JP2008159977A - Apparatus for treating substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify the constitution and the control system of a chemical liquid supply system and reduce the foot print, in an apparatus that performs processing of wafers with a processing liquid which is a mixture of a chemical liquid and deionized water. <P>SOLUTION: The apparatus is constituted of a processing vessel 10 for storing a processing liquid 12, which has been prepared by mixing a chemical liquid and deionized water and processing wafer by immersing thereof into the processing liquid 12; an aspirator 24 that is connected to a liquid jet pipe 18 arranged inside the processing vessel 10 via a processing liquid supply pipe 20 and mixes deionized water and the chemical liquid by sucking the chemical liquid from a suction opening 24c by a negative pressure generated by the jet stream of deionized water; a deionized water supply source for supplying deionized water to the aspirator 24 through a deionized water supply pipe 26 connected to a liquid inlet opening 24b of the aspirator 24; and a chemical liquid supply source for supplying the chemical liquid to the aspirator 24 through a chemical liquid supply pipe 42 connected to the suction opening 24c of the aspirator 24. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, or the like with a processing liquid.

A substrate processing apparatus that performs processing such as cleaning on a substrate with a processing liquid in which a chemical solution such as hydrochloric acid (HCl) or hydrogen peroxide (H ₂ O ₂ ) and pure water are mixed, such as an immersion type substrate processing apparatus Prepares a treatment liquid by mixing a chemical solution and pure water, and supplies the treatment liquid into the treatment tank. And a treatment liquid supply system. The processing liquid supply system has been conventionally connected to a processing tank through a processing liquid supply path, and a mixing unit (mixing valve) for preparing a processing liquid by mixing a chemical and pure water, and supplying pure water to the mixing unit A pure water supply source for supplying pure water to the mixing unit connected to the flow path through the channel, a sealed chemical tank for storing the chemical solution connected to the mixing unit via the chemical supply channel, and an internal space of the chemical tank And a nitrogen gas supply source such as a gas cylinder that supplies an inert gas such as nitrogen gas (N ₂ ) to the inside of the chemical liquid tank. Then, the chemical liquid is supplied from the chemical liquid tank to the mixing section through the chemical liquid supply path by pressurizing the liquid surface of the chemical liquid in the chemical liquid tank with nitrogen gas introduced into the internal space of the chemical liquid tank (for example, Patent Documents). 1).
Japanese Patent Laid-Open No. 11-19605 (5th page, FIG. 1)

  In the substrate processing apparatus provided with the conventional processing liquid supply system as described above, it is necessary to install a sealed chemical liquid tank in order to supply the chemical liquid to the mixing unit. Moreover, in order to pressurize the internal space of the chemical tank, it is necessary to provide a gas supply source such as a gas cylinder and a gas supply pipe. Furthermore, a control mechanism for controlling the pressure of nitrogen gas supplied to the chemical liquid tank is also required so that a predetermined flow rate of the chemical liquid is supplied to the mixing unit. As described above, the conventional apparatus has a problem in that the configuration of the chemical solution supply system and the control system are complicated, and the installation space is increased because a tank, a cylinder, and the like are provided.

  The present invention has been made in view of the circumstances as described above, and simplifies the configuration and control system of a chemical solution supply system in an apparatus for processing a substrate with a processing solution in which a chemical solution and pure water are mixed. An object of the present invention is to provide a substrate processing apparatus that can reduce the installation space.

  According to a first aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate with a processing liquid in which a chemical liquid and pure water are mixed. The substrate is processed with a processing liquid prepared by mixing the chemical liquid and pure water. A processing unit, an aspirator connected to the substrate processing unit via a processing liquid supply path, for sucking the chemical solution from the suction port by a negative pressure generated by the flow of pure water and mixing the pure water and the chemical solution; and Pure water supply means for supplying pure water to the aspirator through the pure water supply path connected to the liquid introduction connection port, and chemical supply means for supplying chemical liquid to the aspirator through the chemical liquid supply path connected to the suction port of the aspirator And.

  According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the chemical solution supply means includes a mixed chemical solution supply path whose one end is connected to the suction port of the aspirator, and the other end of the mixed chemical solution supply path. And a mixed chemical supply means for individually supplying a plurality of types of chemical liquids into the chemical mixing tank through a plurality of mixed chemical supply paths connected to the chemical mixing tank. It is characterized by that.

  According to a third aspect of the present invention, in the substrate processing apparatus of the first aspect, the chemical solution supply means is connected to the mixed chemical solution supply path whose one end is connected to the suction port of the aspirator and the mixed chemical solution supply path, respectively. And a mixed chemical liquid supply means for individually supplying a plurality of types of chemical liquids to the mixed chemical liquid supply path through the plurality of mixed chemical liquid supply paths.

  The invention according to claim 4 is the substrate processing apparatus according to claim 1, wherein the aspirator is a first aspirator, the chemical solution is a first chemical solution, and the first aspirator and the substrate processing unit. The second chemical liquid is sucked from the suction port by the negative pressure generated by the flow of the mixed liquid of the pure water mixed with the first aspirator and the first chemical liquid. The second aspirator for mixing the mixed liquid and the second chemical liquid, and the second chemical liquid is supplied to the second aspirator through the second chemical liquid supply path connected to the suction port of the second aspirator. And a second chemical solution supply means.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the cleaning liquid supply path communicated in the middle of the chemical liquid supply path, and the chemical liquid supply through the cleaning water supply path. The apparatus further comprises cleaning water supply means for supplying cleaning pure water to the path, and flow path switching means for selectively connecting the cleaning water supply path to the chemical liquid supply path.

In the substrate processing apparatus according to the first aspect of the present invention, the chemical liquid supplied by the chemical liquid supply means is naturally contained in the aspirator by the negative pressure generated by the water flow when the pure water supplied by the pure water supply means flows in the aspirator. Since the treatment liquid is prepared by mixing the chemical and pure water in the aspirator, a gas tank or the like is installed to install a sealed chemical tank for supplying the chemical or pressurize the internal space of the chemical tank. It is no longer necessary to provide a gas supply source and a gas supply pipe and to provide a control mechanism for controlling the pressure of the gas supplied to the chemical tank.
Therefore, when the substrate processing apparatus of the invention according to claim 1 is used, the configuration and control system of the chemical solution supply system can be simplified, and the installation space can be reduced.

  In the substrate processing apparatus of the invention according to claim 2, a plurality of types of chemical solutions are mixed in the chemical solution mixing tank, the mixed chemical solution is supplied to the aspirator, and the mixed chemical solution is generated by the negative pressure generated by the flow of pure water flowing in the aspirator. Natural suction is performed in the aspirator, and the mixed chemical liquid and pure water are mixed in the aspirator. Thereby, the process liquid which mixed multiple types of chemical | medical solution and pure water can be prepared with an aspirator.

  In the substrate processing apparatus of the invention according to claim 3, a plurality of types of chemical liquids are mixed by flowing and joining from each mixed chemical liquid supply path to the mixed chemical liquid supply path, and the mixed chemical liquid is supplied to the aspirator, The mixed chemical solution is naturally sucked into the aspirator by the negative pressure generated by the flow of pure water flowing in the aspirator, and the mixed chemical solution and pure water are mixed in the aspirator. Thereby, the process liquid which mixed multiple types of chemical | medical solution and pure water can be prepared with an aspirator.

  In the substrate processing apparatus of the invention according to claim 4, due to the negative pressure generated by the liquid flow when the mixed liquid of the pure water mixed in the first aspirator and the first chemical liquid flows in the second aspirator, The second chemical liquid supplied by the second chemical liquid supply means is naturally sucked into the second aspirator, and the second chemical liquid and the mixed liquid are mixed in the second aspirator. Thereby, the process liquid which mixed two types of chemical | medical solutions and pure water can be prepared.

  In the substrate processing apparatus according to the fifth aspect of the present invention, when the substrate is not processed, the cleaning water supply path is connected to the chemical liquid supply path by the flow path switching means, and the cleaning water supply means supplies the aspirator. By supplying the pure water for cleaning, the pure water for cleaning is naturally sucked into the aspirator by the negative pressure due to the water flow when the pure water supplied by the pure water supply means flows in the aspirator. Thereby, a part of chemical | medical solution supply path and the inside of an aspirator can be wash | cleaned with the pure water for washing | cleaning.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a substrate processing apparatus showing an example of an embodiment of the present invention.

  The substrate processing apparatus includes a processing tank 10 having a rapid drainage function. A processing liquid 12 is stored in the processing tank 10, and a substrate W such as a semiconductor wafer is immersed in the processing liquid 12 in the processing tank 10. Washed. In addition, by storing pure water in the processing tank 10 and immersing the substrate W in the pure water, the substrate W is finally rinsed. The treatment tank 10 is provided with a drain port 14 at the bottom, and a quick drain valve 16 is attached to the drain port 14. Then, by opening the quick drain valve 16, the processing liquid or pure water can be discharged from the processing tank 10 through the drain port 14 in a short time. Further, the processing liquid and pure water can overflow from the upper part of the processing tank 10. Further, in order to measure the specific resistance value of pure water in the treatment tank 10 at the time of the final rinse treatment, a specific resistance meter 17 is installed on the upper part of the treatment tank 10 with an on-off valve 15 interposed.

  A liquid ejection pipe 18 having a plurality of liquid ejection ports is disposed near the inner bottom of the processing tank 10. A treatment liquid supply pipe 20 is connected to the liquid ejection pipe 18, and a concentration meter 22 for measuring and monitoring the chemical concentration in the treatment liquid, in this example, the hydrochloric acid concentration, is provided in the middle of the treatment liquid supply pipe 20. It is installed. The processing liquid supply pipe 20 is connected in communication with the liquid outlet 24 a of the aspirator 24. As shown in the front view of FIG. 2, the aspirator 24 has a liquid outlet 24a on one end surface and a liquid introduction connection port 24b for introducing pure water on the other end surface. It has a mouth 24c. Inside the aspirator 24, an internal flow path 24d communicating with the liquid outlet 24a and the inlet 24c is formed. A jet pipe 24e communicating with the liquid introduction connection port 24b is formed so as to protrude into the internal flow path 24d, and the tip jet outlet of the jet pipe 24e is provided so as to face the liquid outlet 24a. It has been. In the aspirator 24 having such a structure, the internal flow path 24d is decompressed by the flow of pure water introduced through the liquid introduction connection port 24b and ejected from the tip ejection port of the ejection pipe 24e, and is sucked by the negative pressure. A chemical solution such as hydrochloric acid (HCl) is sucked from the mouth 24c, and the chemical solution is mixed with pure water.

  A pure water supply pipe 26 that is connected to a pure water supply source is connected to the liquid introduction connection port 24 b of the aspirator 24. The pure water supply pipe 26 is provided with a regulator 28 and on-off valves 30 and 32 for adjusting the supply pressure of pure water from the upstream side to a constant level. Further, the pure water supply pipe 26 is provided with a bypass pipe 34 that branches upstream from the on-off valve 32 and merges in a flow path downstream from the on-off valve 32. A needle valve 36 for finely adjusting the angle is inserted.

  The other end of a chemical liquid supply pipe 42 having one end connected to the bottom of a buffer tank 40 that temporarily stores the chemical liquid 38 is connected to the suction port 24c of the aspirator 24. Connected to the buffer tank 40 is a chemical solution supply pipe 44 that is connected to a supply source of a chemical solution, for example, hydrochloric acid, and has a filter 46 interposed therebetween. A predetermined amount of the chemical 38 is always stored in the buffer tank 40 by appropriately replenishing the chemical into the buffer tank 40 through the chemical supply pipe 44 from the chemical supply source. A manifold valve 48, a flow meter 50, an on-off valve 52, and a needle valve 54 are inserted in the chemical solution supply pipe 42, and the needle valve 54 finely adjusts the flow rate of the chemical solution. The manifold valve 48 includes two on-off valves 48a and 48b and a junction pipe 48c connected to the on-off valve 48b and communicating with the chemical liquid supply pipe 42. Supplying pure water for cleaning to the on-off valve 48b of the manifold valve 48. A pure water supply pipe 56 connected to the flow path is connected to the source. Then, by switching the manifold valve 48, when processing the substrate W, the buffer tank 40 and the aspirator 24 are connected in a flow path, and when performing maintenance, a pure water supply source for cleaning and an aspirator are connected. 24 can be connected in a flow path.

  In the substrate processing apparatus having the above-described configuration, pure water having a predetermined pressure and flow rate is supplied from the pure water supply source to the aspirator 24 through the pure water supply pipe 26. At this time, the inside of the chemical solution supply pipe 42 is filled up to the front of the suction port 24c of the aspirator 24 with the chemical solution that naturally flows out of the buffer tank 40 due to gravity. Then, due to the negative pressure generated by the water flow when the pure water supplied to the aspirator 24 flows through the aspirator 24, the chemical liquid is naturally sucked into the aspirator 24 from the chemical liquid supply pipe 42, and from the buffer tank 40 by the flow amount. The chemical liquid 38 flows out to the chemical liquid supply pipe 42. In this way, when the chemical solution is sucked into the aspirator 24, the chemical solution is mixed with the pure water passing through the aspirator 24 to prepare a treatment solution. The treatment liquid prepared by the aspirator 24 is fed to the liquid ejection pipe 18 through the treatment liquid supply pipe 20 by the pure water supply pressure from the pure water supply source, and ejected from a plurality of ejection openings of the liquid ejection pipe 18. Then, it is supplied into the processing tank 10. Then, the substrate W is immersed in the processing liquid 12 filled in the processing tank 10 and the substrate W is cleaned.

  Further, when the substrate W is not cleaned, the manifold valve 48 is switched to connect the cleaning pure water supply source and the aspirator 24 in a flow path so that the pure water is supplied from the pure water supply source. When pure water is supplied to the aspirator 24 through the supply pipe 26, the pure water supplied to the aspirator 24 is washed through the chemical liquid supply pipe 42 and the pure water supply pipe 56 due to the negative pressure generated by the water flow when flowing in the aspirator 24. Pure water is naturally sucked into the aspirator 24. By doing in this way, a part of chemical | medical solution supply pipe | tube 42 and the inside of the aspirator 24 can be wash | cleaned with the pure water for washing | cleaning. Alternatively, without supplying pure water from the pure water supply source through the pure water supply pipe 26 to the aspirator 24, the pure water supply source for cleaning passes through the pure water supply pipe 56 and the chemical solution supply pipe 42 to the aspirator 24. By supplying pure water of a predetermined pressure, a part of the chemical solution supply pipe 42 or the inside of the aspirator 24 may be washed with pure water for washing.

  Next, FIG. 3 is a schematic configuration diagram of a substrate processing apparatus showing another embodiment of the present invention. 3 (the same applies to FIGS. 4 and 5), the components / members denoted by the same reference numerals as those used in FIG. 1 have the same functions / actions as the components / members described above with reference to FIG. Therefore, a duplicate description thereof is omitted. Further, in FIG. 3 (the same applies to FIGS. 4 and 5), the illustration of the processing tank 10 is omitted.

In the substrate processing apparatus shown in FIG. 3, one end of the mixed chemical supply pipe 58 is connected to the suction port 24 c of the aspirator 24, and the other end of the mixed chemical supply pipe 58 is connected to the bottom of the chemical mixing tank 60. The chemical solution mixing tank 60 is supplied with a first chemical solution 62 having one end connected to the bottom of a first buffer tank 64 for temporarily storing a first chemical solution 62, for example, hydrochloric acid (HCl), and an open / close valve 68 interposed therebetween. One end is connected to the other end of the pipe 66 and the bottom of a second buffer tank 72 for temporarily storing a second chemical solution 70, for example, hydrogen peroxide (H ₂ O ₂ ), and an on-off valve 76 is inserted. The other ends of the second chemical solution supply pipes 74 are connected to each other. The first buffer tank 64 is connected to a first chemical liquid supply pipe 78 that is connected to a supply source of hydrochloric acid, which is the first chemical liquid, and is connected to a filter 80. Connected to the buffer tank 72 is a second chemical liquid supply pipe 82 that is connected to a supply source of hydrogen peroxide solution, which is a second chemical liquid, and is connected to a filter 84. Then, hydrochloric acid and hydrogen peroxide solution are appropriately supplied from the buffer tanks 64 and 72 to the chemical solution mixing tank 60 through the chemical solution supply pipes 66 and 74, respectively. A predetermined amount of the mixed chemical solution 86 in which hydrogen peroxide solution and hydrogen peroxide solution are mixed at a predetermined ratio is stored. In addition, a concentration meter 88, an on-off valve 90, and a needle valve 92 are inserted in the mixed chemical solution supply pipe 58, and the flow rate of the mixed chemical solution is finely adjusted by the needle valve 92.

  In the substrate processing apparatus having the configuration shown in FIG. 3, the mixed chemical liquid that naturally flows out of the chemical liquid mixing tank 60 by gravity is filled in the mixed chemical liquid supply pipe 58 up to the front of the suction port 24c of the aspirator 24. Pure water having a predetermined pressure and flow rate is supplied from the water supply source to the aspirator 24 through the pure water supply pipe 26. Then, due to the negative pressure generated by the water flow when the pure water supplied to the aspirator 24 flows through the aspirator 24, the mixed chemical liquid is naturally sucked into the aspirator 24 from the mixed chemical liquid supply pipe 58, and the chemical liquid mixing tank corresponding to the flow rate. The mixed chemical solution 86 flows from the inside 60 into the mixed chemical solution supply pipe 58. In this way, when the mixed chemical solution is sucked into the aspirator 24, the mixed chemical solution is mixed with the pure water passing through the aspirator 24 to prepare a treatment liquid in which hydrochloric acid, hydrogen peroxide solution, and pure water are mixed. Is done. The treatment liquid prepared by the aspirator 24 is sent to the liquid ejection pipe 18 (not shown in FIG. 3) at the bottom of the treatment tank 10 through the treatment liquid supply pipe 20 by the supply pressure of pure water from the pure water supply source. To be liquidated.

FIG. 4 is a schematic configuration diagram of a substrate processing apparatus showing still another embodiment of the present invention.
In the substrate processing apparatus shown in FIG. 4, one end of the mixed chemical supply pipe 94 is connected to the suction port 24c of the aspirator 24, and the first chemical liquid 96, for example, hydrochloric acid is temporarily added to the other end of the mixed chemical supply pipe 94. The other end of the first chemical liquid supply pipe 100, one end of which is connected to the bottom of the first buffer tank 98 to be stored and the on-off valve 102 is inserted, and the second chemical liquid 104, for example, hydrogen peroxide water, The other end of the second chemical liquid supply pipe 108 having one end connected to the bottom of the second buffer tank 106 to be temporarily stored and having the on-off valve 110 inserted therein is connected so as to join each other. Connected to the first buffer tank 98 is a first chemical liquid supply pipe 112 which is connected to a supply source of hydrochloric acid which is the first chemical liquid and has a filter 114 interposed therein. Connected to the buffer tank 106 is a second chemical liquid supply pipe 116 that is connected to a supply source of hydrogen peroxide solution, which is a second chemical liquid, and is connected to a filter 118. Then, the first chemical liquid and the second chemical liquid are appropriately replenished from the respective chemical liquid supply sources into the first and second buffer tanks 98 and 106 through the first and second chemical liquid supply pipes 112 and 116. Thus, a predetermined amount of the first and second chemical liquids 96 and 104 are always stored in the buffer tanks 98 and 106, respectively. The mixed chemical solution supply pipe 94 is provided with a flow meter 120, an on-off valve 122, and a needle valve 124, and the needle valve 124 finely adjusts the mixed chemical solution flow rate.

  In the substrate processing apparatus having the configuration shown in FIG. 4, the first and second chemical liquid supply pipes 100 are the first and second chemical liquid supply pipes 100 that naturally flow out of the first and second buffer tanks 98 and 106 by gravity. , 108 and flows into the mixed chemical liquid supply pipe 94 to join together, the first chemical liquid hydrochloric acid and the second chemical liquid hydrogen peroxide are mixed, and the mixed chemical liquid is mixed with the mixed chemical liquid supply pipe. 94 is filled up to just before the suction port 24c of the aspirator 24. In this state, when pure water having a predetermined pressure and flow rate is supplied from the pure water supply source to the aspirator 24 through the pure water supply pipe 26, the pure water supplied to the aspirator 24 flows through the aspirator 24. Due to the negative pressure generated by the water flow, the mixed chemical liquid is naturally sucked into the aspirator 24 from within the mixed chemical liquid supply pipe 94, and the first and second chemical liquids 96 from within the first and second buffer tanks 98 and 106 by the flow rate. , 104 flow out into the first and second chemical liquid supply pipes 100 and 108, respectively, and the first and second chemical liquids flow into the mixed chemical liquid supply pipe 94 and are mixed. In this way, when the mixed chemical solution is sucked into the aspirator 24, the mixed chemical solution is mixed with the pure water passing through the aspirator 24 to prepare a treatment liquid in which hydrochloric acid, hydrogen peroxide solution, and pure water are mixed. Is done. The treatment liquid prepared by the aspirator 24 is sent to the liquid ejection pipe 18 (not shown in FIG. 4) at the bottom of the treatment tank 10 through the treatment liquid supply pipe 20 by the pure water supply pressure from the pure water supply source. To be liquidated.

FIG. 5 is a schematic configuration diagram of a substrate processing apparatus showing still another embodiment of the present invention.
In the substrate processing apparatus shown in FIG. 5, the second aspirator 126 is interposed in the middle of the processing liquid supply pipe 20 connected to the liquid outlet 24a of the aspirator 24 in the apparatus having the configuration shown in FIG. . Then, the liquid outlet 126a of the second aspirator 126 is connected to the liquid ejection pipe 18 (not shown in FIG. 5) at the bottom of the processing tank 10 in a flow path, and the liquid connection port 126b of the second aspirator 126 is connected. Is connected to the liquid outlet 24a of the aspirator 24 in a flow path. The other end of the second chemical liquid supply pipe 132 having one end connected to the bottom of the second buffer tank 130 for temporarily storing the second chemical liquid 128 is connected to the suction port 126c of the second aspirator 126. Has been. Connected to the second buffer tank 130 is a second chemical liquid supply pipe 134 that is connected to a supply source of a second chemical liquid, for example, hydrogen peroxide solution, and is connected to a filter 136. Then, the second chemical tank is always refilled into the second buffer tank 130 by appropriately replenishing the second chemical liquid into the second buffer tank 130 through the second chemical liquid supply pipe 134 from the second chemical liquid supply source. A predetermined amount of the second chemical 128 is stored. A flow meter 138, an on-off valve 140, and a needle valve 142 are inserted in the second chemical solution supply pipe 132, and the flow rate of the second chemical solution is finely adjusted by the needle valve 142.

  In the substrate processing apparatus having the configuration shown in FIG. 5, a mixed solution of pure water and a chemical solution (hydrochloric acid) prepared by the aspirator 24 is supplied to the second aspirator 126. At this time, the inside of the second chemical liquid supply pipe 132 is filled up to the front of the suction port 126c of the second aspirator 126 with the second chemical liquid that naturally flows out of the second buffer tank 130 by gravity. Then, due to the negative pressure generated by the liquid flow when the mixed liquid supplied to the second aspirator 126 flows through the aspirator 126, the second chemical liquid enters the second aspirator 126 from the second chemical liquid supply pipe 132. Natural suction is performed, and the second chemical liquid 128 flows out of the second buffer tank 130 into the second chemical liquid supply pipe 132 by the flow rate. In this way, when the second chemical solution is sucked into the second aspirator 126, the second chemical solution is mixed with the mixed solution passing through the second aspirator 126, and hydrochloric acid, hydrogen peroxide solution, and A treatment liquid mixed with pure water is prepared. The treatment liquid prepared by the second aspirator 126 passes through the treatment liquid supply pipe 20 by the pure water supply pressure from the pure water supply source, and the liquid ejection pipe 18 (not shown in FIG. 5) at the bottom of the treatment tank 10. ).

  In the embodiment shown in FIG. 3 and FIG. 4, the treatment liquid is prepared by mixing the mixed chemical liquid in which two kinds of chemical liquids are mixed with pure water by the aspirator 24. The treatment liquid may be prepared by mixing the mixed chemical liquid obtained by mixing the above kinds of chemical liquid and pure water with the aspirator 24. In the embodiment shown in FIG. 5, two aspirators 24 and 126 are connected in series to prepare a treatment liquid in which two kinds of chemical liquid and pure water are mixed. Alternatively, a treatment liquid in which three or more kinds of chemical liquids and pure water are mixed may be prepared by connecting more or more aspirators in series. Furthermore, the present invention is not limited to the immersion type substrate processing apparatus that performs processing by immersing the substrate in the processing liquid stored in the processing tank. For example, the substrate is held in a horizontal posture and rotated around the vertical axis. However, the present invention can also be applied to a substrate rotating type processing apparatus that discharges and supplies a processing liquid from a nozzle to the surface of a substrate and processes the substrate with the processing liquid.

It is a schematic block diagram of the substrate processing apparatus which shows an example of embodiment of this invention. It is a front view which shows the structural example of the aspirator which is one of the components of the substrate processing apparatus shown in FIG. It is a schematic block diagram of the substrate processing apparatus which shows another embodiment of this invention. It is a schematic block diagram of the substrate processing apparatus which shows another embodiment of this invention. It is a schematic block diagram of the substrate processing apparatus which shows another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Processing tank 12 Processing liquid 18 Liquid ejection pipe 20 Processing liquid supply pipe 24 Aspirator 24a Aspirator liquid outlet 24b Aspirator liquid connection port 24c Aspirator inlet 26 Pure water supply pipe 36, 54, 92, 124, 142 Needle Valve 38 Chemical liquid 40, 64, 72, 98, 106, 130 Buffer tank 42 Chemical liquid supply pipe 44 Chemical liquid supply pipe 48 Manifold valve 56 Pure water supply pipe for cleaning 58, 94 Mixed chemical liquid supply pipe 60 Chemical liquid mixing tank 62, 96 First chemical liquid 66, 100 First chemical liquid supply pipe 70, 104, 128 Second chemical liquid 74, 108, 132 Second chemical liquid supply pipe 78, 112, 134 First chemical liquid supply pipe 82, 116 Second Liquid supply pipe 86 of the chemical liquid 126 The second aspirator 126a The liquid outlet 126b of the second aspirator Second aspirator liquid inlet port 126c Second aspirator inlet W Substrate

Claims (5)

A substrate processing section for processing a substrate with a processing liquid prepared by mixing a chemical and pure water;
An aspirator that is connected to the substrate processing unit via a processing liquid supply path and mixes pure water and the chemical liquid by sucking the chemical liquid from the suction port by a negative pressure generated by the flow of pure water;
Pure water supply means for supplying pure water to the aspirator through a pure water supply path connected to the liquid introduction connection port of the aspirator;
A chemical supply means for supplying a chemical to the aspirator through a chemical supply path connected to the suction port of the aspirator;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The chemical solution supply means includes
A mixed chemical solution supply path having one end connected to the suction port of the aspirator;
A chemical solution mixing tank to which the other end of the mixed chemical solution supply path is connected;
Mixed chemical liquid supply means for individually supplying a plurality of types of chemical liquids into the chemical liquid mixing tank through a plurality of mixed chemical liquid supply paths connected to the chemical liquid mixing tank,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The chemical solution supply means includes
A mixed chemical solution supply path having one end connected to the suction port of the aspirator;
Mixed chemical liquid supply means for individually supplying a plurality of types of chemical liquids to the mixed chemical liquid supply path through a plurality of mixed chemical liquid supply paths respectively connected to the mixed chemical liquid supply path;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The aspirator is a first aspirator, and the chemical liquid is a first chemical liquid,
Due to the negative pressure generated by the flow of the liquid mixture of the pure water mixed with the first aspirator and the first chemical liquid, which is interposed between the first aspirator and the substrate processing unit in a flow path. A second aspirator for sucking the second chemical liquid from the inlet and mixing the mixed liquid and the second chemical liquid;
Second chemical liquid supply means for supplying the second chemical liquid to the second aspirator through a second chemical liquid supply path connected to the suction port of the second aspirator;
A substrate processing apparatus, further comprising: The substrate processing apparatus according to claim 1, wherein:
A washing water supply path communicating in the middle of the chemical liquid supply path;
Cleaning water supply means for supplying pure water for cleaning to the chemical solution supply path through the cleaning water supply path;
A flow path switching means for selectively connecting the cleaning water supply path to the chemical liquid supply path;
A substrate processing apparatus, further comprising:

Images