JP2006100755A5 - - Google Patents
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- Publication number
- JP2006100755A5 JP2006100755A5 JP2004305544A JP2004305544A JP2006100755A5 JP 2006100755 A5 JP2006100755 A5 JP 2006100755A5 JP 2004305544 A JP2004305544 A JP 2004305544A JP 2004305544 A JP2004305544 A JP 2004305544A JP 2006100755 A5 JP2006100755 A5 JP 2006100755A5
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- processing apparatus
- substrate processing
- electric heater
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (19)
前記発熱体は蛇行状に構成され、この発熱体を複数有し、各発熱体の上側端を支持体に固定し、前記各発熱体の下側端を上下方向に移動自在な状態とし、発熱体の上側端と他の発熱体の下側端とを近接させて配置し、前記各発熱体の中間部を絶縁体から離隔させてある基板処理装置。 A substrate processing apparatus comprising a processing chamber for storing and processing a substrate, and a heating device having a heating element and heating the processing chamber by the heating element,
The heating element is configured in a meandering manner, and has a plurality of heating elements, the upper end of each heating element is fixed to a support, and the lower end of each heating element is made movable in the vertical direction to generate heat. A substrate processing apparatus, wherein an upper end of a body and a lower end of another heating element are arranged close to each other, and an intermediate portion of each heating element is separated from an insulator.
前記処理室に前記基板を装入する工程と、
前記発熱体により前記処理室内の基板を熱処理する工程と、
熱処理された前記基板を引出す工程とを有する
半導体装置の製造方法。 A method of manufacturing a semiconductor device using the substrate processing apparatus according to claim 1,
Loading the substrate into the processing chamber;
Heat treating the substrate in the processing chamber with the heating element;
A method of manufacturing a semiconductor device, comprising a step of extracting the heat-treated substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004305544A JP4885438B2 (en) | 2003-10-21 | 2004-10-20 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003361292 | 2003-10-21 | ||
JP2003361292 | 2003-10-21 | ||
JP2004256651 | 2004-09-03 | ||
JP2004256651 | 2004-09-03 | ||
JP2004305544A JP4885438B2 (en) | 2003-10-21 | 2004-10-20 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006100755A JP2006100755A (en) | 2006-04-13 |
JP2006100755A5 true JP2006100755A5 (en) | 2007-11-29 |
JP4885438B2 JP4885438B2 (en) | 2012-02-29 |
Family
ID=36240233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004305544A Expired - Lifetime JP4885438B2 (en) | 2003-10-21 | 2004-10-20 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4885438B2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4646592B2 (en) * | 2003-10-21 | 2011-03-09 | 貞徳舎株式会社 | Electric heater and furnace equipped with the same |
JP5139734B2 (en) * | 2007-06-25 | 2013-02-06 | 株式会社日立国際電気 | Substrate processing apparatus and heating apparatus used therefor |
US8395096B2 (en) | 2009-02-05 | 2013-03-12 | Sandvik Thermal Process, Inc. | Precision strip heating element |
KR101096602B1 (en) * | 2009-07-21 | 2011-12-20 | 가부시키가이샤 히다치 고쿠사이 덴키 | Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
JP5544121B2 (en) | 2009-07-21 | 2014-07-09 | 株式会社日立国際電気 | Heating apparatus, substrate processing apparatus, and semiconductor device manufacturing method |
US9064912B2 (en) | 2009-07-21 | 2015-06-23 | Hitachi Kokusai Electric, Inc. | Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
JP5525248B2 (en) * | 2009-12-03 | 2014-06-18 | 貞徳舎株式会社 | Electric heater, electric heater manufacturing method, and heating apparatus |
JP6630146B2 (en) * | 2015-02-25 | 2020-01-15 | 株式会社Kokusai Electric | Substrate processing apparatus, semiconductor device manufacturing method, and heating unit |
CN105914163B (en) | 2015-02-25 | 2020-03-24 | 株式会社国际电气 | Substrate processing apparatus, method of manufacturing semiconductor device, and heating unit |
JP6887659B2 (en) * | 2015-09-15 | 2021-06-16 | 貞徳舎株式会社 | Hot air generator |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6231997Y2 (en) * | 1980-03-27 | 1987-08-15 | ||
US4403329A (en) * | 1981-07-06 | 1983-09-06 | General Signal Corporation | Support system for electrical resistance element |
JP3307924B2 (en) * | 1990-10-18 | 2002-07-29 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP3484387B2 (en) * | 2000-01-13 | 2004-01-06 | 株式会社第一機電 | Electric furnace |
-
2004
- 2004-10-20 JP JP2004305544A patent/JP4885438B2/en not_active Expired - Lifetime
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