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JP2011031603A - 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法 - Google Patents

金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法 Download PDF

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Publication number
JP2011031603A
JP2011031603A JP2009277420A JP2009277420A JP2011031603A JP 2011031603 A JP2011031603 A JP 2011031603A JP 2009277420 A JP2009277420 A JP 2009277420A JP 2009277420 A JP2009277420 A JP 2009277420A JP 2011031603 A JP2011031603 A JP 2011031603A
Authority
JP
Japan
Prior art keywords
film
polyimide film
thin film
metal
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009277420A
Other languages
English (en)
Japanese (ja)
Inventor
Hirobumi Sone
博文 曽根
Shuichi Ogasawara
修一 小笠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2009277420A priority Critical patent/JP2011031603A/ja
Publication of JP2011031603A publication Critical patent/JP2011031603A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2009277420A 2009-07-08 2009-12-07 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法 Pending JP2011031603A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009277420A JP2011031603A (ja) 2009-07-08 2009-12-07 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009161519 2009-07-08
JP2009277420A JP2011031603A (ja) 2009-07-08 2009-12-07 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法

Publications (1)

Publication Number Publication Date
JP2011031603A true JP2011031603A (ja) 2011-02-17

Family

ID=43455034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009277420A Pending JP2011031603A (ja) 2009-07-08 2009-12-07 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法

Country Status (4)

Country Link
JP (1) JP2011031603A (ko)
KR (1) KR20110004764A (ko)
CN (1) CN101951724B (ko)
TW (1) TWI486253B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204763A (ja) * 2011-03-28 2012-10-22 Sumitomo Metal Mining Co Ltd 金属被覆ポリイミドフィルム、フレキシブル配線板およびそれらの製造方法
JP2016205967A (ja) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 ポリイミドフィルムの良否判定方法、並びにそのポリイミドフィルムを用いた銅張積層板及びフレキシブル配線板の製造方法
JP2020139197A (ja) * 2019-02-28 2020-09-03 住友金属鉱山株式会社 フレキシブル基板の製造方法
CN115850788A (zh) * 2023-01-03 2023-03-28 吉林大学 一种导热填料/聚酰亚胺气凝胶金属化高导热复合材料及制备方法
JP7486393B2 (ja) 2020-09-30 2024-05-17 日鉄ケミカル＆マテリアル株式会社 金属張積層板、その製造方法及び回路基板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548524B (zh) * 2012-09-28 2016-09-11 Dainippon Ink & Chemicals Laminated body, conductive pattern and circuit
KR102003880B1 (ko) * 2012-12-06 2019-07-26 도레이케미칼 주식회사 연성동박적층필름 및 이의 제조방법
KR102010004B1 (ko) * 2012-12-06 2019-08-13 도레이케미칼 주식회사 연성동박적층필름 및 이의 제조방법
CN110049618A (zh) * 2018-01-15 2019-07-23 达迈科技股份有限公司 用于金属化的聚酰亚胺膜、基板结构及电路基板
CN110596805B (zh) * 2019-09-19 2022-02-22 中国科学院重庆绿色智能技术研究院 一种双面微结构聚酰亚胺薄膜光学器件的制备方法
JP2021115861A (ja) * 2020-01-29 2021-08-10 住友化学株式会社 フィルムロール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278371A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd ポリイミド−金属層積層体の製造方法及びこの方法によって得たポリイミド−金属層積層体
WO2009075212A1 (ja) * 2007-12-11 2009-06-18 Kaneka Corporation 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法
WO2010110062A1 (ja) * 2009-03-27 2010-09-30 日鉱金属株式会社 フレキシブル基板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1297398C (zh) * 2001-07-06 2007-01-31 钟渊化学工业株式会社 层压体及其制造方法
JP4222001B2 (ja) * 2002-11-01 2009-02-12 住友金属鉱山株式会社 銅被覆プラスチック基板
JP4257583B2 (ja) * 2003-08-27 2009-04-22 東洋紡績株式会社 金属化ポリイミドフィルム及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278371A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd ポリイミド−金属層積層体の製造方法及びこの方法によって得たポリイミド−金属層積層体
WO2009075212A1 (ja) * 2007-12-11 2009-06-18 Kaneka Corporation 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法
WO2010110062A1 (ja) * 2009-03-27 2010-09-30 日鉱金属株式会社 フレキシブル基板及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204763A (ja) * 2011-03-28 2012-10-22 Sumitomo Metal Mining Co Ltd 金属被覆ポリイミドフィルム、フレキシブル配線板およびそれらの製造方法
JP2016205967A (ja) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 ポリイミドフィルムの良否判定方法、並びにそのポリイミドフィルムを用いた銅張積層板及びフレキシブル配線板の製造方法
JP2020139197A (ja) * 2019-02-28 2020-09-03 住友金属鉱山株式会社 フレキシブル基板の製造方法
JP7273361B2 (ja) 2019-02-28 2023-05-15 住友金属鉱山株式会社 フレキシブル基板の製造方法
JP7486393B2 (ja) 2020-09-30 2024-05-17 日鉄ケミカル＆マテリアル株式会社 金属張積層板、その製造方法及び回路基板
CN115850788A (zh) * 2023-01-03 2023-03-28 吉林大学 一种导热填料/聚酰亚胺气凝胶金属化高导热复合材料及制备方法
CN115850788B (zh) * 2023-01-03 2023-12-12 吉林大学 一种导热填料/聚酰亚胺气凝胶金属化高导热复合材料及制备方法

Also Published As

Publication number Publication date
TW201102267A (en) 2011-01-16
CN101951724A (zh) 2011-01-19
KR20110004764A (ko) 2011-01-14
CN101951724B (zh) 2014-07-02
TWI486253B (zh) 2015-06-01

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