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JP2005166775A - Light emitting diode module and its manufacturing method - Google Patents

Light emitting diode module and its manufacturing method Download PDF

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JP2005166775A
JP2005166775A JP2003401030A JP2003401030A JP2005166775A JP 2005166775 A JP2005166775 A JP 2005166775A JP 2003401030 A JP2003401030 A JP 2003401030A JP 2003401030 A JP2003401030 A JP 2003401030A JP 2005166775 A JP2005166775 A JP 2005166775A
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substrate
light emitting
metal heat
emitting diode
diode module
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Takushi Noguchi
卓志 野口
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Osram Melco Ltd
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Osram Melco Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode (hereinafter referred to an LED) module in which a temperature during LED package lighting can be lowered as compared with a conventional LED module with a metal heatsink plate. <P>SOLUTION: The light emitting diode module includes a substrate 3 made of a resin or a resin containing a glass, an LED package 1 provided on the surface of the substrate 3, and the metal heatsink plate 2 provided on the rear surface of the substrate 3 and having a protruding part 2a brought into contact with the surface of the LED package 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、照明等に利用する発光ダイオードを複数個基板上に設けた発光ダイオード（以下、ＬＥＤ）モジュール及びＬＥＤモジュールの製造方法に関するものである。   The present invention relates to a light emitting diode (hereinafter referred to as LED) module in which a plurality of light emitting diodes used for illumination or the like are provided on a substrate, and a method for manufacturing the LED module.

図７は従来のＬＥＤモジュールを示す図である。図において、ＬＥＤモジュールは、紙フェノール製の基板３の表面にＬＥＤパッケージ１を設け、基板３の裏面に金属放熱板２を設けている。   FIG. 7 is a view showing a conventional LED module. In the figure, the LED module is provided with an LED package 1 on the surface of a paper phenol substrate 3 and a metal heat sink 2 on the back surface of the substrate 3.

図７に示すように、単純に基板３の裏面に金属放熱板２を取り付けるだけで、ＬＥＤモジュールの温度は約７℃減少し、光出力も約５％上昇する。
特開２００２−１６２６２６号公報 As shown in FIG. 7, simply attaching the metal heat sink 2 to the back surface of the substrate 3 reduces the temperature of the LED module by about 7 ° C. and increases the light output by about 5%.
JP 2002-162626 A

従来のＬＥＤモジュールは、基板３の裏面に金属放熱板２を取り付けることで、ＬＥＤモジュールの温度が約７℃減少し、光出力も約５％上昇するが、現在のＬＥＤモジュールは絶対光出力が少ないため、更なるＬＥＤモジュールの温度対策が必要である。   In the conventional LED module, by attaching the metal heat sink 2 to the back surface of the substrate 3, the temperature of the LED module decreases by about 7 ° C. and the light output increases by about 5%, but the current LED module has an absolute light output. Due to the small amount, further countermeasures for the temperature of the LED module are necessary.

この発明は上記のような問題点を解決するためになされたもので、従来の金属放熱板付きのＬＥＤモジュールよりも更にＬＥＤパッケージの点灯中の温度が低減できる発光ダイオードモジュール及び発光ダイオードモジュールの製造方法を提供することを目的とする。   The present invention has been made to solve the above-described problems, and can manufacture a light emitting diode module and a light emitting diode module that can further reduce the temperature during lighting of the LED package as compared with a conventional LED module with a metal heat sink. It aims to provide a method.

この発明に係る発光ダイオードモジュールは、樹脂もしくはガラスを含む樹脂製の基板と、基板の表面に設けられたＬＥＤパッケージと、基板の裏面に設けられ、ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、を備えたことを特徴とする。   A light emitting diode module according to the present invention includes a resin substrate containing resin or glass, an LED package provided on the surface of the substrate, and a metal heat sink having a protrusion provided on the back surface of the substrate and in contact with the LED package surface. And.

また、この発明に係る発光ダイオードモジュールは、金属放熱板の突出部の断面形状を、ＬＥＤパッケージ表面と接する部分を根元より広くしたことを特徴とする。   In addition, the light emitting diode module according to the present invention is characterized in that the cross-sectional shape of the protruding portion of the metal heat radiating plate is wider than the base at the portion in contact with the LED package surface.

また、この発明に係る発光ダイオードモジュールは、金属放熱板の突出部の断面形状を、テーパとしたことを特徴とする。   The light emitting diode module according to the present invention is characterized in that the cross-sectional shape of the protruding portion of the metal heat sink is tapered.

また、この発明に係る発光ダイオードモジュールは、金属放熱板の突出部の断面形状を、Ｔ字状としたことを特徴とする。   The light emitting diode module according to the present invention is characterized in that the cross-sectional shape of the protruding portion of the metal heat sink is T-shaped.

この発明に係る発光ダイオードモジュールの製造方法は、樹脂もしくはガラスを含む樹脂製の基板と、基板の表面に設けられたＬＥＤパッケージと、基板の裏面に設けられ、ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、を備えた発光ダイオードモジュールの製造方法において、金属放熱板と突出部とを分割して組み立てることを特徴とする。   A method of manufacturing a light emitting diode module according to the present invention includes a resin substrate including resin or glass, an LED package provided on the surface of the substrate, and a protrusion provided on the back surface of the substrate and in contact with the LED package surface. In a method of manufacturing a light emitting diode module including a metal heat sink, the metal heat sink and the protrusion are divided and assembled.

また、この発明に係る発光ダイオードモジュールの製造方法は、樹脂もしくはガラスを含む樹脂製の基板と、基板の表面に設けられたＬＥＤパッケージと、基板の裏面に設けられ、ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、を備えた発光ダイオードモジュールの製造方法において、基板に金属放熱板を圧入して組み立てることを特徴とする。   In addition, a method for manufacturing a light emitting diode module according to the present invention includes a resin substrate including resin or glass, an LED package provided on the surface of the substrate, and a protrusion provided on the back surface of the substrate and in contact with the LED package surface. And a metal heat radiating plate including the metal heat radiating plate, wherein the metal heat radiating plate is press-fitted into the substrate for assembly.

この発明に係る発光ダイオードモジュールは、基板の裏面にＬＥＤパッケージ表面と接する突出部を有する金属放熱板を備えたことにより、従来の金属放熱板付きのものよりＬＥＤモジュール温度がさらに約４℃、光出力がさらに約５％向上した。   The light emitting diode module according to the present invention is provided with a metal heat sink having a protruding portion in contact with the LED package surface on the back surface of the substrate, so that the LED module temperature is about 4 ° C. higher than that with a conventional metal heat sink. The output was further improved by about 5%.

また、金属放熱板の突出部の断面形状を、ＬＥＤパッケージ表面と接する部分が根元より広くしたことにより、基板と金属放熱板の剥離がなくなった。   In addition, since the cross-sectional shape of the protruding portion of the metal heat radiating plate is wider than the base at the portion in contact with the LED package surface, the substrate and the metal heat radiating plate are not separated.

この発明に係る発光ダイオードモジュールの製造方法は、金属放熱板と突出部とを分割して組み立てるので、生産性が向上する。   Since the manufacturing method of the light emitting diode module according to the present invention is assembled by dividing the metal heat sink and the protruding portion, productivity is improved.

また、この発明に係る発光ダイオードモジュールの製造方法は、基板に金属放熱板を圧入して組み立てるので、部品点数を低減できる。   Moreover, since the manufacturing method of the light emitting diode module which concerns on this invention press-fits a metal heat sink to a board | substrate and assembles, it can reduce a number of parts.

実施の形態１．
図１は実施の形態１を示す図で、ＬＥＤモジュールを示す図である。図において、ＬＥＤモジュールは、紙フェノール製の基板３の表面にＬＥＤパッケージ１が設けられ、ＬＥＤパッケージ１はハンダ付け部分４により基板３に固定されている。基板３の裏面には、先端がＬＥＤパッケージ１の表面に接する突出部２ａを有する金属放熱板２が設けられている。 Embodiment 1 FIG.
FIG. 1 is a diagram showing the first embodiment and is a diagram showing an LED module. In the figure, the LED module is provided with an LED package 1 on the surface of a paper phenol substrate 3, and the LED package 1 is fixed to the substrate 3 by a soldering portion 4. On the back surface of the substrate 3, a metal heat radiating plate 2 having a protruding portion 2 a whose tip is in contact with the surface of the LED package 1 is provided.

ＬＥＤパッケージ１の熱は、金属放熱板２に伝わり放熱されるが、金属放熱板２の突出部２ａがＬＥＤパッケージ１の表面に接しているので、放熱特性が向上する。   The heat of the LED package 1 is transferred to the metal heat radiating plate 2 to be radiated, but since the protruding portion 2a of the metal heat radiating plate 2 is in contact with the surface of the LED package 1, the heat dissipation characteristics are improved.

図２はＬＥＤモジュール温度に対する光出力変化を示す図である。図に示すように、従来の金属放熱板付きのＬＥＤモジュールは、金属放熱板なしのものに対し、ＬＥＤモジュール温度が約７℃低下し、光出力が約５％向上するが、本実施の形態のＬＥＤモジュールは、従来の金属放熱板付きのＬＥＤモジュールよりも、ＬＥＤモジュール温度が約４℃低下し、光出力が約５％向上する。   FIG. 2 is a diagram showing a change in light output with respect to the LED module temperature. As shown in the figure, the conventional LED module with a metal heat sink reduces the LED module temperature by about 7 ° C. and improves the light output by about 5% as compared with the LED module without the metal heat sink. In the LED module, the LED module temperature is lowered by about 4 ° C. and the light output is improved by about 5% as compared with the conventional LED module with a metal heat sink.

基板３は、紙フェノール以外に、ガラスエポキシ、ポリイミド等を用いることができる。   As the substrate 3, glass epoxy, polyimide, or the like can be used in addition to paper phenol.

実施の形態２．
図３は実施の形態２を示す図で、ＬＥＤモジュールを示す図である。図に示すように、金属放熱板２の突出部２ａの断面形状を、ＬＥＤパッケージ１表面と接する部分の寸法Ａが、根元の寸法Ｂより大きいテーパとした。 Embodiment 2. FIG.
FIG. 3 is a diagram showing the second embodiment and is a diagram showing an LED module. As shown in the figure, the cross-sectional shape of the protruding portion 2a of the metal heat radiating plate 2 is a taper in which the dimension A of the portion in contact with the surface of the LED package 1 is larger than the base dimension B.

それにより、紙フェノール製の基板３と金属放熱板２との剥離が少なくなった。   Thereby, peeling with the board | substrate 3 made from paper phenol and the metal heat sink 2 decreased.

実施の形態３．
図４は実施の形態３を示す図で、ＬＥＤモジュールを示す図である。図に示すように、金属放熱板２の突出部２ａの断面形状を、ＬＥＤパッケージ１表面と接する部分の寸法Ａが、根元の寸法Ｂより大きいＴ字状とした。 Embodiment 3 FIG.
FIG. 4 is a diagram showing the third embodiment and is a diagram showing an LED module. As shown in the figure, the cross-sectional shape of the protruding portion 2a of the metal heat radiating plate 2 is a T-shape in which the dimension A of the portion in contact with the surface of the LED package 1 is larger than the base dimension B.

実施の形態２と同様、それにより紙フェノール製の基板３と金属放熱板２との剥離が少なくなった。   As in the second embodiment, the paper phenol substrate 3 and the metal heat radiating plate 2 were less peeled.

実施の形態４．
図５は実施の形態４を示す図で、ＬＥＤモジュールの製造方法を示す図である。図に示すように、金属放熱板２の突出部２ａを分割し、接着等により組み立てる。これにより、金属放熱板２の突出部２ａの断面形状が、ＬＥＤパッケージ１表面と接する部分が、根元より広いものでも容易に組み立てることができる。尚、金属放熱板２と突出部２ａとは接着以外の方法で固定してもよい。 Embodiment 4 FIG.
FIG. 5 is a diagram showing the fourth embodiment, and is a diagram showing a method for manufacturing an LED module. As shown in the figure, the protruding portion 2a of the metal heat radiating plate 2 is divided and assembled by bonding or the like. Thereby, even if the cross-sectional shape of the protrusion part 2a of the metal heat sink 2 is a part where the LED package 1 surface is wider than a base, it can be assembled easily. In addition, you may fix the metal heat sink 2 and the protrusion part 2a by methods other than adhesion | attachment.

実施の形態５．
図６は実施の形態５を示す図で、ＬＥＤモジュールの製造方法を示す図である。図に示すように、突出部２ａが一体の金属放熱板２を、樹脂もしくはガラスを含む樹脂製の基板３の弾性を利用して圧入により組み立ててもよい。これにより、部品点数を低減できる。 Embodiment 5 FIG.
FIG. 6 is a diagram showing the fifth embodiment, and is a diagram showing a method for manufacturing an LED module. As shown in the drawing, the metal heat radiating plate 2 in which the protrusions 2a are integrated may be assembled by press-fitting using the elasticity of a resin substrate 3 containing resin or glass. Thereby, the number of parts can be reduced.

実施の形態１を示す図で、ＬＥＤモジュールを示す図である。It is a figure which shows Embodiment 1 and is a figure which shows an LED module. 実施の形態１を示す図で、ＬＥＤモジュール温度に対する光出力変化を示す図である。It is a figure which shows Embodiment 1, and is a figure which shows the light output change with respect to LED module temperature. 実施の形態２を示す図で、ＬＥＤモジュールを示す図である。It is a figure which shows Embodiment 2, and is a figure which shows an LED module. 実施の形態３を示す図で、ＬＥＤモジュールを示す図である。It is a figure which shows Embodiment 3, and is a figure which shows an LED module. 実施の形態４を示す図で、ＬＥＤモジュールの製造方法を示す図である。It is a figure which shows Embodiment 4, and is a figure which shows the manufacturing method of an LED module. 実施の形態５を示す図で、ＬＥＤモジュールの製造方法を示す図である。It is a figure which shows Embodiment 5, and is a figure which shows the manufacturing method of an LED module. 従来のＬＥＤモジュールを示す図である。It is a figure which shows the conventional LED module.

符号の説明Explanation of symbols

１ ＬＥＤパッケージ、２ 金属放熱板、２ａ 突出部、３ 基板、４ ハンダ付け部分。   1 LED package, 2 metal heat sink, 2a protruding part, 3 substrate, 4 soldered part.

Claims (6)

樹脂もしくはガラスを含む樹脂製の基板と、
前記基板の表面に設けられた発光ダイオード（以下、ＬＥＤ）パッケージと、
前記基板の裏面に設けられ、前記ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、
を備えたことを特徴とする発光ダイオードモジュール。 A resin substrate containing resin or glass;
A light emitting diode (hereinafter referred to as LED) package provided on the surface of the substrate;
A metal heat dissipating plate provided on the back surface of the substrate and having a protrusion contacting the LED package surface;
A light emitting diode module comprising: 前記金属放熱板の突出部の断面形状を、前記ＬＥＤパッケージ表面と接する部分を根元より広くしたことを特徴とする請求項１記載の発光ダイオードモジュール。   2. The light emitting diode module according to claim 1, wherein a cross-sectional shape of the protruding portion of the metal heat radiating plate is made wider at the base than a portion in contact with the surface of the LED package. 前記金属放熱板の突出部の断面形状を、テーパとしたことを特徴とする請求項２記載の発光ダイオードモジュール。   The light emitting diode module according to claim 2, wherein a cross-sectional shape of the protruding portion of the metal heat radiating plate is tapered. 前記金属放熱板の突出部の断面形状を、Ｔ字状としたことを特徴とする請求項２記載の発光ダイオードモジュール。   The light emitting diode module according to claim 2, wherein a cross-sectional shape of the protruding portion of the metal heat radiating plate is a T-shape. 樹脂もしくはガラスを含む樹脂製の基板と、前記基板の表面に設けられたＬＥＤパッケージと、前記基板の裏面に設けられ、前記ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、を備えた発光ダイオードモジュールの製造方法において、
前記金属放熱板と前記突出部とを分割して組み立てることを特徴とする発光ダイオードモジュールの製造方法。 A light emitting device comprising: a resin substrate including resin or glass; an LED package provided on a surface of the substrate; and a metal heat dissipating plate provided on a back surface of the substrate and having a protruding portion in contact with the LED package surface. In the manufacturing method of the diode module,
A method of manufacturing a light emitting diode module, wherein the metal heat radiating plate and the protruding portion are divided and assembled. 樹脂もしくはガラスを含む樹脂製の基板と、前記基板の表面に設けられたＬＥＤパッケージと、前記基板の裏面に設けられ、前記ＬＥＤパッケージ表面と接する突出部を有する金属放熱板と、を備えた発光ダイオードモジュールの製造方法において、
前記基板に前記金属放熱板を圧入して組み立てることを特徴とする発光ダイオードモジュールの製造方法。 A light emitting device comprising: a resin substrate including resin or glass; an LED package provided on a surface of the substrate; and a metal heat dissipating plate provided on a back surface of the substrate and having a protruding portion in contact with the LED package surface. In the manufacturing method of the diode module,
A method of manufacturing a light emitting diode module, wherein the metal heat sink is press-fitted into the substrate for assembly.
JP2003401030A 2003-12-01 2003-12-01 Light emitting diode module and its manufacturing method Pending JP2005166775A (en)

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Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US20100072510A1 (en) * 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with post/base/cap heat spreader
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WO2011045968A1 (en) * 2009-10-15 2011-04-21 浜松ホトニクス株式会社 Led light source device
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US8003416B2 (en) 2008-03-25 2011-08-23 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
US8034645B2 (en) 2008-03-25 2011-10-11 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader
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US8172434B1 (en) 2007-02-23 2012-05-08 DeepSea Power and Light, Inc. Submersible multi-color LED illumination system
US8178395B2 (en) 2008-03-25 2012-05-15 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
US8203167B2 (en) 2008-03-25 2012-06-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
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