JP2005167001A - Device and method for soldering substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide soldering device/method of a substrate with which a preheater can be made small to a size adjusted to the largest size of the substrate irrespective of preheating time. <P>SOLUTION: The substrate is placed on a carrier 6 by a casting part 20. The carrier 6 is guided to a conveyance rail 5, passes through the preheater 3 from a flux coating device 4, and is sent to a solder tank 2. The substrate is coated with flux in the flux coating device 4, is preheated by the preheater 3 and is soldered in the solder tank 2. In the flux coating device 4 and the solder tank 2, fluxing and soldering are performed while the carrier 6 is conveyed. On the other hand, the substrate is preheated in the preheater 3 in a state where the carrier 6 is stopped. The preheater 3 is made in the minimum size with which the substrate that is placed on the carrier 6 and is in the largest size can be preheated in the state where the carrier 6 is stopped. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a board soldering apparatus and method, and more particularly to a board soldering apparatus and method for applying a flux to a board and preheating the board before soldering the board.

  FIGS. 7A and 8A are a plan view and a cross-sectional view, respectively, schematically showing the configuration of a conventional soldering apparatus.

  The conventional soldering device 31 includes a preheater 33 and a solder bath 32, but the flux applying device 34 is configured as a separate device. The soldering device 31 is provided with a transport rail 35 that passes above the preheater 33 and the solder bath 32, and a transport rail 36 is also provided above the flux application device 34. The transport rails 35 and 36 have portions protruding before and after the soldering device 31 and the flux applying device 34 for delivering a target printed circuit board (not shown). These transport rails 35 and 36 are connected by a transport rail 7 for connection.

  A target printed board (not shown, hereinafter referred to as a board) is placed on the carrier 6. The carrier 6 is guided by the conveyance rails 36, 7 and 35, and is continuously sent from the flux application device 34 to the solder tank 32 through the preheater 33. The carrier 6 supports only the peripheral edge of the substrate, and almost all of the lower surface of the substrate is exposed downward.

  The flux coating device 34 blows air from the flux coating nozzle 17 to spray the flux on the substrate in the form of a mist. The solder bath 32 jets molten solder upward and sprays it onto the lower surface of the substrate, and solders the leads of the mounted components inserted into the through holes to the substrate.

  Accordingly, the substrate is applied with the flux by the flux applying device 34, then preheated by the preheater 33 and then soldered by the solder bath 32. The number of substrates to be manufactured is increased by feeding the substrates to the flux coating device 34 one after another so that a plurality of substrates are simultaneously flowing between the flux coating device 34 and the solder bath 32.

  As shown in FIGS. 7 and 8, the soldering device 31 and the flux applying device 34 are provided with a duct 8 for eliminating the vaporized components of solder vapor and flux.

  The automatic printed circuit board soldering apparatus disclosed in Japanese Patent Laid-Open No. 5-38569 of Patent Document 1 uses a conveyor to send a substrate from a flux coating device through a pre-heater to a solder bath, and solders the substrate. It is. Moreover, this automatic soldering apparatus for printed wiring boards blows air or the like onto a substrate from a spray tube provided between a flux applying device and a preheater. This spraying causes the flux to penetrate into the through hole of the substrate and prevents the vaporized component of the flux from entering the preheater.

JP-A-5-38569

  The conventional board soldering apparatus is divided into two apparatuses, a soldering apparatus 31 and a flux applying apparatus 34. In each of the soldering apparatus 31 and the flux applying apparatus 34, the transfer rails 35 and 36 are used for transferring the board. It has a part protruding forward and backward.

  In order to improve the soldering state by tilting the substrate, the transport rail 35 in the soldering device 31 is tilted so as to rise toward the outlet side by about 5 degrees (the soldering angle in claim 6). . On the other hand, since the conveyance rail 36 of the flux application device 34 is horizontal, in order to absorb the difference in inclination between the two conveyance rails 36 and 35 having different inclinations, the carrier 6 can be smoothly transferred from the conveyance rail 34 to the conveyance rail 35. A connection conveying rail 7 is provided between the conveying rails 35 and 36.

  Further, since the preheater 33 preheats the substrate while it is being transported, it is necessary to ensure a distance within the preheater 33 that the substrate is transported during the preheating time necessary to sufficiently heat the substrate. Therefore, the preheater 33 is indispensable to be several times longer than the substrate size, and has to be large.

  Since the above-described protruding portions of the conveyance rails 35 and 36, the conveyance rail 7 for connection, and the preheater 33 are large, the conventional soldering apparatus, including the flux application apparatus, becomes long as a whole conveyance rail. There was a problem of requiring floor space.

  Further, since the entire transport rails 7, 35 and 36 are long and the substrate is transported over a long distance, the time from when the substrate is loaded into the flux coating device 34 until it is ejected from the soldering device 31 is very long. There is a problem of becoming. Therefore, in the production of a single sheet in which only one board is allowed to flow through the soldering apparatus at the same time for small lot production, the production tact per board becomes very long, resulting in poor production efficiency. End up.

  In conventional substrate production, large-scale equipment was installed on a wide floor, and small-lot large lots were produced in order to maximize equipment capacity. However, recently, it has been changed to the production of small lots that can be sold at the time when they can be sold, and it has become necessary to produce one lot as a minimum unit with minimum time and cost. However, the conventional board soldering apparatus cannot efficiently produce a small lot of boards.

  A substrate soldering apparatus according to a first aspect of the present invention includes a flux application unit (4 in FIG. 1) for applying a flux to the substrate, and a preheater unit (3 in FIG. 1) for preheating the substrate on which the flux has been applied. A soldering part (2 in FIG. 1) for soldering to the preheated board, and after the board is sent from the flux application part to the preheater part, the preheater part is stopped for a preheating time, and then the soldering is performed. And a conveying device (5 and 19 in FIG. 1) to be sent to the attaching portion.

  According to a second aspect of the present invention, there is provided a substrate soldering apparatus comprising: a flux application unit that applies a flux to a substrate; a preheater unit that preheats the substrate to which the flux is applied; and solder that performs soldering to the preheated substrate. An attaching portion, a carrier (6 in FIG. 1) on which the substrate is placed, and the carrier is sent from the flux application portion along the rail to the preheater portion, and then the preheater portion is stopped for a preheating time before the soldering. And a conveying device for sending to the section.

  According to a third aspect of the present invention, there is provided a soldering apparatus for a substrate, a flux applying portion for applying a flux to the substrate, a preheater portion for preheating the substrate to which the flux has been applied, and a solder for soldering the preheated substrate. An attachment unit, a transfer device that sends the substrate from the flux application unit to the soldering unit via the preheater unit, and a detection that the entire substrate is sent to the transfer device and enters the preheater unit A sensor (15 in FIG. 1), and a control unit that controls the transport device to drive again after the sensor has stopped for a preheating time after detecting the substrate and send the substrate to the soldering unit. It is characterized by including.

  According to a fourth aspect of the present invention, there is provided a substrate soldering apparatus comprising: a flux application unit that applies a flux to a substrate; a preheater unit that preheats the substrate to which the flux is applied; and solder that performs soldering to the preheated substrate. An attaching portion, a carrier on which the substrate is placed, a conveying device that sends the carrier along the rail from the flux application portion to the soldering portion via the preheater portion, and the entire carrier is sent to the conveying device. And a sensor (15 in FIG. 1) that detects that the preheater has been entered, and after the sensor has detected the carrier, the sensor is stopped for a preheating time and then re-driven to drive the carrier to the soldering portion. And a control unit that controls the transport device so as to send.

  According to a fifth aspect of the present invention, in the board soldering apparatus according to the first or third aspect, the pre-heater unit is a minimum size capable of preheating a target having the maximum size of the board. It is characterized by being.

  According to a sixth aspect of the present invention, in the board soldering apparatus according to the second or fourth aspect, the preheater unit is a minimum that can preheat the board having the maximum size that can be placed on the carrier. It is characterized by its size.

  The invention according to claim 7 is the board soldering apparatus according to claim 2, 4 or 6, wherein the rail is inclined by a soldering angle as a whole.

  According to an eighth aspect of the present invention, there is provided a substrate soldering apparatus comprising: a substrate loading unit (20 in FIG. 1) for loading a substrate; a flux application unit for applying flux to the substrate; and preheating the substrate on which flux has been applied. A preheater section, a soldering section for soldering the preheated board, and a forward path for sending the board from the board loading section to the soldering section via the preheater section after passing through the flux application section And a transport device for transporting in the reverse path, a sensor (12 in FIG. 1) for detecting that the entire substrate has passed through the soldering section in the forward path, and the flux applying section in the forward path. The preheater unit is fed into the preheater unit, stopped for a preheating time in the preheater unit, and then sent to the soldering unit. The sensor detects the substrate. Characterized in that after and a control unit for the substrate for controlling the transport device back to the insertion portion.

According to a ninth aspect of the present invention, there is provided a substrate soldering apparatus comprising: a substrate loading unit that loads a substrate; a flux coating unit that applies flux to the substrate; a preheater unit that preheats the substrate coated with flux; A soldering part for soldering to the board, a forward path for sending the board from the board input part to the soldering part via the preheater part after passing through the flux application part and a reverse path in reverse A transport device for transporting, a first sensor (13 in FIG. 1) for detecting that the tip of the substrate has reached the flux application section in the forward path, and the entire substrate in the forward path for the flux application section. A second sensor (14 in FIG. 1) for detecting that it has passed, and detecting that the entire substrate has entered the preheater portion in the forward path. A third sensor (15 in FIG. 1), a fourth sensor (12 in FIG. 1) for detecting that the entire substrate has passed through the soldering portion in the forward path, and the substrate in the return path is the substrate. A fifth sensor (9 in FIG. 1) for detecting the return to the input unit;
When the first sensor detects the substrate by transporting the substrate in the forward direction by the transport device, the flux application unit starts applying the flux, and the second sensor passes the substrate. When the detection is detected, the application of the flux by the flux application unit is terminated, and the transfer of the transfer device is stopped for a preheating time from the time when the third sensor detects the substrate. When the fourth sensor detects the passage of the substrate, the substrate is conveyed in the direction of the return path until the substrate is detected by the fifth sensor. And a control unit that controls to return to the input unit.

  According to a tenth aspect of the present invention, there is provided a method of soldering a substrate, wherein the substrate is transported in a flux application unit and the flux is applied to the substrate, and then the substrate coated with the flux is fed into a preheater unit and stopped for a preheating time. After preheating, the preheated board is transported in a soldering section and soldered to the board.

  According to an eleventh aspect of the present invention, there is provided a substrate soldering method comprising: mounting a substrate on a carrier; transporting the carrier in a flux application unit; and applying the flux to the substrate; After the placed carrier is fed into a preheater section and stopped for a preheating time to preheat the board, the carrier on which the preheated board is placed is transported in a soldering section and soldered to the board. It is characterized by that.

According to a twelfth aspect of the present invention, there is provided a soldering method for a substrate, a flux applying portion for applying a flux to the substrate, a preheater portion for preheating the substrate to which the flux has been applied, and solder for soldering the preheated substrate. In a method of soldering a substrate using a device including an attaching portion and a conveying device that sends the substrate from the flux application portion to the soldering portion via the preheater portion,
After stopping the preheating time after detecting that the whole substrate is sent to the transfer device and entering the preheater unit, the transfer device is driven again to send the substrate to the soldering unit. Features.

According to a thirteenth aspect of the present invention, there is provided a soldering method for a substrate, a flux applying portion for applying a flux to the substrate, a preheater portion for preheating the substrate on which the flux has been applied, and solder for performing soldering on the preheated substrate. In a method of soldering a substrate using a device including an attaching portion, a carrier on which the substrate is placed, and a conveying device that sends the carrier from the flux application portion to the soldering portion via the preheater portion,
After stopping the preheating time after detecting that the entire carrier is sent to the transport device and entering the preheater unit, the carrier device is driven again to send the carrier to the soldering unit. Features.

According to a fourteenth aspect of the present invention, there is provided a substrate loading portion for loading a substrate, a flux application portion for applying a flux to the substrate, a preheater portion for preheating the substrate coated with the flux, and soldering the preheated substrate. A soldering unit that performs bonding, and a transport device that transports the substrate from the substrate loading unit to the soldering unit via the preheater unit after passing through the flux application unit and the reverse path thereof. In a method of soldering a substrate using an apparatus including:
The transport device sends the substrate from the flux application unit to the pre-heater unit in the forward path, stops the pre-heater unit for a preheating time, and then sends the substrate to the soldering unit. After passing, the substrate is returned to the input portion by the return path.

According to a fifteenth aspect of the present invention, there is provided a substrate loading portion for loading a substrate, a flux application portion for applying flux to the substrate, a preheater portion for preheating the substrate coated with flux, and soldering the preheated substrate. A soldering unit that performs bonding, and a transport device that transports the substrate from the substrate loading unit to the soldering unit via the preheater unit after passing through the flux application unit and the reverse path thereof. In a method of soldering a substrate using an apparatus including:
When the front end of the substrate reaches the flux application part in the outward path, the flux application part starts applying the flux, and when the whole substrate passes through the flux application part in the outward path, the flux application part becomes a flux. And the transfer device stops transferring the substrate for a preheating time from the time when the entire substrate enters the pre-heater section in the forward path, and after the stop, the transfer device moves the substrate again to the forward path. When the entire board passes through the soldering part in the forward path, the transport apparatus transports the board in the return path and returns the board to the input part. .

  The board soldering apparatus of the present invention is different from the conventional apparatus in which preheating is performed while the board is transported in order to stop and preheat the board in the preheater section, and the preheater section is adjusted to the maximum size of the board regardless of the preheating time. The size can be reduced to a small size. Therefore, the floor area of the entire board soldering apparatus can be reduced, and the apparatus can be installed in a narrow place.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  1 and 2 are a plan view and a front view, respectively, schematically showing the configuration of a board soldering apparatus 1 according to an embodiment of the present invention.

  The board soldering apparatus 1 includes a flux application apparatus 4, a preheater 3, and a solder bath 2. A conveyance rail 5 that passes above the flux application device 4, the preheater 3, and the solder tank 2 is provided. A portion of the transport rail 5 that protrudes outward from the entrance side of the flux coating device 4 is a loading portion 20 for a target substrate (not shown). Further, the transport rail 5 is tilted so as to rise to about 5 degrees toward the left side in FIG. 1 not only on the upper side of the solder tank 2 but also on the whole including the upper side of the flux applying device 4 and the like.

  A substrate to be soldered is placed on the carrier 6 by the input unit 20. The carrier 6 is guided by the transport rail 5, passes through the preheater 3 from the flux application device 4, and is sent to the solder tank 2. Accordingly, the substrate is coated with flux by the flux coating device 4, then preheated by the preheater 3, and then soldered by the solder bath 2.

  The preheater 3 has a maximum size of a substrate that can be placed on the carrier 6 and has a small size that can be preheated while the carrier is stopped.

  On the ceiling of the soldering apparatus 1, a duct 8 is provided for eliminating vaporized components of solder vapor and flux. A duct 8 for sucking and removing a vaporized component of the flux flowing out through an opening through which the substrate of the soldering apparatus 1 is fed along the rail 5 is also provided below the input unit 20.

  Sensors 9, 12, 13, 14 and 15 for detecting the presence / absence of the carrier 6 are provided along the transport rail 5. The sensor 9 detects the presence or absence of the carrier 6 at the right end of the transport rail 5 in FIG. The sensor 13 includes a flux applying unit in which the tip of the carrier 6 (the left end in FIG. 1) is applied to the substrate by the flux applying device 4 in the forward path in which the carrier 6 is conveyed from the flux applying device 4 to the solder bath 2. Detect that you have reached. The sensor 14 detects that the rear end of the carrier 6 in the forward path has passed through the flux application part. The sensor 15 detects that the tip of the carrier 6 has reached the left end of the preheater portion where the substrate is preheated by the preheater 3 in the forward path, and the entire carrier 6 has entered the preheater portion. The sensor 12 detects that the tip of the carrier 6 has reached the left end of the transport rail 5. When the front end of the carrier 6 reaches the left end of the transport rail 5, it is also when the rear end of the carrier 6 passes through a soldering portion where the substrate is soldered by the solder bath 2.

  Air is blown out from an air nozzle 16 provided between the flux applying device 4 and the preheater 3 to prevent the flux from flowing into the preheater 3 from the flux applying device 4.

  Next, an operation controlled by a control unit (not shown) of the board soldering apparatus 1 according to the present embodiment will be described.

  1 and 2 show an initial state, and a substrate is placed on the carrier 6 located in the loading unit 20. When the transport motor 19 is started by operating a start switch (not shown), a belt (not shown) is driven, and the carrier 6 connected to the belt travels along the transport rail 5 toward the left in the figure. It is conveyed to.

  As shown in FIG. 3, when the sensor 13 detects the carrier 6, air is blown out from the nozzle 17, and the flux application device 4 starts applying the flux. The conveyance of the carrier 6 is continued, and the flux application to the substrate placed on the carrier 6 is completed. As shown in FIG. 4, when the sensor 14 detects the passage of the carrier 6, the flux application device 4 stops the application of the flux. Then, the blowing of air from the nozzle 17 is stopped.

  When the carrier 6 is further transported and the sensor 15 detects the carrier 6 as shown in FIG. 5, the transport motor 19 stops driving, the carrier 6 stops on the preheater 3, and the substrate placed on the carrier 6 is preheated. Will be. A timer (not shown) measures the time since the conveyance of the carrier 6 is stopped, stops the carrier 6 for a predetermined preheating time, preheats the substrate, drives the conveyance motor 19 again, and removes the carrier 6 from the forward path. Transport in the direction. At this time, the jet motor 18 of the solder tank 2 is started, and the solder jet is started.

  Next, when the soldering to the substrate is completed and the sensor 12 detects the carrier 6 as shown in FIG. 6, the carrier motor 19 is stopped and the carrier 6 is stopped, and the jet motor 18 is stopped and the solder tank 2 is stopped. Stop the jet. After this stop, the transport motor 19 is rotated in the reverse direction, the carrier 6 is moved in the direction of the return path and returned to the input unit 20, and when the sensor 9 detects the carrier 6, the transport motor 19 is stopped and the carrier 6 is stopped. .

  Note that the present invention can also be applied to a case where a substrate is directly placed on a conveyor such as a chain conveyor and conveyed without using the carrier 6. In this case, the substrate is conveyed and stopped by stopping the conveyor. Further, instead of detecting the carrier 6, the sensors 9, 12, 13, 14 and 15 detect the substrate itself.

  In the above-described embodiment, a motor is used as a drive source for transporting the carrier 6, but it can be replaced with another drive source such as an air cylinder or a hydraulic cylinder.

  As the sensors 9, 12, 13, 14, and 15, optical sensors and other various sensors can be used.

  Further, it is possible to control the carrier 6 and the substrate transport in terms of time without using the sensors 9, 12, 13, 14 and 15. For example, the time required for the conveyance is obtained from the conveyance speed and the conveyance distance, and the flux application apparatus when the time from the start of the conveyance of the carrier 6 in the input unit 20 until the leading edge of the carrier 6 reaches the flux application unit has elapsed. 4 starts the application of flux, and when the time until the entire carrier 6 passes through the flux application portion has passed, the flux application device 4 stops applying the flux, and the entire carrier 6 enters the preheater portion. The carrier 6 is stopped for the preheating time from this time, and after this stop, the carrier 6 is transported again, and when the time until the entire carrier 6 passes through the soldering portion has passed, it is transported in the direction of the return path for returning the carrier 6. It is also possible to return to the input unit 20.

  In addition, the present invention can be implemented even if the substrate soldered in the solder bath 2 is taken out at the outlet of the solder bath 2 without returning to the input unit 20. However, if the substrate soldered in the solder bath 2 is returned to the input unit 20, the substrate can be input to and removed from the soldering apparatus at one location.

  It should be noted that the work speed from loading to unloading of the substrate can be shortened by setting the transport speed of the carrier 6 in the return path to be higher than the transport speed in the forward path. Also, the speed at which the carrier 6 passes through the flux application part and the speed at which it passes through the soldering part are set to the optimum speed for flux application and the optimum speed for soldering so that the respective speeds are different. The conveyance speed can also be controlled. Also, the carrier 6 is transported at high speed from the start of transport of the carrier 6 until the sensor 13 detects the carrier 6 and from when the sensor 14 detects the carrier 6 to when the sensor 15 detects the carrier 6. But work time can be shortened.

  In addition, the present invention enables the positions of the sensors 9, 12, 13, 14 and 15 to be optimized according to differences in the target substrate, the flux to be applied, the type of solder, and the like. You can also.

  When the air nozzle 16 is not provided, in order to prevent the flammable flux from flowing into the preheater 3, it is necessary to provide a sufficient distance between the flux applying device 4 and the preheater 3. In the embodiment, since the air nozzle 16 is provided to prevent the flux from flowing into the preheater 3 from the flux applying device 4, the distance between the flux applying device 4 and the preheater 3 can be shortened.

  In the above-described embodiment, since the inclination of the transfer rail 5 is the same in the entire board soldering apparatus 1, the connection transfer rail 7 and the flux applying apparatus 34 in the conventional board soldering apparatus are soldered. The protruding portions (see FIGS. 7 and 8) of the transport rails 36 and 35 provided for transferring the substrate to and from the attaching device 31 are not required, the overall length of the transport rail 5 is reduced, and the floor area of the entire device is reduced. Can also be reduced.

  It was possible to reduce the size of the preheater, shorten the transport rail, and reduce the size of the device by incorporating the flux coating device into the soldering device and integrating it. If the example of this miniaturization is shown, the total length of the board soldering apparatus could be 1500 mm, which was reduced to about 1/4 of the conventional one. 7 (b) and 8 (b) are the same as the conventional ones shown in FIGS. 7 (a) and 8 (a) for comparison with examples of the board soldering apparatus of the above-described embodiment. FIG.

  In addition, since the length of the transport rail 5 is reduced, the work time from when the substrate is put into the soldering apparatus to when it is taken out is shortened, and the productivity with one sheet flow can be improved.

  The present invention can be applied to soldering component leads inserted into through holes provided in a substrate.

It is a top view which shows typically the structure of the soldering apparatus of the board | substrate of this invention, and shows the initial state of the operation | work which solders to a board | substrate. It is a front view which shows typically the structure of the soldering apparatus of the board | substrate shown in FIG. FIG. 2 is a front view showing a state where a carrier 6 of the board soldering apparatus shown in FIG. It is a front view which shows the state which the carrier 6 of the board | substrate soldering apparatus shown in FIG. FIG. 2 is a front view showing a state where a carrier 6 of the board soldering apparatus shown in FIG. FIG. 2 is a front view showing a state where a carrier 6 of the board soldering apparatus shown in FIG. (A) is a top view which shows typically the structure of the soldering apparatus of the conventional board | substrate. (B) is a top view of the board | substrate soldering apparatus of this invention shown on the same scale as (a). (A) is a front view which shows typically the structure of the soldering apparatus of the conventional board | substrate. (B) is the front view of the board | substrate soldering apparatus of this invention shown on the same scale as (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board soldering apparatus 2 Solder tank 3 Preheater 4 Flux application apparatus 5 Conveyance rail 6 Carrier 7 Conveyance rail 8 Duct 9 Sensor 12 Sensor 13 Sensor 14 Sensor 15 Sensor 16 Air nozzle 17 Flux application nozzle 18 Jet motor 19 Conveyance motor 20 Input Section 31 Soldering device 32 Solder tank 33 Preheater 34 Flux application device 35 Transport rail 36 Transport rail

Claims (15)

A flux application section for applying flux to the substrate, a preheater section for preheating the substrate on which the flux has been applied, a soldering section for soldering the preheated substrate, and the substrate from the flux application section to the preheater And a conveying device for stopping the preheater portion for a preheating time and then sending it to the soldering portion. A flux application unit for applying flux to a substrate, a preheater unit for preheating the substrate on which the flux has been applied, a soldering unit for soldering the preheated substrate, a carrier for placing the substrate, and the carrier A board soldering apparatus comprising: a conveying device that sends the flux to the preheater section from the flux application section along a rail and then stops the preheater section for a preheating time and then sends the preheater section to the soldering section. A flux application section for applying flux to the substrate, a preheater section for preheating the substrate on which the flux has been applied, a soldering section for soldering the preheated substrate, and the substrate from the flux application section to the preheater A transport device that sends the solder to the soldering section via a section, a sensor that detects that the entire board is sent to the transport apparatus and enters the preheater section, and after the sensor detects the board A board soldering apparatus comprising: a control unit that controls the transport device so as to be driven again after being stopped for a preheating time and to send the board to the soldering unit. A flux application unit for applying flux to a substrate, a preheater unit for preheating the substrate on which the flux has been applied, a soldering unit for soldering the preheated substrate, a carrier for placing the substrate, and the carrier A conveying device that sends the flux application unit along the rail to the soldering unit via the preheater unit, and a sensor that detects that the entire carrier is sent to the conveying device and enters the preheater unit. And a control unit for controlling the transfer device so that the sensor is driven again after being stopped for a preheating time after the detection of the carrier and then the carrier is sent to the soldering unit. Soldering equipment. 4. The board soldering apparatus according to claim 1, wherein the preheater unit has a minimum size capable of preheating the maximum size of the target board. 5. The board solder according to claim 2, wherein the preheater portion has a minimum size capable of preheating the maximum size of the board that can be placed on the carrier. 6. Attachment device. 7. The board soldering apparatus according to claim 2, wherein the rail is inclined by a soldering angle as a whole. A substrate loading unit for loading a substrate, a flux application unit for applying a flux to the substrate, a preheater unit for preheating the substrate coated with the flux, and a soldering unit for soldering the preheated substrate, A transport device that transports the substrate from the substrate loading unit to the soldering unit via the pre-heater unit after passing through the flux application unit and the reverse path, and the entire substrate in the outbound route A sensor for detecting the passage through the soldering portion; and in the forward path, the substrate is sent from the flux application portion to the preheater portion, stopped at a preheating time in the preheater portion, and then sent to the soldering portion, the sensor A control unit that controls the transfer device to return the substrate to the loading unit after the substrate is detected Soldering apparatus substrate which comprises a. A substrate loading unit for loading a substrate, a flux application unit for applying a flux to the substrate, a preheater unit for preheating the substrate coated with the flux, and a soldering unit for soldering the preheated substrate, A transport device that transports the substrate from the substrate loading unit to the soldering unit via the pre-heater unit after passing through the flux application unit and a reverse path thereof; and a tip of the substrate in the outbound route A first sensor that detects that the flux application unit has been reached; a second sensor that detects that the entire substrate has passed through the flux application unit in the forward path; and the entire substrate in the forward path. A third sensor that detects that the pre-heater has entered, and the entire board passes through the soldering portion in the forward path. A fourth sensor for detecting the presence of a was, a fifth sensor for detecting that said substrate in said return path is returned to the closing part,
When the first sensor detects the substrate by transporting the substrate in the forward direction by the transport device, the flux application unit starts applying the flux, and the second sensor passes the substrate. When the detection is detected, the application of the flux by the flux application unit is terminated, and the transfer of the transfer device is stopped for a preheating time from the time when the third sensor detects the substrate. When the fourth sensor detects the passage of the substrate, the substrate is conveyed in the direction of the return path until the substrate is detected by the fifth sensor. A board soldering apparatus, comprising: a control unit that controls the return to the input unit. After the substrate is transported in the flux application unit and the flux is applied to the substrate, the substrate on which the flux has been applied is sent to the preheater unit and stopped for a preheating time and preheated, and then the preheated substrate is in the soldering unit A method of soldering a substrate, comprising transporting and soldering the substrate. After the substrate is placed on a carrier, the carrier is transported in a flux application unit and the flux is applied to the substrate, and then the carrier on which the substrate on which the flux has been applied is placed is sent to a preheater unit and stopped for a preheating time. Then, after the substrate is preheated, the carrier on which the preheated substrate is placed is transported in a soldering section and soldered to the substrate. A flux application section for applying flux to the substrate, a preheater section for preheating the substrate on which the flux has been applied, a soldering section for soldering the preheated substrate, and the substrate from the flux application section to the preheater In a method of soldering a substrate using an apparatus including a transfer device that sends the solder to a soldering section via a section,
After stopping the preheating time after detecting that the whole substrate is sent to the transfer device and entering the preheater unit, the transfer device is driven again to send the substrate to the soldering unit. A method of soldering a substrate, which is characterized. A flux application unit for applying flux to the substrate, a preheater unit for preheating the substrate on which the flux has been applied, a soldering unit for soldering the preheated substrate, a carrier for mounting the substrate, In a method of soldering a substrate using an apparatus including a carrier device that sends a carrier from the flux application part to the soldering part via the preheater part,
After stopping the preheating time after detecting that the entire carrier is sent to the transport device and entering the preheater unit, the carrier device is driven again to send the carrier to the soldering unit. A method of soldering a substrate, which is characterized. A substrate loading unit for loading a substrate, a flux application unit for applying a flux to the substrate, a preheater unit for preheating the substrate coated with the flux, and a soldering unit for soldering the preheated substrate, Soldering of a substrate using an apparatus including a forward device for transporting the substrate from the substrate loading section to the soldering section via the preheater section after passing through the flux application section and a transport apparatus for transporting the reverse path. In the attaching method,
The transport device sends the substrate from the flux application unit to the pre-heater unit in the forward path, stops the pre-heater unit for a preheating time, and then sends the substrate to the soldering unit. A board soldering method, wherein the board is returned to the input section by the return path after passing. A substrate loading unit for loading a substrate, a flux application unit for applying a flux to the substrate, a preheater unit for preheating the substrate coated with the flux, and a soldering unit for soldering the preheated substrate, Soldering of a substrate using an apparatus including a forward device for transporting the substrate from the substrate loading section to the soldering section via the preheater section after passing through the flux application section and a transport apparatus for transporting the reverse path. In the attaching method,
When the front end of the substrate reaches the flux application part in the outward path, the flux application part starts applying the flux, and when the whole substrate passes through the flux application part in the outward path, the flux application part becomes a flux. And the transfer device stops transferring the substrate for a preheating time from the time when the entire substrate enters the pre-heater section in the forward path, and after the stop, the transfer device moves the substrate again to the forward path. When the entire board passes through the soldering part in the forward path, the transport apparatus transports the board in the return path and returns the board to the input part. How to solder a board.

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