JP2006253184A - Method of manufacturing substrate unit and component mounting apparatus using the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate unit which improves the production efficiency of the substrate unit by shortening arrangement work in switching the kind of a substrate as much as possible, and to provide a component mounting apparatus using this method. <P>SOLUTION: A temporary group 72 is set and a substrate 32-1 is included in the temporary group 72 to create an disposition table (arrangement table) of a tape feeder. A subsequent substrate 32-2 is added to the temporary group 72, the same parts as those of the substrate 32-1 are commonly used (feeder numbers 4, 18), and the other parts are disposed in a disposition vacant position. In repeating the same process; substrates each having parts unable to be disposed on arrangement vacant positions are excluded from the temporary group 72, a part disposition arrangement table is created for integrating the entire of a main group 73 by considering the temporary group 72 of the other substrates as the main group 73, and a part mounting program is formed for each kind of the substrate. In this way, three kinds of substrates can be continuously manufactured without changing arrangements. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a board unit production method for improving the production efficiency of a board unit by shortening the setup work at the time of switching board models as much as possible, and a component mounting apparatus using the method.

  Conventionally, a production line is configured with a substrate supply device and dispenser on the upstream side of the production line, a reflow furnace on the downstream side of the production line, etc., and an electronic component (hereinafter referred to simply as a substrate) is carried into the own device. There is an electronic component mounting apparatus (hereinafter simply referred to as a component mounting apparatus) that automatically mounts a component and produces a board unit.

FIG. 8 (a) is an external perspective view showing an example of such a component mounting apparatus, and FIG. 8 (b) is a perspective view schematically showing an internal configuration by removing the upper and lower protective covers. .
As shown in FIG. 2A, the component mounting device 1 includes a monitor device 2 composed of a CRT display before and after the ceiling cover, and an alarm lamp 3 for notifying the operation state on the left and right sides of the ceiling cover. It has.

  Further, on the front and rear surfaces of the upper protective cover 4, an operation input display device 5 which is composed of a liquid crystal display and a touch input device and can input various instructions by external operation is disposed. (The display unit 5 for operation input on the rear side which is obliquely upward to the right in the figure is shaded and cannot be seen).

  On the lower base 6, a pair of fixed and movable parallel substrate guide rails 7 is provided in the center in the direction of conveyance of the substrate 8 (X-axis direction, diagonally lower right in the figure). (Slanting upper left direction) and extends horizontally. A loop-shaped conveyance belt (conveyor belt) that is not visible in the drawing is disposed so as to be in contact with the lower part of the board guide rails 7.

  The conveyor belt is driven by a belt drive motor (not shown) with the side of the belt having a width of several millimeters seen from below the substrate guide rail 7 into the substrate conveyance path, and runs in the substrate conveyance direction. Is loaded from the upstream side of the line into the apparatus body. And the board | substrate 8 with which components were mounted is sequentially carried out to the downstream of a line. In this component mounting apparatus 1, two substrates 8 are always carried in, positioned, and fixed until the mounting of electronic components is completed.

  Supply stages 9 are formed on the front and rear sides of the base 6, respectively (the rear supply stage 9 that is obliquely upward to the right in the figure is not visible in the figure. In b), the rear part supply stage 9 is not shown). On the supply stage 9, a large number of tape reel type component supply devices 11 (generally simply referred to as tape feeders, tape cassettes, etc.), 50 to 70, are arranged. The tape reel type component supply device 11 is detachably mounted at its rear end with a tape reel 12 on which a tape containing components is attached.

  Further, above the base 6, two Y-axis rails 13 which are separately fixed to the left and right (X-axis direction) of the main body frame, and are slidably supported by these two Y-axis rails 13, respectively. Two X axis rails 14 (four in total for the entire apparatus) are arranged.

  The X-axis rails 14 can slide in the Y-axis direction along the Y-axis rails 13, and each of these X-axis rails 14 (four in total as a whole device) 15 working heads 15 (15-1, 15-2 and 15-3, 15-4) are suspended along the X-axis rail 14 so as to be slidable in the X-axis direction. In each working head 15, two mounting heads 16 are disposed in the example shown in FIG. That is, a total of eight mounting heads 16 are disposed in the component mounting apparatus 1.

  The working head 15 is bent on an electrical component motherboard inside the base 6 of the apparatus main body 1 through a plurality of signal cords (not shown) that are protected and accommodated in a belt-like chain body 17 that is bendable and hollow inside. It is connected to the central control unit. The work head 15 is supplied with electric power and a control signal from the central control unit via these signal codes, and transmits image data indicating information on a substrate positioning mark and a component mounting position to the central control unit.

  Further, between the board guide rail 7 and the supply stage 9, there are four component recognition cameras 18 for recognizing images of components sucked by the mounting head 16 and judging the quality and sucked posture. Are arranged at four locations corresponding to the working head 15, and in the vicinity thereof, although not shown in the figure, a plurality of types of suction nozzles for mounting on the mounting head 16 in a replaceable manner The nozzle changer which accommodated is arranged.

  In addition to the above-described central control unit, the base 6 is provided with a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two substrate guide rails 7 and the like, although not particularly illustrated. ing.

  FIG. 9 is a perspective view of the working head 15. As shown in the figure, the working head 15 is connected to the central control unit of the main body device by the bendable belt-like chain body 17 as described above, and the two mounting heads 16 supported by the support unit 19. And 16, and a substrate recognition camera 21.

  Each of the two mounting heads 16 can move up and down in the Z-axis direction (vertical direction) and can rotate in the θ-axis direction (360 ° direction). At the tip of the mounting head 16, a diffusion plate illumination device 22 and a suction nozzle 24 are mounted at the tip. The suction nozzle 24 is formed of a light diffusion plate 24-1 and a nozzle 24-2.

  The work head 15 is freely moved back and forth and right and left by the Y-axis rail 13 and the X-axis rail 14 described above. Thereby, the suction nozzle 24 can be moved back and forth, right and left in each work area via the work head 15 and the mounting head 16, can be moved up and down, and can be rotated in a 360 ° direction.

  Such a component mounting apparatus sucks a component from the component supply device by the replaceable suction nozzle 24 at the tip of the mounting head 16 that is movable in a three-dimensional work space of X, Y, and Z as described above. Image recognition of the picked-up component with the component recognition camera, image recognition of the position of the board on which the image-recognized component is to be mounted with the substrate recognition camera, and the image-recognized component at the image-recognized position on the substrate The board unit is produced by mounting automatically while correcting the position.

  By the way, in such a component mounting apparatus, when the production of a predetermined number of board units is completed, the production is switched to the production of board units of the next different standard (also called model). That is, the production model of the board is switched.

  When the type of board to be produced is switched, the type of component mounted on the board is also switched to a part corresponding to the type of board, so that the tape-type component supply device mounted on the component supply stage is replaced.

  When the type of board unit to be produced is switched, a component mounting program corresponding to the switched board unit is loaded into the component mounting apparatus. That is, the component mounting program is switched. Usually, such preliminary work is called “setup”.

  Since some types of board units are always produced at the production line site, "setup" is always performed when the board unit model is switched. Therefore, the above "setup" Is often called.

  In such a setup change operation, first, all the tape-type component supply devices used in the previous production are removed from the component supply stage, and using the new board setup table, while referring to the setup table, Perform setup work while checking all parts in order.

  In the setup table, the standard name (part name) of the part as setup data and the number indicating the mounting position on the part supply stage of the tape-type part supply device accommodating the part are listed on the sheet. It is described.

  In the setup operation as described above, the operator prepares a setup table for a new board prepared in advance, a tape reel wound with a tape containing a component to be replaced, a tape-type component supply device for attaching the tape reel, and Visual confirmation is performed while checking the position on the component supply stage on which the tape-type component supply device is mounted.

As described above, since all of the operations rely on visual observation, the setup work takes a very long time, which is one factor that hinders improvement of work efficiency.
In addition, since all of them are work that relies on visual inspection, even if there are parts that use the same parts regardless of the state before setup change (preparation for the board produced previously), etc. After removing the parts supply device from the parts supply stage, the setup work was performed while visually checking all the parts in the setup table in order, so it wasted that setup time would be required even if the same type of parts were used. Could not be eliminated.

Conventionally, a tape-type component supply device that visually displays a position on a component supply stage where a tape-type component supply device of a component specified in a setup table is to be mounted (arranged) in order to solve such a problem. An arrangement position designation method has been proposed. (For example, refer to Patent Document 1.)
Japanese Patent Laid-Open No. 11-07048 ([Summary], FIG. 1)

  However, even if the mounting position of the part specified in the setup table on the part supply stage of the tape-type part supply device can be visually judged on the display device, the part reference is made to the setup table for the newly produced board. This is not much different from the prior art in that the mounting position displayed on the display device is confirmed while the desired tape type component supply device is sequentially attached to the position while confirming the types of the devices.

  In other words, even when there are parts that use the same parts, the same type of parts is used, in which all the parts supply devices are once removed from the parts supply stage and the parts in the setup table are set up (attached) in order. Even in this case, the waste of taking time for setup has not been solved.

In addition, no consideration has been given to efficiency in creating a component mounting program for each board.
An object of the present invention is to provide a board unit production method for improving the production efficiency of a board unit by shortening the setup work at the time of switching the type of board to be produced as much as possible in view of the above-described conventional situation, and component mounting using the method Is to provide a device.

Hereinafter, a configuration of a board unit production method and a component mounting apparatus using the method according to the present invention will be described.
First, a substrate unit production method according to a first aspect of the present invention is a substrate unit production method for producing a substrate unit by mounting electronic components on a plurality of specified types of substrates. An extraction process for extracting a substrate group capable of placing a component supply apparatus for supplying a mounted component on the component supply apparatus placement stage from the plurality of types of substrates, and a group for grouping the substrate group extracted by the extraction process A setup creation process for creating a setup table capable of batch setup of one group of board groups of the group grouped by the grouping process, and a component mounting program for each board of the one group of board groups And a program creation step for creating a board group of the one group based on a component mounting program created by the program creation step Performing sequential component mounting process into individual substrate configured to collectively performed in a continuous component mounting process to the substrate group of the 1 group.

  For example, when extracting one group of board groups to be subjected to the component mounting process next from the one group of board groups preceded by the component mounting process, The component supply device that supplies the same component is configured to take over the arrangement position on the component supply device arrangement stage.

  Next, a component mounting apparatus according to a second aspect of the present invention is a component mounting apparatus for supplying a component to be mounted in a component mounting apparatus for manufacturing a board unit by mounting electronic components on a plurality of specified types of substrates. Extracting means for extracting a group of boards that can be placed on the component supply apparatus placement stage from among the plurality of types of boards, grouping means for grouping the board groups extracted by the extraction means, and the grouping means A setup creation means for creating a setup table capable of batch setup of one group of board groups in the group grouped by the above, a program creation means for creating a component mounting program for each board of the one group of board groups, In accordance with the component mounting program created by the program creation means, the component mounting process is sequentially performed on the individual boards of the group of boards. Configured to collectively performing component mounting process to the substrate group 1 group continuously.

  According to the present invention, a plurality of types of boards that can share a component supply device arrangement stage are grouped and set up for each group, and for the same component among the groups, the feeder number of the component (of the component supply device) The number of the arrangement position on the component supply apparatus arrangement stage) is inherited at the time of creating the program, so that the setup work at the time of board switching can be shortened as much as possible, thereby improving the production efficiency. In particular, it is effective in the production of many kinds and small lots.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a diagram schematically showing an internal configuration of a main part of a component mounting apparatus that performs a component mounting process using a component mounting method for preventing a difference in component setting during component replacement according to the present invention. The general appearance of the component mounting apparatus of this example is the same as that of the component mounting apparatus 1 shown in FIG.

  In FIG. 1, two board guide rails 31, a loaded board 32, a component supply stage 33, a tape-type component supply device 34 disposed on the component supply stage 33, and a front and rear (Y Direction) Left and right (X direction) working head 36 for performing component mounting work, and six rotary type mountings that are held by this working head 36 and can be moved up and down (Z direction) and rotated 360 degrees. A head 37, a substrate recognition camera 38 that is disposed in the vicinity of the mounting head 37 and captures a position mark or the like of the substrate 32 for image recognition, and a component that is sucked by a suction nozzle 39 at the tip of the mounting head 37 A fixed component recognition camera 40 is shown in the image recognition apparatus main body.

  The mounting head 37 sucks and pulls up the component 42 of the component tape 41 that has been pulled out to the component supply port 35 of the tape-type component supply device 34, and moves the component 42 with the component recognition camera 40 on the way to the substrate 32. Image recognition is performed, position correction is performed, and the component 42 is mounted on the substrate 32.

  FIG. 1 shows a tape reel that has been removed from the position 45 where the component has been cut out and replaced with the tape-type component feeder 34a that is being replaced and the reel holder 43 at the rear end. 44 is shown.

  FIG. 2 is a system block diagram of the component mounting apparatus configured as described above. As shown in the figure, the component mounting apparatus 50 of this example includes a CPU 51 and a control unit including an i / o (input / output) control unit 53 and an image processing unit 54 connected to the CPU 51 via a bus 52. Yes. Further, a memory 55 is connected to the CPU 51. The memory 55 includes a program area and a data area (not shown).

  Further, the i / o control unit 53 is sucked by the board illumination device 56 for illuminating the component mounting position of the board 32 (see FIGS. 1 and 2) and the suction nozzle 39 (see FIG. 1) of the mounting head 37. An LED illuminator 57 provided integrally with a component recognition camera 40 for illuminating the component 42 is connected via an illumination control unit 58.

  Further, an X-axis motor 61, a Y-axis motor 62, a Z-axis motor 63, and a θ-axis motor 64 are connected to the i / o control unit 53 via respective amplifiers (AMP). The X axis motor 61 drives the work head 36 in the X direction, the Y axis motor 62 drives the work head 36 in the Y direction, the Z axis motor 63 drives the mounting head 37 up and down, and the θ axis motor. Reference numeral 64 rotates the mounting head 37, that is, the suction nozzle 39 by 360 degrees.

  Although not shown in particular, each of the amplifiers is provided with an encoder, and the motors (X-axis motor 61, Y-axis motor 62, Z-axis motor 63, and θ-axis motor 64) are provided by these encoders. The encoder value corresponding to the rotation of is input to the CPU 51 via the i / o control unit 53. Thereby, the CPU 51 can recognize the front / rear, left / right, upper / lower current positions, and rotation angles of each mounting head 37.

  Further, a vacuum unit 65 is connected to the i / o control unit 53. The vacuum unit 65 is pneumatically connected to the suction nozzle 39 of the mounting head 37 via a vacuum tube 66. An air pressure sensor 67 is disposed in the vacuum tube 66. The vacuum unit 65 causes the suction nozzle 39 to suck the component 42 by vacuum, or releases suction by vacuum release, air blow, and vacuum break (vacuum break).

  At this time, air pressure data in the vacuum tube 66 is output from the air pressure sensor 67 to the CPU 51 via the i / o control unit 53 as an electrical signal. Thereby, the CPU 51 knows the state of the air pressure in the vacuum tube 66 and can recognize whether or not the component 42 is ready to be sucked by the suction nozzle 39 and the sucked component 42 is normally Whether it is adsorbed or not can be recognized.

  Further, the i / o control unit 53 is connected to a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp and the like via respective drivers. The positioning device is disposed below the board guide rail 31 inside the base of the component mounting apparatus 50, and positions the board 32 guided into the apparatus. The belt drive motor circulates and drives the conveyor belt that is integrally disposed on the guide rail 31. The substrate sensor detects the loading and unloading of the substrate 32. The abnormality display lamp is lit or flashed when an abnormality such as an operation abnormality of the component mounting apparatus 50 or an entry of a foreign object in the work area, and notifies the on-site worker of the occurrence of the abnormality.

  In addition, a communication i / o interface 68, a display operation input device 69, and a recording device 70 are connected to the CPU 51. The communication i / o interface 68 is connected to these processing devices in a wired or wireless manner when, for example, teaching processing or the like is performed by another processing device such as a personal computer, so that communication with the CPU 51 is possible. To do.

  The recording device 70 can be mounted with various recording media such as a hard disk, MO, FD, CD-ROM / RW, flash memory device, etc., and component mounting processing of the component mounting device 50 and component mounting performed beforehand. Various types of data such as teaching processing, setup table creation processing, parts library data, NC data from CAD, and setup table data are recorded and held.

  These programs are loaded into the program area of the memory 55 by the CPU 51 and used for the control process of each unit, and the data is also read into the data area of the memory 55 to perform a predetermined process. The processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium. The data area of the memory 55 includes a number of subdivided register areas, and various count values are temporarily stored in the register area.

  In the display operation input device 69, when the component mounting operation is performed, the image processing unit 54 captures an image of the substrate 32 captured by the substrate recognition camera 38 on the work head 36 side, and the image processing unit 54 also recognizes the component recognition on the main body device side. The image of the part 42 imaged by the camera 40 is displayed on the display device.

In addition, when the teaching process is executed, a teaching screen is displayed, and when the setup is created, the arrangement position of the tape-type component supply device 34 of the board to be grouped is displayed.
When mounting the component 43 (or 47) on the board 32, the CPU 51 recognizes the image of the component 42 sucked by the suction nozzle 39 at the tip of the mounting head 37 from the tape-type component supply device 34 with the component recognition camera 40, The mounting position of the board 32 on which the image-recognized component 42 is to be mounted is image-recognized by the board-recognition camera 38, and the image-recognized component 42 is mounted on the board-recognized mounting position while correcting the position. .

  FIG. 3 (a) is a diagram schematically showing the arrangement of the component supply stages in the component mounting apparatus of the present example that operates as described above in the above configuration, and FIG. 3 (b) schematically shows the setup table. FIG.

  The component mounting apparatus (apparatus main body) 50 of this example is shown in a simplified manner in FIG. 1, but actually, as shown in FIG. 3A, a component supply stage 33 in which a tape-type component supply apparatus 34 is provided. Are arranged in a total of four on the production line of the apparatus main body 50 before and after the two sides of the line.

  FIG. 3 (a) shows these four component supply stages 33. The component supply stage 33a is a 1F stage, the component supply stage 33b is a 2F stage, the component supply stage 33c is a 1R stage, and the component supply stage 33d is a 2R stage. These are expressed in simple terms.

  Each of these component supply stages 33 can have a maximum of 30 tape-type component supply devices 34. Each of these four component supply stages 33 has a setup table corresponding to each.

  FIG. 3B is a diagram schematically showing four setup tables respectively corresponding to the four component supply stages 33. In FIG. 5B, only the setup table 71a for the component supply stage 33a (1F stage) is specifically shown among the four setup tables 71 (71a to 71d).

  As shown in FIG. 3 (b), in the setup table, the “feeder number” (number of the arrangement position on the component supply stage 33 of the tape-type component supply device 34) is described at the top, and the feeder is below that. A list of standard names (also part names) of parts to be accommodated in the number feeder (tape type part supply device 34) is displayed.

  In the example shown in FIG. 3B, for example, the feeder standard number 6 corresponds to the part standard name “2125C”, the feeder number 9 corresponds to the part standard name “3216R”, and the feeder number 25 The part standard name “1608C” is described correspondingly.

  This means that the part with the part standard name “2125C” is set up at the sixth position on the part supply stage 33a, that is, newly installed, and the part with the part standard name “3216R” is the part supply stage. It is set up at position 9 on 33a (newly mounted), and the part with the part name “1608C” is set up at position 25 on the component supply stage 33a (newly mounted). I mean.

Note that the setup table 71a in FIG. 3B shows only three types of part standard names for convenience of explanation, but in reality, more part standard names are described.
Here, the setup performed before the actual operation of the component mounting process as described above will be described. The board unit production method by the setup of this example is particularly effective in the production of many kinds and small lots using a plurality of kinds of boards.

4 (a), 4 (b) to 6 (a), 6 (b) are diagrams showing a procedure for creating a setup table for reducing the setup work as much as possible in the production of a plurality of types of substrates.
FIG. 7 is a flowchart showing a processing procedure for creating a setup table and performing a part program for reducing the setup work as much as possible in the production of a plurality of types of boards.

  In the following description, for convenience of explanation, a group of boards consisting of six types of models will be described. Further, representatively, the setup table 71a of the 1F stage of the component supply stage 33 shown in FIG.

First, in FIG. 7, the CPU 51 shown in FIG. 2 sets a temporary group of substrates in a predetermined area of the memory 55 (S1).
In this process, there is no substrate type belonging to this temporary group. Therefore, as shown in FIG. 4A, the temporary group setup table 72 is in a blank state.

Subsequently, the CPU 51 determines whether or not setup investigation has been completed for all the substrates (S2).
In the description here, the board is referred to as a board including the meaning of the model. That is, the meaning of “all substrates” indicates “all models” of substrates, not the number of substrates. Further, “plural substrates”, “uninvestigated substrates”, etc., which will be described later, also refer to “multiple models”, “unsurveyed models”, and the like.

Therefore, the determination process for determining whether or not the setup investigation has been completed for all the boards is a determination process for determining whether or not the setup investigation has been completed for all types of boards.
In the above-described determination processing, if it is the first time in the processing, the setup investigation has not been completed for all the substrates (S2 is No).

Therefore, in this case, next, the CPU 51 extracts one uninvestigated substrate from the plurality of substrates specified in advance, and adds the substrate to the temporary group (S3).
Here, the first board added (incorporated) to the temporary group is referred to as a board 32-1.

Next, the CPU 51 determines whether or not the previously determined group exists (S4).
Also in this case, if it is the first time of the process, there is no previously determined group (No in S4).

  Therefore, in this case, the CPU 51 next determines whether all the components used in the temporary group can be arranged in the feeder arrangement space (component supply stage 33a) of the mounting machine (component mounting apparatus 50) (S6). .

In the description here, the component is referred to as a component including the meaning of the tape-type component supply device 34 that accommodates the component.
That is, the determination process of whether all the components can be arranged in the feeder arrangement space of the mounting machine is the determination process of whether all the tape-type component supply devices 34 accommodating the components can be arranged on the component supply stage 33a.

  In this determination processing, in the first case of processing, the substrate 32-1 is the only substrate incorporated into the temporary group. Therefore, “all components used in the temporary group” indicates “all types of components to be mounted on the board 32-1”.

That is, in this process, it is determined whether all the components to be mounted on the substrate 32-1 (the tape feeder 34 that accommodates them) can be arranged on the component supply stage.
FIG. 4B shows the arrangement on the component supply stage 33a of the tape feeder 34 that accommodates components to be mounted on the board 32-1, with right hatching.

  In the example shown in FIG. 4B, the parts to be mounted on the board 32-1 are arranged at feeder numbers 2, 4, 7 to 10, 12 to 16, 18 to 20, and 25. This is also a setup table for the substrate 32-1.

As shown in FIG. 4B, all the components to be mounted on the board 32-1 can be arranged on the component supply stage 33a (Yes in S6).
Therefore, in this case, the CPU 51 creates a setup table and a component mounting program, and temporarily holds the created setup table and the component mounting program in a predetermined area of the memory 55 (S7).

The setup table and component mounting program created by this processing are the setup table and component mounting program for the board 32-1.
Thereafter, the CPU 51 returns to the process S1. As a result, in the next process S3, the board 32-2 in the unexamined boards is added to the temporary group. In process 6, the feeder placement space in the temporary group including the added board 32-2 is determined. Is done.

In FIG. 5A, the arrangement of the components of the added board 32-2 on the component supply stage 33a is shown by left hatching below the arrangement of the components of the board 32-1 of the temporary group. .
In the example shown in FIG. 5A, the parts to be mounted on the board 32-2 are arranged at feeder numbers 4 to 6, 18, 24, and 28. This is also a setup table for the substrate 32-2.

  Further, in FIG. 5A, the component numbers of the board 32-1 and the board 32-2 are overlapped at the feeder numbers 4 and 18. This is because the substrate 32-2 uses two types of the same components as the substrate 32-1, and thus the two types of the same components are shared with the substrate 32-1, and the remaining components are arranged as the component arrangement of the substrate 32-1. It is shown that they are arranged at positions that do not overlap.

  As shown in FIG. 5A, since all the components to be mounted on the substrate 32-1 and the substrate 32-2 can be arranged on the component supply stage 33a, in the process 7, the CPU 51 sets the setup table and the component mounting. Create programs and.

The setup table in this case is a setup table in which the board 32-1 and the board 32-2 are combined, and the component mounting program is a component mounting program for the board 32-2.
Further, when creating the component mounting program for the board 32-2, the feeder numbers 4 and 18 are the feeder numbers 4 and 18 of the component mounting program created on the board 32-1 and held in the memory 55. The feeder numbers of 18 parts are taken over as they are.

  The processing is performed again in the same manner as described above, and the substrate 32-3 is added to the temporary group from the next unprocessed substrates, and the feeder arrangement space in the temporary group including the substrate 32-3 is determined. The

  FIG. 5B shows an example of the feeder placement space for parts in the temporary group including the board 32-3. In the example shown in FIG. 5B, the parts of the board 32-3 are arranged at feeder numbers 17, 18, 21 to 23.

And it turns out that the component of the feeder number 18 is shared by the board | substrate 32-1, the board | substrate 32-2, and the board | substrate 32-3.
Again, as shown in FIG. 5B, all of the components to be mounted on the substrate 32-1, the substrate 32-2, and the substrate 32-3 can be placed on the component supply stage 33a. The CPU 51 creates a setup table and a component mounting program.

  The setup table created here is a setup table combining the components of the board 32-1, the board 32-2, and the board 32-3, and the component mounting program is a component mounting program of the board 32-3.

  In creating this component mounting program, the feeder number of the component with the feeder number 18 is the component with the feeder number 18 of the component mounting program created on the substrate 32-1 or 32-2 and held in the memory 55. The feeder number is taken over as it is.

At this stage, the positions of feeder numbers 1, 3, 11, 26, 27, 29, and 30 are vacant as feeder arrangement spaces.
Further, the process is repeated to add the fourth (fourth type) substrate to the temporary group, and the feeder arrangement space in the temporary group including the fourth substrate is determined.

  If the parts of the fourth board are the same parts as the parts of the temporary group 72, they can be shared, so it is not necessary to arrange the parts accordingly, but the parts of the fourth board are not the same as the parts of the temporary group 72. Things need to be placed at the position of the vacant feeder number.

  And even if there is no space in the feeder placement space, if there is still a part that needs to be placed in the position of the empty feeder number among the parts on the fourth board, it is no longer the fourth in the temporary group. There is no feeder placement space for board components.

That is, the process S6 is No in the fourth order process in FIG.
In this case, the CPU 51 determines the temporary group that does not include the board (the board 32-4) extracted this time as the main group (the group 73 in FIG. 5B), and the setup table of the temporary group that has been held. The component mounting program is registered in a predetermined area of the memory 55 as a setup for this group (S8).

  In this process, the setup table is a single setup table in which the components of the board 32-1, the board 32-2, and the board 32-3 are combined, and the component mounting program is used for each of the boards 32-1 to 32-3. This is a component mounting program.

  Then, the CPU 51 treats the substrate extracted this time (substrate 32-4) as unexamined and treats the other substrates (substrates 32-1, 32-2, 32-3) as investigated (S9). Return to processing.

As a result, a new temporary group is set, and the above process is repeated to determine another new main group.
FIG. 6 (a) is a diagram showing the feeder arrangement space (also a collective setup table) of the new main group 74 determined as described above, and FIG. 6 (b) is shown in FIG. 5 (b). It is a figure which re-posts the feeder arrangement space (collective setup table) of this group 73 made first.

  Thus, in the creation of the book group 74 and the like newly determined after the book group 73 that has been created (determined) first, it is always determined in the process 4 of FIG. S4 is Yes) ".

  Therefore, the CPU 51 compares the setup table determined last time with the used parts in the temporary group before carrying out the process of process S6, takes over the setup arrangement of the parts, and creates the setup table and the part loading program (S5). .

  As shown in FIGS. 6A and 6B, in the setup table of the board 32-4 of the main group 74 in FIG. 6A, the component standard name 3216R of the feeder number 14 is shown in FIG. 6B. It is the same as the part standard name of the feeder number 14 of this group 73 that has been made earlier.

In such a case, the arrangement of the part is determined first (the setup arrangement of the part is taken over).
Further, in the setup table of the board 32-5 of the main group 74 in FIG. 6A, the part standard name 2125C of the feeder number 6 is the feeder number 6 of the main group 73 which has been previously formed as shown in FIG. 6B. This is the same as the part standard name.

Also in this case, the arrangement of the part is determined first (the setup arrangement of the part is taken over).
Further, in the setup table of the board 32-6 of the main group 74 in FIG. 6A, the component standard name 1608C of the feeder number 22 is the feeder number 22 of the main group 73 which is made earlier as shown in FIG. 6B. This is the same as the part standard name.

Also in this case, the arrangement of the part is determined first (the setup arrangement of the part is taken over).
In this way, in this example, the setup of six types of substrates 32-1 to 32-6 belonging to two groups is completed.

In this example, the operator can advance the setup of one group of component arrangements using a single setup table.
That is, in this example, it is possible to perform setup of component placement of three types of boards in a single setup table instead of setup of component placement every time one type of board is replaced. Convenient.

Also, when creating a component mounting program, efficiency is improved because the same components are taken over as they are.
For example, when three types of substrates, ie, substrates 32-1, 32-2, and 32-3, are produced, first, three types of substrates (group 1, main group 73) are set up. After that, it is only necessary to produce the board unit without changing the arrangement of the components in order, so that the efficiency is improved.

Further, after the board 32-3, a setup change occurs to the group 2 (the present group 74). However, it is not necessary to change the setup in the same arrangement as the group 1 components.
As described above, in the component mounting apparatus using the board unit production method of the present invention, the preparation of a setup table that can be used for batch change of tape feeders used for a plurality of types of boards at once, The parts mounting program can be created efficiently.

It is a figure which shows typically the internal structure of the principal part of the component mounting apparatus in one Embodiment which performs the component mounting process using the component mounting method which prevents the component setting difference at the time of component replacement | exchange of this invention. It is a system block diagram of the component mounting apparatus in one embodiment. The figure which shows typically arrangement | positioning of the component supply stage of the component mounting apparatus in one Embodiment, (b) is a figure which shows the setup table typically. (a), (b) is a figure (the 1) which shows the preparation procedure of the setup table which reduces setup work as much as possible in the production of multiple types of substrates. (a), (b) is the figure (the 2) which shows the preparation procedure of the setup table which reduces setup work as much as possible in the production of multiple types of substrates. (a), (b) is a figure (the 3) which shows the preparation procedure of the setup table which reduces setup work as much as possible in the production of multiple types of substrates. It is a flowchart which shows the process sequence which preparation of the setup table | surface which makes a setup operation | work possible as few as possible in multi-type board production, and a part program performs. (a) is an external perspective view showing an example of a conventional component mounting apparatus, and (b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers. It is a perspective view which shows the structure of the working head of the conventional component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Monitor apparatus 3 Alarm lamp 4 Upper protective cover 5 Operation input display apparatus 6 Base 7 Board guide rail 8 Board 9 Supply stage 11 Tape reel type component supply apparatus 12 Tape reel 13 Y axis rail 14 X axis rail 15 (15-1, 15-2, 15-3, 15-4) Working head 16 (16-1, 16-2) Mounting head 17 Chain body 18 Component recognition camera 19 Support section 21 Board recognition camera 22 Diffusion Plate illumination device 24 Adsorption nozzle 24-1 Light diffusion plate 24-2 Nozzle 31 Substrate guide rail 32 Substrate 33 Component supply stage 34 Tape type component supply device (tape feeder)
35 Component Supply Port 36 Working Head 37 Mounting Head 38 Substrate Recognition Camera 39 Component Recognition Camera 41 Component Tape 42 Component 43 Reel Holding Unit 44 Tape Reel 45 Position at which Component Out occurs 50 Component Mounting Device 51 CPU
52 bus 53 i / o (input / output) control unit 54 image processing unit 55 memory 56 substrate illumination device 57 LED illuminator 58 illumination control unit 61 X-axis motor 62 Y-axis motor 63 Z motor 64 θ-axis motor 65 vacuum unit 66 vacuum Tube 67 Pneumatic pressure sensor 68 Communication i / o interface 69 Display operation input device 70 Recording device 71 (71a to 71d) Setup table 72 Temporary group feeder arrangement space (setup table)
73, 74 Feeder placement space for this group (setup table)

Claims (3)

In the board unit production method of producing board units by mounting electronic components on any specified multiple types of boards,
An extraction step for extracting a group of substrates that can be arranged on a component supply device arrangement stage from among the plurality of types of substrates; a component supply device that supplies a mounted component to a component mounting device that performs component mounting;
A grouping step for grouping the substrate groups extracted in the extraction process;
A setup creation step for creating a setup table capable of batch setup of one group of substrate groups of groups grouped by the grouping process;
A program creation step of creating a component mounting program for each board of the group of boards;
Including
Based on the component mounting program created by the program creation step, component mounting processing is sequentially performed on individual substrates of the group of board groups, and component mounting processing on the group of substrate groups is performed all at once. A board unit production method characterized by the above.   In the grouping step, when one group of board groups to be subjected to component mounting processing next is extracted from the one group of board groups preceded by component mounting processing, The board unit production method according to claim 1, wherein the position of the component supply device for supplying the component to the component supply device arrangement stage is taken over. In component mounting equipment that produces board units by mounting electronic components on any specified multiple types of boards,
An extraction means for extracting a substrate group capable of arranging a component supply device for supplying a component to be mounted on the component supply device arrangement stage from the plurality of types of substrates;
Grouping means for grouping the substrate groups extracted by the extracting means;
A setup creation means for creating a setup table capable of batch setup of one group of substrate groups of the group grouped by the grouping means;
A program creation means for creating a component mounting program for each board of the group of boards;
Have
Based on the component mounting program created by the program creation means, component mounting processing is sequentially performed on individual substrates of the group of substrate groups, and component mounting processing on the group of substrate groups is performed all at once. A component mounting device characterized by that.