JP2005199269A5 - - Google Patents
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- JP2005199269A5 JP2005199269A5 JP2004364373A JP2004364373A JP2005199269A5 JP 2005199269 A5 JP2005199269 A5 JP 2005199269A5 JP 2004364373 A JP2004364373 A JP 2004364373A JP 2004364373 A JP2004364373 A JP 2004364373A JP 2005199269 A5 JP2005199269 A5 JP 2005199269A5
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- JP
- Japan
- Prior art keywords
- composition
- shaping
- shape
- display device
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (20)
前記組成物が被形成領域に付着する前に、前記組成物の形状を整形する整形手段とを有し、
前記整形手段が、前記吐出手段と前記被形成領域との間に設けられることを特徴とする液滴吐出装置。 A discharge means for discharging a composition containing an insulating material or a conductive material ;
Shaping means for shaping the shape of the composition before the composition adheres to the formation area;
The liquid droplet ejection apparatus, wherein the shaping unit is provided between the ejection unit and the formation region.
前記組成物が被形成領域に付着した後に、前記組成物の形状を整形する整形手段とを有することを特徴とする液滴吐出装置。 A discharge means for discharging a composition containing an insulating material or a conductive material ;
A liquid droplet ejection apparatus comprising: a shaping unit that shapes the shape of the composition after the composition has adhered to the formation region.
前記整形部の形状は針状であることを特徴とする液滴吐出装置。 In any 1 paragraph of Claims 1 thru / or 3, The above-mentioned shaping means has a shaping part,
The shape of the shaping part is a needle-like shape.
前記整形部の形状は柱状または板状であることを特徴とする液滴吐出装置。 In any 1 paragraph of Claims 1 thru / or 3, The above-mentioned shaping means has a shaping part,
The shape of the shaping part is a columnar shape or a plate shape.
前記整形部の形状は管状であることを特徴とする液滴吐出装置。 In any 1 paragraph of Claims 1 thru / or 3, The above-mentioned shaping means has a shaping part,
The shape of the said shaping part is a tubular shape, The droplet discharge apparatus characterized by the above-mentioned.
前記組成物が前記被形成領域に付着する前に、前記組成物の形状を整形することによって、選択的にパターンを形成することを特徴とするパターン形成方法。 A composition containing an insulating material or a conductive material is discharged toward a formation region;
A pattern forming method, wherein a pattern is selectively formed by shaping a shape of the composition before the composition adheres to the formation region.
前記組成物が前記被形成領域に付着した後であって、かつ固化する前に、前記組成物の形状を整形することによって、選択的にパターンを形成することを特徴とするパターン形成方法。 A composition containing an insulating material or a conductive material is discharged toward a formation region;
A pattern forming method comprising selectively forming a pattern by shaping the composition after the composition is attached to the formation region and before solidifying.
導電性材料を含む組成物を被形成領域上に吐出し、前記組成物の形状の一部を整形し、前記組成物を選択的に拡張することによって、前記配線及び前記電極を形成することを特徴とする表示装置の作製方法。 Having a semiconductor layer, wiring and electrodes,
Forming the wiring and the electrode by discharging a composition containing a conductive material onto a formation region, shaping a part of the shape of the composition, and selectively expanding the composition; A method for manufacturing a display device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004364373A JP4583904B2 (en) | 2003-12-17 | 2004-12-16 | Method for manufacturing display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003419923 | 2003-12-17 | ||
JP2004364373A JP4583904B2 (en) | 2003-12-17 | 2004-12-16 | Method for manufacturing display device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005199269A JP2005199269A (en) | 2005-07-28 |
JP2005199269A5 true JP2005199269A5 (en) | 2008-02-07 |
JP4583904B2 JP4583904B2 (en) | 2010-11-17 |
Family
ID=34829237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004364373A Expired - Fee Related JP4583904B2 (en) | 2003-12-17 | 2004-12-16 | Method for manufacturing display device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4583904B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8053850B2 (en) | 2005-06-30 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof |
JP4914589B2 (en) | 2005-08-26 | 2012-04-11 | 三菱電機株式会社 | Semiconductor manufacturing apparatus, semiconductor manufacturing method, and semiconductor device |
JP4696957B2 (en) * | 2006-02-22 | 2011-06-08 | ソニー株式会社 | Wiring board correction method and wiring board correction apparatus |
KR100785038B1 (en) | 2006-04-17 | 2007-12-12 | 삼성전자주식회사 | Amorphous ZnO based Thin Film Transistor |
JPWO2009035036A1 (en) * | 2007-09-14 | 2010-12-24 | コニカミノルタホールディングス株式会社 | Electrode forming method and organic thin film transistor |
JP2012109581A (en) * | 2011-12-19 | 2012-06-07 | Mitsubishi Electric Corp | Semiconductor manufacturing method and semiconductor device |
KR20170059523A (en) * | 2015-11-20 | 2017-05-31 | 삼성디스플레이 주식회사 | Display apparatus, tiled display apparatus and method of manufacturing the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59130562A (en) * | 1983-01-14 | 1984-07-27 | Kinugawa Rubber Ind Co Ltd | Coating device for long-sized material |
JPS59193571U (en) * | 1983-06-13 | 1984-12-22 | ナショナル住宅産業株式会社 | caulking nozzle |
JP2593434B2 (en) * | 1985-06-29 | 1997-03-26 | 株式会社東芝 | Recording device |
US4868138A (en) * | 1988-03-23 | 1989-09-19 | Sgs-Thomson Microelectronics, Inc. | Method for forming a self-aligned source/drain contact for an MOS transistor |
JPH0864937A (en) * | 1994-08-24 | 1996-03-08 | Ibiden Co Ltd | Pasty material coater |
JPH10223138A (en) * | 1996-12-04 | 1998-08-21 | Dainippon Printing Co Ltd | Phosphor-filling device |
JPH1157574A (en) * | 1997-08-20 | 1999-03-02 | Ricoh Co Ltd | Mixing and coating device and mixing and coating method using the same |
JP4003273B2 (en) * | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | Pattern forming method and substrate manufacturing apparatus |
JPH11237790A (en) * | 1998-02-23 | 1999-08-31 | Brother Ind Ltd | Image forming device |
JPH11329221A (en) * | 1998-05-15 | 1999-11-30 | Canon Inc | Coating method of paste material and image display device using same |
JP3726667B2 (en) * | 1999-11-02 | 2005-12-14 | 松下電器産業株式会社 | AC type plasma display device |
JP2002316401A (en) * | 2001-04-20 | 2002-10-29 | Matsushita Electric Ind Co Ltd | Viscous material coating method and apparatus therefor |
JP2002086020A (en) * | 2000-09-11 | 2002-03-26 | Fuji Photo Film Co Ltd | Liquid coating apparatus |
JP2002177842A (en) * | 2000-12-07 | 2002-06-25 | Kawasaki Steel Corp | Method and apparatus for coating steel pipe with adhesive |
JP2003059940A (en) * | 2001-08-08 | 2003-02-28 | Fuji Photo Film Co Ltd | Substrate for microfabrication, production method therefor and image-shaped thin film forming method |
JP3793709B2 (en) * | 2001-10-19 | 2006-07-05 | アイカ工業株式会社 | Coating floor and its construction method |
JP2003151443A (en) * | 2001-11-12 | 2003-05-23 | Matsushita Electric Ind Co Ltd | Ac type plasma display panel |
JP2003311196A (en) * | 2002-04-19 | 2003-11-05 | Seiko Epson Corp | Method and apparatus for forming film pattern, conductive film wiring, electrooptical apparatus, electronic device, non-contact type card medium, piezoelectric element, and ink-jet recording head |
JP4615197B2 (en) * | 2002-08-30 | 2011-01-19 | シャープ株式会社 | Manufacturing method of TFT array substrate and manufacturing method of liquid crystal display device |
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2004
- 2004-12-16 JP JP2004364373A patent/JP4583904B2/en not_active Expired - Fee Related
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