JP2008197545A - Flexible printed wiring board with insulating film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board with an insulating film formed by coating with a photosensitive resin composition which ensures a small warpage amount, excels in resistance to the heat of soldering, and can be cured at a low temperature. <P>SOLUTION: The flexible printed wiring board with the insulating film is obtained by forming a film on a flexible printed substrate on which wiring has been formed, by photo- and/or heat-curing the photosensitive resin composition prepared by mixing at least (A) a tetracarboxylic acid terminated siloxane imide oligomer, (B) a diamino compound, (C) a photosensitive resin, (D) a photopolymerization initiator and (E) a thermosetting resin. The photosensitive resin composition becomes a cured film and satisfies the following conditions (1)-(3); (1) it can be cured at ≤200°C, (2) it has resistance to the heat of soldering at 300°C/10 s/3 cycles, (3) it has a warpage index of ≤5 mm after application in a thickness of 25 μm on a surface of a polyimide film having a thickness of 25 μm and an elastic modulus of ≥4.0 GPa and drying. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible printed wiring board which can be cured at a low temperature, has a solder heat resistance at a high temperature, and has an insulating film with a small warp.

  Polyimide resins are used for electrical and electronic applications because of their excellent heat resistance, electrical insulation and chemical resistance, and excellent mechanical properties. For example, insulating films and protective coating agents on semiconductor devices, flexible printed wiring boards and rigid printed wiring boards, surface protection materials such as integrated circuits, base resin, and interlayer insulating films for fine circuits Used when forming a protective film. In particular, when used as a coating material for flexible printed wiring, a cover lay film obtained by applying an adhesive to a molded body such as a polyimide film, a liquid liquid cover coat ink composed of an epoxy resin, etc. Has been used.

  On the other hand, as the liquid cover coat ink, a photosensitive cover coat ink (generally referred to as a solder resist) mainly composed of an epoxy resin or the like is used, but this ink is excellent in electrical insulation reliability as an insulating material. There are problems such as poor mechanical properties such as bending and, for example, large warpage, and it is difficult to use for flexible circuit boards.

  In recent years, a liquid cover coat ink using a polyimide resin has been proposed.

  For example, a photosensitive resin composition containing a polyimide resin using siloxane diamine has been proposed (see, for example, Patent Documents 1 and 2).

Furthermore, a photosensitive resin composition or a plasma etching resist using a terminal half-esterified imidosiloxane oligomer has been proposed (see, for example, Patent Documents 3 to 6).
JP 9-100350 A JP 2002-162740 A JP 2000-212446 A JP 2001-89656 A JP 2001-125273 A JP 2001-215702 A

However, the polyimide-type and polyamic acid-type cover coat inks of the above-mentioned Patent Documents 1 and 2 need to harden the structural skeleton of the polyimide resin in order to give solder heat resistance, and the thin film In the case of this polyimide film, there was a problem of curling.
Moreover, when the terminal half esterified imide siloxane oligomer described in patent documents 3-6 was used, there existed a problem that hardening at low temperature was difficult.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have at least (A) a terminal tetracarboxylic acid siloxane imide oligomer, (B) a diamino compound, (C) a photosensitive resin, (D) obtained by mixing a photopolymerization initiator and (E) a thermosetting resin, the following conditions:
(1) It can be cured at a temperature of 200 ° C. or lower.
(2) Solder heat resistance at 300 ° C./10 seconds / 3 cycles,
(3) A warp index of 5 mm or less after coating and drying to a thickness of 25 μm on a polyimide film surface having a thickness of 25 μm and an elastic modulus of 4.0 GPa or more,
The above-mentioned problem can be obtained by providing a flexible printed wiring board having an insulating film, wherein the photosensitive resin composition that forms a cured film satisfying the above conditions is formed by curing with light and / or heat. It turns out that it can be solved.

  Furthermore, the (A) terminal tetracarboxylic acid siloxane imide oligomer is a siloxane diamine represented by the following general formula (1):

（式中、Ｒ_１,Ｒ_２は炭素数１〜１２のアルキル基もしくは芳香族基であり、Ｒ_１,Ｒ_２は同一であっても異なっていても良い。ｍは１〜４０の整数、ｎは１〜２０の整数を示す。）
下記一般式（２）で示されるテトラカルボン酸二無水物及び水を、

(In the formula, R ₁ and R ₂ are alkyl groups or aromatic groups having 1 to 12 carbon atoms, and R ₁ and R ₂ may be the same or different. M is an integer of 1 to 40, n represents an integer of 1 to 20.)
Tetracarboxylic dianhydride and water represented by the following general formula (2)

（式中、Ｒは４価の有機基を示す。）
モル比でシロキサンジアミンのモル数／テトラカルボン酸二無水物のモル数≦０.８０となるように反応して得られることを特徴とするフレキシブルプリント配線板である。

(In the formula, R represents a tetravalent organic group.)
It is a flexible printed wiring board obtained by reacting so that the molar ratio is the number of moles of siloxane diamine / the number of moles of tetracarboxylic dianhydride ≦ 0.80.

  The flexible printed wiring board having an insulating film, wherein the (B) diamino compound is an aromatic diamine represented by the following general formula (3).

（式中、Ｒ’’は、２価の有機基である。）
さらに、前記、（Ｃ）感光性樹脂が、分子内に不飽和二重結合を少なくとも１つ有する絶縁被膜を有するフレキシブルプリント配線板である。

(In the formula, R ″ is a divalent organic group.)
Furthermore, the (C) photosensitive resin is a flexible printed wiring board having an insulating film having at least one unsaturated double bond in the molecule.

  Furthermore, (E) The flexible printed wiring board which has an insulating film characterized by the thermosetting resin being an epoxy resin.

Furthermore, (A) component and (B) component in the said photosensitive resin composition are as follows.
(A) the molar amount of the acid dianhydride of component (A),
(B) the molar amount of the siloxane diamine of component (A),
(C) When the molar amount of the diamine of component (B) is used, (a) / ((b) + (c)) is blended so as to be 0.80 or more and 1.20 or less. A flexible printed wiring board having an insulating coating.

Further, the component (A), the component (B), the component (C) and the component (D) in the photosensitive resin composition are as follows:
The component (C) is 10 to 200 parts by weight and the component (D) is 0.1 to 50 parts by weight with respect to 100 parts by weight of the solid content of the sum of the components (A) and (B). A flexible printed wiring board having an insulating coating characterized by being blended.

  Moreover, the blending ratio of the (E) thermosetting resin is 0.5 to 100 parts by weight based on the total solid content of the (A) component, the (B) component, the (C) component, and the (D) component. It is a flexible printed wiring board having an insulating film, which is blended so as to be 100 parts by weight.

  By using the present invention, it is possible to cure at a low temperature, have a solder heat resistance of 300 ° C., and is formed by laminating a photosensitive resin composition with a small warp when laminated on the polyimide film surface. A flexible printed wiring board having an insulating coating can be obtained.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have at least (A) a terminal tetracarboxylic acid siloxane imide oligomer, (B) a diamino compound, (C) a photosensitive resin, (D) obtained by mixing a photopolymerization initiator and (E) a thermosetting resin, the following conditions:
(1) It can be cured at a temperature of 200 ° C. or lower.
(2) Solder heat resistance at 300 ° C./10 seconds / 3 cycles,
(3) A warp index of 5 mm or less after coating and drying to a thickness of 25 μm on a polyimide film surface having a thickness of 25 μm and an elastic modulus of 4.0 GPa or more,
Any flexible printed wiring board having an insulating coating characterized in that a film is formed by curing a photosensitive resin composition that satisfies the above requirements with light and / or heat.

  The flexible printed wiring board in the present invention is one in which conductor wiring is formed on the polyimide film surface, and further, a multilayer flexible printed wiring board in which several layers of flexible printed wiring boards are stacked, and a rigid laminated with epoxy resin or the like. A flexible printed wiring board having a part, a TAB tape using a polyimide film having a high elastic modulus, COF capable of forming fine wiring, and the like are included in the flexible printed wiring board of the present invention.

  The polyimide film used for this flexible printed wiring board is, for example, a flexible printed wiring board having a substrate made of Kaneka Chemical's polyimide film APICAL series, Toray DuPont polyimide film KAPTON series, Ube Industries Ltd. UPILEX series. Can be mentioned.

The insulating coating laminated on the surface of the flexible printed wiring board having the insulating coating of the present invention is
(1) It can be cured at a temperature of 200 ° C. or lower.
(2) Solder heat resistance at 300 ° C./10 seconds / 3 cycles,
(3) A warp index of 5 mm or less after coating and drying to a thickness of 25 μm on a polyimide film surface having a thickness of 25 μm and an elastic modulus of 4.0 GPa or more,
Any insulating coating having these three characteristics may be used. In particular, it is preferable that the resin can be cured at a temperature of 200 ° C. or lower because oxidation of the conductor wiring can be suppressed when applied and dried on the surface of the flexible printed wiring board. Particularly preferably, it can be cured at 180 ° C. or lower.

  In the present invention, a resin excellent in solder heat resistance at 300 ° C. is preferable. High solder heat resistance is preferable because it has heat resistance when wiring is connected to the conductor portion of the flexible printed wiring board with solder. Particularly, in recent years, lead-free solder has been generally used from the viewpoint of environmental problems. However, when it is intended to cope with such solder, solder heat resistance at a temperature of 300 ° C. or higher is recommended. It is essential to have The characteristics (1) and (2) are contradictory characteristics. Generally, when the curing temperature is low, the melting temperature is also low, and thus the solder heat resistance tends to be lost. The photosensitive resin composition of the invention is designed to satisfy the above characteristics.

  Furthermore, the photosensitive resin composition of the present invention is preferably a product having the characteristic (3) in addition to the characteristics (1) and (2). Having such characteristics is preferable because the warp of the film is reduced after coating and drying on the surface of the flexible printed wiring board, and the flexible printed wiring board can be easily handled. In the case of making such a polyimide film, it can be achieved by lowering the elastic modulus of the polyimide film to be applied. In such a case, the above-mentioned property (1) is satisfied, but the property (2) Will not be satisfied. This is because when the elastic modulus of the photosensitive resin composition is lowered, the glass transition temperature of the composition is lowered and the heat resistance on the film surface is lowered. The warp index in the present invention is a polyimide film having a thickness of 25 μm and an elastic modulus of 4.0 GPa or more, preferably 25 μm on the surface of Apical 25NPI manufactured by Kaneka Corporation, and a thickness of 5 cm × 5 cm for each polyimide film. When the cut-out polyimide film is placed on the bottom surface and the amount of warpage of the edge is defined as a warp index, it is preferably 5 mm or less when used as an insulating coating on a flexible printed wiring board. In the above case, the flexible printed wiring board warps and is not preferable.

  It has been found that satisfying the above characteristics (1) to (3) is essential when used for an insulating coating for a flexible printed wiring board.

  In this invention, as a photosensitive resin laminated | stacked on the surface of a flexible printed wiring board, as a thing which can satisfy the characteristics of said (1)-(3) variously, as a result of having examined the above-mentioned characteristics, and also having at least (A) terminal tetra. It is a photosensitive resin composition obtained by mixing a carboxylic acid siloxane imide oligomer, (B) a diamino compound, (C) a photosensitive resin, (D) a photopolymerization initiator, and (E) a thermosetting resin. Has been found to be preferable.

  Preferred embodiments of the photosensitive resin composition of the present invention are described below.

<(A) Terminal tetracarboxylic acid siloxane imide oligomer>
The terminal tetracarboxylic acid siloxane imide oligomer is an oligomer having an imide ring inside and having a terminal carboxylic acid structure. The raw material thereof includes (a) the following general formula (1) ) And a siloxane diamine represented by

（式中、Ｒ_１,Ｒ_２は炭素数１〜１２のアルキル基もしくは芳香族基であり、Ｒ_１,Ｒ_２は同一であっても異なっていても良い。ｍは１〜４０の整数、ｎは１〜２０の整数を示す。）
（ｂ）下記一般式（２）で示されるテトラカルボン酸二無水物及び水を、

(In the formula, R ₁ and R ₂ are alkyl groups or aromatic groups having 1 to 12 carbon atoms, and R ₁ and R ₂ may be the same or different. M is an integer of 1 to 40, n represents an integer of 1 to 20.)
(B) a tetracarboxylic dianhydride represented by the following general formula (2) and water:

（式中、Ｒは４価の有機基を示す。）
モル比でシロキサンジアミンのモル数／テトラカルボン酸二無水物のモル数≦０.８０となるように反応して得られる内部はイミド環を有しており、末端がカルボン酸のシロキサンイミドオリゴマーである。より具体的には、本願発明に好適に用いられるシロキサンジアミンとテトラカルボン酸二無水物のモル比は、１未満、より好ましくは、０.２０以上０.８０以下であり、特に好ましくは０.２５以上０.７０以下である。尚、上記範囲に添加量を制御して反応させることで、末端テトラカルボン酸シロキサンイミドオリゴマーの分子量を最適な範囲に制御することができるので好ましい。０．８０より大きい場合には、オリゴマーの分子量が大きくなり感光性樹脂組成物に用いた場合に、現像することが困難になるので好ましくない。また、本願発明の末端テトラカルボン酸シロキサンイミドオリゴマーの合成の際には、水を反応させることが必須である。水を反応させて末端をカルボン酸基にすることで低濃度のアルカリ溶液でも現像し易くなる。

(In the formula, R represents a tetravalent organic group.)
The inside obtained by reacting so that the molar ratio of the number of moles of siloxane diamine / the number of moles of tetracarboxylic dianhydride ≦ 0.80 has an imide ring, and the terminal is a siloxane imide oligomer having a carboxylic acid. is there. More specifically, the molar ratio of siloxane diamine and tetracarboxylic dianhydride suitably used in the present invention is less than 1, more preferably 0.20 or more and 0.80 or less, and particularly preferably 0.8. It is 25 or more and 0.70 or less. In addition, since the molecular weight of the terminal tetracarboxylic acid siloxane imide oligomer can be controlled to an optimum range by controlling the addition amount within the above range, it is preferable. When it is larger than 0.80, the molecular weight of the oligomer becomes large, and it becomes difficult to develop when used in the photosensitive resin composition, which is not preferable. In addition, when synthesizing the terminal tetracarboxylic acid siloxane imide oligomer of the present invention, it is essential to react water. Development with a low-concentration alkaline solution is facilitated by reacting water with a carboxylic acid group at the end.

  Preferred are terminal tetracarboxylic acid siloxane imide oligomers having an average molecular weight (weight average molecular weight in terms of polyethylene glycol) of 20,000 or less, particularly an average molecular weight of about 800 to 20,000. When the molecular weight exceeds 20000, the solubility in an organic solvent and the solubility when formed into a photosensitive resin composition are remarkably lowered.

  Further, in the present invention, it is preferable to obtain a terminal tetracarboxylic acid siloxane imide oligomer by reacting water during the imidation to open a terminal acid anhydride group. However, after the imidation reaction, a method may be used in which water is reacted to open a terminal acid anhydride group to obtain a terminal tetracarboxylic acid siloxane imide oligomer.

  In addition, when the molar ratio of the tetracarboxylic dianhydride and the siloxane diamine in the present invention is less than 0.50, an excess of tetracarboxylic dianhydride reacts with water and the tetracarboxylic acid that is ring-opened coexists. However, in the present invention, there is no problem even if such a tetracarboxylic acid coexists.

  Examples of the tetracarboxylic dianhydride used as a raw material for the above-mentioned (A) terminal tetracarboxylic acid siloxane imide oligomer include, for example, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride 3,3 ′, 4,4′-oxydiphthalic dianhydride, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride, 2,2-bis (4-hydroxy Phenyl) propanedibenzoate-3,3 ′, 4,4′-tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride, 3,3 ′, 4,4 '-Biphenyltetracarboxylic dianhydride, 2,3,3', 4-biphenyltetracarboxylic dianhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3- It can be used tetracarboxylic acid dianhydride such as cyclohexene-1,2-dicarboxylic anhydride.

  Particularly preferably, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride, 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride, 3,3 Since the solubility to the organic solvent of the terminal tetracarboxylic-acid siloxane imide oligomer obtained by using ', 4,4'- oxydiphthalic dianhydride can be improved, it is preferable.

  Particularly preferably, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride is most preferably used from the viewpoint of compatibility with the photosensitive resin and the like, and the photosensitive resin composition This is preferable because turbidity of the cured film is less likely to occur.

  The siloxane diamine used in the present invention is preferably a siloxane diamine represented by the following general formula (1).

（式中、Ｒ_１,Ｒ_２は炭素数１〜１２のアルキル基もしくは芳香族基であり、Ｒ_１,Ｒ_２は同一であっても異なっていても良い。ｍは１〜４０の整数、ｎは１〜２０の整数を示す。）
特に本願発明に用いられるシロキサンジアミンの構造は、Ｒ_１,Ｒ_２がメチル基、エチル基、フェニル基であって、ｍは１〜４０、ｎが２以上であるものが好ましく用いられる。

(In the formula, R ₁ and R ₂ are alkyl groups or aromatic groups having 1 to 12 carbon atoms, and R ₁ and R ₂ may be the same or different. M is an integer of 1 to 40, n represents an integer of 1 to 20.)
In particular, the structure of the siloxane diamine used in the present invention is preferably such that R ₁ and R ₂ are a methyl group, an ethyl group, and a phenyl group, m is 1 to 40, and n is 2 or more.

Particularly preferably, R ₁ and R ₂ are methyl groups, m is 1 to 20, n is 3 siloxane diamine, or R ₁ and R ₂ are methyl groups or phenyl groups, and n = 3, m A siloxane diamine of 9 to 12 is preferably used. By using this diamine, the imidization temperature can be lowered and the electrical insulation reliability and the like of the polyimide resin can be improved.

  Various methods are mentioned as a manufacturing method of a terminal tetracarboxylic-acid siloxane imide oligomer. The typical method is illustrated below.

  Method 1: A polyamic acid solution is prepared by adding and reacting a siloxane diamine represented by the general formula (1) in a solution in which tetracarboxylic dianhydride is dispersed or dissolved in an organic solvent. After the reaction of tetracarboxylic dianhydride and siloxane diamine is completed, the resulting polyamic acid solution is heated to 100 ° C. or higher and 300 ° C. or lower, more preferably 150 ° C. or higher and 250 ° C. or lower to perform dehydration and imidization Subsequently, the reaction solution is cooled to 150 ° C. or lower and water is added. More preferably, it is 20 degreeC or more and 150 degrees C or less, Most preferably, they are 40 degreeC or more and 100 degrees C or less. In the imidation, it can be removed from the reaction system while azeotropically boiling with a solvent such as toluene or hexane. The input amount of water is preferably larger than the molar amount of tetracarboxylic dianhydride used. The solvent used in the present method is preferably a solvent having a boiling point of 100 ° C. or higher, and the reaction time in each step varies depending on the raw materials used, and thus is preferably selected as appropriate.

  Method 2: A polyamic acid solution is prepared by adding and reacting a siloxane diamine represented by the general formula (1) in a solution in which tetracarboxylic dianhydride is dispersed or dissolved in an organic solvent. Add an imidization catalyst (preferably tertiary amines such as pyridine, picoline, isoquinoline, trimethylamine, triethylamine, tributylamine, etc.) and a dehydrating agent (acetic anhydride, etc.) to this polyamic acid solution at 60 ° C. or higher. Heat to 180 ° C. or less to imidize. Water is added to the solution that has undergone imidization, or the solution that has undergone imidization is poured into water to cause precipitation. The terminal tetracarboxylic acid siloxane imide oligomer can be obtained by precipitating, filtering and drying the precipitated particles. In addition, when it does not precipitate, it can manufacture by removing a solvent with a vacuum dryer etc.

  Method 3: A polyamic acid solution is prepared by adding and reacting a siloxane diamine represented by the general formula (1) in a solution in which tetracarboxylic dianhydride is dispersed or dissolved in an organic solvent. The polyamic acid solution is placed in a vacuum reduced pressure dryer heated to 100 ° C. or more and 250 ° C. or less, and imidation is performed by drawing a vacuum while heating and drying. The terminal tetracarboxylic acid siloxane imide oligomer can be obtained by reacting this resin with water.

  The above method is preferably used. Regardless of the above method, any method can be used as long as the method has an imide ring inside and a terminal tetracarboxylic acid siloxane imide oligomer having a terminal carboxylic acid. There is no problem even if it is used.

  The amount of water to be reacted is 2.0 to 300 times, more preferably 2.0 to 200 times the molar amount of tetracarboxylic dianhydride used, It is preferable to open the ring. It is preferable to include a large amount of water. However, there is no problem outside the above range depending on the reaction method. It is preferable to select an optimal amount as appropriate.

Examples of the solvent used for the synthesis of the terminal tetracarboxylic acid siloxane imide oligomer include sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, and formamide solvents such as N, N-dimethylformamide and N, N-diethylformamide. Acetamide solvents such as N, N-dimethylacetamide and N, N-diethylacetamide, pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone, phenol, o-, m- or p -Phenol solvents such as cresol, xylenol, halogenated phenol, catechol, or hexamethylphosphoramide, γ-butyrolactone, methylmonoglyme (1,2-dimethoxyethane), methyldiglyme (bis (2-methoxyether) Ether), methyltriglyme (1,2-bis (2-methoxyethoxy) ethane), methyltetraglyme (bis [2- (2-methoxyethoxyethyl)] ether), ethyl monoglyme (1,2-diethoxy) Ethane), ethyl diglyme (bis (2-ethoxyethyl) ether), symmetric glycol diethers such as butyl diglyme (bis (2-butoxyethyl) ether), γ-butyrolactone and N-methyl-2-pyrrolidone, Methyl acetate, ethyl acetate, isopropyl acetate, n-propyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate (also known as carbitol acetate, 2- (2-butyl acetate) Xyloxy) ethyl)), diethylene glycol monobutyl ether acetate, 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol diacetate, 1,3-butylene glycol diacetate Acetates such as dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol n-propyl ether, dipropylene glycol n-propyl ether, propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n -Propyl ether, propylene glycol phenyl ether , Dipropylene glycol dimethyl ether, 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, a solvent may be used ethers such as ethyl ether also ethylene glycol. If necessary, low-boiling hexane, acetone, toluene, xylene and the like can be used in combination.
Among them, symmetric glycol diethers are particularly preferable because of high solubility of oligomers.

<(B) Diamino Compound>
In this invention, the (B) diamino compound is an aromatic diamine represented by the general formula (3).

（式中、Ｒ’’は、２価の有機基である。）
上記ジアミノ化合物の中で、より具体的には、ｍ−フェニレンジアミン、ｏ−フェニレンジアミン、ｐ−フェニレンジアミン、ｍ−アミノベンジルアミン、ｐ−アミノベンジルアミン、ビス（３−アミノフェニル）スルフィド、（３−アミノフェニル）（４−アミノフェニル）スルフィド、ビス（４−アミノフェニル）スルフィド、ビス（３−アミノフェニル）スルホキシド、（３−アミノフェニル）（４−アミノフェニル）スルホキシド、ビス（４−アミノフェニル）スルホキシド、ビス（３−アミノフェニル）スルホン、（３−アミノフェニル）（４−アミノフェニル）スルホン、ビス（４−アミノフェニル）スルホン、３，４’−ジアミノベンゾフェノン、４，４’−ジアミノベンゾフェノン、３，３’−ジアミノベンゾフェノン、３，３’−ジアミノジフェニルメタン、３，４’−ジアミノジフェニルメタン、４，４’−ジアミノジフェニルメタン、４，４’−ジアミノジフェニルエーテル、３，３’−ジアミノジフェニルエーテル、３，４’−ジアミノジフェニルエーテル、ビス［４−（３−アミノフェノキシ）フェニル］スルホキシド、ビス［４−（アミノフェノキシ）フェニル］スルホキシド、（４−アミノフェノキシフェニル）（３−アミノフェノキシフェニル）フェニル］スルホキシド、ビス［４−（３−アミノフェノキシ）フェニル］スルホン、ビス［４−（４−アミノフェノキシ）フェニル］スルホン、（４−アミノフェノキシフェニル）（３−アミノフェノキシフェニル）フェニル］スルホン、ビス［４−（３−アミノフェノキシ）フェニル］スルフィド、ビス［４−（アミノフェノキシ）フェニル］スルフィド、（４−アミノフェノキシフェニル）（３−アミノフェノキシフェニル）フェニル］スルフィド、３，３’−ジアミノベンズアニリド、３，４’−ジアミノベンズアニリド、４，４’−ジアミノベンズアニリド、ビス［４−（３−アミノフェノキシ）フェニル］メタン、ビス［４−（４−アミノフェノキシ）フェニル］メタン、[４−（４−アミノフェノキシフェニル）][４−（３−アミノフェノキシフェニル）]メタン、１，１−ビス［４−（３−アミノフェノキシ）フェニル］エタン、１，１−ビス［４−（４−アミノフェノキシ）フェニル］エタン、１，１−[４−（４−アミノフェノキシフェニル）][４−（３−アミノフェノキシフェニル）]エタン、１，２−ビス［４−（３−アミノフェノキシ）フェニル］エタン、１，２−ビス［４−（４−アミノフェノキシ）フェニル］エタン、１，２−[４−（４−アミノフェノキシフェニル）][４−（３−アミノフェノキシフェニル）]エタン、２，２−ビス［４−（３−アミノフェノキシ）フェニル］プロパン、２，２−ビス［４−（４−アミノフェノキシ）フェニル］プロパン、２，２−[４−（４−アミノフェノキシフェニル）][４−（３−アミノフェノキシフェニル）] プロパン、２，２−ビス［３−（３−アミノフェノキシ）フェニル］−１，１，１，３，３，３−ヘキサフルオロプロパン、２，２−ビス［４−（４−アミノフェノキシ）フェニル］−１，１，１，３，３，３−ヘキサフルオロプロパン、２，２−[４−（４−アミノフェノキシフェニル）][４−（３−アミノフェノキシフェニル）] −１，１，１，３，３，３−ヘキサフルオロプロパン、１，３−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（４−アミノフェノキシ）ベンゼン、１，３−ビス（４−アミノフェノキシ）ベンゼン、４，４’−ビス（４−アミノフェノキシ）ビフェニル、４，４’−ビス（３−アミノフェノキシ）ビフェニル、ビス［４−（３−アミノフェノキシ）フェニル］ケトン、ビス［４−（４−アミノフェノキシ）フェニル］ケトン、ビス［４−（３−アミノフェノキシ）フェニル］エーテル、ビス［４−（４−アミノフェノキシ）フェニル］エーテル、ポリテトラメチレンオキシド−ジ−Ｐ−アミノベンゾエート、ポリ（テトラメチレン／３−メチルテトラメチレンエーテル）グリコールビス（４−アミノベンゾエート）、トリメチレン―ビス（４−アミノベンゾエート）、ｐ-フェニレン−ビス（４−アミノベンゾエート）、ｍ−フェニレン−ビス（４−アミノベンゾエート）、ビスフェノールＡ−ビス（４−アミノベンゾエート）、２，４−ジアミノ安息香酸、２，５−ジアミノ安息香酸、３，５−ジアミノ安息香酸、３，３’−ジアミノ−４，４’−ジカルボキシビフェニル、４，４’−ジアミノ−３，３’−ジカルボキシビフェニル、４，４’−ジアミノ−２，２’−ジカルボキシビフェニル、[ビス(４-アミノ-２-カルボキシ)フェニル]メタン、 [ビス(４-アミノ-３-カルボキシ)フェニル]メタン、[ビス(３-アミノ-４-カルボキシ)フェニル]メタン、 [ビス(３-アミノ-５-カルボキシ)フェニル]メタン、２，２−ビス[３−アミノ−４−カルボキシフェニル]プロパン、２，２−ビス[４−アミノ−３−カルボキシフェニル]プロパン、２，２−ビス[３−アミノ−４−カルボキシフェニル]ヘキサフルオロプロパン、２，２−ビス[４−アミノ−３−カルボキシフェニル]ヘキサフルオロプロパン、３，３’−ジアミノ−４，４’−ジカルボキシジフェニルエーテル、４，４‘−ジアミノ−３，３’−ジカルボキシジフェニルエーテル、４，４’−ジアミノ−２，２’−ジカルボキシジフェニルエーテル、３，３’−ジアミノ−４，４‘−ジカルボキシジフェニルスルフォン、４，４’−ジアミノ−３，３’−ジカルボキシジフェニルスルフォン、４，４’−ジアミノ−２，２’−ジカルボキシジフェニルスルフォン、２，３−ジアミノフェノール、２，４−ジアミノフェノール、２，５−ジアミノフェノール、３，５−ジアミノフェノール等のジアミノフェノール類、３，３’−ジアミノ−４，４’−ジヒドロキシビフェニル、４，４’−ジアミノ−３，３’−ジヒドロキシビフェニル、４，４’−ジアミノ−２，２’−ジヒドロキシビフェニル、４，４’−ジアミノ−２，２’，５，５’−テトラヒドロキシビフェニル等のヒドロキシビフェニル化合物類、３，３’−ジアミノ−４，４’−ジヒドロキシジフェニルメタン、４，４’−ジアミノ−３，３’−ジヒドロキシジフェニルメタン、４，４’−ジアミノ−２，２’−ジヒドロキシジフェニルメタン等のジヒドロキシジフェニルメタン類、２，２−ビス[３−アミノ−４−ヒドロキシフェニル]プロパン、２，２−ビス[４−アミノ−３−ヒドロキシフェニル]プロパン等のビス[ヒドロキシフェニル]プロパン類、２，２−ビス[３−アミノ−４−ヒドロキシフェニル]ヘキサフルオロプロパン、２，２−ビス[３−アミノ−４−ヒドロキシフェニル]ヘキサフルオロプロパン等のビス[ヒヒドロキシフェニル]ヘキサフルオロプロパン類、３，３’−ジアミノ−４，４’−ジヒドロキシジフェニルエーテル、４，４’−ジアミノ−３，３’−ジヒドロキシジフェニルエーテル、４，４’−ジアミノ−２，２’−ジヒドロキシジフェニルエーテル等のヒドロキシジフェニルエーテル類、３，３’−ジアミノ−４，４’−ジヒドロキシジフェニルスルフォン、４，４’−ジアミノ−３，３’−ジヒドロキシジフェニルスルフォン、４，４’−ジアミノ−２，２’−ジヒドロキシジフェニルスルフォン等のジヒドロキシジフェニルスルフォン類、３，３’−ジアミノ−４，４’−ジヒドロキシジフェニルスルフィド、４，４’−ジアミノ−３，３’−ジヒドロキシジフェニルスルフィド、４，４’−ジアミノ−２，２’−ジヒドロキシジフェニルスルフィド等のジヒドロキシジフェニルスルフィド類、３，３’−ジアミノ−４，４’−ジヒドロキシジフェニルスルホキシド、４，４’−ジアミノ−３，３’−ジヒドロキシジフェニルスルホキシド、４，４’−ジアミノ−２，２’−ジヒドロキシジフェニルスルホキシド等のジヒドロキシジフェニルスルホキシド類、２，２−ビス[４−（４−アミノ−３−ヒドロキシフェノキシ）フェニル]プロパン等のビス［（ヒドロキシフェニル）フェニル］アルカン化合物類、４，４’−ビス（４−アミノ−３−ヒドキシフェノキシ）ビフェニル等のビス（ヒドキシフェノキシ）ビフェニル化合物類、２，２−ビス[４−（４−アミノ−３−ヒドロキシフェノキシ）フェニル]スルフォン等のビス[（ヒドロキシフェノキシ）フェニル]スルフォン化合物、４，４’−ジアミノ−３，３’−ジハイドロキシジフェニルメタン、４，４’−ジアミノ−２，２’−ジハイドロキシジフェニルメタン、２，２−ビス[３−アミノ−４−カルボキシフェニル]プロパン、４，４’−ビス（４−アミノ−３−ヒドキシフェノキシ）ビフェニル等のビス（ヒドキシフェノキシ）ビフェニル化合物類をあげることができる。

(In the formula, R ″ is a divalent organic group.)
Among the diamino compounds, more specifically, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis (3-aminophenyl) sulfide, ( 3-aminophenyl) (4-aminophenyl) sulfide, bis (4-aminophenyl) sulfide, bis (3-aminophenyl) sulfoxide, (3-aminophenyl) (4-aminophenyl) sulfoxide, bis (4-amino) Phenyl) sulfoxide, bis (3-aminophenyl) sulfone, (3-aminophenyl) (4-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, 3,4'-diaminobenzophenone, 4,4'-diamino Benzophenone, 3,3′-diaminobenzophenone, 3,3 ′ -Diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, bis [4- (3 -Aminophenoxy) phenyl] sulfoxide, bis [4- (aminophenoxy) phenyl] sulfoxide, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfoxide, bis [4- (3-aminophenoxy) phenyl] Sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [ 4- Aminophenoxy) phenyl] sulfide, (4-aminophenoxyphenyl) (3-aminophenoxyphenyl) phenyl] sulfide, 3,3′-diaminobenzanilide, 3,4′-diaminobenzanilide, 4,4′-diaminobenz Anilide, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, [4- (4-aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl) )] Methane, 1,1-bis [4- (3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1- [4- (4- Aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)] ethane, 1,2-bis [4- (3-aminophenoxy) fur Nyl] ethane, 1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 1,2- [4- (4-aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)] ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2- [4- (4-aminophenoxyphenyl) ] [4- (3-aminophenoxyphenyl)] propane, 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2 -Bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2- [4- (4-aminophenoxyphenyl)] [4- (3 -Aminophenoxypheny )]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-bis (3-aminophenoxy) biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) ) Phenyl] ether, polytetramethylene oxide-di-P-aminobenzoate, poly (tetramethylene / 3-methyltetramethylene ether) glyco Rubis (4-aminobenzoate), trimethylene-bis (4-aminobenzoate), p-phenylene-bis (4-aminobenzoate), m-phenylene-bis (4-aminobenzoate), bisphenol A-bis (4-amino) Benzoate), 2,4-diaminobenzoic acid, 2,5-diaminobenzoic acid, 3,5-diaminobenzoic acid, 3,3′-diamino-4,4′-dicarboxybiphenyl, 4,4′-diamino- 3,3′-dicarboxybiphenyl, 4,4′-diamino-2,2′-dicarboxybiphenyl, [bis (4-amino-2-carboxy) phenyl] methane, [bis (4-amino-3-carboxy ) Phenyl] methane, [bis (3-amino-4-carboxy) phenyl] methane, [bis (3-amino-5-carboxy) phenyl] methane, 2,2-bis [3-amino-4- Ruboxyphenyl] propane, 2,2-bis [4-amino-3-carboxyphenyl] propane, 2,2-bis [3-amino-4-carboxyphenyl] hexafluoropropane, 2,2-bis [4- Amino-3-carboxyphenyl] hexafluoropropane, 3,3′-diamino-4,4′-dicarboxydiphenyl ether, 4,4′-diamino-3,3′-dicarboxydiphenyl ether, 4,4′-diamino- 2,2′-dicarboxydiphenyl ether, 3,3′-diamino-4,4′-dicarboxydiphenyl sulfone, 4,4′-diamino-3,3′-dicarboxydiphenyl sulfone, 4,4′-diamino- 2,2′-dicarboxydiphenylsulfone, 2,3-diaminophenol, 2,4-diaminophenol, 2,5-diaminophenol , Diaminophenols such as 3,5-diaminophenol, 3,3′-diamino-4,4′-dihydroxybiphenyl, 4,4′-diamino-3,3′-dihydroxybiphenyl, 4,4′- Hydroxybiphenyl compounds such as diamino-2,2′-dihydroxybiphenyl, 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxybiphenyl, 3,3′-diamino-4,4′-dihydroxy Dihydroxydiphenylmethanes such as diphenylmethane, 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4′-diamino-2,2′-dihydroxydiphenylmethane, 2,2-bis [3-amino-4-hydroxy Bis [hydroxyphenyl] propanes such as phenyl] propane and 2,2-bis [4-amino-3-hydroxyphenyl] propane Bis [hyhydroxyphenyl] hexafluoropropanes such as 2,2-bis [3-amino-4-hydroxyphenyl] hexafluoropropane, 2,2-bis [3-amino-4-hydroxyphenyl] hexafluoropropane, Hydroxydiphenyl ethers such as 3,3′-diamino-4,4′-dihydroxydiphenyl ether, 4,4′-diamino-3,3′-dihydroxydiphenyl ether, 4,4′-diamino-2,2′-dihydroxydiphenyl ether, Dihydroxy such as 3,3′-diamino-4,4′-dihydroxydiphenyl sulfone, 4,4′-diamino-3,3′-dihydroxydiphenyl sulfone, 4,4′-diamino-2,2′-dihydroxydiphenyl sulfone Diphenyl sulfones, 3,3′-diamino-4,4′-dihydro Dihydroxydiphenyl sulfides such as sidiphenyl sulfide, 4,4′-diamino-3,3′-dihydroxydiphenyl sulfide, 4,4′-diamino-2,2′-dihydroxydiphenyl sulfide, 3,3′-diamino-4 , 4'-dihydroxydiphenyl sulfoxide, 4,4'-diamino-3,3'-dihydroxydiphenyl sulfoxide, dihydroxydiphenyl sulfoxides such as 4,4'-diamino-2,2'-dihydroxydiphenyl sulfoxide, 2,2- Bis [(hydroxyphenyl) phenyl] alkane compounds such as bis [4- (4-amino-3-hydroxyphenoxy) phenyl] propane, 4,4′-bis (4-amino-3-hydroxyphenoxy) biphenyl, etc. Bis (hydroxyphenoxy) biphenyl compounds, 2,2 Bis [(hydroxyphenoxy) phenyl] sulfone compounds such as bis [4- (4-amino-3-hydroxyphenoxy) phenyl] sulfone, 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4 ′ -Bis such as diamino-2,2'-dihydroxydiphenylmethane, 2,2-bis [3-amino-4-carboxyphenyl] propane, 4,4'-bis (4-amino-3-hydroxyphenoxy) biphenyl (Hydroxyphenoxy) biphenyl compounds can be mentioned.

  In particular, diamines that can be suitably used in the photosensitive resin composition of the present invention include m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, bis (3-aminophenyl) sulfone, and bis (4-aminophenyl). Sulfone, 3,4′-diaminobenzophenone, 4,4′-diaminobenzophenone, 3,3′-diaminobenzophenone, 3,3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] Sulfone, bis [4- (3-amino Enoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-amino) Phenoxy) phenyl] propane, 2,2- [4- (4-aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)] propane, 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2- [4- (4-Aminophenoxyphenyl)] [4- (3-aminophenoxyphenyl)]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis (3 -Aminopheno B) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, bis [4- (3- Aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, polytetramethylene oxide-di-P-aminobenzoate, poly (tetramethylene / 3-methyltetramethylene ether) glycol bis (4- Aminobenzoate), trimethylene-bis (4-aminobenzoate), p-phenylene-bis (4-aminobenzoate), m-phenylene-bis (4-aminobenzoate), bisphenol A-bis (4-aminobenzoate) are preferred. Used for. It is preferable to use the aromatic diamine because the heat resistance of the photosensitive resin composition is improved.

  Among them, bis (3-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, bis is also used to reduce the amount of warpage of the photosensitive resin. [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] methane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, bis [4 -(3-aminophenoxy) phenyl] ether and bis [4- (4-aminophenoxy) phenyl] ether are preferably used Rukoto can.

The compounding amount of the diamino compound in the present invention is such that (A) component and (B) component in the photosensitive resin composition are:
(A) the molar amount of the acid dianhydride of component (A),
(B) the molar amount of the siloxane diamine of component (A),
(C) It is preferable that (a) / ((b) + (c)) is blended so as to be 0.80 or more and 1.20 or less when the molar amount of the component (B) diamine is used. .

  When the amount is within the above range, the amount of warpage of the cured film of the photosensitive resin composition can be reduced, the curing can proceed easily, and a cured film excellent in various properties can be obtained.

<(C) Photosensitive resin>
The photosensitive resin (C) in the present invention is a resin having at least one unsaturated double bond in the molecule. More specifically, the unsaturated double bond is an acrylic group (CH2 = CH-group), a methacryloyl group (CH = C (CH3) -group) or a vinyl group (-CH = CH-group). .

  For example, bisphenol F EO modified (n = 2-50) diacrylate, bisphenol A EO modified (n = 2-50) diacrylate, bisphenol S EO modified (n = 2-50) diacrylate, bisphenol F EO modified (n = 2-50) dimethacrylate, bisphenol A EO modified (n = 2-50) dimethacrylate, bisphenol S EO modified (n = 2-50) dimethacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, Ethylene glycol diacrylate, pentaerythritol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol hexaacrylate, tetramethylolpropane tetraacrylate Tetraethylene glycol diacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol dimethacrylate, ethylene glycol dimethacrylate, pentaerythritol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexamethacrylate, tetramethylol Propane tetramethacrylate, tetraethylene glycol dimethacrylate, methoxydiethylene glycol methacrylate, methoxypolyethylene glycol methacrylate, β-methacryloyloxyethyl hydrogen phthalate, β-methacryloyloxyethyl hydrogen succinate, 3-chloro-2-hydroxypropyl methacrylate, Allyl methacrylate, phenoxyethyl acrylate, phenoxydiethylene glycol acrylate, phenoxy polyethylene glycol acrylate, β-acryloyloxyethyl hydrogen succinate, lauryl acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, 1 , 3-butylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol dimethacrylate, polypropylene glycol dimethacrylate, 2-hydroxy-1,3-dimethacryloxypropane, 2,2-bis [4- ( Methacryloxyethoxy) phenyl] propane, 2,2-bi [4- (methacryloxy / diethoxy) phenyl] propane, 2,2-bis [4- (methacryloxy / polyethoxy) phenyl] propane, polyethylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol diacrylate, 2,2- Bis [4- (acryloxy-diethoxy) phenyl] propane, 2,2-bis [4- (acryloxy-polyethoxy) phenyl] propane, 2-hydroxy-1-acryloxy-3-methacryloxypropane, trimethylolpropane trimethacrylate, Tetramethylol methane triacrylate, tetramethylol methane tetraacrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, nonylphenol Xylethylene glycol acrylate, nonylphenoxy polypropylene glycol acrylate, 1-acryloyloxypropyl-2-phthalate, isostearyl acrylate, polyoxyethylene alkyl ether acrylate, nonylphenoxyethylene glycol acrylate, polypropylene glycol dimethacrylate, 1,4-butanediol di Methacrylate, 3-methyl-1,5-pentanediol dimethacrylate, 1,6-mexanediol dimethacrylate, 1,9-nonanediol methacrylate, 2,4-diethyl-1,5-pentanediol dimethacrylate, 1, 4-cyclohexanedimethanol dimethacrylate, dipropylene glycol diacrylate, tricyclodecane dimethanol dia Relate, 2,2-hydrogenated bis [4- (acryloxy polyethoxy) phenyl] propane, 2,2-bis [4- (acryloxy polypropoxy) phenyl] propane, 2,4-diethyl-1,5-pentane Diol diacrylate, ethoxylated totimethylolpropane triacrylate, propoxylated tomethylolpropane triacrylate, isocyanuric acid tri (ethane acrylate), pentathritol tetraacrylate, ethoxylated pentathritol tetraacrylate, propoxylated pentathritol tetraacrylate, Ditrimethylolpropane tetraacrylate, dipentaerythritol polyacrylate, triallyl isocyanurate, glycidyl methacrylate, glycidyl allyl ether, 1,3,5-triac Roylhexahydro-s-triazine, triallyl 1,3,5-benzenecarboxylate, triallylamine, triallyl citrate, triallyl phosphate, allobarbital, diallylamine, diallyldimethylsilane, diallyl disulfide, diallyl ether, zalyl sialate Preferred are diallyl isophthalate, diallyl terephthalate, 1,3-dialyloxy-2-propanol, diallyl sulfide diallyl maleate, 4,4′-isopropylidene diphenol dimethacrylate, 4,4′-isopropylidene diphenol diacrylate, and the like. However, it is not limited to these. In particular, the repeating unit of EO (ethylene oxide) contained in one molecule of diacrylate or methacrylate is preferably in the range of 2-50, more preferably 2-40. By using a product having an EO repeating unit in the range of 2 to 50, the solubility in an aqueous developer typified by an alkaline aqueous solution is improved, and the development time is shortened. Furthermore, it is difficult for stress to remain in the cured film obtained by curing the photosensitive resin composition. For example, among the printed wiring boards, when laminated on a flexible printed wiring board based on a polyimide resin, curling of the printed wiring board is prevented. Features such as being able to be suppressed.

  In addition, hydroxyl groups in the molecular structure skeleton such as 2-hydroxy-3-phenoxypropyl acrylate, monohydroxyethyl acrylate phthalate, ω-carboxy-polycaprolactone monoacrylate, acrylic acid dimer, pentaerythritol tri and tetraacrylate, Those having a carbonyl group are also preferably used.

  In addition, any photosensitive resin such as an epoxy-modified acrylic (methacrylic) resin, a urethane-modified acrylic (methacrylic) resin, or a polyester-modified acrylic (methacrylic) resin may be used.

  In addition, although it is also possible to use 1 type as a photosensitive resin, using 2 or more types together is preferable when improving the heat resistance of the cured film after photocuring.

<(D) Photopolymerization initiator>
(D) As the photopolymerization initiator, for example, Michler's ketone, 4,4′-bis (diethylamino) benzophenone, 4,4 ′, 4 ″ -tris (dimethylamino) triphenylmethane, 2,2′- Bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-diimidazole, acetophenone, benzoin, 2-methylbenzoin, benzoin methyl ether, benzoin ethyl ether, benzoin Isopropyl ether, benzoin isobutyl ether, 2-t-butylanthraquinone, 1,2-benzo-9,10-anthraquinone, methylanthraquinone, thioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 1-hydroxy Cyclohexyl phenyl ketone, diacetylbenzyl, benzyldimethylketa , Benzyldiethylketal, 2 (2′-furylethylidene) -4,6-bis (trichloromethyl) -S-triazine, 2 [2 ′ (5 ″ -methylfuryl) ethylidene] -4,6- Bis (trichloromethyl) -S-triazine, 2 (p-methoxyphenyl) -4,6-bis (trichloromethyl) -S-triazine, 2,6-di (p-azidobenzal) -4-methylcyclohexanone, 4, 4'-diazidochalcone, di (tetraalkylammonium) -4,4'-diazidostilbene-2,2'-disulfonate, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1 -Hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -pheny ] -2-Hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Amino-1- (4-morpholinophenyl) -butane-1, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl -Pentylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, bis (n5-2,4-cyclopentadiene- 1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, 1,2-octa Dione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], iododium, (4-methylphenyl) [4- (2-methylpropyl) phenyl] -hexafluorophosphate (1 -), Ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1 -(O-acetyloxyome) etc. are mentioned. The photopolymerization initiator is preferably selected as appropriate, and one or more types are preferably mixed and used.

In the present invention, the (A) component, (B) component, (C) component and (D) component in the photosensitive resin composition are:
The component (C) is 10 to 200 parts by weight and the component (D) is 0.1 to 50 parts by weight with respect to 100 parts by weight of the solid content of the sum of the components (A) and (B). It is preferable that it is blended.

The blending ratio is preferable because various properties (such as electrical insulation reliability) of the cured product and insulating film finally obtained are improved.
(C) When the photosensitive resin is less than the above range, the heat resistance of the cured film after photo-curing the photosensitive resin is lowered, and the contrast when exposed and developed is difficult to be obtained. For this reason, it is possible to set the resolution at the time of exposure / development to an optimal range by setting the value within the above range.

  (D) When there are few photoinitiators than the said range, the hardening reaction of the acrylic resin at the time of light irradiation hardly occurs, and hardening becomes inadequate in many cases. Moreover, when there is too much, adjustment of light irradiation amount becomes difficult and may be in an overexposure state. Therefore, in order to advance the photocuring reaction efficiently, it is preferable to adjust within the above range.

<(E) Thermosetting resin>
The thermosetting resin used in the photosensitive resin composition of the present invention is epoxy resin, isocyanate resin, block isocyanate resin, bismaleimide resin, bisallyl nadiimide resin, acrylic resin, methacrylic resin, hydrosilyl cured resin, allyl cured resin. Thermosetting resins such as unsaturated polyester resins; side chain reactive group type thermosetting resins having reactive groups such as allyl group, vinyl group, alkoxysilyl group, hydrosilyl group, etc. at the side chain or terminal of the polymer chain A polymer or the like can be used. The thermosetting component may be used alone or in combination of two or more.

  Among these, it is preferable to use an epoxy resin. By containing an epoxy resin component, heat resistance can be imparted to a cured resin obtained by curing a thermosetting resin composition, and adhesion to a conductor such as a metal foil or a circuit board can be imparted. .

  The epoxy resin contains at least two epoxy groups in the molecule, and is bisphenol A type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, bisphenol A novolac type epoxy resin. , Water added bisphenol A type epoxy resin, ethylene oxide adduct bisphenol A type epoxy resin, propylene oxide adduct bisphenol A type epoxy resin, novolac type epoxy resin, glycidyl ester type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, Alkylphenol novolac type epoxy resin, polyglycol type epoxy resin, cycloaliphatic epoxy resin, cyclopentadiene type epoxy resin, dicyclopentadiene Type epoxy resins, cresol novolak type epoxy resins, glycidyl amine type epoxy resins, naphthalene type epoxy resins, urethane modified epoxy resins, rubber-modified epoxy resin, an epoxy resin such as epoxy-modified polysiloxane. These epoxy resins may be used alone or in combination of two or more at any ratio.

  Examples of the epoxy resin include, for example, the product name Epicron HP-4700 of the naphthalene type tetrafunctional epoxy resin manufactured by Dainippon Ink Chemical Co., Ltd., the product name Epicron HP-7200 of the cyclopentadiene type epoxy resin, and the product of the phenol novolac type epoxy resin. The name Epicron N-740, Epicron EXA-7240, which is a high heat resistance epoxy resin, Epicron N-660, N-665, N-670, N-680, N-655-, which is a cresol novolac type polyfunctional epoxy resin EXP, trade name of phenol novolac type epoxy resin, Epicron N-740, trade name of tetraphenylethane type epoxy resin, Epicron ETePE, trade name of triphenylmethane type epoxy resin, Epicron ETrPM, trade name of Japan Epoxy Resin Co., Ltd. Bisphenol A type epoxy resin such as Tote Kasei Co., Ltd., Bisphenol F type epoxy resin such as YDF-170, manufactured by Toto Kasei Co., Ltd., Epicoat 152, 154 manufactured by Japan Epoxy Resin Co., Ltd., Nippon Kayaku ( Phenol novolac type epoxy resin such as trade name EPPN-201 manufactured by Dow Chemical Co., Ltd., and trade name EOCN-125S, 103S, 104S manufactured by Nippon Kayaku Co., Ltd. Novolac type epoxy resin, trade name Epon 1031S manufactured by Japan Epoxy Resins Co., Ltd., trade name Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., trade names Denacol EX-611, EX-614 manufactured by Nagase Chemical Co., Ltd. EX-614B, EX-622, EX-512, EX-521, EX 421, EX-411, EX-321 and other polyfunctional epoxy resins, Japan Epoxy Resin Co., Ltd. trade name Epicoat 604, Toto Kasei Co., Ltd. trade name YH434, Mitsubishi Gas Chemical Co., Ltd. trade name TETRAD-X, TERRAD-C, Nippon Kayaku Co., Ltd. trade name GAN, Sumitomo Chemical Co., Ltd. trade name ELM-120, etc. Amine type epoxy resin, Ciba Specialty Chemicals Co., Ltd. Heterocycle-containing epoxy resins such as the name Araldite PT810, and alicyclic epoxy resins such as ERL4234, 4299, 4221, and 4206 manufactured by UCC, and the like can be used alone or in combination of two or more.

  Among these epoxy resins, an epoxy resin having two or more epoxy groups in one molecule is particularly preferable from the viewpoint of improving the heat resistance, solvent resistance, chemical resistance and moisture resistance of the photosensitive resin composition.

  The amount of the thermosetting resin used in the present invention is a solid content of (A) terminal tetracarboxylic acid siloxane imide oligomer, (B) diamino compound, (C) photosensitive resin, and (D) photopolymerization initiator. It is preferable to mix | blend so that it may become 0.5-100 weight part with respect to a weight part. Particularly preferred is 1.0 to 50 parts by weight. It is preferable to add it in the above range since the heat resistance, chemical resistance and electrical insulation reliability of the cured film of the photosensitive resin composition can be improved.

  The epoxy resin used in the resin composition of the present invention is an epoxy compound having only one epoxy group in one molecule, such as n-butyl glycidyl ether, phenyl glycidyl ether, dibromophenyl glycidyl ether, dibromocresyl glycidyl ether, etc. There is. In addition, alicyclic epoxy compounds such as 3,4-epoxycyclohexyl and methyl (3,4-epoxycyclohexane) carboxylate can be used in combination.

  In the photosensitive resin composition of the present invention, as a curing agent for the photosensitive resin, for example, phenol resins such as phenol novolac type phenol resin, cresol novolac type phenol resin, naphthalene type phenol resin, amino resins, urea resins Melamine resins, dicyandiamide, dihydrazine compounds, imidazole compounds, Lewis acids, Bronsted acid salts, polymercaptan compounds, isocyanates and blocked isocyanate compounds, and the like can be used in combination.

  Further, the curing accelerator is not particularly limited, but for example, phosphine compounds such as triphenylphosphine; amine compounds such as tertiary amine, trimethanolamine, triethanolamine and tetraethanolamine; 1,8- Borate compounds such as diaza-bicyclo [5,4,0] -7-undecenium tetraphenylborate, imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-un Imidazoles such as decylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4-methylimidazole; 2-methylimidazoline, 2- Ethyl imidazoline, 2 Imidazolines such as isopropylimidazoline, 2-phenylimidazoline, 2-undecylimidazoline, 2,4-dimethylimidazoline, 2-phenyl-4-methylimidazoline; 2,4-diamino-6- [2′-methylimidazolyl- ( 1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2 ′ And azine-based imidazoles such as -ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-triazine. When an amino group is contained in the urethane resin, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2,4-diamino-6- [ It is preferable to use imidazoles such as 2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine.

<Method of mixing (A) to (D) and (E)>
The photosensitive resin composition of the present invention is obtained by uniformly mixing the components (A) to (D) and (E). As a method of uniformly mixing, for example, a general kneading apparatus such as a three roll or bead mill apparatus may be used for mixing. Moreover, when the viscosity of a solution is low, you may mix using a general stirring apparatus.

<Other ingredients>
Various additives such as a flame retardant, an antifoaming agent, a filler, an adhesion aid, a leveling agent, and a polymerization inhibitor can be further added to the photosensitive resin composition of the present invention as necessary. As the filler, a fine inorganic filler such as silica, mica, talc, barium sulfate, wollastonite, calcium carbonate, or a fine organic polymer filler may be contained. It is preferable to select the content appropriately.

<Photosensitive resin composition solution>
The photosensitive resin composition of the present invention is highly soluble in various organic solvents, such as sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, and formamide systems such as N, N-dimethylformamide and N, N-diethylformamide. Solvents, acetamide solvents such as N, N-dimethylacetamide, N, N-diethylacetamide, pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone, phenol, o-, m- or Phenolic solvents such as p-cresol, xylenol, halogenated phenol, catechol, or hexamethylphosphoramide, γ-butyrolactone, methylmonoglyme (1,2-dimethoxyethane), methyldiglyme (bis (2-methoxyether) ) Ether), Methyl Trigura (1,2-bis (2-methoxyethoxy) ethane), methyltetraglyme (bis [2- (2-methoxyethoxyethyl)] ether), ethyl monoglyme (1,2-diethoxyethane), ethyldigig Symmetric glycol diethers such as lime (bis (2-ethoxyethyl) ether), butyldiglyme (bis (2-butoxyethyl) ether), γ-butyrolactone, N-methyl-2-pyrrolidone, methyl acetate, ethyl acetate , Isopropyl acetate, n-propyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate (also known as carbitol acetate, 2- (2-butoxyethoxy) ethyl acetate)) Acetates such as diethylene glycol monobutyl ether acetate, 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol diacetate, 1,3-butylene glycol diacetate, Dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol n-propyl ether, dipropylene glycol n-propyl ether, propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n-propyl ether, propylene glycol Phenyl ether, dipropylene glycol Methyl ether, 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, a solvent may be used ethers such as ethyl ether also ethylene glycol. If necessary, low-boiling hexane, acetone, toluene, xylene and the like can be used in combination.

  Among these, symmetric glycol diethers are particularly preferable because the solubility of the photosensitive resin composition is high.

  The photosensitive resin composition solution of the present invention comprises (A) component, (B) component, (C) component, (D) component, and (E) component with respect to 100 parts by weight of the total solid content, It is preferable that 10 to 100 parts by weight is blended.

  A photosensitive resin composition solution within this range is preferable because the film reduction rate after coating and drying on the flexible printed wiring board is reduced.

<The manufacturing method of the flexible printed wiring board which has an insulating film>
A flexible printed wiring board having an insulating coating in the present invention is characterized in that a film is formed by applying the photosensitive resin composition on the flexible printed wiring board and curing it by light and / or heat. It is particularly preferable that the photosensitive resin composition solution is applied on a flexible printed wiring board and molded by curing with light and / or heat.

  Particularly preferably, after coating on a flexible printed wiring board, it is preferably formed as an insulating film on the flexible printed wiring board through drying, exposure, alkali development and curing processes.

  In the present invention, coating is a conductive surface of a flexible printed wiring board formed by screen printing, curtain roll, river roll, spray coating, spin coating using a spinner or the like. In this case, a partial drying step may be included. The thickness of the coating film at the time of coating on the flexible printed wiring board at this time is preferably 5 to 100 μm, particularly preferably 10 to 100 μm.

  In the present invention, drying is a step of removing the solvent in the coating film by subjecting the flexible printed wiring board formed with the coating film to air drying and / or hot air drying.

  In particular, heating at a temperature of 120 ° C. or lower is preferable, and heating at a temperature of 40 to 100 ° C. is particularly preferable. In this drying, it is preferable to send air in order to dry quickly.

  In the present invention, the exposure is a step of placing a negative photomask on the dry coating film on the flexible printed wiring board and irradiating with actinic rays such as ultraviolet rays, visible rays, electron beams, laser rays, etc. In this case, the sample may be exposed under nitrogen, but is preferably exposed under reduced pressure. The depressurized state means that the inside of the sample container is depressurized with a vacuum pump or the like. In addition, after irradiating light, in order to harden the part which started hardening with light, you may heat again.

In the present invention, alkali development refers to an unexposed portion that has not been cured with an alkaline solution, using various methods in which the alkaline solution is brought into contact with the coating film on the surface of the printed circuit board, such as shower, paddle, immersion, or ultrasonic wave. The relief pattern is obtained by washing out. Since the time until the pattern is exposed varies depending on the spraying pressure and flow rate of the apparatus during alkali development and the temperature of the etching solution, it is preferable to find optimal apparatus conditions as appropriate. In the present invention, the use temperature of the alkaline solution is 10 to 40 ° C., preferably 20 to 35 ° C., and the spray pressure of the etching solution is preferably 0.3 to 2.0 kgf / mm ² , particularly Preferably, it is 0.5 to 1.5 kgf / mm ² . The development time is preferably 10 seconds to 600 seconds, and more preferably 20 seconds to 300 seconds. By controlling within the above range, the pattern can be exposed more clearly. As the alkaline solution, it is preferable to use a sodium carbonate aqueous solution or a sodium hydroxide aqueous solution having a concentration of 0.01% by weight to 2.0% by weight, and more preferably 0.05% by weight to 1.5% by weight. It is preferable to use a sodium carbonate aqueous solution or a sodium hydroxide aqueous solution having a concentration of not more than%. Use of such an aqueous alkali solution is preferable because the alkali metal concentration in the remaining film after development is lowered and the electrical insulation reliability can be improved. This alkaline aqueous solution may contain various surfactants and water-soluble organic solvents such as methanol, ethanol, n-propanol, isopropanol, and N-methyl-2-pyrrolidone. .

  The relief pattern formed by the alkali development step is rinsed to remove unnecessary residues. Examples of the rinsing liquid include water and acidic aqueous solutions.

  The curing step in the present invention is a step of completely curing the coating film by heating and curing the photosensitive resin composition on the flexible printed wiring board. The temperature applied at this time is preferably 100 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower. When the curing temperature increases, the resin cures and a cured film with good characteristics is easily obtained, but it is not preferable because the conductive wiring is further deteriorated by oxidation. Therefore, it is preferable to control within the above temperature range. Further, at the time of curing, for the purpose of suppressing oxidative deterioration due to oxygen, it is possible to perform firing in a state in which the chamber is replaced with an inert gas such as argon, nitrogen, or helium.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.

(Synthesis Example 1)
200 g (0.384 mol) of 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride (hereinafter abbreviated as BPADA) was converted to 140 g of 1,2-bis (2-methoxyethoxy) ethane. Dispersed and kept at 80 ° C. 128 g (0) of siloxane diamine (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KF8010, molecular weight 830, R ₁ and R ₂ in the general formula (1) are methyl groups, n = 3, m = 6 to 11). 154 mol), and stirred uniformly for 30 minutes. Next, the mixture was heated to 140 ° C. and stirred uniformly for 1 hour, then heated to 180 ° C. and heated to reflux for 3 hours to carry out an imidization reaction. Next, the mixture was cooled to 80 ° C., 27.7 g (1.54 mol) of water was added, and the mixture was heated to reflux for 5 hours. In this way, a terminal tetracarboxylic acid resin containing a terminal tetracarboxylic acid siloxane imide oligomer was obtained. The solid content concentration of this solution was 66% by weight, and the viscosity of the solution was 140 poise at 23 ° C. This terminal tetracarboxylic acid resin solution was a stable solution with little change in viscosity even when it was allowed to stand at room temperature for 1 month. This synthetic resin is abbreviated as resin A.

(Synthesis Example 2)
200 g (0.384 mol) of BPADA was dispersed in 159 g of 1,2-bis (2-methoxyethoxy) ethane and kept at 80 ° C. To this, 172 g of siloxane diamine (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name X-22-9409S, molecular weight 1492, wherein R ₁ and R ₂ are methyl groups or phenyl groups, n = 3, m = 9 to 12). (0.115 mol) was added, and uniform stirring was performed for 30 minutes. Next, the mixture was heated to 140 ° C. and stirred uniformly for 1 hour, then heated to 180 ° C. and heated to reflux for 3 hours to carry out an imidization reaction. Next, the mixture was cooled to 80 ° C., 27.7 g (1.54 mol) of water was added, and the mixture was heated to reflux for 5 hours. In this way, a terminal tetracarboxylic acid resin containing a terminal tetracarboxylic acid siloxane imide oligomer was obtained. The solid content concentration of this solution was 67% by weight, and the viscosity of the solution was 120 poise at 23 ° C. This terminal tetracarboxylic acid resin solution was a stable solution with little change in viscosity even when it was allowed to stand at room temperature for 1 month. This synthetic resin is abbreviated as resin B.

(Synthesis Example 3)
200 g (0.384 mol) of BPADA was dispersed in 154 g of 1,2-bis (2-methoxyethoxy) ethane and kept at 80 ° C. 159 g (0 from Shin-Etsu Chemical Co., Ltd .: trade name KF8010, molecular weight 830, R ₁ and R ₂ in the general formula (1) are methyl groups, n = 3, m = 6 to 11) 192 mol) and stirred uniformly for 30 minutes. Next, the mixture was heated to 140 ° C. and stirred uniformly for 1 hour, heated to 180 ° C. and heated to reflux for 3 hours to carry out an imidization reaction. After cooling to 80 ° C., 27.7 g (1.54 mol) of water was added, and the mixture was heated to reflux for 5 hours. In this way, a terminal tetracarboxylic acid resin containing a terminal tetracarboxylic acid siloxane imide oligomer was obtained. The solid content concentration of this solution was 66% by weight, and the viscosity of the solution was 100 poise at 23 ° C. This terminal tetracarboxylic acid resin solution was a stable solution with little change in viscosity even when it was allowed to stand at room temperature for 1 month. This synthetic resin is abbreviated as resin C.

(Synthesis Example 4)
200 g (0.384 mol) of BPADA was dispersed in 184 g of 1,2-bis (2-methoxyethoxy) ethane and kept at 80 ° C. To this, 229 g of siloxane diamine (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name X-22-9409S, molecular weight 1492, wherein R ₁ and R ₂ are methyl groups or phenyl groups, n = 3, m = 9 to 12). (0.154 mol) was added, and uniform stirring was performed for 30 minutes. Next, the mixture was heated to 140 ° C. and stirred uniformly for 1 hour, heated to 180 ° C. and heated to reflux for 3 hours to carry out an imidization reaction. After cooling to 80 ° C., 27.7 g (1.54 mol) of water was added. After stirring uniformly for 30 minutes, the mixture was heated to 80 ° C. and refluxed for 5 hours. In this way, a terminal tetracarboxylic acid resin containing a terminal tetracarboxylic acid siloxane imide oligomer was obtained. The solid content concentration of this solution was 67% by weight, and the viscosity of the solution was 90 poise at 23 ° C. This terminal tetracarboxylic acid resin solution was a stable solution with little change in viscosity even when it was allowed to stand at room temperature for 1 month. This synthetic resin is abbreviated as resin D.

(Examples 1-4)
A diamino compound, a photosensitive resin, a photopolymerization initiator, a thermosetting resin, a filler, and an organic solvent were added to the terminal tetracarboxylic acid resins obtained in Synthesis Examples 1 to 4 to prepare a photosensitive resin composition solution. Table 1 shows the blending amount of each constituent raw material in the resin solid content and the kind of the raw material. In addition, 1,2-bis (2-methoxyethoxy) ethane which is a solvent in the table is the total amount of solvent including the solvent and the like contained in the above synthetic resin solution and the like.
The photosensitive resin composition was first mixed with a general stirring device equipped with a stirring blade, and the solution was passed twice with a three-roll mill to obtain a uniform solution. When the particle diameter was measured with a grindometer, all were 10 μm or less. The following evaluation was carried out by completely defoaming the foam in the solution with a defoaming device. The evaluation results are shown in Table 2.

(Preparation of polyimide film with insulating coating)
The above photosensitive resin composition solution is cast and coated on a 25 μm polyimide film (manufactured by Kaneka Co., Ltd .: trade name: 25NPI) on a 100 μm × 100 mm area using a Baker applicator so that the final dry thickness is 25 μm. And dried at 80 ° C. for 20 minutes. Ten sheets of this dry film were prepared. Nine sheets have a negative photomask with a completely transparent area of 50 mm × 50 mm, and one sheet has a negative photomask with a line width / space width = 100 μm / 100 μm (30 mm length × 100 μm width). A photomask with 10 lines left) was placed and exposed to UV light at 300 mJ / cm ² in a nitrogen atmosphere. This photosensitive film was subjected to spray development for 30 seconds at a discharge pressure of 1.0 kgf / mm 2 using a solution obtained by heating a 0.8 wt% sodium carbonate aqueous solution to 30 ° C. After development, the film was thoroughly washed with pure water, and then heated and dried in an oven at 170 ° C. for 60 minutes to produce a polyimide film having an insulating film.

(Warpage index)
The polyimide film having an insulating film of 50 mm × 50 mm was placed on a flat metal plate so that the polyimide film was on the lower surface, and the height at which the terminal film was warped was measured at four points at each edge portion. The average value is defined as the warpage index.

  The results of measuring the warpage index in this way are listed in Table 1.

(Solder heat resistance)
The polyimide film having the insulating coating was floated in a solder bath in which the polyimide film having the insulating coating was completely dissolved at 300 ° C. so that the cured film of the photosensitive resin composition was in contact with the solder, and was cooled after 10 seconds. The operation was performed three times, and the adhesive strength of the cured film was evaluated by a cross-cut tape method according to JIS K5400.
○ The one that does not peel off by the cross-cut tape method
△, when 95% or more of the cells remain
The case where the residual amount of the mesh was less than 80% was evaluated as x.

(Photosensitivity and developability evaluation)
Evaluation of the photosensitivity and developability of the photosensitive resin composition was determined by observing the surface of the polyimide film having an insulating film obtained in the above item (Preparation of polyimide film having an insulating film).
◯: Clear line width / space width = 100/100 μm photosensitive pattern is drawn on the polyimide film surface, there is no fluctuation of the line due to peeling of the line part, and there is no residual residue in the space part thing.
Δ: A clear line width / space width = 100/100 μm photosensitive pattern is drawn, and the line portion is shaken due to peeling, but the space portion has no undissolved residue.
X: A clear line width / space width = 100/100 μm photosensitive pattern was not drawn, the line portion was peeled off, and a dissolution residue was generated in the space portion.

(Coating film adhesion)
The adhesive strength of the cured film of the photosensitive resin composition obtained in the above item (production of polyimide film having an insulating coating) was evaluated by a cross-cut tape method according to JIS K5400.
Yes, those with no peeling by the cross-cut tape method
△, when 95% or more of the cells remain
The case where the residual amount of the mesh was less than 80% was evaluated as x.

(Solvent resistance)
The solvent resistance of the cured film of the photosensitive resin composition obtained in the above item (production of polyimide film having an insulating coating) was evaluated. In the evaluation method, the film was dipped in isopropanol at 25 ° C. for 15 minutes and then air-dried, and the state of the film surface was observed.
○: There is no abnormality in the coating film.
X: Abnormality occurs in the coating film.

(Acid resistance)
The acid resistance of the cured film of the photosensitive resin composition obtained in the above item (production of a polyimide film having an insulating coating) was evaluated. In the evaluation method, the film was immersed in a 2N hydrochloric acid solution at 25 ° C. for 15 minutes and then air-dried, and the state of the film surface was observed.
○: The coating film has no abnormality (whitening or peeling).
X: Abnormality (whitening or peeling) occurs in the coating film.

(Alkali resistance)
The alkali resistance of the cured film of the photosensitive resin composition obtained in the above item (production of a polyimide film having an insulating coating) was evaluated. In the evaluation method, the film was dipped in a 2N sodium hydroxide solution at 25 ° C. for 15 minutes and then air-dried, and the state of the film surface was observed.
○: There is no abnormality (whitening or peeling) in the coating film.
X: Abnormality (whitening or peeling) occurs in the coating film.

(Flexibility)
The film obtained in the above item (Preparation of polyimide film having insulating coating) was cut into a 30 mm × 10 mm strip, bent at 180 ° at 10 ° and bent 10 times, and the coating film was visually confirmed to check for cracks. went.
○: The cured film has no cracks Δ: The cured film has some cracks ×: The cured film has cracks (Moisture resistance)
A comb-shaped pattern of line width / space width = 100 μm / 100 μm on a flexible copper-laminated laminate (copper foil thickness 12 μm, polyimide film is Apical 25 NPI manufactured by Kaneka Corporation, and copper foil is bonded with a polyimide adhesive) After being prepared and immersed in a 10% by volume sulfuric acid aqueous solution for 1 minute, the surface of the copper foil was treated by washing with pure water. Then, the cured film of the photosensitive resin composition was produced on the comb pattern by the method similar to the production method of the cured film on a polyimide film, and the test piece was adjusted. A 100 V direct current was applied to both terminals of the test piece in an environmental test machine at 85 ° C. and 85% RH, and changes in the insulation resistance value and occurrence of migration were observed. Table 2 also shows the insulation resistance value after 500 hours.
○: A resistance value of 10 ⁶ Ω or more is exhibited in 500 hours after the start of the test, and no migration or dendrite is generated. ×: Migration, dendrite, etc. are generated in 500 hours after the test is started.

Claims (8)

On the flexible printed circuit board on which the wiring is formed,
It is obtained by mixing at least (A) terminal tetracarboxylic acid siloxane imide oligomer, (B) diamino compound, (C) photosensitive resin, (D) photopolymerization initiator, and (E) thermosetting resin. conditions,
(1) It can be cured at a temperature of 200 ° C. or lower.
(2) Solder heat resistance at 300 ° C./10 seconds / 3 cycles,
(3) A warp index of 5 mm or less after coating and drying to a thickness of 25 μm on a polyimide film surface having a thickness of 25 μm and an elastic modulus of 4.0 GPa or more,
Photosensitive resin composition that becomes a cured film satisfying
A flexible printed wiring board having an insulating film, wherein the film is formed by curing with light and / or heat. The (A) terminal tetracarboxylic acid siloxane imide oligomer is a siloxane diamine represented by the following general formula (1):

(In the formula, R ₁ and R ₂ are alkyl groups or aromatic groups having 1 to 12 carbon atoms, and R ₁ and R ₂ may be the same or different. M is an integer of 1 to 40, n represents an integer of 1 to 20.)
Tetracarboxylic dianhydride and water represented by the following general formula (2)

(In the formula, R represents a tetravalent organic group.)
2. The insulating coating according to claim 1, which is a photosensitive resin composition obtained by reacting such that the molar ratio is the number of moles of siloxane diamine / the number of moles of tetracarboxylic dianhydride ≦ 0.80. A flexible printed wiring board. The flexible printed wiring board having an insulating coating according to claim 1, wherein the (B) diamino compound is an aromatic diamine represented by the following general formula (3).

(In the formula, R ″ is a divalent organic group.)   The flexible printed wiring board which has an insulating film of any one of Claims 1-3 in which the said (C) photosensitive resin has at least one unsaturated double bond in a molecule | numerator.   The flexible printed wiring board having an insulating coating according to any one of claims 1 to 4, wherein the (E) thermosetting resin is an epoxy resin. The component (A) and the component (B) in the photosensitive resin composition are
(A) the molar amount of the acid dianhydride of component (A),
(B) the molar amount of the siloxane diamine of component (A),
(C) When the molar amount of the diamine of component (B) is used, (a) / ((b) + (c)) is blended so as to be 0.80 or more and 1.20 or less. The flexible printed wiring board which has an insulating film in any one of Claims 1-5. The component (A), the component (B), the component (C) and the component (D) in the photosensitive resin composition are as follows:
The component (C) is 10 to 200 parts by weight and the component (D) is 0.1 to 50 parts by weight with respect to 100 parts by weight of the solid content of the sum of the components (A) and (B). The flexible printed wiring board which has an insulating film of any one of Claims 1-6 characterized by the above-mentioned.   The blending ratio of the (E) thermosetting resin is 0.5 to 100 weights with respect to 100 parts by weight of the solid content of the sum of the components (A), (B), (C) and (D). It mix | blends so that it may become a part, The flexible printed wiring board which has an insulating film of any one of Claims 1-7 characterized by the above-mentioned.