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Publication number
JP2007523481A5
JP2007523481A5 JP2006553340A JP2006553340A JP2007523481A5 JP 2007523481 A5 JP2007523481 A5 JP 2007523481A5 JP 2006553340 A JP2006553340 A JP 2006553340A JP 2006553340 A JP2006553340 A JP 2006553340A JP 2007523481 A5 JP2007523481 A5 JP 2007523481A5
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substrate
layer
conductivity type
forming
well
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JP2006553340A
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JP2007523481A (ja
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Priority claimed from US10/951,283 external-priority patent/US7304354B2/en
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Publication of JP2007523481A publication Critical patent/JP2007523481A/ja
Publication of JP2007523481A5 publication Critical patent/JP2007523481A5/ja
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Claims (1)

  1. 第１導電型を有し、上面を有する基板を提供する工程と、
    前記基板の上面の下に配置され、前記第１導電型を有し、第１基板不純物濃度よりも高い層不純物濃度を更に含む層を形成する工程と、
    前記第１導電型を有する前記層が前記複数のウェル領域の下に実質的に連続して延び、前記複数のウェル領域が、前記第１導電型を有するとともに第１ウェル接触領域を含む前記層と前記基板の上面との間の第１ウェル領域を含む、複数のトランジスタに対応する複数のウェル領域を形成する工程と、
    前記層から前記基板の前記上面に伸びる垂直導体を形成する工程と
    を含むことを特徴とする方法。
JP2006553340A 2004-02-17 2005-02-15 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法 Pending JP2007523481A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US54527104P 2004-02-17 2004-02-17
US10/951,283 US7304354B2 (en) 2004-02-17 2004-09-27 Buried guard ring and radiation hardened isolation structures and fabrication methods
PCT/US2005/004740 WO2005079400A2 (en) 2004-02-17 2005-02-15 Buried guard ring and radiation hardened isolation structures and fabrication methods

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JP2012129441A Division JP5607111B2 (ja) 2004-02-17 2012-06-07 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法

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JP2007523481A JP2007523481A (ja) 2007-08-16
JP2007523481A5 true JP2007523481A5 (ja) 2008-04-03

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JP2006553340A Pending JP2007523481A (ja) 2004-02-17 2005-02-15 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法
JP2012129441A Active JP5607111B2 (ja) 2004-02-17 2012-06-07 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法

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US (6) US7304354B2 (ja)
EP (1) EP1716591A4 (ja)
JP (2) JP2007523481A (ja)
WO (1) WO2005079400A2 (ja)

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