JP2006056928A - Vacuum bonding method in room temperature bonding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum bonding method in a room temperature bonding method, by which a uniform pressure is applied to an adherend to give a stable adhesion force, when the adherend is covered with a film and then vacuum-adhered to an application plate. <P>SOLUTION: 1 is a flat plate-like rigid application plate such as a steel plate. 2 is a flowable adhesive, such as an epoxy resin, to be coated on the upper side of the rigid application plate 1. 3 is a square and relatively soft (JIS about 50 to 60 Hs) adherend, such as a rubbery elastic plate (rubber, urethane resin, or the like), having a thickness of ≥20 mm. A frame material 4 having at least the same thickness as that of the adherend 3 is disposed around the adherend 3. In the embodiment of the present invention the adherend 3 is covered with a vacuum resin film 5 in the above-mentioned state, and the periphery of the film 5 is sealed with a sealing member 6. The film 5 is attached to the connection port 8 of a suction pipe 7 connected to a non-illustrated suction means, such as a vacuum pump, and then vacuum-sucked with the suction means to vacuum-bond the adherend 3 to a rigid application surface through an adhesive layer 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a vacuum pressure bonding method in the room temperature bonding method, and more specifically, a vacuum is applied to an adherend made of a relatively soft rubber-like elastic plate material via an adhesive layer on a flat plate-like rigid surface. The present invention relates to a vacuum pressure bonding method in a room temperature bonding method in which pressure bonding can be performed with uniform pressure during bonding.

  Conventionally, a vacuum pressure bonding method is known as a method for pressure-bonding and fixing a plate-like material having a predetermined thickness on a substrate via an adhesive (see, for example, Patent Document 1).

  By the way, on a flat rigid construction surface such as an iron plate, it is relatively soft (JIS 50-60Hs around JIS 50-60Hs) with a thickness of 20 mm or more via a flowing adhesive such as epoxy resin. ) When adhering materials such as rubber-like elastic plates (rubber, urethane resin, etc.) by pressure bonding, cover the adhering material with a film, etc., and tightly seal the periphery of the material, such as a vacuum pump There has been a method in which a suction member is vacuum-sucked and a adherend is vacuum-bonded onto a rigid construction surface via an adhesive layer.

  However, in such a conventional vacuum pressure bonding method, the tip of the film is likely to be applied to the upper end of the periphery of the adherend during vacuum adsorption, and as a result, when vacuum suction is performed by the suction means, A suction force acts on the upper end of the periphery of the adherend before the center, and is crimped.

For this reason, it is easy for the adhesive to flow and gather in the center of the construction surface, resulting in an adhesive layer with a non-uniform thickness, and the outer peripheral upper part of the adherend will also be bonded in a rounded form in appearance. There was a problem to say.
JP-A-6-136328

  The present invention has been devised by paying attention to such conventional problems, and it is possible to stably apply a uniform pressure to the upper surface of the adherend when the adherend is covered with a film and subjected to vacuum pressure bonding. It is an object of the present invention to provide a vacuum press-bonding method in a room temperature bonding method capable of obtaining an adhesive force.

  In order to achieve the above object, the present invention provides a frame member around the adherend at least as thick as the adherend, and in this state is airtightly covered with the film by the suction means. The gist is to vacuum-bond the adherend onto the rigid construction surface via an adhesive layer by vacuuming.

  Here, the height of the mold material is set to the thickness of the adherend + 2 mm or less, and the mold material is arranged around the entire circumference of the adherend or divided. The mold material is formed of a material harder than the material of the adherend.

  By carrying out such a vacuum pressing construction method, the adhesive does not easily flow and gather in the center of the construction surface, it becomes an adhesive layer with a uniform thickness, and the product can also have a good appearance. I can do it.

  According to the present invention, as described above, a mold material having a thickness equal to or larger than the thickness of the adherend is disposed around the adherend, and vacuuming is performed by a suction means in a state of being airtightly covered with the film in this state. By vacuum-bonding the adherend through the adhesive layer on the rigid construction surface, when applying the film to the adherend and vacuum-bonding, apply a uniform pressure on the top surface of the adherend Thus, a stable adhesive force can be obtained, and as a result, an adhesive layer having a uniform thickness can be obtained, resulting in an excellent appearance.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a schematic perspective view of a vacuum pressure bonding apparatus for performing a vacuum pressure bonding method in the room temperature bonding method according to the present invention, wherein 1 is a plate-like rigid work plate such as an iron plate, 2 is a rigid work plate 1 Adhesive material such as epoxy resin that is applied on the surface of the material, 3 is 20 mm thick or more, is square and relatively soft (around JIS 50-60Hs), covered with rubber-like elastic plate (rubber, urethane resin, etc.) A form material 4 having at least the thickness (t) of the adherend 3 is disposed around the adherend 3.

  In the embodiment of the present invention, the adherend 3 is covered with the resin vacuum film 5 in the above-described state, and the periphery of the film 5 is sealed with the seal member 6. A connection port 8 of a suction pipe 7 connected to a suction means (not shown) such as a vacuum pump is attached to the film 5 and is vacuum-sucked by the suction means to cover the rigid construction surface through the adhesive layer 2. The dressing 3 is vacuum bonded. In addition, 9 has shown the bridder cloth arrange | positioned on the lower surface side of a film.

  The height of the mold material 4 is preferably the thickness (t) of the adherend 3 + 2 mm or less. That is, the height of the mold material 4 is equal to or greater than the thickness (t) of the adherend 3 and the thickness (t) of the adherend 3 + 2 mm or less, thereby obtaining a more stable adhesive force. I can do it.

  In particular, the mold material 4 as described above can obtain a more uniform adhesive force when applied to the adherend 3 having a thickness of 20 mm or more.

  For example, when the formwork 4 is not used, the pressure F applied to the adherend 3 by the film 5 is applied to the end of the adherend 3 first as shown in the X part of FIG. 2 and the Y part of FIG. It becomes easy to act. In addition, when the adherend 3 is thin (less than 20 mm), as shown in FIG. 2, it is easy to apply pressure to the adherend 3 in a substantially vertical direction, and the adhesion surface of the adherend 3 is substantially vertical. Since the adhesive material 2 is pressed, the adhesive material 2 spreads evenly, and a relatively uniform adhesive force can be obtained.

  Further, when the adherend 3 is thick (20 mm or more), as shown in FIG. 3, it is easy to apply pressure to the adherend 3 in an oblique direction, and the adhesion surface of the adherend 3 is adhered in the oblique direction. Since the adhesive 2 moves in the center direction of the adherend 3 in order to hold down the material 2, non-uniform adhesive force is likely to occur.

  For this reason, in particular, when the adherend 3 is 20 mm or more, it is preferable to dispose the mold material 4 as in the embodiment of the present invention in order to obtain a uniform adhesive force.

  Further, the mold material 4 can be arranged around the entire circumference or divided of the adherend 3, and the mold material 4 is harder than the material of the adherend 3 (for example, wood, metal, etc.). Etc.). By using a material harder than the material of the adherend 3, the peripheral edge of the adherend 3 can be further protected.

Next, a vacuum pressing method for the adherend 3 of the present invention will be described.
First, a flowable adhesive material such as epoxy resin is applied to the surface of a flat rigid construction plate 1 such as an iron plate, and a rectangular shape (for example, 400 × 400 mm) having a thickness of 20 mm or more is applied thereon. And relatively soft (around JIS 50-60Hs) A substrate 3 such as a rubber-like elastic plate (rubber, urethane resin, etc.) is placed.

  A mold member 4 having a thickness (t) equal to or larger than the thickness of the adherend 3 is disposed around the adherend 3, and the adherend 3 is made of resin vacuum via a bridder cloth 9. The film 5 is covered, and the periphery of the film 5 is sealed by a seal member 6. Further, the inside of the film 5 is a vacuum pipe 7 connected to the suction means and vacuum sucked by the suction means to vacuum-bond the adherend 3 on the surface of the rigid construction plate 1 via the adhesive layer 2. is there.

  At this time, when the film 5 is evacuated and adsorbed to the adherend 3, the frame material 4 protects the peripheral portion of the adherend 3, so that the peripheral portion of the adherend 3 may be out of shape. In addition, a uniform pressure can be applied to the upper surface of the adherend 3 to obtain a stable adhesive force. As a result, an adhesive layer with a uniform thickness can be obtained, and the appearance can be improved. It is possible.

It is a schematic perspective view of the vacuum press-bonding construction apparatus which implemented the vacuum press-fit construction method in the normal temperature adhesion construction method of this invention. It is explanatory drawing of the crimping | compression-bonding force by a film in case a to-be-adhered material is thin (less than 20 mm), and an adhesive material. It is explanatory drawing of the crimping | compression-bonding force by a film, and an adhesive material when a to-be-adhered material is thick (20 mm or more).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rigid construction board 2 Adhesive material 3 Adhering material 4 Formwork material 5 Film 6 Sealing member 7 Suction pipe 8 Connection port 9 Bridder cloth

Claims (4)

An adherend made of a rubber-like elastic plate having a predetermined thickness is placed on a flat rigid construction surface via an adhesive layer, and the rigid construction surface and the surface of the adherend are covered with a film, and the periphery of the film In the vacuum pressure bonding construction method in the room temperature adhesion construction method in which the inside of the film is sucked by a suction means and the adherend is vacuum pressure-bonded via an adhesive layer on the rigid construction surface,
On the rigid construction surface, by placing a formwork material at least around the thickness of the adherend around the adherend and evacuating it with suction means in a state of being airtightly covered with the film in this state A vacuum pressure bonding method in the room temperature bonding method, characterized in that the adherend is vacuum-bonded via an adhesive layer. The vacuum pressing method according to claim 1, wherein the height of the mold material is set to the thickness of the adherend + 2 mm or less. The vacuum press-bonding construction method according to claim 1 or 2, wherein the mold material is arranged around the entire circumference of the adherend or divided. The vacuum press-bonding construction method according to claim 1, 2 or 3, wherein the mold material is formed of a material harder than the material of the adherend.

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