JP2010079209A - Novel photosensitive resin composition, and use thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing micro-fine working owing to its photosensitivity, developable by an dilute alkaline solution, curable at low temperatures (200°C or lower), rich in flexibility, excellent in electric insulation reliability, soldering heat resistance, stability against an organic solvent and flame retardancy, capable of reducing a warpage after cured, and excellent in tightness with a sealant. <P>SOLUTION: The problem is solved using the photosensitive resin composition containing at least (A) a polyimide precursor imidized partially and having an amido bond other than a polyamido acid region, (B) a photosensitive resin, and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  Since this invention has photosensitivity, it can be finely processed, can be developed with a dilute alkaline aqueous solution, can be cured at a low temperature (200 ° C. or less), has high flexibility, electrical insulation reliability, and solder heat resistance. , A photosensitive resin composition having excellent organic solvent resistance and flame retardancy, small warpage of the substrate after curing, and excellent adhesion to the sealant, a resin film obtained therefrom, an insulating film, and a printed film with an insulating film The present invention relates to a wiring board.

  Polyimide resins are widely used in electrical and electronic applications because of their excellent heat resistance, electrical insulation reliability, chemical resistance, and mechanical properties. For example, it is used to form insulating films and protective coatings on semiconductor devices, base materials such as flexible circuit boards and integrated circuits, surface protective materials, and further, interlayer insulating films and protective films for fine circuits. .

  In particular, when used as a surface protective material for a flexible circuit board, a coverlay film obtained by applying an adhesive to a molded body such as a polyimide film has been used. When bonding this coverlay film on a flexible circuit board, there is a method in which an opening is provided in advance by a method such as punching in a terminal portion of a circuit or a joint portion with a component, and after aligning, a method of thermocompression bonding by a hot press or the like is used. It is common.

  However, it is difficult to provide a high-precision opening in a thin coverlay film, and the alignment at the time of bonding is often performed manually, so the positional accuracy is poor and the workability of bonding is also low. It was bad and expensive.

  On the other hand, a liquid cover coat ink or the like may be used as a surface protection material for a circuit board. In particular, a liquid cover coat ink having a photosensitive function is preferably used when fine processing is required. Yes. As the liquid cover coat ink, a photosensitive ink mainly composed of epoxy resin or the like (generally also referred to as a solder resist) is used. This ink is excellent in electrical insulation reliability as an insulating material, but is bent. Therefore, when it is laminated on a thin and flexible circuit board such as a flexible circuit board, the warpage of the board becomes large and it is difficult to use it for a flexible circuit board.

In recent years, film-type photosensitive resin compositions have been proposed as various proposals that can exhibit flexibility and high electrical insulation reliability (see, for example, Patent Documents 1 and 2).
JP 2000-98607 A Japanese Patent Laid-Open No. 2004-361883

  When the photosensitive resin composition described in Patent Document 1 is used for a flexible printed circuit board, there are problems that warpage is large and a curing temperature is high. Patent Document 2 provides a photosensitive resin composition that is flexible and has a small warp by using a flexible siloxane diamine. However, it has a siloxane diamine structure in the skeleton, and there is a problem that impurities contained in the siloxane diamine bleed out from the cured film and induce semiconductor malfunction. In addition, when a cured film formed from a resin composition containing a siloxane diamine structure is used as a circuit board material, there is a problem that the wettability of the cured film surface is poor and the adhesion to various sealants is poor. .

  In view of the above situation, the problem of the present invention is that it has photosensitivity, can be finely processed, can be developed with a dilute alkaline aqueous solution, can be cured at a low temperature (200 ° C. or less), has high flexibility, Photosensitive resin composition, photosensitive resin film, polyimide insulation with excellent insulation reliability, solder heat resistance, organic solvent resistance, flame retardancy, low warpage of the substrate after curing, and excellent adhesion to the sealant It is to provide a printed wiring board with a film and an insulating film.

  As a result of intensive studies to solve the above problems, the inventors of the present application have at least (A) a partially imidized polyimide precursor having an amide bond in addition to the polyamic acid site, (B) a photosensitive resin, and (C). By using a photosensitive resin composition characterized by containing a photopolymerization initiator, it can be finely processed because it has photosensitivity, can be developed with a dilute alkaline aqueous solution, and at a low temperature (200 ° C. or lower). Curability, flexibility, electrical insulation reliability, solder heat resistance, organic solvent resistance, flame resistance, low warpage of the cured substrate, and excellent adhesion to the sealant It has been found that a resin composition, a photosensitive resin film, a polyimide insulating film, and a printed wiring board with an insulating film can be provided.

  In the photosensitive resin composition of the present invention, the (A) polyimide precursor reacts at least (a) a dicarboxylic acid compound having a polycarbonate residue and / or a polyalkylene glycol residue with (b) a diisocyanate compound. And (c) a tetracarboxylic dianhydride is reacted to synthesize a terminal acid anhydride imide oligomer, and (d) a diamine compound is further reacted. It is preferable that it is the photosensitive resin composition of Claim 1.

  In addition to the components (A), (B) and (C) of the photosensitive resin composition of the present invention, it is preferable to contain (D) an isocyanate compound (block isocyanate).

  In the photosensitive resin composition of the present invention, (A) a partially imidized polyimide precursor having an amide bond other than the polyamic acid site, (B) a photosensitive resin, and (C) a photopolymerization initiator, (A ) A partially imidized polyimide precursor having an amide bond other than the polyamic acid part, and (B) 100 parts by weight of the total solid content of the photosensitive resin, It is preferable to mix | blend so that it may become 1-50 weight part.

  Moreover, the resin film concerning this invention is obtained by drying, after apply | coating the said photosensitive resin composition to the base-material surface.

  The insulating film according to the present invention is obtained by curing the resin film.

  The printed wiring board with an insulating film according to the present invention is obtained by coating the insulating film on the printed wiring board.

  As described above, the photosensitive resin composition of the present invention includes at least (A) a partially imidized polyimide precursor having an amide bond in addition to the polyamic acid moiety, (B) a photosensitive resin, and (C) light. By using a photosensitive resin composition characterized by containing a polymerization initiator, it can be finely processed because it has photosensitivity, can be developed with a dilute alkaline aqueous solution, and is cured at a low temperature (200 ° C. or lower). It is possible, has high flexibility, is excellent in electrical insulation reliability, solder heat resistance, organic solvent resistance, and flame resistance, has low warpage of the substrate after curing, and has excellent adhesion to the sealant. Therefore, the photosensitive resin composition of the present invention can be used for protective films of various circuit boards and exhibits excellent effects.

  Hereinafter, the present invention will be described in detail.

<Photosensitive resin composition>
The photosensitive resin composition of the present invention comprises at least (A) a partially imidized polyimide precursor having an amide bond other than a polyamic acid site, (B) a photosensitive resin, and (C) a photopolymerization initiator. It should just contain.

  In the photosensitive resin composition of the present invention, (A) a partially imidized polyimide precursor having an amide bond other than the polyamic acid moiety has a polycarbonate residue and / or a polyalkylene glycol residue. A polyimide precursor obtained by using a dicarboxylic acid compound and partially imidized and having an amide bond other than the polyamic acid moiety is more preferably used, but is not limited thereto.

  Further, the photosensitive resin composition of the present invention includes (A) a partially imidized polyimide precursor having an amide bond other than the polyamic acid site, (B) a photosensitive resin, and (C) a photopolymerization initiator. In addition, (D) an isocyanate compound (block isocyanate) may be contained.

  Here, although the present inventors discovered that the photosensitive resin composition of this invention was excellent in various characteristics, it estimates that this may be based on the following reasons.

  In other words, (A) a partially imidized polyimide having an amide bond other than the polyamic acid moiety and obtained by thermosetting a polyimide precursor has an imide skeleton in the molecule, and therefore has heat resistance and electrical properties derived from the imide skeleton. Excellent insulation reliability and flexibility. In addition, a partially imidized polyimide precursor having an amide bond other than the polyamic acid moiety has a carboxyl group derived from polyamic acid, and therefore becomes soluble in a developer typified by a dilute alkaline aqueous solution. Fine processing is possible. Especially, it is obtained by thermosetting a polyimide precursor obtained by using a dicarboxylic acid compound having a polycarbonate residue and / or a polyalkylene glycol residue and having a amide bond in addition to a partially imidized polyamic acid moiety. The resulting polyimide is excellent in flexibility and low moisture absorption.

  In addition, since the molecular skeleton does not contain a siloxane skeleton, the resulting cured film surface has good wettability, not only very good adhesion to various members, but also derived from the siloxane component from the cured film Therefore, when a cured film is used as an insulating film of a printed wiring board, the semiconductor does not malfunction.

  Hereinafter, (A) a partially imidized polyimide precursor having an amide bond other than the polyamic acid site, (B) a photosensitive resin, (C) a photopolymerization initiator and (D) an isocyanate compound (block isocyanate) The other components and the mixing method of (A) to (D) will be described.

<(A) Partially imidized polyimide precursor having an amide bond other than the polyamic acid moiety>
The polyimide precursor used in the present invention, which is partially imidized and has an amide bond other than the polyamic acid moiety, has at least a polyamic acid skeleton, and has an amide bond other than the polyamic acid inside, A polyimide precursor having an imide ring and having a number average molecular weight of 1,000 or more, more preferably 5,000 or more in terms of polyethylene glycol.

  If it is the above, there is no particular limitation, but more specifically, (A) partially imidized in the present invention, an example of a method for producing a polyimide precursor having an amide bond in addition to the polyamic acid moiety is described below. To do.

<(A) Dicarboxylic acid compound having a polycarbonate residue>
First, (A) a partially imidized dicarboxylic acid compound having (a) a polycarbonate residue used for a polyimide precursor having an amide bond other than a polyamic acid moiety will be described.

  The dicarboxylic acid compound having a polycarbonate residue is a condition in which the equivalent ratio (carboxyl group of dicarboxylic acid / hydroxyl group of polycarbonate diol) of polycarbonate diol and dicarboxylic acid shown below exceeds 1, preferably 1.1 to 3, more preferably Can be synthesized at 1.5 to 2 (dehydration esterification).

  About the chemical structure of polycarbonate diol, what is represented, for example by General formula (1) is mentioned.

（式中、複数個のＲ₁はそれぞれ独立に２価の有機基を示し、ｍは１〜２０の整数である。）

(Wherein represents a divalent organic group, each plurality of R ₁ is independently, m is an integer from 1 to 20.)

  There is no restriction | limiting in particular as polycarbonate diol for synthesize | combining the dicarboxylic acid compound which has a polycarbonate residue, For example, PLACEL CD series, PLACEL CD-PL series, PLACEL CD-HL series (above, Daicel Chemical Industries Ltd. make) Trade name), PNOC-series (trade name, manufactured by Kuraray Co., Ltd.), trade names PCDL T-4671, T-4672, T-4691, T-4692, T-5650J, T-5651, manufactured by Asahi Kasei Chemicals Corporation T-5652, T-6001, T-6002, Trade name Plaxel CD CD205, CD205PL, CD205HL, CD210, CD210PL, CD210HL, CD220, CD220PL, CD220HL, manufactured by Daicel Chemical Industries, Ltd. Examples include the product names Nippon Run 981, 980R, 982R manufactured by Retan Kogyo Co., Ltd.

  These can be used alone or in combination of two or more. The number average molecular weight of the polycarbonate diol is preferably 500 to 5000, more preferably 750 to 2500, and particularly preferably 1000 to 2000 in terms of polystyrene. When the number average molecular weight of the polycarbonate diol is within the above range, it is preferable in that the chemical resistance and flexibility of the obtained cured film can be improved. When the number average molecular weight is less than 500, the flexibility of the resulting cured film may be reduced. When the number average molecular weight is 5000 or more, the polyimide precursor having an amide bond in addition to the partially imidized polyamic acid moiety. Solvent solubility may be reduced.

<(A) Dicarboxylic acid compound having polyalkylene glycol residue>
(A) A partially imidized dicarboxylic acid compound having a polyalkylene glycol residue (a) used for a polyimide precursor having an amide bond other than a polyamic acid moiety will be described.

  The dicarboxylic acid compound having a polyalkylene glycol residue is a condition in which the equivalent ratio of polyalkylene glycol and dicarboxylic acid shown below (carboxyl group of dicarboxylic acid / hydroxyl group of polyalkylene glycol) exceeds 1, preferably 1.1 to 3 and more preferably 1.5 to 2 for the reaction (dehydration esterification).

  Examples of the dicarboxylic acid used include aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, decanedioic acid, dodecanedioic acid, and eicosandioic acid, dimer acid, and 1,4- Examples include alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid, and aromatic dicarboxylic acids such as isophthalic acid, terephthalic acid, phthalic acid, naphthalenedicarboxylic acid, and oxydibenzoic acid.

  There is no restriction | limiting in particular as polyalkylene glycol for synthesize | combining the dicarboxylic acid compound which has a polyalkylene glycol residue, For example, what is represented by General formula (2) is mentioned.

（式中、Ｒ₂は炭素数１〜６の２価アルコール残基を表し、ｎは１〜５００の整数である。）

(In the formula, R ₂ represents a dihydric alcohol residue having 1 to 6 carbon atoms, and n is an integer of 1 to 500.)

  Examples thereof include polyethylene glycol, polypropylene glycol, polypropylene glycol ethylene oxide adduct, and polytetramethylene glycol.

  Specifically, polypropylene glycol (for example, Sanyo Chemical Industries Co., Ltd., trade name Newpol PP-series), polypropylene glycol ethylene oxide adduct (for example, Sanyo Chemical Industries, Ltd. trade name Newpol PE-61) , New Pole PE-62, New Pole PE-71, etc.). These polyalkylene glycols are used alone or in combination of two or more. The molecular weight of polyalkylene glycol (calculated value from the hydroxyl value) is preferably 200 to 5000, more preferably 500 to 4000, and particularly preferably 1000 to 3000.

  A dicarboxylic acid compound having another polyalkylene glycol residue will be described.

  A compound obtained by reacting a compound having an amino group at both ends of a polyalkylene glycol chain (hereinafter referred to as polyoxyalkylene diamine) with a dicarboxylic acid or a tricarboxylic anhydride, a compound obtained by adding bisphenol A to polypropylene oxide (for example, bisol) 30PN, manufactured by Toho Chemical Co., Ltd.) can be preferably used.

  Polycarbonate diol-modified dicarboxylic acid is a condition in which the equivalent ratio of polycarbonate diol and dicarboxylic acid (carboxyl group of dicarboxylic acid / hydroxyl group of polycarbonate diol) exceeds 1, preferably 1.1 to 3, more preferably 1.5 to 2. (Dehydration esterification).

  For example, (1) polyoxyalkylene diamine (the number of carbon atoms of the alkylene group is 2 to 6) [for example, trade names Jeffamine D-230, D-400, D-2000, D-4000 (manufactured by Huntsman Corporation) Is isopropylene group), ED-600, ED-900, ED2001 (the above alkylene groups are ethylene group and isopropylene group), EDR-148 (alkylene group is ethylene group), manufactured by Guangei Chemical Industry Co., Ltd. α, ω- (3-aminopropyl) -polyethylene glycol, etc.] and dicarboxylic acid are reacted under the condition that the reaction equivalent ratio (carboxyl group of dicarboxylic acid / amino group of polyoxyalkylenediamine) exceeds 1. Oxyalkylene amide dicarboxylic acid, (2) polyoxyalkylene diamine and tricar A reaction equivalent ratio (tricarboxylic acid anhydride such as trimellitic anhydride, tricarballylic anhydride, ricinoleic acid dehydration adduct of maleic anhydride, sorbic acid adduct of maleic anhydride) Polyoxyalkylene diimide dicarboxylic acid obtained by reacting acid monoanhydride acid anhydride group / polyoxyalkylenediamine amino group) under the condition of 1, (3) polyoxyalkylenediamine and tetracarboxylic dianhydride [ For example, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, s-biphenyltetracarboxylic dianhydride, diphenylsulfone tetracarboxylic dianhydride, methylcyclohexene tetracarboxylic dianhydride, ethylene glycol bisanhydrotri Reaction equivalent ratio (polyoxyalkylene) The above-mentioned tricarboxylic acid monoanhydride is added to the polyoxyalkyleneimide diamine obtained by the reaction under the condition that the amino group of diamine / acid anhydride group of tetracarboxylic dianhydride exceeds 1 (tricarboxylic acid monoanhydride). Polyoxyalkylene polyimide dicarboxylic acid obtained by reacting under conditions where the acid anhydride group of the product / the amino group of polyoxyalkylene imide diamine is 1, the polyoxyalkylene diol (the alkylene group has 2 to 14 carbon atoms) ) And dicarboxylic acid under the condition that the reaction equivalent ratio (carboxyl group of dicarboxylic acid / hydroxyl group of polyoxyalkylene diol) exceeds 1, (5) polyoxyethylene diglycolic acid (For example, product name PEO acid manufactured by Kawaken Fine Chemical Co., Ltd. 400, # 1000, # 4000, etc.), and the like.

  Examples of the dicarboxylic acid in the above (1) and (4) include aliphatic dicarboxylic acids (succinic acid, glutaric acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, dodecanedioic acid, eicosanedioic acid, dimer, and the like. Acid, 1,4-cyclohexanedicarboxylic acid, etc.), aromatic dicarboxylic acid (isophthalic acid, terephthalic acid, phthalic acid, 1,5-naphthalenedicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenylsulfone) Dicarboxylic acid, 4,4'-benzophenone dicarboxylic acid, etc.).

  Among these, (1) polyoxyalkylene amide dicarboxylic acid, (2) polyoxyalkylene diimide dicarboxylic acid, and (3) polyoxyalkylene polyimide carboxylic acid in terms of the balance between hydrophilicity and heat resistance of the polyamide resin to be obtained. Acid is preferred. These (a) dicarboxylic acids having an oxyalkylene group may be used alone or in combination of two or more.

  (A) The number of oxyalkylene groups in the dicarboxylic acid having an oxyalkylene group may be one or may be continuously connected. In any case, the molecular weight of all the oxyalkylene groups is 200 to 10,000. Is preferable, 500 to 5000 is more preferable, and 1000 to 3000 is particularly preferable. If the molecular weight is less than 200, the hydrophilicity and flexibility of the component (A) to be obtained tend to decrease, and if it exceeds 10,000, the heat resistance of the component (A) to be obtained tends to decrease.

<Terminal isocyanate compound>
A diisocyanate compound having a polycarbonate residue and / or a dicarboxylic acid compound having a polyalkylene glycol residue and a diisocyanate compound are reacted to synthesize a terminal isocyanate compound.

  The (b) diisocyanate compound used in the present invention is a compound having two isocyanate groups in the molecule, represented by the general formula (3).

（式中、Ｘは２価の有機基を示す。）

(In the formula, X represents a divalent organic group.)

  Examples of the (b) diisocyanate compound include diphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2'- or 4,3'- or 5,2'- or 5,3'- or 6,2'- or 6,3'-dimethyldiphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2'- or 4,3'- Or 5,2'- or 5,3'- or 6,2'- or 6,3'-diethyldiphenylmethane-2,4'-diisocyanate, 3,2'- or 3,3'- or 4,2 ' -Or 4,3'- or 5,2'- or 5,3'- or 6,2'- or 6,3'-dimethoxydiphenylmethane-2,4'-diisocyanate, diphenylmethane-4,4'-diisocyanate, Diphenylmethane-3,3'-diiso Anate, diphenylmethane-3,4'-diisocyanate, diphenyl ether-4,4'-diisocyanate, benzophenone-4,4'-diisocyanate, diphenylsulfone-4,4'-diisocyanate, tolylene-2,4-diisocyanate, tolylene-2 , 6-diisocyanate, m-xylylene diisocyanate, p-xylylene diisocyanate, naphthalene-2,6-diisocyanate, 4,4 '-[2,2-bis (4-phenoxyphenyl) propane] diisocyanate Compounds, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate, norbornene diisocyanate, etc., hexamethylene diisocyanate Sulfonate, trimethyl hexamethylene diisocyanate, aliphatic diisocyanate compounds and the like such as lysine diisocyanate, and these may be used alone or in combinations of two or more. Use of these is preferable for increasing the heat resistance of the resulting cured film. Moreover, you may use what was stabilized with the blocking agent required in order to avoid a change over time. Such blocking agents include alcohol, phenol, oxime and the like, but are not particularly limited.

  (B) As the diisocyanate compound, diphenylmethane-4,4'-diisocyanate, diphenylmethane-3,3'-diisocyanate, diphenylmethane-3,4'-diisocyanate, tolylene-2,4-diisocyanate, tolylene-2,6-diisocyanate It is particularly preferable to use norbornene diisocyanate. Thereby, it is preferable at the point which can improve the heat resistance of the cured film obtained, and water resistance further.

  In order to improve the developability of the photosensitive resin composition, (b) tolylene-2,6-diisocyanate, tolylene-2,4-diisocyanate and 1,6-hexamethylene diisocyanate are suitable as the diisocyanate compound. Used for.

<Method for synthesizing terminal isocyanate compound>
The method for synthesizing a terminal isocyanate compound obtained by reacting (a) a dicarboxylic acid compound having a polycarbonate residue and / or a polyalkylene glycol residue and (b) a diisocyanate compound used in the present invention comprises a polycarbonate residue and / or Alternatively, the blending amount of the dicarboxylic acid compound having a polyalkylene glycol residue and the diisocyanate compound is such that the ratio of the number of carboxylic acid groups to the number of isocyanate groups is isocyanate group / carboxylic acid group = 1.00 or more and 2.10 or less, more preferably It is obtained by reacting in a solvent-free or organic solvent so as to be 1.10 or more and 2.10 or less, more preferably 1.90 or more and 2.10 or less.

  When two or more kinds of (a) dicarboxylic acid compounds are used, the reaction with (b) diisocyanate compound may be carried out after mixing two or more kinds of (a) dicarboxylic acid compounds, and each (a) The dicarboxylic compound and (b) diisocyanate compound may be reacted separately. Moreover, after reacting (a) dicarboxylic compound and (b) diisocyanate compound, the obtained terminal isocyanate compound is further reacted with another (a) dicarboxylic compound, and this is further reacted with (b) diisocyanate compound. May be. The same applies when two or more types of (b) diisocyanate compounds are used. In this way, a desired terminal isocyanate compound can be produced.

  The reaction temperature between (a) and (b) is preferably 40 to 160 ° C, more preferably 60 to 150 ° C. If it is less than 40 ° C., the reaction time becomes too long. If it exceeds 160 ° C., a three-dimensional reaction occurs during the reaction and gelation tends to occur. The reaction time can be appropriately selected depending on the scale of the batch and the reaction conditions employed. If necessary, the reaction may be performed in the presence of a catalyst such as a tertiary amine, an alkali metal, an alkaline earth metal, a metal such as tin, zinc, titanium, cobalt, or a metalloid compound.

  The above reaction can be carried out in the absence of a solvent. However, in order to control the reaction, it is desirable to carry out the reaction in an organic solvent system. For example, examples of the organic solvent include sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, N , N-dimethylformamide, formamide solvents such as N, N-diethylformamide, N, N-dimethylacetamide, acetamide solvents such as N, N-diethylacetamide, N-methyl-2-pyrrolidone, N-vinyl-2 Examples include pyrrolidone solvents such as -pyrrolidone, hexamethylphosphoramide, and γ-butyrolactone. Further, if necessary, these organic polar solvents can be used in combination with an aromatic hydrocarbon such as xylene or toluene.

  Furthermore, for example, methyl monoglyme (1,2-dimethoxyethane), methyldiglyme (bis (2-methoxyether) ether), methyltriglyme (1,2-bis (2-methoxyethoxy) ethane), methyltetraglyme (Bis [2- (2-methoxyethoxyethyl)] ether), ethyl monoglyme (1,2-diethoxyethane), ethyldiglyme (bis (2-ethoxyethyl) ether), butyldiglyme (bis (2 Symmetric glycol diethers such as -butoxyethyl) ether), methyl acetate, ethyl acetate, isopropyl acetate, n-propyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether Cetate (also known as carbitol acetate, 2- (2-butoxyethoxy) ethyl acetate), diethylene glycol monobutyl ether acetate, 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether Acetates such as acetate, propylene glycol diacetate, 1,3-butylene glycol diacetate, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol n-propyl ether, dipropylene glycol n-propyl ether, propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n Propyl ether, propylene glycol phenyl ether, dipropylene glycol dimethyl ether, 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, a solvent may be used ethers such as ethyl ether also ethylene glycol. Of these, symmetrical glycol diethers are preferably used because side reactions are unlikely to occur.

  The amount of solvent used in the reaction is desirably such that the solute weight concentration in the reaction solution, that is, the solution concentration is 5% by weight or more and 90% by weight or less. The solute weight concentration in the reaction solution is more preferably 10 wt% or more and 80 wt% or less. When the solution concentration is 5% or less, the polymerization reaction is difficult to occur, the reaction rate is lowered, and a desired structural substance may not be obtained.

  Moreover, the terminal isocyanate compound obtained by the said reaction can also block the isocyanate group of the resin terminal after completion | finish of synthesis | combination with blocking agents, such as alcohol, lactams, and oximes.

<Synthesis of terminal acid anhydride imide oligomer>
An imide oligomer (terminal acid anhydride imide oligomer) having a terminal acid anhydride and having an amide bond in addition to the polyamic acid moiety used as an example of the synthesis method of the present invention is a terminal isocyanate compound obtained as described above. And tetracarboxylic dianhydride can be reacted. At this time, the blending amount of the terminal isocyanate compound and the tetracarboxylic dianhydride is such that the ratio of the number of isocyanate groups to the number of acid dianhydride groups is acid dianhydride groups / isocyanate groups = 1.01 or more and 2.10 or less. It is preferably 1.10 to 2.10, more preferably 1.90 to 2.10. Moreover, the solvent used at the time of the synthesis | combination of the said terminal isocyanate compound may be used for reaction of a terminal isocyanate compound and tetracarboxylic dianhydride as it is, and also said solvent can be added in addition.

  Various methods are mentioned as a reaction method of a terminal acid anhydride imide oligomer and tetracarboxylic dianhydride. The typical method is illustrated below. However, any method may be used as long as tetracarboxylic dianhydride is arranged at the terminal.

  Method 1: A terminal isocyanate compound is gradually added to a solution in which tetracarboxylic dianhydride is dispersed or dissolved in an organic solvent. The reaction temperature at this time is 100 ° C. or higher and 300 ° C. or lower, more preferably 140 ° C. or higher and 250 ° C. or lower. It is preferred that the reaction occurs and imidization proceeds at the same time when the terminal isocyanate compound is added by heating to such a temperature. However, after the terminal isocyanate compound and tetracarboxylic dianhydride are completely dissolved at a low temperature, a method of imidizing by heating to a high temperature may be used.

  Method 2: A terminal isocyanate compound is gradually added and dissolved in a solution in which tetracarboxylic dianhydride is dispersed or dissolved in an organic solvent. Imidization can be carried out by drawing a vacuum while heating and drying a uniformly dissolved solution heated to 100 ° C. or higher and 250 ° C. or lower.

<Tetracarboxylic dianhydride>
Examples of the tetracarboxylic dianhydride used in the synthesis of the polyimide precursor that is partially imidized in the present invention and has an amide bond other than the polyamic acid moiety include 3,3 ′, 4,4′-benzophenonetetracarboxylic acid. Acid dianhydride, pyromellitic dianhydride, 3,3 ′, 4,4′-oxydiphthalic dianhydride, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride 2,2-bis (4-hydroxyphenyl) propanedibenzoate-3,3 ′, 4,4′-tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic acid Anhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4-biphenyltetracarboxylic dianhydride, 5- (2,5-dioxotetrahydro-3 -Furani ) Methyl-3-cyclohexene-1,2-tetracarboxylic dianhydride, such as dicarboxylic acid anhydride can be used.

  The tetracarboxylic dianhydride used for the synthesis of the polyimide precursor having an amide bond other than the polyamic acid moiety which is partially imidized is more preferably 2,2-bis [4- (3,4-di Carboxyphenoxy) phenyl] propane dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride, 3,3 ′, 4,4′-oxydiphthalic dianhydride. Partially imidized by using these, having an amide bond in addition to the polyamic acid site, it is possible to improve the solubility of the polyimide precursor in an organic solvent, and to improve the chemical resistance of the resulting cured film It is preferable in terms of improvement.

  The tetracarboxylic dianhydride is 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride or 5- (2,5-dioxotetrahydro-3-furanyl). It is more preferable to use -3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride from the viewpoint of compatibility with other materials in the photosensitive resin composition.

  The amount of the tetracarboxylic dianhydride used in the present invention is 1 mol of the amount of the dicarboxylic acid compound having a polycarbonate residue and / or a polyalkylene glycol residue used in the production of the terminal isocyanate compound. When used at a ratio of 1.50 mol or more and 6.00 mol or less, the polyimide precursor having an amide bond in addition to the partially imidized polyamic acid portion is preferable and particularly preferable. The use range is to use it in a proportion of 1.70 mol or more and 5.00 mol or less. This is preferable because tetracarboxylic dianhydride that does not contribute to the reaction can be reduced.

<Synthesis of partially imidized polyimide precursor having an amide bond other than the polyamic acid moiety>
A polyimide precursor having an amide bond in addition to the polyamic acid moiety, which is partially imidized by reacting a diamine compound with the terminal acid anhydride imide oligomer that can be obtained by the above method, can be obtained.

  The diamine compound used in the present invention is a compound having two or more amino groups. Preferably, the general formula (4)

（式中、Ｚは２価の有機基を示す。）
で示される芳香族ジアミンである。

(In the formula, Z represents a divalent organic group.)
Is an aromatic diamine.

  More specifically, the diamine compound is m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis (3-aminophenyl) sulfide, (3 -Aminophenyl) (4-aminophenyl) sulfide, bis (4-aminophenyl) sulfide, bis (3-aminophenyl) sulfoxide, (3-aminophenyl) (4-aminophenyl) sulfoxide, bis (4-aminophenyl) ) Sulphoxide, bis (3-aminophenyl) sulfone, (3-aminophenyl) (4-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, 3,4'-diaminobenzophenone, 4,4'-diaminobenzophenone 3,3′-diaminobenzophenone, , 3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylether, 3,3′-diaminodiphenylether, 3,4′-diaminodiphenylether, bis [4 -(3-aminophenoxy) phenyl] sulfoxide, bis [4- (aminophenoxy) phenyl] sulfoxide, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfoxide, bis [4- (3-aminophenoxy) ) Phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfi Bis [4- (aminophenoxy) phenyl] sulfide, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfide, 3,3′-diaminobenzanilide, 3,4′-diaminobenzanilide, 4 , 4'-diaminobenzanilide, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, [4- (4-aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)] methane, 1,1-bis [4- (3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1- [4- (4-Aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)] ethane, 1,2-bis [4- (3-a Nophenoxy) phenyl] ethane, 1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 1,2- [4- (4-aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl) ] Ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2- [4- (4-amino) Phenoxyphenyl)] [4- (3-aminophenoxyphenyl)] propane, 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2- [4- (4-aminophenoxyphenyl)] [4 -(3-Ami Phenoxyphenyl)]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4 -Bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl, 4,4'-bis (3-aminophenoxy) biphenyl Bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4- Aminophenoxy) phenyl] ether, polytetramethylene oxide-di-P-aminobenzoate, poly (tetramethylene / 3-methyltetramethyl) Ether) glycol bis (4-aminobenzoate), trimethylene-bis (4-aminobenzoate), p-phenylene-bis (4-aminobenzoate), m-phenylene-bis (4-aminobenzoate), bisphenol A-bis ( 4-aminobenzoate), 2,4-diaminobenzoic acid, 2,5-diaminobenzoic acid, 3,5-diaminobenzoic acid, 3,3′-diamino-4,4′-dicarboxybiphenyl, 4,4 ′ -Diamino-3,3'-dicarboxybiphenyl, 4,4'-diamino-2,2'-dicarboxybiphenyl, [bis (4-amino-2-carboxy) phenyl] methane, [bis (4-amino- 3-carboxy) phenyl] methane, [bis (3-amino-4-carboxy) phenyl] methane, [bis (3-amino-5-carboxy) phenyl] methane, , 2-bis [3-amino-4-carboxyphenyl] propane, 2,2-bis [4-amino-3-carboxyphenyl] propane, 2,2-bis [3-amino-4-carboxyphenyl] hexafluoro Propane, 2,2-bis [4-amino-3-carboxyphenyl] hexafluoropropane, 3,3′-diamino-4,4′-dicarboxydiphenyl ether, 4,4′-diamino-3,3′-di Carboxydiphenyl ether, 4,4′-diamino-2,2′-dicarboxydiphenyl ether, 3,3′-diamino-4,4′-dicarboxydiphenyl sulfone, 4,4′-diamino-3,3′-dicarboxy Diphenylsulfone, 4,4′-diamino-2,2′-dicarboxydiphenylsulfone, 2,3-diaminophenol, 2, Diaminophenols such as 4-diaminophenol, 2,5-diaminophenol, 3,5-diaminophenol, 3,3′-diamino-4,4′-dihydroxybiphenyl, 4,4′-diamino-3,3 ′ Hydroxybiphenyl compounds such as -dihydroxybiphenyl, 4,4'-diamino-2,2'-dihydroxybiphenyl, 4,4'-diamino-2,2 ', 5,5'-tetrahydroxybiphenyl, 3,3' Dihydroxydiphenylmethanes such as -diamino-4,4'-dihydroxydiphenylmethane, 4,4'-diamino-3,3'-dihydroxydiphenylmethane, 4,4'-diamino-2,2'-dihydroxydiphenylmethane, 2,2- Bis [3-amino-4-hydroxyphenyl] propane, 2,2-bis [4-amino-3- Bis [hydroxyphenyl] propanes such as droxyphenyl] propane, 2,2-bis [3-amino-4-hydroxyphenyl] hexafluoropropane, 2,2-bis [3-amino-4-hydroxyphenyl] hexa Bis [hyhydroxyphenyl] hexafluoropropanes such as fluoropropane, 3,3′-diamino-4,4′-dihydroxydiphenyl ether, 4,4′-diamino-3,3′-dihydroxydiphenyl ether, 4,4′- Hydroxydiphenyl ethers such as diamino-2,2′-dihydroxydiphenyl ether, 3,3′-diamino-4,4′-dihydroxydiphenyl sulfone, 4,4′-diamino-3,3′-dihydroxydiphenyl sulfone, 4,4 '-Diamino-2,2'-dihydroxydiphenylsulfur Dihydroxydiphenyl sulphones such as 3,3′-diamino-4,4′-dihydroxydiphenyl sulfide, 4,4′-diamino-3,3′-dihydroxydiphenyl sulfide, 4,4′-diamino-2, Dihydroxydiphenyl sulfides such as 2′-dihydroxydiphenyl sulfide, 3,3′-diamino-4,4′-dihydroxydiphenyl sulfoxide, 4,4′-diamino-3,3′-dihydroxydiphenyl sulfoxide, 4,4′- Dihydroxydiphenyl sulfoxides such as diamino-2,2′-dihydroxydiphenyl sulfoxide, and bis [(hydroxyphenyl) phenyl] alkane compounds such as 2,2-bis [4- (4-amino-3-hydroxyphenoxy) phenyl] propane 4,4′-bis (4- Bis [(hydroxyphenoxy) biphenyl compounds such as mino-3-hydroxyphenoxy) biphenyl, bis [(hydroxyphenoxy) such as 2,2-bis [4- (4-amino-3-hydroxyphenoxy) phenyl] sulfone Phenyl] sulfone compound, 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4′-diamino-2,2′-dihydroxydiphenylmethane, 2,2-bis [3-amino-4-carboxy Bis (hydroxyphenoxy) biphenyl compounds such as phenyl] propane and 4,4′-bis (4-amino-3-hydroxyphenoxy) biphenyl. These can be used alone or in combination of two or more.

  In particular, diamine compounds that can be suitably used in the photosensitive resin composition of the present invention include m-phenylenediamine, bis (3-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, and 3,3′-diaminodiphenylmethane. Bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] methane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3 -Bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, etc. It is an aromatic diamine. Since the heat resistance of the cured film obtained by using said aromatic diamine improves, it is desirable.

<(B) Photosensitive resin>
The photosensitive resin (B) in the present invention is a resin in which a chemical bond is formed by a photopolymerization initiator. Among these, a resin having at least one unsaturated double bond in the molecule is preferable. Furthermore, the unsaturated double bond is preferably an acrylic group (CH2 = CH-group), a methacryloyl group (CH = C (CH3) -group) or a vinyl group (-CH = CH-group). .

  Examples of the photosensitive resin (B) include bisphenol F EO modified (n = 2 to 50) diacrylate, bisphenol A EO modified (n = 2 to 50) diacrylate, and bisphenol S EO modified (n = 2 to 50). Diacrylate, bisphenol F EO modified (n = 2-50) dimethacrylate, bisphenol A EO modified (n = 2-50) dimethacrylate, bisphenol S EO modified (n = 2-50) dimethacrylate, 1,6-hexane Diol diacrylate, neopentyl glycol diacrylate, ethylene glycol diacrylate, pentaerythritol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, tetramethyl Propane tetraacrylate, tetraethylene glycol diacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol dimethacrylate, ethylene glycol dimethacrylate, pentaerythritol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol trimethacrylate, dipenta Erythritol hexamethacrylate, tetramethylolpropane tetramethacrylate, tetraethylene glycol dimethacrylate, methoxydiethylene glycol methacrylate, methoxypolyethylene glycol methacrylate, β-methacryloyloxyethyl hydrogen phthalate, β-methacryloyloxyethyl hydrogen succinate, 3-chloro-2- Hide Xylpropyl methacrylate, stearyl methacrylate, phenoxyethyl acrylate, phenoxydiethylene glycol acrylate, phenoxy polyethylene glycol acrylate, β-acryloyloxyethyl hydrogen succinate, lauryl acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol Dimethacrylate, 1,3-butylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol dimethacrylate, polypropylene glycol dimethacrylate, 2-hydroxy-1,3-dimethacryloxypropane, 2,2-bis [4- (Methacryloxyethoxy ) Phenyl] propane, 2,2-bis [4- (methacryloxy diethoxy) phenyl] propane, 2,2-bis [4- (methacryloxy polyethoxy) phenyl] propane, polyethylene glycol diacrylate, tripropylene glycol diacrylate, Polypropylene glycol diacrylate, 2,2-bis [4- (acryloxydiethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, 2-hydroxy-1-acryloxy-3-methacryl Roxypropane, trimethylolpropane trimethacrylate, tetramethylolmethane triacrylate, tetramethylolmethane tetraacrylate, methoxydipropylene glycol methacrylate, methoxytriethylene group Cole acrylate, nonylphenoxy polyethylene glycol acrylate, nonyl phenoxy polypropylene glycol acrylate, 1-acryloyloxypropyl-2-phthalate, isostearyl acrylate, polyoxyethylene alkyl ether acrylate, nonylphenoxyethylene glycol acrylate, polypropylene glycol dimethacrylate, 1,4 -Butanediol dimethacrylate, 3-methyl-1,5-pentanediol dimethacrylate, 1,6-mexanediol dimethacrylate, 1,9-nonanediol methacrylate, 2,4-diethyl-1,5-pentanediol di Methacrylate, 1,4-cyclohexanedimethanol dimethacrylate, dipropylene glycol diacrylate, Tricyclodecane dimethanol diacrylate, 2,2-hydrogenated bis [4- (acryloxy polyethoxy) phenyl] propane, 2,2-bis [4- (acryloxy polypropoxy) phenyl] propane, 2,4-diethyl -1,5-pentanediol diacrylate, ethoxylated tomethylolpropane triacrylate, propoxylated tomethylolpropane triacrylate, isocyanuric acid tri (ethane acrylate), pentathritol tetraacrylate, ethoxylated pentathritol tetraacrylate, propoxylation Pentathritol tetraacrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol polyacrylate, triallyl isocyanurate, glycidyl methacrylate, glycidyl ali Ether, 1,3,5-triacryloylhexahydro-s-triazine, triallyl1,3,5-benzenecarboxylate, triallylamine, triallyl citrate, triallyl phosphate, arborbital, diallylamine, diallyldimethylsilane, diallyl Disulfide, diallyl ether, zalyl sialate, diallyl isophthalate, diallyl terephthalate, 1,3-dialyloxy-2-propanol, diallyl sulfide diallyl maleate, 4,4′-isopropylidene diphenol dimethacrylate, 4,4′-isopropyl Redene diphenol diacrylate and the like are preferable, but are not limited thereto. In particular, the repeating unit of EO (ethylene oxide) contained in one molecule of diacrylate or methacrylate is preferably in the range of 2-50, more preferably 2-40. By using an EO repeating unit in the range of 2 to 50, the solubility of the photosensitive resin composition in an aqueous developer typified by an alkaline aqueous solution is improved, and the development time is shortened. Furthermore, it is difficult for stress to remain in the cured film obtained by curing the photosensitive resin composition. For example, among the printed wiring boards, when laminated on a flexible printed wiring board based on a polyimide resin, curling of the printed wiring board is prevented. Features such as being able to be suppressed.

In particular, it is particularly preferable to use the EO-modified diacrylate or dimethacrylate together with an acrylic resin having 3 or more acrylic groups or methacrylic groups in order to improve developability. For example, ethoxylated isocyanuric acid EO-modified triacrylate, Ethoxylated isocyanuric acid EO modified trimethacrylate, ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol tri Acrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, ditrimethyl Propanetetraacrylate, ditrimethylolpropane tetraacrylate, propoxylated pentaerythritol tetraacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, 2,2,2-trisacryloyloxymethyl ethyl succinic acid, 2,2, 2-trisacryloyloxymethylethylphthalic acid, propoxylated ditrimethylolpropane tetraacrylate, propoxylated dipentaerythritol hexaacrylate, ethoxylated isocyanuric acid triacrylate, ε-caprolactone modified tris- (2-acryloxyethyl) isocyanurate, Caprolactone-modified ditrimethylolpropane tetraacrylate,
The following general formula (5)

（式中、ａ＋ｂ＝６、ｎ＝１２である。）で表される化合物、
下記一般式（６）

(Wherein, a + b = 6, n = 12.)
The following general formula (6)

（式中、ａ＋ｂ＝４、ｎ＝４である。）で表される化合物、
下記式（７）

(Wherein a + b = 4 and n = 4),
Following formula (7)

で表される化合物、
下記一般式（８）

A compound represented by
The following general formula (8)

（式中、ｍ＝１、ａ＝２、ｂ＝４もしくは、ｍ＝1、ａ＝３、ｂ＝３もしくは、ｍ＝１、ａ＝６、ｂ＝０もしくは、ｍ＝２、ａ＝６、ｂ＝０である。）で表される化合物、
下記一般式（９）

(Where m = 1, a = 2, b = 4, or m = 1, a = 3, b = 3, or m = 1, a = 6, b = 0, or m = 2, a = 6 B = 0).)
The following general formula (9)

（式中、ａ＋ｂ＋ｃ＝３.６である。）で表される化合物、
下記式（１０）

(Wherein a + b + c = 3.6),
Following formula (10)

で表される化合物、
下記一般式（１１）

A compound represented by
The following general formula (11)

（式中、ｍ・ａ＝３、ａ＋ｂ＝３、ここで「ｍ・ａ」は、ｍとａとの積である。）で表される化合物等のアクリル樹脂が好適に用いられる。

An acrylic resin such as a compound represented by the formula (where m · a = 3, a + b = 3, where “m · a” is a product of m and a) is preferably used.

  In addition, hydroxyl groups in the molecular structure skeleton such as 2-hydroxy-3-phenoxypropyl acrylate, monohydroxyethyl acrylate phthalate, ω-carboxy-polycaprolactone monoacrylate, acrylic acid dimer, pentaerythritol tri and tetraacrylate, Those having a carbonyl group are also preferably used.

  In addition, any photosensitive resin such as an epoxy-modified acrylic (methacrylic) resin, a urethane-modified acrylic (methacrylic) resin, or a polyester-modified acrylic (methacrylic) resin may be used.

  In addition, although it is also possible to use 1 type as a photosensitive resin, using 2 or more types together is preferable when improving the heat resistance of the cured film after photocuring.

  (B) component in the photosensitive resin composition of this invention is mix | blended so that (B) component may be 0.1-500 weight part with respect to 100 weight part of solid content of (A) component. It is preferable that 10 to 300 parts by weight are contained.

  When the photosensitive resin of the component (B) is less than the above range, the heat resistance of the cured film after photocuring the photosensitive resin composition is lowered, and the contrast when exposed and developed is difficult to be applied. Therefore, it may not be preferable. For this reason, it is possible to set the resolution at the time of exposure / development to an optimal range by setting the value within the above range.

<(C) Photopolymerization initiator>
The (C) photopolymerization initiator in the present invention is a compound that is activated by energy such as UV and starts and accelerates the reaction of the photosensitive resin. Examples of the (C) photopolymerization initiator include Mihilaz ketone, 4,4′-bis (diethylamino) benzophenone, 4,4 ′, 4 ″ -tris (dimethylamino) triphenylmethane, and 2,2 ′. -Bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-diimidazole, acetophenone, benzoin, 2-methylbenzoin, benzoin methyl ether, benzoin ethyl ether, Benzoin isopropyl ether, benzoin isobutyl ether, 2-t-butylanthraquinone, 1,2-benzo-9,10-anthraquinone, methylanthraquinone, thioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 1- Hydroxycyclohexyl phenyl ketone, diacetylbenzyl, benzyldimethyl Ketal, benzyldiethylketal, 2 (2′-furylethylidene) -4,6-bis (trichloromethyl) -S-triazine, 2 [2 ′ (5 ″ -methylfuryl) ethylidene] -4, 6-bis (trichloromethyl) -S-triazine, 2 (p-methoxyphenyl) -4,6-bis (trichloromethyl) -S-triazine, 2,6-di (p-azidobenzal) -4-methylcyclohexanone, 4,4′-diazidochalcone, di (tetraalkylammonium) -4,4′-diazidostilbene-2,2′-disulfonate, 2,2-dimethoxy-1,2-diphenylethane-1-one 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy)- Enyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2- Dimethylamino-1- (4-morpholinophenyl) -butane-1, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4- Trimethyl-pentylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, bis (n5-2,4-cyclopentadiene -1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, 1,2- Kutanonedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], iododium, (4-methylphenyl) [4- (2-methylpropyl) phenyl] -hexafluorophosphate (1 -), Ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1 -(O-acetyloxyome) etc. are mentioned. The photopolymerization initiator is desirably selected as appropriate, and it is desirable to use a mixture of one or more.

  In the photosensitive resin composition of the present invention, the component (A), the component (B) and the component (C) are the component (C) with respect to 100 parts by weight of the total solid content of the component (A) and the component (B). However, it is preferable to mix | blend so that it may become 0.1-50 weight part.

  The blending ratio is preferable because various properties (such as electrical insulation reliability) of the cured product and insulating film finally obtained are improved.

  (C) When there are few photoinitiators than the said range, the hardening reaction of the acrylic resin at the time of light irradiation hardly occurs, and hardening may become inadequate in many cases. Moreover, when there is too much, adjustment of light irradiation amount becomes difficult and may be in an overexposure state. Therefore, in order to advance the photocuring reaction efficiently, it is preferable to adjust within the above range.

<(D) Isocyanate compound (block isocyanate)>
The isocyanate compound (block isocyanate) as component (D) means an isocyanate compound whose isocyanate group is stabilized with a blocking agent such as oximes, diketones, phenols, caprolactams and the like. The blocked isocyanate compound is a compound that is inactive at room temperature, and is heated to dissociate a blocking agent such as oximes, diketones, phenols, caprolactams, and regenerate isocyanate groups. Product names Duranate 17B-60PX, Duranate TPA-B80E, Duranate MF-B60X, Duranate MF-K60X, Duranate E402-B80T manufactured by Asahi Kasei Chemicals Co., Ltd. Trade names Takenate B-830, Takenate B- 815N, Takenate B-846N, Takenate B-882N, trade names Coronate AP-M, Coronate 2503, Coronate 2507, Coronate 2513, Coronate 2515, Million Over preparative MS-50 and the like. In particular, the blocked isocyanate compound suitably used in the present invention is a block isocyanate compound such as a hexamethylene diisocyanate type isocyanurate type, biuret type, adduct type, etc., in which the dissociation temperature of the blocking agent is 160 ° C. or less, hydrogenated diphenylmethane diisocyanate type, water It is an additive xylylene diisocyanate block isocyanate compound.

  It is preferable to use the above-mentioned blocked isocyanate compound because high adhesiveness can be imparted to the cured film obtained when the photosensitive resin composition is cured.

  These isocyanate compounds can be used alone or in combination of two or more.

  The use amount of the above-mentioned blocked isocyanate is 100 parts by weight of the total weight of the polyimide precursor having the amide bond in addition to the polyamic acid part partially imidized as the component (A) and the photosensitive resin as the component (B). On the other hand, it is preferably in the range of 1 to 100 parts by weight, more preferably in the range of 1 to 50 parts by weight, and particularly preferably in the range of 1 to 40 parts by weight.

  When the said block isocyanate exceeds 100 weight part, since stickiness may be seen in the photosensitive resin composition of the B stage state mentioned later, it is unpreferable. Moreover, when 1 weight part or more of block isocyanate is contained, since it reacts with the hydroxyl group and carboxyl group which are the hydrophilic groups which remain | survive in the photosensitive resin composition, it is preferable.

<(E) Flame retardant>
In this invention, in addition to (A)-(D) component, in order to provide a flame retardance, a "flame retardant" can be added. “Flame retardant” means a substance that acts to make a flammable substance difficult to burn by adding or reacting with a flammable substance such as plastic, wood, or fiber. Although it does not specifically limit as said flame retardant, Phosphorus ester, condensed phosphate ester, phosphine oxide, phosphine, phosphorus-type flame retardants, such as a phosphazene compound having a phosphorus-nitrogen double bond, the content of aromatic rings Examples thereof include high silicone compounds. Among these flame retardants, one kind or a combination of two or more kinds may be used. In the present invention, the phosphorus-based flame retardant refers to a compound containing phosphorus such as a phosphate ester, a condensed phosphate ester, a phosphine oxide, a phosphine, and a phosphazene compound.

  From the viewpoint of compatibility with the photosensitive resin composition and flame retardancy, it is preferable to use a condensed phosphate ester and a phosphazene compound phosphorus flame retardant.

  Examples of the condensed phosphate ester include CR-733S (resorcinol diphosphate) (manufactured by Daihachi Chemical), CR-741 (manufactured by Daihachi Chemical), CR-747 (manufactured by Daihachi Chemical), and PX-200 ( Daihachi Chemical Co., Ltd.), and the phosphazene compounds include SPE-100 (Otsuka Chemical Co., Ltd.), SPH-100 (Otsuka Chemical Co., Ltd.), and the like.

  The amount of the flame retardant used is a partially imidized component (A), a polyimide precursor having an amide bond other than the polyamic acid moiety, and a total weight of 100 parts by weight of the photosensitive resin (B). On the other hand, it is preferably in the range of 1 to 100 parts by weight, more preferably in the range of 1 to 50 parts by weight, and particularly preferably in the range of 1 to 40 parts by weight.

  If the flame retardant is less than 1 part by weight, a sufficient flame retardant effect may not be obtained. On the other hand, if it exceeds 100 parts by weight, stickiness may be seen in the photosensitive resin composition in the B-stage state described later, and the physical properties of the cured product may be adversely affected.

<(F) Other ingredients>
In addition to the components (A) to (E), the photosensitive resin composition of the present invention may contain other components as the component (F) as necessary. Examples of other components include an epoxy resin, a curing accelerator and / or a curing agent, a polymerization inhibitor, a stabilizer, an antioxidant, and an adhesion imparting agent.

(Epoxy resin)
By using an epoxy resin, the adhesiveness with respect to copper foil, a polyimide film, etc. can be improved to the photosensitive dry film resist produced.

  Although it does not specifically limit as said epoxy resin, For example, bisphenol A type epoxy, such as product name Epicoat 828,834,1001,1002,1003,1004,1005,1007,1010,1100L (Japan Epoxy Resin Co., Ltd. product), etc. Resins, product names ESCN-220L, 220F, 220H, 220HH, 180H65 (Japan Epoxy Resin Co., Ltd.) and other o-cresol novolak type epoxy resins, product names EPPN-502H (Nippon Kayaku Co., Ltd.), etc. Trishydroxyphenylmethane type epoxy resin, naphthalene aralkyl novolak type epoxy resin such as product name ESN-375, novolak type epoxy resin such as product name ESN-185 (Nippon Steel Chemical Co., Ltd.), biphenol type such as product name YX4000H Epoxy resin I can make it.

  In addition to the above, bisphenol A glycidyl ether type epoxy resin, bisphenol F glycidyl ether type epoxy resin, novolac glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, cyclic aliphatic epoxy resin, aromatic type An epoxy resin, a halogenated epoxy resin, or the like may be used.

  The epoxy resin may be used alone or in combination of two or more. In addition, it is preferable to use the said epoxy resin within the range of 1-100 weight part as needed with respect to 100 weight part of (A) component, and it is more preferable to use within the range of 0-50 weight part, It is particularly preferable to use within the range of 1 to 30 parts by weight. If the epoxy resin exceeds 30 parts by weight with respect to 100 parts by weight of the component (A), the flex resistance may be lowered.

(Curing accelerator and / or curing agent)
When an epoxy resin is used as the material of the photosensitive resin composition, a curing accelerator and / or a curing agent is added to the photosensitive resin composition in order to efficiently cure the photosensitive dry film resist to be produced. Also good. Although it does not specifically limit as such a hardening accelerator and / or a hardening | curing agent, For example, in order to cure | harden an epoxy resin efficiently, an imidazole type compound, an acid anhydride, a tertiary amine, hydrazines And aromatic amines, phenols, triphenylphosphines, and organic peroxides. What is necessary is just to use 1 type or in combination of 2 or more types among these hardening accelerators and / or hardening agents.

  The amount of the curing accelerator and / or curing agent used is preferably in the range of 0.1 to 20 parts by weight, and in the range of 0.5 to 20 parts by weight with respect to 100 parts by weight of component (A). More preferably, it is particularly preferably in the range of 0.5 to 15 parts by weight. When the curing accelerator and / or curing agent is less than 0.1 part by weight with respect to 100 parts by weight of component (A), the epoxy resin is not sufficiently cured, and conversely, if it exceeds 20 parts by weight, heat resistance May cause a decrease in

(Polymerization inhibitor, stabilizer, antioxidant)
The photosensitive resin composition of the present invention has a photopolymerizable / thermopolymerizable functional group such as a vinyl group, an acryl group or a methacryl group contained in the photosensitive resin of the component (A) and / or the component (B). In order to prevent a crosslinking reaction during storage of the photosensitive resin composition and the photosensitive dry film resist, at least one polymer additive selected from the group consisting of a polymerization inhibitor, a stabilizer and an antioxidant is added. It is preferable to do.

  The polymerization inhibitor is not particularly limited as long as it is generally used as a polymerization inhibitor or a polymerization inhibitor. The stabilizer is not particularly limited as long as it is generally known as a heat stabilizer or a light stabilizer. The antioxidant is not particularly limited as long as it is generally used as an antioxidant or a radical scavenger.

  The above polymerization inhibitor, stabilizer and antioxidant are not necessarily separate compounds, and one compound may be used as a polymerization inhibitor or an antioxidant.

  As a polymer additive selected from the group consisting of a polymerization inhibitor, a stabilizer and an antioxidant in the present invention, a polymerization inhibitor, a polymerization inhibitor, a heat stabilizer, a light stabilizer, an antioxidant, and a radical scavenger are generally used. Although it will not specifically limit if it is used as an agent, For example, hydroquinone, methyl hydroquinone, 2,5-di-t-butyl hydroquinone, t-butyl hydroquinone, 2,5-bis (1,1,3, 3-tetramethylbutyl) hydroquinone (trade name DOHQ, manufactured by Wako Pure Chemical Industries, Ltd.), 2,5-bis (1,1-dimethylbutyl) hydroquinone (trade name DHHQ, manufactured by Wako Pure Chemical Industries, Ltd.), etc. Hydroquinone compounds; benzoyl such as p-benzoquinone, methyl-p-benzoquinone, t-butylbenzoquinone, 2,5-diphenyl-p-benzoquinone Compound: pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] (trade name: Irganox 1010, manufactured by Ciba Specialty Chemicals), N, N ′ -Hexane-1,6-diylbis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionamide] (manufactured by the company, trade name: Irganox 1098), 1,3,5-tris ( 3,5-di-t-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione (product name: Irganox 3114), hydroxy Hindered phenol compounds such as phenol benzotriazole (trade name Adeka AO-20 manufactured by Asahi Denka Kogyo Co., Ltd.); 2- (2H-benzotriazole- -Il) -p-; Benzotriazole compounds such as Cresol (Ciba Specialty Chemicals, trade name TINUVIN P); N-nitrosophenylhydroxylamine (Wako Pure Chemical Industries, trade name) Nitrosamine compounds such as Q-1300) and N-nitrosophenylhydroxylamine aluminum salt (trade name Q-1301 manufactured by Wako Pure Chemical Industries, Ltd.); organic sulfur compounds such as phenothiazine, dithiobenzoyl sulfide and dibenzyltetrasulfide; Bis (1,2,2,6,6-pentamethyl-4-piperidyl) [{3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl} methyl] butyl malonate (Ciba Special Hindered amine compounds such as Tea Chemicals Co., Ltd., trade name Irganox 144) Aromatic aromatic amines such as p-phenylenediamine (commonly called paramine) and N, N-diphenyl-p-phenylenediamine; tris (2,4-di-t-butylphenyl) phosphite (trade name, Irganox 168, manufactured by the same company); Phosphorus compounds such as tetrakis (2,4-di-t-butylphenyl) [1,1-biphenyl] -4,4′-diylbisphosphonate (product name: Irganox P-EPQ) Can be mentioned.

  Particularly preferred are hydroquinone compounds, hindered phenol compounds, nitrosamine compounds, and aromatic amines. By using these compounds, the crosslinking reaction of the photopolymerizable / thermopolymerizable functional group can be prevented, so that the viscosity of the organic solvent solution of the photosensitive resin composition increases during storage of the photosensitive resin composition. Since there is also an antioxidant effect, the resin can be prevented from deteriorating, and the long-term heat resistance and hydrolysis resistance of the photosensitive resin composition can be improved.

(Adhesion imparting agent)
In order to improve the adhesion to a substrate such as a polyimide film or metal, a known so-called adhesion imparting agent may be added.

  Such an adhesion promoter is not particularly limited, and examples thereof include benzimidazole, benzoxazole, benzthiazole, triazole, and a silane coupling agent.

<(G) Organic solvent>
In the present invention, in addition to the components (A) to (F), an organic solvent can be mixed. (G) Examples of the organic solvent include sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, methyl monoglyme (1,2-dimethoxyethane), methyl diglyme (bis (2-methoxyether) ether), and methyl triglyme. (1,2-bis (2-methoxyethoxy) ethane), methyltetraglyme (bis [2- (2-methoxyethoxyethyl)] ether), ethyl monoglyme (1,2-diethoxyethane), ethyldiglyme Symmetrical glycol diethers such as (bis (2-ethoxyethyl) ether) and butyldiglyme (bis (2-butoxyethyl) ether), γ-butyrolactone, methyl acetate, ethyl acetate, isopropyl acetate, n-propyl acetate, Butyl acetate, propylene glycol monomethyl Ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate (also known as carbitol acetate, 2- (2-butoxyethoxy) ethyl acetate), diethylene glycol monobutyl ether acetate, 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, Acetates such as ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol diacetate, 1,3-butylene glycol diacetate, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol n-propyl Ether, dipropylene glycol n-propyl ether , Propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n-propyl ether, propylene glycol phenyl ether, dipropylene glycol dimethyl ether, 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol mono Examples thereof include ethers such as butyl ether and ethylene glycol monoethyl ether, and these can be used alone or in combination of two or more.

  The component (G) in the photosensitive resin composition of the present invention is 100 parts by weight of the sum of the component (A), the component (B), the component (C), and the component (D) and the component (E) as necessary. On the other hand, it is 10 to 400 parts by weight, more preferably 20 to 200 parts by weight, and particularly preferably 40 to 100 parts by weight.

  It is preferable to adjust the amount of the component (G) within the above range because the viscosity and viscosity of the photosensitive resin composition can be adjusted within a range suitable for coating such as screen printing.

  When the component (G) is less than the above range, the viscosity of the photosensitive resin composition becomes very high, coating becomes difficult, and foam entrainment and leveling may be inferior during coating. Moreover, when there are more (G) components than the said range, the viscosity of the photosensitive resin composition will become very low, coating will become difficult and it may be inferior to the coverage of a circuit.

  In the photosensitive resin composition of the present invention, additives such as an antifoaming agent, a leveling agent, a colorant, an adhesion imparting agent, and a polymerization inhibitor can be used as necessary. These additives are not particularly limited. For example, as an antifoaming agent, a silicon compound, an acrylic compound, as a leveling agent, a silicon compound, an acrylic compound, and as a colorant, a phthalocyanine compound, Examples of the azo compound, carbon black, titanium oxide, and adhesion imparting agent include silane coupling agents, triazole compounds, tetrazole compounds, triazine compounds, and polymerization inhibitors include hydroquinone and hydroquinone monomethyl ether. These can be used alone or in combination of two or more.

  The photosensitive resin composition of the present invention is obtained by uniformly mixing the components (A) to (G). As a method of uniformly mixing, for example, a general kneading apparatus such as a three roll or bead mill apparatus may be used for mixing. Moreover, when the viscosity of a solution is low, you may mix using a general stirring apparatus.

  The photosensitive resin composition of the present invention can form a pattern as follows. First, the photosensitive resin composition is applied onto a substrate and dried to remove the organic solvent. The substrate can be applied by screen printing, roller coating, curtain coating, spray coating, spin coating using a spinner, or the like. The coating film (preferably having a thickness of 5 to 100 μm) is dried at 120 ° C. or lower, preferably 40 to 100 ° C. After drying, a negative photomask is placed on the dried coating film and irradiated with actinic rays such as ultraviolet rays, visible rays, and electron beams. Next, the pattern can be obtained by washing the unexposed portion with a developing solution using various methods such as shower, paddle, dipping or ultrasonic waves. Since the time until the pattern is exposed varies depending on the spray pressure and flow velocity of the developing device and the temperature of the developer, it is preferable to find the optimum device conditions as appropriate.

  As the developer, an aqueous alkali solution is preferably used. The developer is water-soluble such as methanol, ethanol, n-propanol, isopropanol, N-methyl-2-pyrrolidone and the like. An organic solvent may be contained. Examples of the alkaline compound that gives the alkaline aqueous solution include hydroxides, carbonates, hydrogen carbonates, amine compounds, and the like of alkali metals, alkaline earth metals, or ammonium ions, specifically sodium hydroxide. , Potassium hydroxide, ammonium hydroxide, sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, potassium bicarbonate, ammonium bicarbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetraisopropylammonium Hydroxide, N-methyldiethanolamine, N-ethyldiethanolamine, N, N-dimethylethanolamine, triethanolamine, triisopropanolamine, trii Propylamine and the like, aqueous solution compound other than this as long as it exhibits basicity can also be used.

  The concentration of the alkaline compound that can be suitably used in the development step of the photosensitive resin composition of the present invention is preferably 0.01 to 10% by weight, particularly preferably 0.05 to 5% by weight. preferable. Further, the temperature of the developer depends on the composition of the photosensitive resin composition and the composition of the developer, and is generally 0 ° C. or higher and 80 ° C. or lower, more generally 20 ° C. or higher and 50 ° C. or lower. It is preferable to use it.

  The pattern formed by the development step is rinsed to remove unnecessary developer residue. Examples of the rinsing liquid include water and acidic aqueous solutions.

  Next, a cured film rich in heat resistance and flexibility can be obtained by performing heat curing treatment. Although a cured film is determined in consideration of wiring thickness etc., it is preferable that thickness is about 2-50 micrometers. The final curing temperature at this time is desired to be cured by heating at a low temperature for the purpose of preventing oxidation of the wiring and the like and not reducing the adhesion between the wiring and the substrate. The heat curing temperature at this time is preferably 100 ° C. or higher and 250 ° C. or lower, more preferably 120 ° C. or higher and 200 ° C. or lower, and particularly preferably 130 ° C. or higher and 190 ° C. or lower. When the final heating temperature becomes high, the wiring may be oxidized and deteriorated.

  A pattern comprising a cured film formed from the photosensitive resin composition of the present invention is excellent in heat resistance, flame retardancy, electrical and mechanical properties, and is particularly excellent in flexibility. For example, the insulating film of the present invention preferably has a thickness of about 2 to 50 μm and a resolution of at least 10 μm after photocuring, and particularly a resolution of about 10 to 1000 μm. For this reason, the insulating film of the present invention is particularly suitable as an insulating material for a high-density flexible substrate. Furthermore, it is used for various photo-curing type wiring coating protective agents, photosensitive heat-resistant adhesives, electric wire / cable insulation coatings, and the like.

  After uniformly coating the photosensitive resin composition solution of the present invention on a support film such as PET, heating and / or hot air spraying is performed, and the photosensitive resin composition solution is dried, that is, the photosensitive resin composition solution. The organic solvent is removed to form a photosensitive dry film resist in which the photosensitive resin composition is in the form of a film. The photosensitive dry film resist obtained from the photosensitive resin composition of the present invention is subjected to thermocompression treatment such as thermal laminating treatment on the printed wiring board, and after embedding the pattern circuit of the printed wiring board, exposure processing, development, thermosetting It is also possible to produce a printed wiring board with an insulating film in which an insulating film made of the photosensitive resin of the present invention, which exhibits good characteristics by performing the treatment, is coated on the printed wiring board.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.

  In addition, evaluation of molecular weight, adhesiveness of photosensitive resin composition or photosensitive dry film resist, solder heat resistance, photosensitivity, migration resistance, warpage, flame resistance, solvent resistance and flexibility in Examples and Comparative Examples The law is as follows.

(Molecular weight measurement method)
The molecular weight was measured using a high-speed GPC (trade name HLC-8220GPC, manufactured by Tosoh Corporation). Measurement conditions were DMF (0.036M LiBr, 0.019M phosphoric acid included) as a developing solvent, a column manufactured by Shodex, trade name: KD-805-M, a column temperature of 40 ° C., and a detector. PI (PEO standard) was used, and the flow rate was 0.6 ml / min.

[Adhesion]
A photosensitive resin composition dissolved in dimethylformamide is applied to a PET film (thickness 25 μm) on a PET film (thickness 25 μm) so that the thickness after drying is 25 μm. Was removed to obtain a photosensitive dry film resist (drying conditions were 10 minutes at 100 ° C.). Polyimide film Apical 25 NPI (manufactured by Kaneka) and a photosensitive dry film resist were combined and laminated under the conditions of 110 ° C. and 20000 Pa · m. Subsequently, 400 m light was exposed by 300 mJ / cm 2, and then the PET film was peeled off and heated at 180 ° C. for 2 hours to obtain a laminate. About this laminated body, adhesiveness evaluation was performed according to the test of the crosscut peel of IPC TM650 2.4.28.1, and as a result, the number remaining in 100 was described (if all remained, 100 Described as individual.).

[Solder heat resistance]
A photosensitive dry film resist prepared in the same manner as in the above <Adhesion> was laminated to a bright surface of an electrolytic copper foil (3EC-VLP made by Mitsui Kinzoku) at 100 ° C. and 20000 Pa · m. Subsequently, 400 m light was exposed by 300 mJ / cm 2, and then the PET film was peeled off and heated at 180 ° C. for 2 hours to obtain a laminate. The laminate was conditioned at 40 ° C. and 95% RH for 24 hours, and then immersed in a solder bath at 270 ° C. for 10 seconds, and the presence or absence of surface swelling and discoloration was observed. If there was no blistering or discoloration, it was marked with ◯, and if there was a change, it was marked with ×.

[Photosensitivity]
Photosensitive dry film resist prepared in the same way as the above <Adhesion> is laminated on the bright surface of electrolytic copper foil (3EC-VLP made by Mitsui Kinzoku) and laminated at 100 ° C. and 20000 Pa · m while shielding light. A laminated body was obtained.

  A mask pattern was placed on the laminate, 400 nm light was exposed by 300 mJ / cm 2, and developed with a 1 wt% aqueous sodium carbonate solution (liquid temperature 35 ° C.). The photomask pattern depicts fine holes of 500 μmφ, 200 μmφ, and 100 μmφ and lines having a line / space of 500 μm / 500 μm, 200 μm / 200 μm, and 100 μm / 100 μm. The pattern formed by development was then washed with distilled water to remove the developer. If a fine hole of 100 μmφ and a line / space of 100 μm / 100 μm were drawn, the pattern formed by development was then washed with distilled water to remove the developer. If fine holes of 500 μmφ and lines / spaces of 500 μm / 500 μm were drawn, Δ was marked, and if not fine, x was marked.

[Migration resistance]
Combin pattern of line / space = 100 / 100μm on Nippon Steel Chemical's flexible copper-clad laminate (single-sided copper-clad laminate with a copper foil on one side of a polyimide resin: SC18-25-00FR) Formed.

  On this comb pattern, a photosensitive dry film resist prepared in the same manner as in the above item <Adhesion> was superposed and laminated at 100 ° C. and 20000 Pa · m. Subsequently, 400 nm light was exposed by 400 mJ / cm 2, and then the PET film was peeled off and heated at 180 ° C. for 2 hours to obtain a laminate.

In an environmental test machine at 85 ° C. and 85% RH, a DC voltage of 60 V was applied to both terminals of the comb pattern covered with the obtained laminate, and changes in resistance and presence / absence of migration were observed.
○: A resistance value of 10 8 or more in 1000 hours after the start of the test and no occurrence of migration, dendrite, etc. ×: An occurrence of migration, dendrite, etc. in 1000 hours after the start of the test

〔warp〕
A photosensitive dry film resist prepared in the same manner as in the above <Adhesion> was combined with polyimide film Apical 25 NPI (manufactured by Kaneka) and laminated under the conditions of 110 ° C. and 20000 Pa · m. Subsequently, 400 m light was exposed by 300 mJ / cm 2, and then the PET film was peeled off and heated at 180 ° C. for 2 hours to obtain a laminate. This laminate was cut into 5 cm pieces to obtain 5 cm × 5 cm test samples. After leaving the test sample in an environment of 23 ° C. and 65% RH for 24 hours, place the photosensitive dry film resist side up on a flat table, and measure the maximum height of the part that has been warped from the table with a ruler. Warpage (mm) was used. A warp of 5 mm or less was regarded as an acceptable line.

〔Flame retardance〕
A photosensitive dry film resist prepared in the same manner as the above <Photosensitivity> was laminated on polyimide film Apical 25 NPI (manufactured by Kaneka) and laminated under the conditions of 110 ° C. and 20000 Pa · m. Subsequently, 400 nm light was exposed by 300 mJ / cm 2, the PET film was peeled off, and heated at 180 ° C. for 2 hours to obtain a laminate. This laminate was tested according to the UL94 thin material vertical combustion test (VTM-0). VTM-0 equivalent was marked with ◯, and non-corresponding with x.

[Solvent resistance]
Photosensitive dry film resist prepared in the same way as the above <Adhesion> is laminated on the bright surface of electrolytic copper foil (3EC-VLP made by Mitsui Kinzoku) and laminated at 100 ° C. and 20000 Pa · m while shielding light. A laminated body was obtained. A mask pattern (3-cm square black square) is placed on the laminate, 400 nm light is exposed by 300 mJ / cm2, and then the PET film is peeled off and developed with a 1 wt% sodium carbonate aqueous solution (liquid temperature 35 ° C). And it heated at 180 degreeC for 2 hours, and obtained the laminated body of the pattern in which the 3 cm square photosensitive resin remained in copper foil. This laminate was immersed in a methyl ethyl ketone solution for 15 minutes at room temperature and then taken out and observed. The case where the thickness of the film was reduced by 5% or more was evaluated as x, and the case where the thickness was not decreased was evaluated as ◯.

[Flexibility]
A cured film laminated film of a photosensitive resin composition was prepared on the surface of a polyimide film having a thickness of 25 μm (Apical 25NPI manufactured by Kaneka Corporation) in the same manner as in the above item <Adhesion>. The cured film laminated film was cut into a 30 mm × 10 mm strip, bent 10 times at 180 ° at 15 mm, and the coating film was visually confirmed to check for cracks.
○: The cured film has no cracks Δ: The cured film has some cracks ×: The cured film has cracks

[Synthesis Example 1]
<Synthesis of a dicarboxylic acid compound having a polycarbonate diol residue>
In a four-necked flask equipped with a stirrer, a cooling pipe with an oil / water separator, a nitrogen inlet pipe and a thermometer, 200.0 g (0.10 mol) of polycarbonate diol (manufactured by Asahi Kasei Co., Ltd .: trade name PCDL T5652, the following general formula The polycarbonate diol represented by (12), having an average molecular weight of 2000) and 29.22 g (0.20 mol) of adipic acid, heated to 200 ° C. over 2 hours, reacted for 3 hours and then cooled. 225 g of a dicarboxylic acid compound having a polycarbonate diol residue with an acid value of 49.6 mg KOH / g and a molecular weight of 2260 was obtained.

（式中、ｑ、ｒ、ｓは１以上の整数である。）

(In the formula, q, r, and s are integers of 1 or more.)

<Synthesis of an imide oligomer having an amide bond other than the polyamic acid moiety>
113.0 g (0.05 mol) of dicarboxylic acid compound having the above polycarbonate diol residue, 17.41 g (0.10 mol) of coronate T80 (tolylene diisocyanate: TDI: manufactured by Nippon Polyurethane Industry Co., Ltd.), 84 g of methyl triglyme And reacted at 140 ° C. for 4 hours. Next, 64.45 g (0.2 mol) of benzophenone tetracarboxylic dianhydride (BTDA: manufactured by Daicel Chemical Industries) was added and reacted at 200 ° C. for 3 hours to obtain an imide oligomer having an amide bond other than the polyamic acid moiety. .

<Synthesis of (A) component partially imidized polyimide precursor having an amide bond other than the polyamic acid site>
The above solution was cooled and 105 g of dimethylformamide (hereinafter abbreviated as DMF) 1,3-bis (3-aminophenoxy) benzene 43.85 g (0.15 mol, APB: manufactured by Mitsui Chemicals, Inc.) 65.8 g Was dissolved in dimethylformamide, added over 1 hour, stirred for 2 hours, and partially imidized to obtain a polyimide precursor having an amide bond in addition to the polyamic acid moiety. The weight average molecular weight was 82,000, and the number average molecular weight was 27,000.

[Synthesis Example 2]
<Synthesis of dicarboxylic acid compound having polyalkylene glycol residue>
A flask equipped with a stirrer, reflux condenser, inert gas inlet, and thermometer was charged with PTG (polytetramethylene ether glycol, molecular weight 1,000); 1,000 g, sebacic acid; 405 g, over 2 hours. The temperature was raised to 200 ° C. and the reaction was further continued for 3 hours, followed by cooling to obtain a dicarboxylic acid compound having a polyalkylene glycol residue having an acid value of 81.9 and a molecular weight of 1,370.

<Synthesis of an imide oligomer having an amide bond other than the polyamic acid moiety>
137.0 g (0.10 mol) of the dicarboxylic acid compound having the polyalkylene glycol residue, 34.82 g (0.20 mol) of coronate T80 (tolylene diisocyanate: TDI: manufactured by Nippon Polyurethane Industry Co., Ltd.), methyltriglyme 197 .2 g was taken and reacted at 140 ° C. for 4 hours. Next, 124.08 g (0.4 mol) of 3,3 ′, 4,4′-oxydiphthalic dianhydride (ODPA: Manac Co., Ltd.) was added and reacted at 200 ° C. for 3 hours to amide bond other than the polyamic acid moiety. An imide oligomer having

<Synthesis of (A) component partially imidized polyimide precursor having an amide bond other than the polyamic acid site>
The above solution was cooled, 220.1 g of DMF was added, and 87.7 g (0.3 mol) of 1,3-bis (3-aminophenoxy) benzene (APB: Mitsui Chemicals, Inc.) was added to 131.6 g. It melt | dissolved in DMF, added over 1 hour, stirred for 2 hours, and obtained the polyimide precursor which has an amide bond other than the polyamic-acid part partially imidated. The weight average molecular weight was 95,000 and the number average molecular weight was 30000.

[Synthesis Example 3]
<Synthesis of dicarboxylic acid compound having polyalkylene glycol residue>
A flask equipped with a stirrer, a thermometer, a cooling pipe, a distilling pipe, and a nitrogen gas introduction pipe, 2000 parts by weight of polyoxypropylene diamine (trade name, Jeffamine D-2000, average molecular weight 2000, manufactured by Huntsman Corporation), Trimerit 384 parts by weight of acid anhydride was charged, and the temperature was raised to 200 ° C. over 1 hour while the condensed water produced as a by-product was azeotropically distilled off with toluene under nitrogen gas flow. The mixture was kept at the same temperature for 2 hours to complete the dehydrating imidization reaction, and then cooled to obtain a dicarboxylic acid compound having a polyalkylene glycol residue.

<Synthesis of an imide oligomer having an amide bond other than the polyamic acid moiety>
234.8 g (0.10 mol) of the dicarboxylic acid compound having a polyalkylene glycol residue, 41.25 g (0.2 mol) of norbornene diisocyanate, and 267 g of methyltriglyme were taken and reacted at 140 ° C. for 3 hours. Next, 124.08 g (0.4 mol) of 3,3 ′, 4,4′-oxydiphthalic dianhydride (ODPA: Manac Co., Ltd.) was added and reacted at 200 ° C. for 3 hours to amide bond other than the polyamic acid moiety. An imide oligomer having

<Synthesis of (A) component partially imidized polyimide precursor having an amide bond other than the polyamic acid site>
The above solution was cooled, 306.7 g of DMF was added, and 87.7 g (0.3 mol) of 1,3-bis (3-aminophenoxy) benzene (APB: manufactured by Mitsui Chemicals, Inc.) was added to 131.6 g of g. The polyimide precursor which melt | dissolved in DMF, added over 1 hour, stirred for 2 hours, and was partially imidized and which has an amide bond other than a polyamic-acid site | part was obtained. The weight average molecular weight was 75,000 and the number average molecular weight was 26000.

[Examples 1-7]
<Preparation of photosensitive resin composition>
(A) Partially imidized obtained in Synthesis Examples 1 to 3, a polyimide precursor having an amide bond in addition to the polyamic acid site, (B) a photosensitive resin, (C) a photopolymerization initiator, (D) A photosensitive resin composition was prepared by adding an isocyanate compound (block isocyanate), (E) a flame retardant, (F) other components, and (G) an organic solvent. Table 1 shows the blending amount of each constituent raw material in the resin solid content and the kind of the raw material. The evaluation results of the photosensitive resin composition are shown in Table 2.

[Comparative Example 1]
In a reactor (with a stirrer, a reflux condenser and a nitrogen introduction tube), under nitrogen atmosphere, 135 g of N, N-dimethylacetamide and 135 g of diethylene glycol dimethyl ether were combined with 67.16 g of 0,4'-bis (3-aminophenoxy) biphenyl (0 .1825 mol) was dissolved, and 53.214 g (0.1810 mol) of 3,3′-4,4′-biphenyltetracarboxylic dianhydride was added little by little as a dry solid while stirring. During this time, the temperature of the reactor was kept at 25 to 30 ° C., and stirring was continued in a nitrogen atmosphere for 20 hours after the addition to obtain a polyamic acid having a solid content of 30%.

  200 g of polyamic acid solution, 24 g of pentaerythritol triacrylate (Aronix M-305, manufactured by Toagosei Co., Ltd.), 6 g of polyethylene glycol 200 diacrylate (NKA-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), 4 g of IRUGACURE907 (manufactured by Ciba Geigy), Kayacure DETX ( Nippon Kayaku) 1g was mixed. The foam of the mixed solution was completely defoamed with a defoaming apparatus, and the physical properties of this composition were evaluated in the same manner as in Example 1. The results are listed in Table 3.

[Comparative Example 2]
A 3 L separable flask was equipped with a stirrer, a reflux condenser, a dropping funnel and a nitrogen introducing tank, and under a nitrogen atmosphere, 87.3 g of pyromellitic dianhydride (manufactured by Daicel Chemical Industries), N-methylpyrrolidone (Wako Pure Chemical Industries, Ltd.) 496 g (manufactured by Kogyo Co., Ltd.) was put into the flask, and the internal temperature was raised to 50 ° C. while stirring the flask. At that temperature, 92.0 g (an equivalent of amine 463) of modified amino silicone BY16-853U (manufactured by Toray Dow Corning Silicone) was added dropwise from the dropping funnel over 2 hours. After completion of the dropwise addition, stirring was continued for 1 hour at that temperature. Thereafter, the reaction temperature was cooled to 30 ° C. or lower, and after stirring, 87.7 g of 1,3-bis (3-aminophenoxy) benzene (manufactured by Mitsui Chemicals) was added and stirring was continued in a nitrogen atmosphere for a solid content of 35 A mass% polyamic acid solution was obtained.

  88.5 g of polyethylene glycol-modified bisphenol A dimethacrylate (FA321M: manufactured by Hitachi Chemical Co., Ltd.), 53.4 g of pentaerythritol triacrylate (M305: manufactured by Toagosei Co., Ltd.), and 2,4,6 as a photoinitiator. -10.7 g of trimethylbenzoyldiphenylphosphine oxide (SPEEDCURETPO: manufactured by Nippon Sebel Hegner) and 50.4 g of bisphenol A bis (diphenyl) phosphate (CR-741: manufactured by Daihachi Chemical Co., Ltd.) as a flame retardant were added at room temperature And stirring was carried out for 5 hours to obtain a brown viscous liquid. The viscosity of the solution was 15 Pa · s.

  The foam of the mixed solution was completely defoamed with a defoaming apparatus, and the physical properties of this composition were evaluated in the same manner as in Example 1. The results are listed in Table 3.

<1> Product name NK ester A-9300 (ethoxylated isocyanuric acid triacrylate) manufactured by Nakamura Chemical Co., Ltd.
<2> Product name NK ester BPE-1300 (bisphenol A EO-modified diacrylate) manufactured by Nakamura Chemical Co., Ltd. Molecular weight: 1684
<3> Product name of photopolymerization initiator manufactured by Ciba Specialty Chemicals <4> Block isocyanate manufactured by Asahi Kasei Chemicals Co., Ltd. Product name Duranate
TPA-B80E Solid Concentration 80% Ethyl Acetate Solution <5> Otsuka Chemical Product Name SPB-100 (phosphezene compound)
<6> Product name PX-200 (aromatic condensed phosphate ester) manufactured by Daihachi Chemical Industry
<7> Product name of flame retardant (special heat resistant aluminum hydroxide) manufactured by Naval Tech Co., Ltd. Average particle size: 0.9 μm Thermal decomposition start temperature: 350 ° C.
<8> Product name of flame retardant (phosphinic acid salt) manufactured by Clariant Co., Ltd. Average particle size: 2-3 μm Thermal decomposition start temperature: 300 ° C. or higher <9> Product of cresol novolac type polyfunctional epoxy resin manufactured by Dainippon Ink Co., Ltd. Name

Claims (7)

  A photosensitive resin composition comprising at least (A) a partially imidized polyimide precursor having an amide bond other than a polyamic acid site, (B) a photosensitive resin, and (C) a photopolymerization initiator. object.   The (A) polyimide precursor is reacted with a dicarboxylic acid compound having at least (a) a polycarbonate residue and / or a polyalkylene glycol residue and (b) a diisocyanate compound to synthesize a terminal isocyanate compound, and then (c 2. The photosensitive resin composition according to claim 1, which is obtained by reacting tetracarboxylic dianhydride to synthesize a terminal acid anhydride imide oligomer and further reacting with (d) a diamine compound.   3. The photosensitive resin composition according to claim 1, further comprising (D) an isocyanate compound (block isocyanate) in addition to the components (A), (B), and (C).   (A) Partially imidized polyimide precursor having an amide bond in addition to the polyamic acid moiety, (B) photosensitive resin and (C) photopolymerization initiator in the photosensitive resin composition (A) (C) The photopolymerization initiator is 0.1 to 0.1 parts by weight based on 100 parts by weight of the solid content in which the polyimide precursor having the amide bond other than the polyamic acid site and (B) the photosensitive resin is combined. It mix | blends so that it may become 50 weight part, The photosensitive resin composition of any one of Claims 1-3 characterized by the above-mentioned.   The resin film obtained by apply | coating at least the photosensitive resin composition of any one of Claims 1-4 to the base-material surface, and drying.   An insulating film obtained by curing the resin film according to claim 5.   The printed wiring board with an insulating film which coat | covered the insulating film of Claim 6 on the printed wiring board.