 is carried into the screen printing machine 1 (step ST1 shown in FIG. 4; FIG. 5A), the substrate holding mechanism 12B is controlled to operate. 2 is held (step ST2 shown in FIG. 4; FIG. 5B). Specifically, the holding of the substrate 2 is performed by pushing up the lower receiving portion 24 by the lower receiving portion lifting cylinder 23 and lifting the substrate 2 from the conveyor 22 (arrow A1 shown in FIG. 5B), This is done by driving the pair of clamp members 25 in the closing direction and sandwiching both ends of the substrate 2 (arrow B1 shown in FIG. 5B).

  When holding the substrate 2, the control device 19 controls the operation of the camera unit moving mechanism 17A, and positions the lower imaging camera 17a directly above the substrate-side mark 2m (FIG. 1) provided on the substrate 2, thereby lowering the imaging camera 17a. The upper imaging camera 17b is positioned immediately below the mask side mark 15m (FIGS. 1 and 3) provided on the mask 15, and the upper imaging camera 17b is moved to the mask side mark 15m. Make an image. And while grasping | ascertaining the position of the board | substrate 2 from the image data of the obtained board | substrate side mark 2m, the position of the mask 15 is grasped | ascertained from the image data of the obtained mask side mark 15m, and the board | substrate holding | maintenance unit 12 is made into a horizontal surface inward direction. The substrate side mark 2m and the mask side mark 15m are vertically moved so as to align the substrate 2 with respect to the mask 15 in the horizontal plane direction (step ST3 shown in FIG. 4).

  When the alignment of the substrate 2 with respect to the mask 15 is completed, the control device 19 controls the operation of the unit moving mechanism 12A to raise the substrate holding unit 12 with respect to the base 10 (arrows shown in FIG. 6A). C1) By making the pair of clamp members 25 holding the substrate 2 relatively pressed against the lower surface of the mask 15 from below, the upper surfaces of the pair of clamp members 25 and the substrate 2 are made lower surfaces of the mask 15. Contact is made (step ST4 shown in FIG. 4; FIG. 6A). As a result, the electrode 3 on the substrate 2 and the pattern hole 15h of the mask 15 are brought into alignment.

  When the control device 19 brings the substrate 2 into contact with the mask 15, the control device 19 displays a message for prompting the operator OP to supply the paste Pt on the display device DP (FIG. 2) connected to the control device 19 (step ST5 shown in FIG. 4). In response to this display, the operator OP looks at the paste Pt remaining on the mask 15 at the present time, and determines whether or not to supply (supplement) the paste Pt based on the amount of the paste Pt. When it is determined that the paste Pt should be supplied, the paste Pt is supplied onto the mask 15 by a separately provided paste supply syringe (not shown). When the operator OP determines that the supply of the paste Pt is finished or that the supply of the paste Pt is unnecessary, the operator OP operates the operation restart button BT (FIG. 2) connected to the control device 19.

  The control device 19 displays a message for prompting the supply of the paste Pt on the display device DP, and then determines whether or not the operation restart button BT has been operated at regular intervals (step ST6 shown in FIG. 4). When it is detected that the operation OP is operated by the operator OP based on the signal output from the restart button BT, squeegee 44 performs squeegeeing to transfer the paste Pt on the mask 15 to the substrate 2 ( Step ST7 shown in FIG.

  Specifically, this squeezing moves one of the two squeegees 44 down from the squeegee head 16 and moves the base member 41 in the Y-axis direction while maintaining the state in contact with the upper surface of the mask 15. (Arrow D shown in FIG. 6B). As a result, the squeegee 44 slides on the mask 15, and the paste Pt on the mask 15 is scraped by the squeegee 44, pushed into the pattern holes 15 h of the mask 15, and transferred onto the electrodes 3 of the substrate 2. When squeezing by moving the squeegee head 16 from the front to the rear, the control device 19 abuts the squeegee 44 on the rear side on the mask 15 and moves the squeegee head 16 from the rear to the front. When performing, the front squeegee 44 is brought into contact with the mask 15.

  After squeezing and transferring the paste Pt to the substrate 2, the control device 19 operates the unit moving mechanism 12A to lower the substrate holding unit 12 (arrow C2 shown in FIG. 7A), and the mask 15 The substrate 2 and the pair of clamp members 25 are separated from each other to release the plate (step ST8 shown in FIG. 4; FIG. 7A). As a result, the paste Pt remains on the electrode 3 of the substrate 2, and the paste Pt is printed on the substrate 2.

  When the plate separation is completed, the control device 19 releases the holding of the substrate 2 by the substrate holding unit 12 (step ST9 shown in FIG. 4; FIG. 7B). Specifically, the holding of the substrate 2 is released after the control device 19 operates the substrate holding mechanism 12B to open the pair of clamp members 25 (arrow B2 shown in FIG. 7B). The lower receiving portion 24 is lowered (arrow A2 shown in FIG. 7B), and both ends of the substrate 2 are lowered onto the pair of conveyors 22.

  After releasing the holding of the substrate 2, the control device 19 operates the unit moving mechanism 12 </ b> A to move the substrate holding unit 12 in the horizontal plane, aligns the direction of the conveyor 22, and operates the conveyor 22 and the substrate carry-out conveyor 13. Then, the substrate 2 is carried out of the screen printer 1 (step ST10 shown in FIG. 4).

  After carrying out the substrate 2, the control device 19 determines whether there is another substrate 2 on which screen printing is to be performed (step ST11 shown in FIG. 4). As a result, if there is another substrate 2 to be screen-printed, the process returns to step ST1 to carry in a new substrate 2, and if there is no other substrate 2 to be screen-printed, a series of screen printing operations. Exit.

  The screen printing machine 1 performs a screen printing operation for each substrate 2 according to the above procedure. When such a screen printing operation is performed on several to a dozen (or several tens) substrates 2, There is a possibility that the printing state becomes poor due to the paste Pt (the remaining residue of the paste Pt) adhering to the lower surface of the mask 15. For this reason, in the screen printing machine 1 in the present embodiment, the cleaning work of the mask 15 using the mask cleaner 18 is periodically performed, which will be described below with reference to FIGS. 8 and 9. Give an explanation.

  When cleaning the mask 15 (mask body 15a) using the mask cleaner 18, the control device 19 first cleans each mask 15 stored in the storage unit 19c (FIG. 2) by prior input from the operator OP. In the area setting unit 19d (FIG. 2), the related information is obtained, and the area where the lower surface of the mask 15 is cleaned (cleaning area S1, see also FIG. 3) and the area where no cleaning is performed (non-cleaning area S2, also FIG. 3). Reference) is set (area setting step).

  These cleaning area S1 and non-cleaning area S2 are set as band-like areas extending in a direction (X-axis direction) orthogonal to the Y-axis direction, which is the moving direction of the squeegee head 16, as shown in FIG. Here, the first cleaning area S11 which is the first cleaning area S1, the non-cleaning area S2, and the second cleaning area S12 which is the second cleaning area S1 are arranged in this order from the rear side of the mask 15 in the Y-axis direction. It has become a lineup.

  The non-cleaning region S2 is, for example, when the pattern hole 15h corresponding to the electrode 3 on the substrate 2 is not formed and the region where the paste Pt is not originally printed is cleaned. Is set in a region where the paste Pt adhering to the cleaning surface 18a of the mask cleaner 18 is rubbed to cause a problem (for example, a region where gold pads are dispersedly arranged).

  The cleaning execution unit 19b of the control device 19 controls the operation of the cleaner moving mechanism 18A and the cleaner operating mechanism 18B when the region setting unit 19d sets the region for cleaning the lower surface of the mask 15 and the region for not performing the cleaning. Then, the following cleaning execution process is performed.

  In the cleaning execution step, the cleaning execution unit 19b of the control device 19 is provided at both ends of the first cleaning region S11 before and after (in the Y-axis direction) the mask cleaner 18 is set by the region setting unit 19d (in the region setting step). Among them, it is positioned directly below the front end, which is the end on the non-cleaning region S2 side (arrow W1 shown in FIG. 8A), and the mask cleaner 18 is raised from there (in FIG. 8A). Arrow W2), the cleaning surface 18a of the mask cleaner 18 is brought into contact with the lower surface of the mask 15 (FIG. 8A). The position before the mask cleaner 18 is raised (the position at the end of the arrow W1) is set so that the cleaning surface 18a of the mask cleaner 18 does not reach the non-cleaning region S2 when the mask cleaner 18 is raised. 19 is adjusted by the cleaning execution unit 19b.

  When the cleaning execution part 19b of the control device 19 brings the cleaning surface 18a of the mask cleaner 18 into contact with the lower surface of the mask 15, it controls the operation of the cleaner moving mechanism 18A to move the mask cleaner 18 away from the non-cleaning region S2. It is moved (from the inside of the mask 15 to the outside of the mask 15), and the remaining residue of the paste Pt adhering to the lower surface of the mask 15 is wiped off by the cleaning surface 18a (paper member 32) of the mask cleaner 18 (FIG. 8B ) The arrow W3) shown in the middle, and the first cleaning region S11 is cleaned. When the cleaning surface 18a of the mask cleaner 18 reaches the end of the first cleaning region S11 (the end opposite to the non-cleaning region S2 and the rear end), the first cleaning region S11 is reached. The cleaning is finished (FIG. 8B).

  Here, when the remaining surface of the paste Pt adhering to the lower surface of the mask 15 is wiped off by the cleaning surface 18 a of the mask cleaner 18, the cleaning execution unit 19 b of the control device 19 opens the air suction pipe in the nozzle unit 31. The air is sucked through (the same applies to the subsequent cleaning operation).

  When the cleaning of the first cleaning region S11 is completed, the cleaning execution unit 19b of the control device 19 lowers the mask cleaner 18 to separate the cleaning surface 18a from the lower surface of the mask 15 (in FIG. 8C). Arrow W4), and the mask cleaner 18 is positioned directly below the rear end, which is the end on the non-cleaning region S2 side, of the front and rear ends of the second cleaning region S12 (in FIG. 8C). Arrow W5). Then, the mask cleaner 18 is raised (arrow W6 shown in FIG. 8C), and the cleaning surface 18a of the mask cleaner 18 is brought into contact with the lower surface of the mask 15 (FIG. 8C). The position before the mask cleaner 18 is raised (the position at the end of the arrow W5) is set so that the cleaning surface 18a of the mask cleaner 18 does not enter the non-cleaning region S2 when the mask cleaner 18 is raised. 19 is adjusted by the cleaning execution unit 19b.

  When the cleaning surface 19a of the mask cleaner 18 contacts the lower surface of the mask 15, the cleaning execution unit 19b of the control device 19 moves the mask cleaner 18 away from the non-cleaning region S2 (from the inside of the mask 15 to the outside of the mask 15). ) The remaining surface of the paste Pt adhering to the lower surface of the mask 15 is wiped off by the cleaning surface 18a (paper member 32) of the mask cleaner 18 (arrow W7 shown in FIG. 8D), and the second The cleaning area S12 is cleaned. When the cleaning surface 18a of the mask cleaner 18 reaches the end of the second cleaning region S12 (the end opposite to the non-cleaning region S2 and the front end), the second cleaning region S12 is reached. Is finished (FIG. 8D), the mask cleaner 18 is separated from the mask 15 (arrow W8 shown in FIG. 8E), and the cleaning execution process for one mask 15 is finished (FIG. 8D). FIG. 8 (e)).

  After the cleaning execution process for one mask 15 is completed in this way, when it is time to execute the next mask cleaning, the mask cleaner 18 is moved along a route that is symmetrical with respect to the above-described procedure. The mask cleaning is executed in the order of the second cleaning area S12 and the first cleaning area S11 (FIGS. 9 (a), (b), (c), (d), (d), (e) and these drawings. (See arrows W11-W18 shown in the inside)

  In such a mask cleaning, the cleaning execution unit 19b of the control device 19 operates the pair of roller members 33 when the amount of the paste Pt sticking to the cleaning surface 18a of the mask cleaner 18 increases, so that the paper member 32 is wound up and the cleaning surface 18a is updated.

  As described above, the screen printer 1 according to the present embodiment is supplied onto the mask 15 by sliding on the mask 15 in contact with the upper surface of the substrate 2 and the mask 15 in contact with the upper surface of the substrate 2. The squeegee 44 for transferring the paste Pt to the substrate 2 and the mask cleaner for cleaning the paste Pt adhering to the lower surface of the mask 15 by moving relative to the mask 15 with the cleaning surface 18a in contact with the lower surface of the mask 15 18. The non-cleaning area S2 is set by the area setting means (area setting section 19d of the control device 19) and the area setting means for setting the cleaning area S1 for cleaning the lower surface of the mask 15 and the non-cleaning area S2 for which cleaning is not performed. The mask cleaner 18 in a direction away from the non-cleaning region S2. Has become one with the cleaning execution means the moved by cleaning the cleaning area S1 (cleaning executing section 19b of the controller 19).

  Further, the mask cleaning method in the screen printer 1 according to the present embodiment is a non-cleaning region setting step for setting the cleaning region S1 for cleaning the lower surface of the mask 15 and the non-cleaning region S2 for performing no cleaning. When the cleaning area S2 is set, a cleaning execution step is performed in which the mask cleaner 18 is moved in a direction away from the non-cleaning area S2 to clean the cleaning area S1.

  In the screen printing machine 1 and the mask cleaning method in the screen printing machine 1 according to the present embodiment, when the non-cleaning area S2 is set as an area where the lower surface of the mask 15 is not cleaned, it moves away from the non-cleaning area S2. Since the cleaning of the cleaning area S1 is performed by moving the mask cleaner 18, the paste Pt does not enter the non-cleaning area S2 from the cleaning surface 18a of the mask cleaner 18 and the occurrence of printing defects occurs. Can be prevented.

  In the above example, one non-cleaning region S2 is positioned between two cleaning regions S1 (first cleaning region S11 and second cleaning region S12). Is set as a band-like region extending in the direction (X-axis direction) orthogonal to the Y-axis direction, which is the moving direction of the squeegee head 16, the position and number thereof are arbitrary. When cleaning one cleaning region S1 located between two non-cleaning regions S2, from both ends of each cleaning region S1 toward the center of the cleaning region S1 (that is, in a direction away from the non-cleaning region S2). If cleaning is performed by moving the mask cleaner 18, the cleaning region S 1 can be cleaned without causing the paste Pt adhering to the mask cleaner 18 to enter any of the two non-cleaning regions S 2.

  Provided are a mask cleaning method and a screen printer in a screen printer that do not allow a paste on the mask cleaner side to enter a non-cleaning region set as a region where the lower surface of the mask is not cleaned.

DESCRIPTION OF SYMBOLS 1 Screen printer 2 Board | substrate 3 Electrode 15 Mask 15h Pattern hole 18 Mask cleaner 18a Cleaning surface 19b Cleaning execution part (cleaning execution means)
19d area setting section (area setting means)
44 Squeegee Pt Paste S1 Cleaning area S2 Non-cleaning area

Claims (4)

A mask in contact with the upper surface of the substrate, a squeegee that slides on the mask in contact with the upper surface of the substrate and transfers the paste supplied on the mask to the substrate, and a state in which the cleaning surface is in contact with the lower surface of the mask And a mask cleaning method in a screen printing machine provided with a mask cleaner that cleans the paste adhered to the lower surface of the mask by moving relative to the mask.
A region setting step for setting a cleaning region for cleaning the lower surface of the mask and a non-cleaning region for which cleaning is not performed;
And a cleaning execution step of cleaning the cleaning region by moving the mask cleaner away from the non-cleaning region when the non-cleaning region is set in the region setting step. Method.   2. The mask cleaning method for a screen printing machine according to claim 1, wherein the non-cleaning area is set to an area where a pattern hole corresponding to the electrode on the substrate is not formed. A mask in contact with the upper surface of the substrate;
A squeegee that slides on the mask in contact with the upper surface of the substrate and transfers the paste supplied on the mask to the substrate;
A mask cleaner that cleans the paste adhered to the lower surface of the mask by moving relative to the mask with the cleaning surface in contact with the lower surface of the mask;
A region setting means for setting a cleaning region for cleaning the lower surface of the mask and a non-cleaning region for which cleaning is not performed;
A screen printing machine comprising: a cleaning execution unit configured to move a mask cleaner in a direction away from the non-cleaning area and clean the cleaning area when the non-cleaning area is set by the area setting unit.   4. The screen printing machine according to claim 3, wherein the non-cleaning area is set in an area where a pattern hole corresponding to the electrode on the substrate is not formed.

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