JP2011180618A - 反射部材、反射部材の製造方法、発光装置、照明装置 - Google Patents
反射部材、反射部材の製造方法、発光装置、照明装置 Download PDFInfo
- Publication number
- JP2011180618A JP2011180618A JP2011130584A JP2011130584A JP2011180618A JP 2011180618 A JP2011180618 A JP 2011180618A JP 2011130584 A JP2011130584 A JP 2011130584A JP 2011130584 A JP2011130584 A JP 2011130584A JP 2011180618 A JP2011180618 A JP 2011180618A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- inorganic particles
- inorganic
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000010954 inorganic particle Substances 0.000 claims abstract description 81
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 19
- 239000011147 inorganic material Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 35
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 19
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 11
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 7
- 239000012780 transparent material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 2
- 238000001354 calcination Methods 0.000 claims 1
- 238000005137 deposition process Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 10
- 238000005286 illumination Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 86
- 229920005989 resin Polymers 0.000 description 34
- 239000011347 resin Substances 0.000 description 34
- 239000004020 conductor Substances 0.000 description 20
- 238000005259 measurement Methods 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 230000031700 light absorption Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- -1 gallium nitride compound Chemical class 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000007088 Archimedes method Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920000995 Spectralon Polymers 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 235000012255 calcium oxide Nutrition 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000011366 tin-based material Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000005068 transpiration Effects 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- 229910015365 Au—Si Inorganic materials 0.000 description 1
- 241001417501 Lobotidae Species 0.000 description 1
- 229910003023 Mg-Al Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
- G02B5/0221—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having an irregular structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/0236—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
- G02B5/0247—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element by means of voids or pores
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0284—Diffusing elements; Afocal elements characterized by the use used in reflection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/107—Porous materials, e.g. for reducing the refractive index
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249956—Void-containing component is inorganic
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Elements Other Than Lenses (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Abstract
光などの波成分を効率よく反射させることができ、かつ反射特性の劣化が抑制された反射部材、それを用いた発光装置および照明装置を提供する。
【解決手段】
本発明は、反射部材(7)に関するものである。この反射部材(7)は、無機材料によ
り多孔質に形成された反射層61(7)を有している。反射層61(7)は、気孔率が1
5〜43%となるように形成するのが好ましい。このような反射層61(7)は、複数の
無機粒子をそれらの一部において一体化させることにより形成されている。
【選択図】 図4
Description
反射部材においては、まず無機粒子としてアルミナ粒子、ジルコニア粒子、イットリア粒子、チタニア粒子を準備し、それぞれの無機粒子を、カルシア粒子、シリカ粒子およびマグネシア粒子と、重量比で9.2:0.2:0.5:0.1の割合で秤量・混合し、混合物を調製した。
反射率は、分光測色計(ミノルタ製CM−3700D)により測定した。得られたサンプルにキセノンランプの光を入射してサンプル表面で反射させ、その反射光の強度を測定し入射光と反射光の強度比を反射率とした。なお、測定波長は、400nmまたは600nmとした。
95%以上とすることにより、光出力の高い優れたものになることがわかった。
2 発光装置
4 (発光装置の)発光素子
6 第1反射部材
61 (第1反射部材の)反射層
64 (第1反射部材の)孔
7 第2反射部材
70 (第2反射部材の)孔
Claims (22)
- 無機材料により多孔質に形成された反射層を有しており、
前記反射層は、複数の無機粒子を互いに一部分で一体化させて前記複数の無機粒子の間に空隙を設けることにより、抗折強度が1〜300MPaの多孔質に形成されている、反射部材。 - 前記空隙は、気体により、または前記無機粒子よりも屈折率の低い透明材料により満たされている、請求項1に記載の反射部材。
- 前記複数の無機粒子は、仮焼成することにより互いに一部分で一体化されている、請求項1に記載の反射部材。
- 前記無機粒子は、アルミナ、イットリア、ジルコニアおよびチタニアからなる選択される少なくとも一種を含んでいる、請求項1に記載の反射部材。
- 無機材料により多孔質に形成された、抗折強度が1〜300MPaの反射層を有する反射部材の製造方法であって、
複数の無機粒子を含む無機粒子層または無機粒子成型体を形成する工程と、
仮焼成することにより、前記無機粒子層または無機粒子成型体を多孔質化する工程と、
を含んでいる、反射部材の製造方法。 - 無機材料により多孔質に形成された、抗折強度が1〜300MPaの反射層を有する反射部材の製造方法であって、
複数の無機粒子およびバインダを含む被着材料を、基材の表面に吹き付けて前記基材の表面に多孔質層を形成する被着工程と、
前記多孔質層における複数の無機粒子を、仮焼成することにより互いに一部分で一体化する加熱工程とを含んでいる、反射部材の製造方法。 - 前記加熱工程には、前記バインダを除去する工程を含んでいる、請求項6に記載の反射部材の製造方法。
- 1または複数の発光要素と、前記発光要素から出射された光を反射させるための反射部材と、を備えた発光装置であって、
前記反射部材は、無機材料により多孔質に形成され、複数の無機粒子を互いに一部分で一体化させて前記複数の無機粒子の間に空隙を設けることにより抗折強度が1〜300MPaの多孔質に形成されている、発光装置。 - 前記空隙は、気体により、または前記無機粒子よりも屈折率の低い透明材料により満たされている、請求項8に記載の発光装置。
- 前記複数の無機粒子は、仮焼成することにより互いに一部分で一体化されている、請求項8に記載の発光装置。
- 前記無機粒子は、アルミナ、イットリア、ジルコニアおよびチタニアからなる選択される少なくとも一種を含んでいる、請求項8に記載の発光装置。
- 前記発光要素のピーク波長に対する前記反射部材の反射率が95%以上である、請求項8に記載の発光装置。
- 前記発光要素は、LEDチップまたはLDチップである、請求項8に記載の発光装置。
- 前記発光要素は、紫外光、近紫外光、または青色光を出射するように構成されている、請求項8に記載の発光装置。
- 前記反射部材は、全体が多孔質に構成された基体または枠体のうち少なくとも一方である、請求項8に記載の発光装置。
- 1または複数の発光装置を備えた照明装置であって、
前記発光装置として、1または複数の発光要素と、前記発光要素から出射された光を反射させるためのものであり、かつ無機材料により多孔質に形成された、抗折強度が1〜300MPaの反射層を有する反射部材と、を備え、
前記反射層は、複数の無機粒子を互いに一部分で一体化させて前記複数の無機粒子の間に空隙を設けることにより多孔質に形成されている、照明装置。 - 前記空隙は、気体により、または前記無機粒子よりも屈折率の低い透明材料により満たされている、請求項16に記載の照明装置。
- 前記複数の無機粒子は、仮焼成することにより互いに一部分で一体化されている、請求項16に記載の照明装置。
- 前記無機粒子は、アルミナ、イットリア、ジルコニアおよびチタニアからなる選択される少なくとも一種を含んでいる、請求項16に記載の照明装置。
- 前記発光要素のピーク波長に対する前記反射部材の反射率が95%以上である、請求項16に記載の照明装置。
- 前記発光要素は、LEDチップまたはLDチップである、請求項16に記載の照明装置。
- 前記発光要素は、紫外光、近紫外光、または青色光を出射するように構成されている、請求項16に記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011130584A JP5362777B2 (ja) | 2005-03-29 | 2011-06-10 | 発光装置、照明装置 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005095015 | 2005-03-29 | ||
JP2005095015 | 2005-03-29 | ||
JP2005346904 | 2005-11-30 | ||
JP2005346904 | 2005-11-30 | ||
JP2011130584A JP5362777B2 (ja) | 2005-03-29 | 2011-06-10 | 発光装置、照明装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007510464A Division JP4847954B2 (ja) | 2005-03-29 | 2006-03-25 | 反射部材、これを用いた発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011180618A true JP2011180618A (ja) | 2011-09-15 |
JP5362777B2 JP5362777B2 (ja) | 2013-12-11 |
Family
ID=37053319
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007510464A Active JP4847954B2 (ja) | 2005-03-29 | 2006-03-25 | 反射部材、これを用いた発光装置および照明装置 |
JP2011127436A Active JP5383747B2 (ja) | 2005-03-29 | 2011-06-07 | 反射部材、これを用いた発光装置および照明装置 |
JP2011130584A Active JP5362777B2 (ja) | 2005-03-29 | 2011-06-10 | 発光装置、照明装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007510464A Active JP4847954B2 (ja) | 2005-03-29 | 2006-03-25 | 反射部材、これを用いた発光装置および照明装置 |
JP2011127436A Active JP5383747B2 (ja) | 2005-03-29 | 2011-06-07 | 反射部材、これを用いた発光装置および照明装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8449973B2 (ja) |
EP (1) | EP1873563B1 (ja) |
JP (3) | JP4847954B2 (ja) |
KR (1) | KR20070112411A (ja) |
CN (1) | CN101180557B (ja) |
TW (1) | TWI304871B (ja) |
WO (1) | WO2006104061A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020016748A (ja) * | 2018-07-25 | 2020-01-30 | クアーズテック株式会社 | 反射部材接合波長変換部材 |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070112411A (ko) * | 2005-03-29 | 2007-11-23 | 쿄세라 코포레이션 | 반사 부재, 이것을 이용한 발광 장치 및 조명 장치 |
JP4991173B2 (ja) * | 2005-04-27 | 2012-08-01 | 京セラ株式会社 | 発光素子搭載用基体ならびにこれを用いた発光装置 |
JP2008147610A (ja) * | 2006-11-15 | 2008-06-26 | Kyocera Corp | 発光装置 |
JP2010517213A (ja) * | 2007-01-19 | 2010-05-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 改善された熱伝達を伴う発光装置 |
JP2008198962A (ja) * | 2007-02-16 | 2008-08-28 | Nichia Chem Ind Ltd | 発光装置およびその製造方法 |
JP2009032943A (ja) * | 2007-07-27 | 2009-02-12 | Japan Gore Tex Inc | 発光素子用プリント配線基板 |
WO2009031608A1 (ja) * | 2007-09-05 | 2009-03-12 | Nikon Corporation | 光学式エンコーダ用反射板およびその製造方法、ならびに光学式エンコーダ |
DE102007046339A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lichtquelle mit veränderlicher Abstrahlcharakteristik |
JP2009088112A (ja) * | 2007-09-28 | 2009-04-23 | Kyocera Corp | 発光装置 |
US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
CN101878540B (zh) | 2007-11-29 | 2013-11-06 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
US8384119B2 (en) * | 2007-12-25 | 2013-02-26 | Kyocera Corporation | Light emitting device |
WO2009082011A1 (ja) * | 2007-12-26 | 2009-07-02 | Kyocera Corporation | 発光装置および照明装置 |
JP5153402B2 (ja) * | 2008-01-30 | 2013-02-27 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
ES2667009T3 (es) | 2008-07-22 | 2018-05-09 | Philips Lighting Holding B.V. | Un elemento óptico para un dispositivo de emisión de luz y un método de fabricación del mismo |
TWI478370B (zh) | 2008-08-29 | 2015-03-21 | Epistar Corp | 一具有波長轉換結構之半導體發光裝置及其封裝結構 |
JP2010153556A (ja) * | 2008-12-25 | 2010-07-08 | Kyocera Corp | 発光装置及びこれを用いた照明装置 |
KR101383673B1 (ko) * | 2009-04-16 | 2014-04-09 | 박준영 | 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및 이에 의해 제조되는 터치패널 |
JP2011009461A (ja) * | 2009-06-25 | 2011-01-13 | Kyocera Corp | 光電変換装置および光電変換装置用部品 |
JP4902020B2 (ja) * | 2009-07-31 | 2012-03-21 | 京セラ株式会社 | 発光素子搭載用セラミックス基体 |
US9362459B2 (en) | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US9105824B2 (en) * | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
JP5745784B2 (ja) * | 2010-06-10 | 2015-07-08 | シチズン電子株式会社 | 発光ダイオード |
CN102456809B (zh) * | 2010-10-26 | 2015-09-30 | 比亚迪股份有限公司 | 一种led组件及其制备方法 |
JP5281665B2 (ja) * | 2011-02-28 | 2013-09-04 | 株式会社東芝 | 照明装置 |
EP2684224B1 (en) * | 2011-03-07 | 2019-05-08 | Lumileds Holding B.V. | A light emitting module, a lamp, a luminaire and a display device |
WO2012133173A1 (ja) | 2011-03-28 | 2012-10-04 | 富士フイルム株式会社 | 発光素子用反射基板およびその製造方法 |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
WO2013027847A1 (ja) * | 2011-08-25 | 2013-02-28 | 富士フイルム株式会社 | Led発光素子用反射基板およびledパッケージ |
JP2013065847A (ja) * | 2011-09-01 | 2013-04-11 | Fujifilm Corp | 絶縁反射基板およびledパッケージ |
US9599292B2 (en) * | 2011-09-20 | 2017-03-21 | Koninklijke Philips N.V. | Light emitting module, a lamp, a luminaire and a display device |
WO2013047874A1 (ja) * | 2011-09-30 | 2013-04-04 | 富士フイルム株式会社 | 発光素子用反射基板 |
JP5781006B2 (ja) * | 2012-05-14 | 2015-09-16 | 京セラ株式会社 | 発光素子用配線基板および発光装置 |
US20150162511A1 (en) * | 2012-07-27 | 2015-06-11 | Konica Minolta, Inc. | Led device and method for manufacturing same |
JP6061072B2 (ja) * | 2012-09-24 | 2017-01-18 | 東芝ライテック株式会社 | 照明器具 |
US9923132B2 (en) * | 2013-05-24 | 2018-03-20 | Cree, Inc. | Solid state lighting component package with conformal reflective coating |
JP6062801B2 (ja) * | 2013-05-28 | 2017-01-18 | 京セラ株式会社 | 発光素子用基板および発光装置 |
WO2015068072A1 (en) * | 2013-11-07 | 2015-05-14 | Koninklijke Philips N.V. | Substrate for led with total-internal reflection layer surrounding led |
DE102013114226B4 (de) | 2013-12-17 | 2019-03-07 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode, Verfahren zur Herstellung einer Halbleiterlaserdiode und Halbleiterlaserdiodenanordnung |
JP6314472B2 (ja) * | 2013-12-20 | 2018-04-25 | 日本電気硝子株式会社 | プロジェクター用蛍光ホイール、その製造方法及びプロジェクター用発光デバイス |
US9508907B2 (en) * | 2014-09-15 | 2016-11-29 | Koninklijke Philips N.V. | Light emitting device on a mount with a reflective layer |
JP6623508B2 (ja) * | 2014-09-30 | 2019-12-25 | 日亜化学工業株式会社 | 光源及びその製造方法、実装方法 |
JP6478894B2 (ja) * | 2014-10-22 | 2019-03-06 | クアーズテック株式会社 | 多孔質セラミックス |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
WO2016125611A1 (ja) * | 2015-02-03 | 2016-08-11 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いた発光デバイス |
JP6726486B2 (ja) * | 2015-03-10 | 2020-07-22 | シチズン時計株式会社 | 反射基板の製造方法及び反射基板 |
US11127887B2 (en) * | 2015-08-03 | 2021-09-21 | Lumileds Llc | Semiconductor light emitting device with reflective side coating |
JP6634766B2 (ja) * | 2015-09-30 | 2020-01-22 | 日亜化学工業株式会社 | 分光放射束測定装置 |
CN108105604B (zh) * | 2016-11-25 | 2020-05-29 | 深圳光峰科技股份有限公司 | 发光陶瓷结构及其制备方法、相关发光装置和投影装置 |
JP6822660B2 (ja) * | 2017-02-08 | 2021-01-27 | 株式会社オプトコム | 積分球型減光器 |
EP3370308B1 (en) * | 2017-03-03 | 2020-01-01 | Nichia Corporation | Optical component and method of manufacturing same |
JP6891648B2 (ja) | 2017-06-07 | 2021-06-18 | セイコーエプソン株式会社 | 波長変換素子、波長変換装置、光源装置およびプロジェクター |
JP6870592B2 (ja) * | 2017-11-24 | 2021-05-12 | 豊田合成株式会社 | 発光装置 |
JP2019125683A (ja) * | 2018-01-16 | 2019-07-25 | 東芝マテリアル株式会社 | Ledモジュール |
CN110488560B (zh) | 2018-05-14 | 2021-10-26 | 中强光电股份有限公司 | 波长转换元件及其形成方法、波长转换模块以及投影装置 |
CN110687674B (zh) | 2018-07-06 | 2021-10-29 | 中强光电股份有限公司 | 波长转换模块、波长转换模块的形成方法以及投影装置 |
CN114762135A (zh) * | 2020-01-20 | 2022-07-15 | 冈本硝子株式会社 | 光阻墨水 |
CN115552873A (zh) * | 2020-03-20 | 2022-12-30 | 阿莫绿色技术有限公司 | 折叠板及用于制造折叠板的方法 |
EP4160704A1 (en) * | 2021-09-29 | 2023-04-05 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0257666A (ja) * | 1988-08-20 | 1990-02-27 | Kawasaki Steel Corp | 鏡面性に優れた焼結合金とその製造方法 |
JPH0277575A (ja) * | 1988-05-31 | 1990-03-16 | Johnson Matthey Inc | タングステン―チタンのスパッタリングターゲットの製造方法 |
JPH11213892A (ja) * | 1998-01-20 | 1999-08-06 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネル |
JP2001229838A (ja) * | 1999-12-02 | 2001-08-24 | Toray Ind Inc | ディスプレイ用部材およびディスプレイ |
JP2003086475A (ja) * | 2001-06-26 | 2003-03-20 | Kyocera Corp | ダミーウェハとその製造方法及びそれを用いた検出方法 |
JP2004207678A (ja) * | 2002-10-30 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
WO2006104061A1 (ja) * | 2005-03-29 | 2006-10-05 | Kyocera Corporation | 反射部材、これを用いた発光装置および照明装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4802186A (en) | 1987-07-06 | 1989-01-31 | Hughes Aircraft Company | High reflectance laser resonator cavity |
US4912720A (en) | 1988-10-27 | 1990-03-27 | Labsphere, Inc. | Laser cavity material |
DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
JP3329573B2 (ja) * | 1994-04-18 | 2002-09-30 | 日亜化学工業株式会社 | Ledディスプレイ |
JPH09157060A (ja) * | 1995-12-06 | 1997-06-17 | Sumitomo Chem Co Ltd | 無機焼結多孔体およびフィルタ |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
JPH1129745A (ja) * | 1997-07-09 | 1999-02-02 | Matsushita Electric Works Ltd | 塗料組成物、塗膜形成方法、塗装品、照明器具用反射板 |
WO2003014778A1 (fr) * | 2001-08-06 | 2003-02-20 | Yupo Corporation | Reflecteur optique |
WO2003032073A1 (en) * | 2001-09-27 | 2003-04-17 | Tsujiden Co., Ltd. | Reflective film |
DE10229067B4 (de) * | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
CN1330983C (zh) | 2002-07-24 | 2007-08-08 | 优泊公司 | 光反射体 |
US7118438B2 (en) | 2003-01-27 | 2006-10-10 | 3M Innovative Properties Company | Methods of making phosphor based light sources having an interference reflector |
-
2006
- 2006-03-25 KR KR1020077023551A patent/KR20070112411A/ko not_active Application Discontinuation
- 2006-03-25 WO PCT/JP2006/306041 patent/WO2006104061A1/ja active Application Filing
- 2006-03-25 CN CN2006800176426A patent/CN101180557B/zh not_active Expired - Fee Related
- 2006-03-25 EP EP06729989.1A patent/EP1873563B1/en active Active
- 2006-03-25 JP JP2007510464A patent/JP4847954B2/ja active Active
- 2006-03-25 US US11/909,147 patent/US8449973B2/en not_active Expired - Fee Related
- 2006-03-29 TW TW95110995A patent/TWI304871B/zh not_active IP Right Cessation
-
2011
- 2011-06-07 JP JP2011127436A patent/JP5383747B2/ja active Active
- 2011-06-10 JP JP2011130584A patent/JP5362777B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0277575A (ja) * | 1988-05-31 | 1990-03-16 | Johnson Matthey Inc | タングステン―チタンのスパッタリングターゲットの製造方法 |
JPH0257666A (ja) * | 1988-08-20 | 1990-02-27 | Kawasaki Steel Corp | 鏡面性に優れた焼結合金とその製造方法 |
JPH11213892A (ja) * | 1998-01-20 | 1999-08-06 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネル |
JP2001229838A (ja) * | 1999-12-02 | 2001-08-24 | Toray Ind Inc | ディスプレイ用部材およびディスプレイ |
JP2003086475A (ja) * | 2001-06-26 | 2003-03-20 | Kyocera Corp | ダミーウェハとその製造方法及びそれを用いた検出方法 |
JP2004207678A (ja) * | 2002-10-30 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
WO2006104061A1 (ja) * | 2005-03-29 | 2006-10-05 | Kyocera Corporation | 反射部材、これを用いた発光装置および照明装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020016748A (ja) * | 2018-07-25 | 2020-01-30 | クアーズテック株式会社 | 反射部材接合波長変換部材 |
JP7097255B2 (ja) | 2018-07-25 | 2022-07-07 | クアーズテック株式会社 | 反射部材接合波長変換部材 |
Also Published As
Publication number | Publication date |
---|---|
TW200643340A (en) | 2006-12-16 |
US20090213591A1 (en) | 2009-08-27 |
JP4847954B2 (ja) | 2011-12-28 |
CN101180557A (zh) | 2008-05-14 |
JP2011191785A (ja) | 2011-09-29 |
JP5383747B2 (ja) | 2014-01-08 |
KR20070112411A (ko) | 2007-11-23 |
US8449973B2 (en) | 2013-05-28 |
EP1873563B1 (en) | 2017-03-22 |
JP5362777B2 (ja) | 2013-12-11 |
TWI304871B (en) | 2009-01-01 |
EP1873563A4 (en) | 2010-09-01 |
JPWO2006104061A1 (ja) | 2008-09-04 |
EP1873563A1 (en) | 2008-01-02 |
WO2006104061A1 (ja) | 2006-10-05 |
CN101180557B (zh) | 2013-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4847954B2 (ja) | 反射部材、これを用いた発光装置および照明装置 | |
JP4744335B2 (ja) | 発光装置および照明装置 | |
CN101794855B (zh) | 半导体发光装置及半导体发光装置的制造方法 | |
JP5326837B2 (ja) | 発光装置 | |
JP4991173B2 (ja) | 発光素子搭載用基体ならびにこれを用いた発光装置 | |
TW200537716A (en) | Light-emitting apparatus and illuminating apparatus | |
JP2007035885A (ja) | 発光装置およびそれを用いた照明装置 | |
KR20060107428A (ko) | 발광장치 | |
JP2017117858A (ja) | 発光装置 | |
JP2007121613A (ja) | 光反射体、発光素子搭載用配線基板、および発光装置 | |
JP2008147610A (ja) | 発光装置 | |
JP2011114096A (ja) | 照明装置 | |
JP5610036B2 (ja) | 発光装置 | |
JP2006093399A (ja) | 発光装置およびその製造方法ならびに照明装置 | |
JP6680302B2 (ja) | 発光装置 | |
JP2011222743A (ja) | 発光装置 | |
JP5535276B2 (ja) | 発光装置 | |
JP4707433B2 (ja) | 発光装置および照明装置 | |
JP2019165237A (ja) | 発光装置 | |
JP2010100827A (ja) | 波長変換部材およびそれを用いた発光装置 | |
JP2020053364A (ja) | 発光装置 | |
JP2013190800A (ja) | 光反射体、発光素子搭載用配線基板、および発光装置 | |
JP2011090325A (ja) | 光反射体、発光素子搭載用配線基板、および発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110616 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121210 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130115 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130313 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130903 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130904 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5362777 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |