JP6627243B2 - Substrate processing method and substrate film forming method - Google Patents

Description

The present invention, the processing method of the board, and then related to the film forming method of a substrate, concerning in particular the processing method of a substrate using a suction holding jig, and the method for forming the substrate.

  When a film formation process such as sputtering is performed on the surface of a glass substrate, the glass substrate is held in an appropriate posture according to a film formation unit. For example, in a case where a film is formed on a glass substrate, the periphery of the glass substrate may be held by a jig called a setter. Alternatively, when performing a film formation process in a state where the glass substrate is horizontal, the glass substrate may be mounted on a horizontal mounting table.

  However, when a method of holding and holding a glass substrate is employed, a film formation process cannot be performed over the entire surface on the side on which a film is to be formed. This is because the surface on the side on which the film is to be formed is partially hidden by the holding jig.

  If the glass substrate is placed on a horizontal mounting table, there is no possibility that the jig will hide the surface on which the film is to be formed, but the surface of the glass substrate on which the film is not formed (Rear surface), there is a concern that a film forming process may be performed on an unnecessary area. This is because the peripheral portion of the glass substrate may be lifted by the atmospheric pressure depending on the film forming means. Alternatively, depending on the size of the glass substrate, the periphery of the glass substrate may be lifted by deformation such as quasi-unavoidable warpage that occurs during manufacturing.

  Here, for example, Patent Document 1 discloses a substrate holding mechanism provided with a plurality of vacuum suction pads. This holding mechanism suctions and holds the peripheral portion of the front surface (rear surface) of the glass substrate on the side that is not the film formation target with a plurality of vacuum suction pads, and covers the entire area of the rear surface other than the portion where the vacuum suction pads are in contact with. The heating plate can be tightly supported (paragraphs 0037 to 0038, FIG. 4).

JP-A-8-23265

  However, as described in Patent Literature 1, when the back surface of the glass substrate is sucked and held by using the vacuum suction pad, an area of the back surface directly sucked by the vacuum suction pad (the pad and the glass substrate). Only the region that is in contact with the space surrounded by is strongly adsorbed, and the attraction force hardly reaches the peripheral region. Therefore, even if a plurality of vacuum suction pads are arranged on the peripheral portion of the glass substrate as described in Patent Document 1, the peripheral portion of the glass substrate receives a sufficient suction force from any of the vacuum suction pads. The result is a region that does not. In this case, the area may be lifted due to insufficient suction power. In particular, when the glass substrate to be suctioned becomes relatively large (when the surface dimension becomes larger than the thickness dimension), the glass substrate is easily deformed by the action of its own weight or an external force, and thus the glass substrate is sucked by the vacuum suction pad. The possibility that the periphery of the region is deformed by suction and is partially lifted increases. When the glass substrate is partially lifted, a film forming material enters from a gap generated by the lifting, and there is a concern about color unevenness, adhesion failure in bonding in a later process, and printing failure in printing.

  In addition, depending on the type of the glass substrate, most of the rear surface except the peripheral portion may be used as an effective surface. Therefore, as in Patent Document 1, it is not preferable to closely support the entire rear surface of the substrate with a heating plate. is there.

  In addition, when performing a film forming process in a vacuum environment such as sputtering, the pressure between the vacuum suction pad and the glass substrate and the pressure around it, in other words, the negative pressure acting on the back surface of the glass substrate, It is conceivable that the difference from the negative pressure acting on the surface of the substrate is reduced or substantially reduced to zero. In this case, the suction holding force on the glass substrate decreases or disappears, and thus the posture at the time of film formation may not be stable.

  In view of the above circumstances, in the present specification, it is a technical problem to be solved to stably perform a film forming process over a wide area of a substrate surface while preventing a film forming material from flowing around.

  The above-mentioned object is achieved by a suction holding jig according to the present invention. That is, the jig is a suction holding jig for sucking and holding the substrate, and has an attachment surface that can be attached only to the peripheral edge portion of the substrate, and a long hole for suction that opens to the attachment surface. Characterized by a point.

  As described above, in the present invention, the attachment surface to which only the peripheral portion of the substrate can be attached is provided in the jig for holding and holding, and the long hole for adsorption is formed so as to open to the attachment surface. With the jig configured as described above, it is possible to suck the region corresponding to the periphery of the elongated hole, that is, the peripheral portion of the substrate as much as possible over the entire periphery thereof. Therefore, when the substrate is sucked through the elongated hole, a region where the suction force is insufficient at the peripheral portion of the substrate is minimized, and the peripheral portion can be prevented from being lifted. Therefore, it is possible to prevent the film-forming material from wrapping around to the back surface, and to accurately perform the film-forming process only on the surface on the side on which the film is to be formed. Of course, according to this jig, only the back surface of the substrate can be sucked and adhered and held, so that the film forming process can be performed over the entire surface on the film forming target side.

  Further, in the present invention, since the long hole for suction is provided by being opened on the adhering surface, both sides in the width direction of the long hole (refer to a direction orthogonal to the longitudinal direction; hereinafter the same in this specification). Is always in a state where the attachment surface is provided. Therefore, when the substrate is sucked using this jig, the back surface of the substrate is attached to and supported by the attachment surface on both sides in the width direction of the elongated hole, so that the space inside the frame portion, that is, the substrate, It is possible to stably hold the substrate without adhering and supporting the area on the center side of the plane. Therefore, even if the back surface of the substrate (the surface on the side that is not a film formation target) is the effective surface, the substrate can be stably held without affecting the surface quality. .

  Further, in the present invention, since the surface to be suction-supported around the elongated hole provided in the jig is used as the attachment surface, when the peripheral portion of the substrate is sucked and held via the elongated hole, the peripheral edge of the substrate is elongated. Is pressed against an adhering surface provided around and is fixed by newly generated adhering force. For this reason, for example, when performing a film forming process such as vacuum deposition or sputtering, even when the substrate is placed in a vacuum environment together with the jig, it is possible to maintain a sufficient holding force due to the adhesive force.

  Further, the jig according to the above configuration has, for example, a suction device including the jig and a decompression device that can depressurize a space surrounded by the elongated hole and the substrate in a state where the substrate is placed on the adhesion surface. It can also be provided as a holding device.

  As described above, if the suction holding device is provided with the above-described jig and the decompression device capable of decompressing the space surrounded by the elongate hole of the jig and the substrate, it is mounted on the attachment surface (elongated hole). The substrate in the placed state is adsorbed on the adhesion surface by the decompression device, and the substrate can be held on the jig by the adsorption force and the adhesion force. Therefore, for example, by configuring the jig so that it can be attached to and detached from the apparatus main body having the decompression device, only the substrate and the jig can be transported to the next step (for example, a film forming process) after adsorption, and The surface is also good.

  In the suction holding device according to the present invention, the suction holding jig may further include a frame-shaped portion provided with an attachment surface. Further, in that case, the pressure reducing device can reduce the pressure only in the space surrounded by the elongated hole and the substrate without depressurizing the space inside the frame-shaped portion in a state where the substrate is placed on the adhesion surface. May be done.

  As described above, when the attachment surface is provided in the frame-shaped portion, by limiting the space to be decompressed to only the space related to the elongated hole, it is possible to reliably hold and hold only the peripheral portion of the substrate. In addition, by keeping the space inside the frame-shaped portion without decompression, the situation where the substrate is excessively deformed in a direction in which the center of the plane is depressed toward the jig side is avoided as much as possible, and the portion of the substrate other than the adhesion surface is prevented. And the occurrence of cracks due to excessive deformation (bending deformation) can be avoided as much as possible.

  Further, in the suction holding device according to the present invention, a longitudinal end portion of the long hole may have a square shape.

  That is, by making the oblong hole, for example, an oblong hole, the distance from the oblong hole (oblong hole) of the attachment surface can be made as uniform as possible. Specifically, the width dimension of the attachment surface located on both sides in the width direction of the rectangular hole, and the distance between the adjacent rectangular holes in the longitudinal direction, that is, the longitudinal dimension of the attachment surface located between the rectangular holes Can be equally designed. As a result, the suction force acting on the substrate via the elongated holes can be more uniformly applied to the peripheral portion, and stable suction holding without partial lifting can be realized.

  Further, in the suction holding device according to the present invention, the width dimension of a region adjacent to the elongated hole in the width direction of the attachment surface may be set to be smaller than the width dimension of the elongated hole. .

  The present inventors have verified the dimensional relationship between the long hole for suction and the adhering surface adjacent in the width direction thereof. It has been found that the regulation allows the substrate to effectively exert the suction effect by the reduced pressure through the elongated hole. Therefore, for example, a situation in which the suction force is insufficient at the end of the substrate can be avoided as much as possible, and stable suction holding can be realized.

  Further, the suction holding device according to the present invention may further include a pressurizing device capable of pressurizing at least one of a space inside the frame portion and a space surrounded by the elongated hole and the substrate. Good.

  As described above, in addition to the decompression device, by providing the pressurization device capable of pressurizing at least one of the space inside the frame-shaped portion and the space surrounded by the elongated hole and the substrate, the adhesion surface by the decompression device is provided. Can be pressed in a direction in which the peripheral portion of the substrate rear surface or the area on the center side of the plane in a state where the substrate is sucked and held away from the frame-shaped portion (adhering surface). Therefore, by adjusting the pressing force (pressing force), the glass plate can be peeled off from the attachment surface without directly touching the glass plate. At this time, in consideration of effective peeling from the adhesion surface of the substrate, it is preferable that the pressurizing device be configured so as to pressurize the space inside the frame portion. The above-described pressurization of the space is performed, for example, by sending air of a predetermined pressure from a blow device serving as a pressurizing device to any of the above-described spaces. If the contact area is small, high-pressure air must be sent to that extent, and a pressurizing device with a large output is required, which is not economical. If too high pressure air is used, dust generation may become a problem. On the other hand, if the space is inside the frame-shaped part, the area in contact with the back surface of the substrate can be easily increased as compared with the elongated hole. It is possible to apply a sufficient pressure to the substrate for peeling. Of course, if there is no problem in the configuration, it is preferable that the pressurizing device be configured to be able to pressurize not only the space inside the frame-shaped portion but also the space surrounded by the elongated hole and the substrate.

  Further, the above object can be achieved by a suction holding method according to the present invention. That is, this suction holding method is a method for holding the substrate by suction, and has a sticking surface that can be stuck only to the peripheral portion of the substrate, and a suction hole that is opened in the sticking surface. The method is characterized in that a substrate is placed on a jig, and thereafter, a space surrounded by the elongated hole and the substrate is decompressed.

  As described above, according to the suction holding method according to the present invention, similarly to the suction holding jig according to the present invention and the suction holding device including the jig, the area corresponding to the periphery of the long hole, that is, the substrate Can be sucked as much as possible over the entire periphery without leakage. Therefore, it is possible to avoid a situation where the peripheral edge of the substrate is lifted when the substrate is sucked through the elongated hole, thereby preventing the film-forming material from wrapping around to the back surface, and preventing only the front surface on the side to be film-formed. It is possible to accurately perform a film forming process. In addition, when the substrate is sucked using the above-described jig, the back surface of the substrate is attached to and supported by the attaching surface on both sides in the width direction of the elongated hole. Without doing so, the substrate can be stably held. Therefore, even if the back surface of the substrate (the surface on the side that is not a film formation target) is the effective surface, the substrate can be stably held without affecting the surface quality. . Furthermore, according to the suction holding method according to the present invention, when the peripheral portion of the substrate is suction-held through the long hole, the peripheral portion of the substrate is pressed against the adhesion surface provided around the long hole, and the newly generated edge is formed. Is fixed by the adhesive force. Therefore, for example, when performing a film forming process such as vacuum deposition or sputtering, a sufficient holding force can be maintained even when the substrate is placed in a vacuum environment together with the jig.

  Further, the suction holding method according to the present invention may be such that the suction holding of the substrate is performed using a suction holding jig further having a frame portion provided with an attachment surface. Further, in this case, without depressurizing the space inside the frame-shaped portion in a state where the substrate is placed on the adhesion surface, even if only the space surrounded by the elongated hole and the substrate is depressurized. Good.

  Also in this case, similarly to the suction holding device described above, by limiting the space to be depressurized to only the space related to the elongated hole, only the peripheral portion of the substrate can be reliably held by suction. In addition, by keeping the space inside the frame-shaped portion without decompression, the situation where the substrate is excessively deformed in a direction in which the center of the plane is depressed toward the jig side is avoided as much as possible, and the portion of the substrate other than the adhesion surface is prevented. And the occurrence of cracks due to excessive deformation (bending deformation) can be avoided as much as possible.

  Further, in the suction holding method according to the above configuration, for example, after the peripheral portion of the substrate is attached to the attachment surface by the suction holding method, a predetermined process is performed on the substrate, and thereafter, the substrate is surrounded by the elongated hole and the substrate. It is also possible to provide a method for treating a substrate, in which at least one of the space and the space inside the frame-shaped portion is pressurized to peel off the substrate from the suction holding jig. Alternatively, after the peripheral portion of the substrate is attached to the attachment surface by the above-described suction method, a film is formed on the substrate, and thereafter, the space surrounded by the elongated hole and the substrate and the space inside the frame-shaped portion are formed. It is also possible to provide a method for forming a substrate, in which at least one of the substrates is pressed to separate the substrate from the suction holding jig. With this configuration, when performing a predetermined process or a film forming process on the substrate, the operator can hold the substrate on the jig without applying an external force to the substrate and can peel the substrate off the jig. . Therefore, the above-mentioned processing can be performed safely and simply on the substrate. In addition, the handling at that time is also improved.

  As described above, according to the present invention, a film formation process can be stably performed over a wide area of a substrate surface while preventing a film formation material from flowing around.

FIG. 2 is a plan view of the suction holding jig according to the first embodiment of the present invention. It is AA sectional drawing of the jig shown in FIG. FIG. 2 is a sectional view of a suction holding device provided with the jig shown in FIG. 1. FIG. 3A is a cross-sectional view of the suction holding device in a state where a glass substrate is placed, and FIG. FIG. 4 is a cross-sectional view of the suction holding jig in a state where the glass substrate is suction-held and then removed from the suction holding device main body. FIG. 3 is a cross-sectional view of the suction holding device in a state where a jig that integrally holds a glass substrate on which a film forming process has been performed is attached. It is a top view of the jig for adsorption holding concerning a second embodiment of the present invention. It is a top view of the jig for adsorption holding concerning a third embodiment of the present invention. It is a principal part enlarged plan view of the jig | tool for suction holding which concerns on 4th Embodiment of this invention. It is a principal part enlarged plan view of the jig | tool for suction holding which concerns on 5th Embodiment of this invention. It is sectional drawing of the jig | tool for adsorption holding which concerns on 6th Embodiment of this invention. It is a sectional view of a suction holding device concerning a 7th embodiment of the present invention. It is a sectional view of a suction holding device concerning an 8th embodiment of the present invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In the following description, in the upward direction, in a state where the glass substrate as the substrate is held by the suction holding jig, the glass substrate side in the thickness direction when viewed from the jig is upward, and when viewed from the glass substrate, the thickness is The jig side in the direction is defined as a downward direction. Of course, the definition of these directions does not limit the installation mode or usage mode of the jig and the suction holding device provided with the jig.

  As shown in FIGS. 1 and 2, a suction holding jig 10 according to an embodiment of the present invention includes a substantially rectangular frame portion 11 and a glass upper portion of the frame portion 11, that is, a glass as a suction holding target. An attachment portion 12 is provided on the side to which the substrate 1 (see FIG. 4 and the like) is attached, and a bottom plate portion 13 is provided below the frame portion 11.

  In the present embodiment, the frame-shaped portion 11 has a shape similar to the outer edge of the glass substrate 1. For example, when the rectangular glass substrate 1 is to be suction-held, the frame-shaped portion 11 has a substantially rectangular shape ( (Frame shape). In this case, both the inner edge shape and the outer edge shape of the frame portion 11 are rectangular.

  The attachment portion 12 has an attachment surface 14 that can be attached to the front surface of the glass substrate 1 on the side that is not a film formation target, that is, the back surface 2, and has a layered shape in the present embodiment. The attachment surface 14 has a shape corresponding to the peripheral portion 2a of the back surface 2 of the glass substrate 1 to be attached. For example, in the present embodiment, a substantially rectangular outer edge shape and inner edge shape follow the outer edge shape of the glass substrate 1. It has a shape (frame shape). At this time, the width dimension (first width dimension W1) from one long side edge 14a1 forming the outer edge of the attachment surface 14 to the other long side edge 14a2 is set to be equal to or longer than the length dimension of the short side of the glass substrate 1. You. Similarly, the width dimension (second width dimension W2) from one short side edge 14b1 forming the outer edge of the attachment surface 14 to the other short side edge 14b2 is set to be equal to or longer than the length dimension of the long side of the glass substrate 1. You. In the present embodiment, both the first width dimension W1 and the second width dimension W2 of the adhesion surface 14 are set to the sizes that match the length dimensions of the short side and the long side of the glass substrate 1 (see FIG. See).

  The means for imparting the adhesive force to the adhesive surface 14 is not particularly limited. For example, the attachment surface 14 and the attachment portion 12 can be configured by any attachment means, as long as the attachment means is not irreversible (such as an adhesive state is eliminated by destruction) such as adhesion using a thermosetting resin. . For example, in the present embodiment, the attachment portion 12 is formed of a double-sided adhesive tape, one surface of which is attached to the upper surface 11 a of the frame portion 11, and the other surface is the attachment surface 14. In this case, it is preferable that the adhesive force of the double-sided adhesive tape to the glass substrate 1 is larger than the adhesive force to the glass substrate 1. Examples of usable double-sided pressure-sensitive adhesive tapes include UV tapes whose adhesive strength is greatly reduced by irradiation with ultraviolet rays, and double-sided pressure-sensitive adhesive tapes made of pressure-sensitive adhesive fluororubber. The thickness dimension is not particularly limited. Alternatively, although not shown, a glass plate is used for the attachment portion 12, and the surface serving as the attachment surface 14 is peeled off by direct contact with the back surface 2 of the glass substrate 1 to be attached (so-called optical contact between the glass plates). They may be attached as much as possible. In this case, it is important that both the front surface of the glass plate serving as the attachment surface 14 and the back surface 2 of the glass substrate 1 be finished to an appropriate surface roughness.

  The bottom plate portion 13 has a substantially rectangular shape as a whole, and is provided integrally with the frame portion 11 in the present embodiment. The space 15 inside the frame portion 11 is defined by the inner side surface 11b of the frame portion 11 and the upper surface 13a of the bottom plate portion 13, and has a form in which only the upper portion is opened. Therefore, when the glass substrate 1 is placed on the attachment surface 14, the space 15 inside the frame-shaped portion 11 is formed by the back surface 2 of the glass substrate 1, the inner side surface 11 b of the frame-shaped portion 11, and the bottom plate portion 13. And the upper surface 13a of the first member 13a, thereby forming a sealed state (see FIG. 4A described later). In the present embodiment, the bottom plate portion 13 has a configuration in which a peripheral portion protrudes from the frame-shaped portion 11 in a plan view, but is not necessarily limited to this configuration. An arbitrary form can be adopted as long as a long hole 16 to be described later can be formed through.

  One or a plurality of long holes 16 are formed in the attachment surface 14 so as to open (FIG. 1). Each of these elongated holes 16 has a shape extending in the longitudinal direction of the attachment surface 14, that is, in a direction along the peripheral edge 2 a of the glass substrate 1 with the glass substrate 1 to be sucked placed on the attachment surface 14. It is formed so as to penetrate the attachment portion 12 having the attachment surface 14, the frame portion 11, and the bottom plate portion 13 (FIG. 2). In the present embodiment, each of the long holes 16 has a form in which the entire circumference is surrounded by the attachment surface 14. Each of the long holes 16 has a shape in which a longitudinal end portion is formed in a semicircular shape.

  Next, a configuration of the suction holding device 20 including the suction holding jig 10 will be described with reference to FIG. The suction holding device 20 includes the suction holding jig 10 configured as described above, and a suction holding device main body 21 on which the suction holding jig 10 is installed. Here, the suction holding device main body 21 includes a base portion 22 on which the suction holding jig 10 is placed, and a voltage transforming device 24 connected to the base portion 22 via a connection portion 23.

  Further, a concave portion 22 a is provided inside the base portion 22. When the suction holding jig 10 is placed on the base portion 22 and the glass substrate 1 is placed on the attachment surface 14 of the suction holding jig 10, It functions as a transforming space 25 that can be transformed by the device 24 (see FIG. 4A described later). At this time, the variable pressure space 25 communicates with the long hole 16 provided in the suction holding jig 10, and the long hole 16 is closed by the glass substrate 1. , The internal space of the elongated hole 16 communicating with the transformed space 25, that is, the space surrounded by the inner surface of the elongated hole 16 and the back surface 2 of the glass substrate 1 is also transformed in the same manner as the transformed space 25. .

  Here, the transformer 24 is capable of reducing the pressure of at least the transforming space 25, and may employ a known decompression mechanism such as a vacuum decompression pump. Further, in the present embodiment, the pressure changing device 24 is capable of switching between decompression and pressurization, and operates as a decompression device when adsorbing and holding the glass substrate 1, as described later, and releases adsorption (peeling) of the glass substrate 1. Sometimes it operates as a pressurizing device.

  Next, an example of a suction holding mode of the glass substrate 1 using the suction holding device 20 having the above configuration will be described mainly with reference to FIGS.

  First, as shown in FIG. 3, the suction holding jig 10 is set on the suction holding device main body 21. At this time, the bottom plate 13 of the suction holding jig 10 is attached to and detached from the flange 22b of the base 22 by a screw or a clamp (not shown) to such an extent that the pressure can be changed (reduced pressure or pressurized described later) by the pressure changing device 24. It is fixed by possible means. Thereafter, as shown in FIG. 4A, the glass substrate 1 to be suction-held is placed on the attachment surface 14 of the suction-holding jig 10. At this time, the mounting position is set such that the entire outer edge of the glass substrate 1 is on the attachment surface 14. In the present embodiment, the end 1a of the glass substrate 1 and the outer ends (here, the long sides 14a1 and 14a2 and the short sides 14b1 and 14b2, which form four sides) of the adhesion surface 14 are aligned over the entire circumference. Then, the glass substrate 1 is placed.

  Here, as shown in FIG. 4 (b), the width dimension W3 of the elongated hole 16 is set such that the effective area of the back surface 2 of the glass substrate 1 is made as large as possible from the viewpoint of securing a sufficient suction force to the glass substrate 1. Taking both aspects into consideration, the distance is set, for example, in the range of 0.2 mm or more and 10.0 mm or less, preferably in the range of 1.0 mm or more and 5.0 mm or less.

  Further, the larger the width dimension W41 of the adhering surface 14 that can adhere to the back surface 2 of the glass substrate 1 outside the elongate hole 16 in the width direction, the larger the adhering force to the glass substrate 1 is. On the other hand, the range (distance from the end of the long hole 16) of the suction force generated by reducing the pressure through the long hole 16 has a certain limit. In consideration of the above points, it is preferable to set the width direction dimension W41 of the attachment surface 14, for example, the upper limit is set to 5.0 mm or less, preferably 3.0 mm or less. The lower limit is set to 1.0 mm or more, preferably 2.0 mm or more. In terms of the magnitude relationship with the width dimension W3 of the elongated hole 16, it is preferable to set the width dimension W41 of the attachment surface 14 so as to be smaller than the width dimension W3 of the elongated hole 16. The widthwise dimension W42 of the attachment surface 14 that can attach to the back surface 2 of the glass substrate 1 inside the slot 16 in the width direction and the longitudinal dimension W43 of the attachment surface 14 between the slots 16 adjacent in the longitudinal direction are also described. Should be set in the same level range.

  With the glass substrate 1 placed on the attachment surface 14 as described above, the transformer 24 is operated to reduce the pressure in the transformer space 25 formed inside the base 22. As a result, the internal space of the elongated hole 16 communicating with the variable pressure space 25, that is, the space surrounded by the inner side surface of the elongated hole 16 and the back surface 2 of the glass substrate 1 is similarly depressurized. The part that blocks the long hole 16 and the surrounding area are sucked with a predetermined suction force. Further, the peripheral portion 2 a of the back surface 2 of the glass substrate 1 is pressed against and adheres to the adhesion surface 14 by the suction action.

  After the glass substrate 1 is held by the suction holding jig 10 by adsorbing and adhering to the adhering surface 14 in this manner, the glass substrate 1 is transported to the next film forming process. At this time, the glass substrate 1 may be transferred integrally with the suction holding device 20. In addition, when performing a film formation process that requires a reduced pressure such as sputtering, which will be described later, the suction and holding device 20 cannot be put into the chamber of the film formation device. Therefore, as shown in FIG. It is preferable to convey only the holding jig 10 integrally. Since the back surface 2 of the glass substrate 1 is attached to the attachment surface 14, the pressure in the variable pressure space 25 of the suction holding device 20 is returned to normal pressure, and the suction holding jig 10 is removed from the suction holding device main body 21. In this case, the glass substrate 1 can maintain a state of being integrated with the suction holding jig 10 by the adhesive force. Therefore, the glass substrate 1 can be easily transferred to the next step without directly touching the glass substrate.

  In the next step, a predetermined film forming process is performed on the surface of the glass substrate 1 by, for example, sputtering. Thereafter, the glass substrate 1 is separated from the suction holding jig 10. In the present embodiment, for example, as shown in FIG. 6, the suction holding jig 10 integrally including the glass substrate 1 having the thin film 4 formed on one surface 3 is placed on the suction holding device main body 21 again. It is fixed by the above-mentioned means. Thereafter, the variable pressure device 24 is operated, and high-pressure air is sent into a variable pressure space 25 formed inside the base portion 22 to pressurize the variable pressure space 25. Accordingly, the internal space of the elongated hole 16 communicating with the variable pressure space 25, that is, the space surrounded by the inner side surface of the elongated hole 16 and the back surface 2 of the glass substrate 1 is similarly pressurized. Is pressed away from the attachment surface 14 of the suction holding jig 10. When this pressing force (pressing force) exceeds the adhesive force with the adhering surface 14, the glass substrate 1 is peeled off from the adhering surface 14 and can be separated.

  As described above, in the present invention, the attachment / holding jig 10 is provided with the attachment surface 14 to which only the peripheral portion 2 a of the back surface 2 of the glass substrate 1 can be attached, and the suction / holding jig 10 is opened to the attachment surface 14. A long hole 16 was formed. With the jig 10 configured as described above, it is possible to adsorb only the peripheral portion 2a of the back surface 2 of the glass substrate 1 corresponding to the periphery of the long hole 16 as much as possible over the entire circumference. Therefore, when the glass substrate 1 is sucked through the elongated hole 16, an area where the suction force is insufficient on the peripheral portion 2 a of the rear surface 2 is minimized, and the rising of the peripheral portion 2 a can be avoided. Therefore, it is possible to prevent the film-forming material from sneaking into the back surface 2 and accurately perform the film-forming process only on the front surface 3 on the side to be formed. Of course, according to this jig 10, only the back surface 2 can be attracted and adhered and held without any contact with the front surface 3 of the glass substrate 1, so that the thin film 4 Can be formed.

  In particular, in the present embodiment, since the attachment surface 14 is provided so as to surround the entire circumference of the long hole 16, the suction force due to the reduced pressure acts on the back surface 2 of the glass substrate 1 around the long hole without leakage. The peripheral portion 2a of the back surface 2 of the glass substrate 1 corresponding to the elongated hole 16 can be more firmly attached to the attachment surface 14 over the entire area.

  Further, in the present invention, since the long holes 16 for suction are provided in the opening on the adhering surface 14, the adhering surfaces 14 are always provided on both sides in the width direction of the long hole 16. Therefore, when the glass substrate 1 is sucked using the suction holding jig 10, the back surface 2 of the glass substrate 1 is attached and supported on the attaching surface 14 on both sides in the width direction of the elongated hole 16. The glass substrate 1 can be stably held without adhering and supporting the space inside the frame-shaped portion 11, that is, the region on the center side of the plane of the glass substrate 1. Therefore, even if the glass substrate 1 is of a type in which most of the back surface 2 of the glass substrate 1 is an effective surface, the glass substrate 1 can be stably held without affecting the surface quality.

  Further, according to the suction holding device 20 according to the above-described embodiment, only the peripheral edge portion 2a can be sucked and held without sucking the area on the center side of the plane of the glass substrate 1. Therefore, for example, even when a hole or the like is provided in the center of the plane of the glass substrate 1, the glass substrate 1 is held at a regular position only at a portion (peripheral portion 2 a) irrelevant to the hole and the end portion is not lifted. be able to. Therefore, it is excellent in versatility.

  In the present invention, the surface to be suction-supported around the long hole 16 provided in the suction holding jig 10 is the attachment surface 14, so that the peripheral portion 2 a of the glass substrate 1 is suction-held through the long hole 16. At this time, the peripheral portion 2a of the glass substrate 1 is pressed against the attachment surface 14 provided around the elongated hole 16 and is fixed by the newly generated attachment force. Therefore, when the film formation process is performed by sputtering as described above, a sufficient holding force can be maintained even when the glass substrate 1 is placed in a vacuum environment together with the suction holding jig 10.

  Further, as in the present embodiment, the suction holding jig 10 is configured to be detachable from the suction holding device main body 21 so that the glass substrate 1 is sucked and held, and then the glass substrate 1 is sucked and held. In a state of being integrated with only 10, it can be transported to the film forming process and carried out. Therefore, it is possible to improve the handleability of the glass substrate 1 before and after the film forming process. Further, even if the size of the glass substrate 1 changes, the suction holding device main body 21 can be reused only by changing the suction holding jig 10 to one corresponding to the changed size of the glass substrate 1 ( This is preferable because it can have versatility).

  Although the first embodiment of the present invention has been described above, the suction holding jig 10 according to the present invention, the suction holding device 20 including the jig 10, the suction holding method using the jig 10, the The processing method and the substrate film formation method can of course take any form within the scope of the present invention.

  For example, in the above-described embodiment (first embodiment), the frame portion 11 and the attachment surface 14 are configured such that the peripheral portion 2a of the glass substrate 1 can be attached over the entire circumference. Absent. FIG. 7 shows an example (a second embodiment of the present invention), in which the frame-shaped portion 11 and the attachment surface 14 according to the present embodiment form a completely closed frame-like (ring-shaped connected shape). Instead, it forms a frame with an open part. With this configuration, for example, although not shown, the suction holding jig 10 and the suction holding method according to the present invention can be applied to the glass substrate 1 having a hole or the like in the peripheral portion 2a. it can. At this time, the open portion 17 of the frame portion 11 and the attachment surface 14 is preferably closed by a block 18 provided on the upper surface 13a of the bottom plate portion 13 as shown in the drawing. By doing so, although not shown, the space 15 inside the frame-shaped portion 11 can be closed by the block 18 while the glass substrate 1 is placed on the attachment surface 14, and the open portion 17 can be closed. It is possible to prevent the film-forming material from wrapping around to the back surface 2.

  Further, with respect to the dimensions of the elongated holes 16 (the width direction dimensions and the longitudinal dimension dimensions), in the above-described embodiment, the case where all the elongated holes 16 have the same dimensions has been exemplified. It is also possible to form an opening on the attachment surface 14. FIG. 8 shows an example (third embodiment of the present invention). A suction holding jig 10 shown in FIG. 8 includes a long hole 16 shown in FIG. And has a first connection long hole 16a and a second connection long hole 16b whose longitudinal dimension is larger than the long hole 16. In this way, by devising the manner of forming the long holes, it becomes possible to appropriately hold the glass substrate 1 by suction in accordance with the type thereof.

  Further, with respect to the shape of the elongated hole 16, in the above-described embodiment, an example in which the dimension in the width direction is fixed has been exemplified, but it is needless to say that other configurations can be adopted. FIG. 9 shows an example (fourth embodiment of the present invention). The elongated holes 16 and 16a shown in FIG. (The portion 16c is provided). Thus, it is possible to provide a sufficient adsorbing property even at the corner portion of the attachment surface 14 where the distance from the elongated holes 16, 16a, 16b tends to be larger than other portions.

  Further, with respect to the end shape of the long hole 16, in the above-described embodiment, the long end of the long hole 16 is illustrated as having a semicircular shape. The opening may be formed on the surface 14. FIG. 10 shows an example (fifth embodiment of the present invention). The long hole 16 shown in FIG. 10 has a rectangular end 16d in the longitudinal direction.

  Further, the number of the long holes 16 is arbitrary, and one or a plurality of long holes 16 may be formed in the attachment surface 14 by opening. In the case where one long hole 16 is provided, although not shown, the long hole 16 is provided over the entire circumference of the attachment surface 14 formed in a substantially rectangular frame shape, and a part of the long hole 16 is formed in the bottom plate portion 13. A configuration in which the elongated hole 16 that is interrupted (that is, the bottom plate portion 13 is connected at least partially at the outer side and the inner side in the width direction of the elongated hole 16) is possible.

  In the above-described embodiment, the suction holding jig 10 has a frame-shaped portion 11, an attachment portion 12 (attachment surface 14), and a bottom plate portion 13, which are integrated. It is also possible to take the configuration of FIG. 11 shows an example (sixth embodiment of the present invention). The suction holding jig 10 shown in FIG. 11 includes a frame-shaped portion 11, an attachment portion 12, and a bottom plate portion 13, It further has a spacer 19. The spacer 19 is attached to the attachment surface 14 extending outward in the width direction from the form shown in the first embodiment, and has a shape and dimensions surrounding the outer periphery of the glass substrate 1 placed on the attachment surface 14. I have. According to this configuration, the glass substrate 1 can be reliably placed at a predetermined position on the attachment surface 14, so that the desired suction action is exerted on the peripheral portion 2a of the glass substrate 1 and the glass substrate 1 is securely held. Can be held by suction.

  Further, the bottom plate portion 13 does not necessarily need to be provided integrally with the frame-shaped portion 11, and may be attached to, for example, the upper portion of the suction-holding device main body 21, or the frame-shaped portion 11 may be directly attached to the suction-holding device main body 21 ( If it can be attached to the base portion 22), the bottom plate portion 13 itself can be omitted.

  Further, in the above embodiment, the suction holding jig 10 has the frame portion 11, the attachment surface 14 provided on the frame portion 11, and the elongated hole 16 formed in the attachment surface 14. However, the frame 11 is not an essential component. As long as the attachment surface 14 is provided, the shape of the base (base portion) of the jig 10 is not limited to a frame shape, and can take various forms.

  Further, in the above-described embodiment, a configuration in which no member is in contact with the area on the center side of the back surface 2 of the glass substrate 1 in the plane is illustrated. However, depending on the size (thickness dimension, side dimension, and the like) of the glass substrate 1, its own weight is reduced. A configuration may be added to locally support the region on the center side of the rear surface 2 in the plane for the purpose of suppressing the bending due to the above. For example, although not shown, it is also possible to locally support the region on the center side of the rear surface 2 in the plane with the support portion erected from the bottom plate portion 13. However, the region on the center side of the plane of the glass substrate 1 often functions as an effective surface irrespective of the front surface 3 and the back surface 2. Therefore, the adhesion surface 14 is provided on the contact surface with the back surface 2 (end surface of the support portion). It is preferable to keep it.

  Further, in the above embodiment, as the suction holding device main body 21 constituting the suction holding device 20 together with the suction holding jig 10, one pressure transforming device 24 and one pressure transforming space 25 are provided, Although the case where pressure reduction and pressurization of the variable pressure space 25 are selectively used is described above, it is needless to say that other desorption modes can be adopted. FIG. 12 shows an example (seventh embodiment of the present invention). The suction holding device 20 shown in FIG. 12 includes a pressure device 28 and a pressure device 28 in addition to a pressure device 24 and a corresponding pressure space 25. And a pressurized space 29 corresponding to. More specifically, in the concave portion 22a of the base portion 22, a partition wall 26 is provided for partitioning the internal space of the concave portion 22a for pressure reduction and pressure application, and is connected to the inner space partitioned by the partition wall 26. A pressurizing device 28 is connected via the section 27. Therefore, as shown in FIG. 11, in a state where the suction holding jig 10 is mounted on the base portion 22 and the glass substrate 1 is mounted on the attachment surface 14 of the suction holding jig 10, The space inside the concave portion 22 a partitioned by the partition wall 26 functions as a pressurizing space 29 that can be pressurized by the pressurizing device 28.

  The bottom plate portion 13 is provided with a communication hole 30 for communicating the space 15 inside the frame-shaped portion 11 and the space inside the concave portion 22a partitioned by the partition wall 26. By operating the pressurizing device 28 in the state shown in FIG. 12 to pressurize the pressurizing space 29, the space 15 inside the frame-shaped portion 11 communicating with the pressurizing space 29 is also connected to the pressurizing space 29. Pressurized in the same way. Here, since the space 15 inside the frame-shaped portion 11 is closed by a region on the center side of the plane except for the peripheral portion 2 a of the back surface 2 of the glass substrate 1, by pressing this space 15, 1 can be pressed in a direction to push up the area on the center side of the plane. As described above, in the space 15 inside the frame-shaped portion 11, the area in contact with the back surface 2 of the glass substrate 1 (the area to be pressed) can be easily increased as compared with the long hole 16, so that the output is so high. Without using the pressurizing device 28, it is possible to apply a pressing force to the glass substrate 1 that is large enough to separate from the adhesion surface 14. Of course, in the present embodiment, in addition to the pressurizing device 28, by using the transformer 24 for pressurizing, the glass substrate 1 is attached to the peripheral portion 2 a (the region facing the elongated hole 16) and the adhering surface 14. This is preferable because both the region on the center side of the plane (the region facing the space 15 inside the frame-shaped portion 11) that is not attached can be pushed up.

  Of course, when the glass substrate 1 is adsorbed and peeled off only by the single transformer 24 and the transformer space 25, for example, the following valve structure can be adopted. FIG. 13 shows a suction holding device 20 according to an example (eighth embodiment of the present invention). The suction holding device 20 has a valve device 31 in a variable pressure space 25 for switching between a valve closing operation and a valve opening operation in accordance with a pressure changing operation of the variable pressure device 24. The valve device 31 is, for example, a spherical valve. By contacting the body 32 and the valve body 32, the seat surface 34 that blocks the internal space 33 of the valve device 31 and the variable pressure space 25 and the upward movement of the valve body 32 (outside the internal space 33) are restricted. And a communication port 36 that communicates the internal space 33 with the space 15 inside the frame-shaped portion 11.

  According to the suction holding device 20 having the valve device 31 having the above configuration, when the variable pressure device 24 is operated to reduce the pressure in the variable pressure space 25, the internal space 33 of the valve device 31 connected to the variable pressure space 25 is reduced in pressure, and 32 comes into contact with the seat surface 34 by suction. As a result, the internal space 33 of the valve device 31 is shut off from the variable pressure space 25, so that the space 15 inside the frame 11 communicating with the internal space 33 is prevented from being depressurized, and communicates with the variable pressure space 25. It is possible to reduce the pressure only in the internal space of the elongated hole 16, that is, the space surrounded by the inner side surface of the elongated hole 16 and the back surface 2 of the glass substrate 1. On the other hand, when the transformer 24 is operated to pressurize the transformer space 25, the pressurization acts in a direction to push the valve body 32 in contact with the seat surface 34. Therefore, the valve body 32 is separated from the seat surface 34 by the pushing action, so that the internal space 33 connected to the variable pressure space 25 is pressurized, and the space 15 inside the frame-shaped portion 11 communicating with the internal space 33 is added. Pressed. At this time, the internal space of the elongated hole 16 communicating with the variable pressure space 25 is also pressurized, so that the glass substrate 1 is attached to the peripheral portion 2 a (the area facing the elongated hole 16) and the attachment surface 14. It is possible to push up both the region on the center side of the plane (the region facing the space 15 inside the frame-shaped portion 11). As described above, according to the suction holding device 20 according to the present embodiment, the back surface 2 is spread over a wide range as much as possible while holding only the peripheral portion 2a of the back surface 2 of the glass substrate 1 with only one transformer 24. It becomes possible to push up.

  In the above description, the case where the glass substrate 1 is set as the suction holding object is exemplified. However, it is needless to say that any other plate-like body (substrate) on which one surface is subjected to a film forming process may be used. The present invention is not limited to the glass substrate 1, and the present invention can be applied.

  In the above description, the case where the glass substrate 1 is subjected to the film forming process is exemplified. However, even if the process other than the film forming process is performed, the suction holding jig according to the present invention and the It is possible to apply a suction holding device, a suction holding method, and a substrate processing method.

REFERENCE SIGNS LIST 1 glass substrate 2 back surface 2a peripheral portion 3 front surface 4 thin film 10 suction holding jig 11 frame portion 12 attachment portion 13 bottom plate portion 14 attachment surface 15 space inside frame portion 16 elongated hole 17 opening portion 18 block 19 spacer 20 Suction and holding device 21 Suction and holding device main body 22 Base portions 22a Recesses 23 and 27 Connecting portion 24 Transformer 25 Transformation space 26 Partition wall 28 Pressurizing device 29 Pressurizing space 30 Communication hole 31 Valve device 32 Valve element 33 Internal space 34 Seat surface

Claims (2)

A substrate processing method for applying a suction force to a substrate, holding the substrate by suction , and performing a predetermined process on the substrate ,
And attachment surface for imparting a biasing adhesive force only to the periphery of the substrate by contact with the substrate, and long holes for suction opening to the attachment surface, suction holding of the attachment surface is provided with a frame portion provided In a state where the substrate is placed on the attachment surface of the jig,
By only space vacuo surrounded by the substrate and the slot without depressurizing the inside space of the frame-like portion, the suction force a peripheral portion of the substrate to the substrate with adhered to the attachment surface After applying and holding the substrate by suction,
After removing the suction holding jig from the main body of the suction holding device including the suction holding jig and performing a predetermined process on the substrate,
A method of processing a substrate, wherein at least one of a space surrounded by the elongated hole and the substrate and a space inside the frame-shaped portion is pressed to separate the substrate from the suction holding jig . A method of forming a substrate by applying a suction force to the substrate, holding the substrate by suction, and performing a film forming process on the substrate,
Suction holding having an attachment surface that gives an adhesion force only to a peripheral portion of the substrate by contact with the substrate, a long slot for suction opening to the attachment surface, and a frame portion provided with the attachment surface In a state where the substrate is placed on the attachment surface of the jig,
By only space vacuo surrounded by the substrate and the slot without depressurizing the inside space of the frame-like portion, said suction a peripheral portion of the substrate to Rutotomoni the substrate is attached to the attachment surface After applying force to hold the substrate by suction ,
Remove the suction holding jig from the body of the suction holding device equipped with the suction holding jig, was subjected to film formation process on the substrate,
A substrate film forming method, wherein at least one of a space surrounded by the elongated hole and the substrate and a space inside the frame-shaped portion is pressed to peel the substrate from the suction holding jig.

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