JP2005079475A - Multilayer wiring board and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a conductive substance that is improper for filling up holes to be used for interlayer continuity, to relieve a phenomenon caused by difference in the material characteristics between the conductive substance used for interlayer continuity and an insulating layer, and to suppress the occurrence of ion migration at a boundary section in the insulating layer. <P>SOLUTION: In a multilayer wiring board (8), a through hole (4) passing through an interlayer bonding layer (22) and an insulating base (21) is formed in a base (1) for multilayer wiring boards, where a conductive layer (3) for composing a wiring pattern is provided on one side of the insulating base (21) and the interlayer bonding layer (22) is provided on the other side; and the conductive substance (6) for obtaining the interlayer continuity of the conductive layer (3) is arranged in the through hole (4) for lamination. A conductive composition, where the volume is contracted and hardened by heating, is used as the conductive substance (6), and heating and pressurization are performed in multilayer lamination, thus forming a protective insulating layer (5) by a material for composing the interlayer bonding layer (22) between the conductive substance (6) and the side of the through hole (4). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer wiring board and a manufacturing method thereof, and more particularly to a flexible multilayer wiring board and a manufacturing method thereof.

  In recent years, electronic devices have become smaller and lighter in addition to high-frequency signals, digitization, etc. Along with this, printed wiring boards to be mounted are also required to be compact and high-density mounting, and prints that meet these requirements Many multilayer wiring boards have been announced as wiring boards.

  In general, the means for interlayer connection in a multilayer wiring board is roughly divided into two types, a through hole and a via hole.

  The through hole is used to form an interlayer conductive portion by punching the substrate after multilayer lamination in a lump, and filling this hole (substrate through hole) by plating or filling a conductive composition. The number of man-hours can be reduced because the holes are made in a lump after stacking, but the interlayer conduction part must be straight in the depth direction of the substrate, so the degree of freedom of wiring is small and suitable for high-density wiring I can't say that.

On the other hand, a via hole is one in which an interlayer conductive portion is formed for each layer. In particular, an IVH (Interstitial Via Hole) type multilayer wiring board has a higher wiring density and a higher degree of freedom in wiring. Therefore, it is widely used for small electric products such as mobile phones. Typical examples of the construction method include the ALIVH construction method (see Non-Patent Document 1) manufactured by Matsushita Electronic Parts Co., Ltd. and the B ² it construction method (see Non-Patent Document 2) manufactured by DT Circuit Technology.

  Common to these methods is the build-up method. In the case of the build-up method, the build-up layer is sequentially laminated from the core layer one by one, and is built up. Since the alignment between the layers is easy, it is used for most IVH multilayer wiring boards. For these reasons, IVH multilayer wiring boards are often referred to as build-up boards.

  However, in the case of the build-up method, since the layers are sequentially laminated one by one, the circuit forming process is required for the number of layers. This causes problems such as delay in trial delivery and cost increase due to an increase in the number of manufacturing processes.

Therefore, recently, development of an IVH multilayer wiring board by a collective laminating method in which a plurality of substrates on which circuits have been formed is superposed and laminated together is becoming active. As an example thereof, there is a trade name PALAP (see Non-Patent Document 3) by Denso Corporation. In the case of this construction method, not only the manufacturing process can be greatly simplified, but also the defective layer can be replaced and removed in advance and only the good layer can be laminated, which greatly contributes to the yield improvement.
“Electronic Materials” October 1995 issue, p52-58, Seiichi Nakatani et al. “Resin multilayer substrate with all-layer IVH structure“ ALIVH ”” “Journal of Japan Institute of Electronics Packaging” Vol. 3, no. 7 (2000), p563-568, Yoshitaka Fukuoka “Thick film / thin film hybrid high-density build-up wiring board technology” “Proceedings of the 16th Electronics Packaging Conference” p67-68, Rikiya Uemura, etc. “Examination of printed circuit board recycling system using PALAP substrate”

  However, since such a multilayer wiring board is a composite of various materials, it is necessary to ensure reliability by matching the thermal characteristics and mechanical characteristics of each material to some extent. In particular, it is important to match the characteristics of the material of the insulating layer and the material of the interlayer conductive portion, but in reality, it is difficult to completely match them.

  For example, due to the difference in the coefficient of linear expansion between the material of the insulating layer constituting the via hole or the through hole and the interlayer conductive material in the via hole or the through hole, the interlayer conductive portion is cracked during the thermal shock test, or There arises a problem that the electrical resistance is greatly increased.

  In the case of a multilayer wiring board, a structure in which a large number of insulating layers are stacked is adopted. Therefore, the boundary portion of the insulating layer has a problem that the mechanical strength is weaker than that inside the insulating layer other than the boundary, and ion migration easily proceeds from there.

  In addition, in the case where interlayer conduction is obtained by filling the via hole or through hole with the conductive composition, there are many conductive compositions that cannot be used for filling holes because the volume shrinks when cured. Such a conductive composition has a problem that it cannot be used for interlayer conduction.

  An object of the present invention is to eliminate the above-mentioned problems of the conventional ones, and to use a conductive substance that is unsuitable for hole filling applications for interlayer conduction, and to improve the material characteristics of the conductive substance and insulating layer used for interlayer conduction. An object of the present invention is to provide a multilayer wiring board that can alleviate the phenomenon caused by the difference and suppress the occurrence of ion migration at the boundary portion of the insulating layer, and a manufacturing method thereof.

  The present invention solves the above-mentioned problems. In the invention according to claim 1, a through hole is formed together with an interlayer adhesive layer in an insulating layer having a conductive layer forming a wiring pattern on one side, and the through hole is formed in the through hole. In a multilayer wiring board in which a conductive material for obtaining interlayer conduction of the conductive layer is disposed, by using a conductive composition that shrinks and cures a volume by heating as the conductive material, the conductive material and the through-hole are used. It is a multilayer wiring board in which a protective insulating layer made of the material forming the interlayer adhesive layer is formed between the side surfaces of the holes.

  According to this multilayer wiring board, a conductive composition that shrinks and hardens when heated can be used as the conductive substance, and also depends on a material that forms an interlayer adhesive layer between the conductive substance and the insulating layer. Since the protective insulating layer is formed, a phenomenon caused by a difference in material characteristics between the conductive material and the insulating layer can be reduced by the protective insulating layer.

  According to a second aspect of the present invention, there is provided an interlayer adhesive layer on a substrate for a multilayer wiring board in which a conductive layer forming a wiring pattern is provided on one side surface of an insulating substrate and an interlayer adhesive layer is provided on the other side surface. And a multilayer wiring board in which a through-hole penetrating the insulating base material is formed and a conductive material for obtaining interlayer conduction of the conductive layer is disposed in the through-hole and laminated, Protective insulation with a material that forms the interlayer adhesive layer between the conductive substance and the side surface of the through hole by heating and pressurizing at the time of multilayer lamination using a conductive composition that shrinks and hardens by heating. A multilayer wiring board in which layers are formed.

  According to this multilayer wiring board, a conductive composition that shrinks and hardens by heating can be used as the conductive substance, and between the conductive substance and the insulating base material and the interlayer adhesive layer, Since the protective insulating layer is formed using the material forming the interlayer adhesive layer, a phenomenon caused by the difference in material characteristics between the conductive substance and the insulating base material can be alleviated by the protective insulating layer.

  The invention according to claim 3 is the multilayer wiring board according to claim 1 or 2, wherein the protective insulating layer is formed so as to cover a boundary between the insulating layer or the insulating base material and the interlayer adhesive layer. It is.

  According to this multilayer wiring board, the boundary between the insulating layer or the insulating base material and the interlayer adhesive layer is covered with the protective insulating layer so that it does not come into direct contact with the conductive material. Therefore, the occurrence of ion migration can be suppressed.

  A fourth aspect of the present invention is the multilayer wiring according to any one of the first to third aspects, wherein the protective insulating layer is made of a material having a Young's modulus smaller than that of the insulating layer or the insulating base material. It is a board.

  According to this multilayer wiring board, the protective insulating layer made of a material having a lower Young's modulus than the insulating layer or the insulating base material has a difference in coefficient of linear expansion between the conductive substance and the insulating layer or the insulating base material. Can relieve the stress generated by the heat resistance and improve the resistance in the thermal shock test.

  According to this multilayer wiring board, the protective insulating layer made of a material having a lower Young's modulus than the insulating layer or the insulating base material covers the boundary between the insulating layer or the insulating base material and the interlayer adhesive layer. By being formed in this manner, it is possible to achieve both suppression of the occurrence of ion migration and relaxation of stress generated due to the difference in linear expansion coefficient between the conductive substance and the insulating layer or the insulating base material.

  A fifth aspect of the present invention is the multilayer wiring according to any one of the first to fourth aspects, wherein the protective insulating layer is made of a material having a lower dielectric constant than the insulating layer or the insulating substrate. It is a board.

  According to this multilayer wiring board, the protective insulating layer made of a material having a lower dielectric constant than that of the insulating layer or the insulating base material can avoid a delay in transmission speed.

  Further, according to this multilayer wiring board, the protective insulating layer is made of a material having a Young's modulus lower than that of the insulating layer or the insulating base and having a low dielectric constant, so that the conductive substance and the insulating layer or It is possible to achieve both relaxation of stress generated due to the difference in linear expansion coefficient from the insulating base material and avoidance of transmission speed delay.

  Further, according to this multilayer wiring board, the protective insulating layer made of a material having a lower dielectric constant than the insulating layer or the insulating base material covers the boundary between the insulating layer or the insulating base material and the interlayer adhesive layer. By being formed in this way, it is possible to achieve both suppression of the occurrence of ion migration and avoidance of transmission speed delay.

  Furthermore, according to this multilayer wiring board, the protective insulating layer made of a material having a lower Young's modulus and a lower dielectric constant than the insulating layer or the insulating base material is bonded to the insulating layer or the insulating base material with an interlayer adhesion. It is formed so as to cover the boundary with the layer, thereby suppressing the occurrence of ion migration, relieving the stress generated by the difference in the linear expansion coefficient between the conductive material and the insulating layer or insulating substrate, and the transmission speed It is possible to achieve both avoidance of delay.

  A sixth aspect of the present invention is the multilayer wiring board according to any one of the first to fifth aspects, wherein the insulating layer or the insulating base is made of a flexible resin such as polyimide.

  According to this multilayer wiring board, the insulating layer or the insulating substrate made of a flexible resin such as polyimide can be easily bent. In particular, the protective insulating layer is made of a material having a lower Young's modulus than that of the insulating layer or the insulating base material, so that the conductive material is peeled off from the insulating layer or the insulating base material when bent, and the conductive material. Can be prevented from breaking.

  The invention according to claim 7 is the multilayer wiring board according to any one of claims 1 to 6, wherein the conductive substance is a conductive composition comprising nano-sized silver oxide, an organic silver compound, and an organic solvent. It is.

  According to this multilayer wiring board, by heating to a required temperature and pressurizing to a required pressure, a structure in which silver particles are welded is obtained by reduction of silver oxide nanoparticles and decomposition of an organic silver compound. Thus, the volume of the conductive composition shrinks to about half, and a protective insulating layer made of a material forming an interlayer adhesive layer can be formed in a gap of a substantial size generated thereby.

  According to an eighth aspect of the present invention, a through hole is formed in an insulating layer having a conductive layer forming a wiring pattern on one side together with an interlayer adhesive layer, and the conductive material for obtaining an interlayer conduction of the conductive layer in the through hole Multilayer wiring in which a conductive insulating composition that is contracted and hardened by heating is disposed to form a protective insulating layer made of a material that forms the interlayer adhesive layer between the conductive material and the side surface of the through hole A method of manufacturing a board, the step of forming the through hole together with the interlayer adhesive layer in the insulating layer, the step of filling the conductive material in the through hole, and heating and pressurizing a multilayer wiring board A step of shrinking and curing the filled conductive substance, and forming the protective insulating layer by infiltrating the material forming the interlayer adhesive layer between the conductive substance and the side surface of the through hole; Multi-layer wiring board including It is a manufacturing method.

  According to this method for producing a multilayer wiring board, as a conductive material, a conductive composition using a metal filler of 1 μm or more, a conductive paste that can obtain a metal bond by heating using nano metal particles, All kinds of conductive materials can be used.

  In addition, a step of shrinking and curing the filled conductive material, and a step of forming a protective insulating layer by infiltrating the material forming the interlayer adhesive layer between the conductive material and the side surface of the through hole are one step. Can be done.

  The invention according to claim 9 is directed to a multilayer wiring board substrate in which a conductive layer forming a wiring pattern is provided on one side surface of an insulating substrate, and an interlayer adhesive layer is provided on the other side surface. And a through-hole penetrating the insulating substrate is formed, and in the through-hole, a conductive composition that shrinks and cures volume by heating is disposed as a conductive substance for obtaining interlayer conduction of the conductive layer, and a multilayer A method of manufacturing a multilayer wiring board in which a protective insulating layer is formed by a material forming the interlayer adhesive layer between the conductive substance and a side surface of the through-hole by being heated and pressurized at the time of lamination, The step of forming the through hole in the interlayer adhesive layer and the insulating substrate, the step of filling the conductive material in the through hole, and heating and pressurizing at the time of multilayer lamination, the filled conductive material While shrinking and curing the volume, A step of forming the protective insulating layer material comprised between the adhesive layer is penetrating between the side surface of the conductive material and the through hole, a method for manufacturing a multilayer wiring board comprising a.

  According to this method for producing a multilayer wiring board, as a conductive material, a conductive composition using a metal filler of 1 μm or more, a conductive paste that can obtain a metal bond by heating using nano metal particles, All kinds of conductive materials can be used.

  In addition, a step of shrinking and curing the filled conductive material, and a step of forming a protective insulating layer by infiltrating the material forming the interlayer adhesive layer between the conductive material and the side surface of the through hole are one step. Can be done. In addition, by realizing this process by the heat and pressure process at the time of multilayer lamination, the conductive material volume shrinkage and curing process and the protective insulating layer infiltration and formation process are performed separately from the heat and pressure process at the time of multilayer lamination. Can be omitted.

  As described above, according to the present invention, a through hole is formed together with an interlayer adhesive layer in an insulating layer having a conductive layer forming a wiring pattern on one side, and a conductive substance for obtaining interlayer conduction of the conductive layer in the through hole In the multilayer wiring board in which is disposed, the interlayer adhesive layer is formed between the conductive material and the side surface of the through hole by using, as the conductive material, a conductive composition that shrinks and hardens when heated. Since a protective insulating layer is formed of a material, it is possible to use a conductive substance that is not suitable for hole filling applications for interlayer conduction, and alleviate the phenomenon caused by the difference in material properties between the conductive substance used for interlayer conduction and the insulating layer. In addition, there is an effect that the occurrence of ion migration at the boundary portion of the insulating layer can be suppressed.

Embodiments of the present invention will be described with reference to the drawings.
1 and 2 are explanatory views showing an embodiment of a multilayer wiring board according to the present invention. The multilayer wiring board 1 will be described together with a manufacturing method thereof.

  First, as shown to Fig.1 (a), the polyimide base material 11 with the single-sided copper foil in which the copper foil 31 was adhere | attached on the single side | surface of the polyimide base material (insulating layer) 21 is prepared as a starting material.

  Next, by etching the copper foil 31 using a subtractive method on the polyimide substrate 11 with a single-sided copper foil, the conductive layer 3 forming the wiring pattern is formed on one side as shown in FIG. The circuit-formed wiring board 12 provided is prepared.

  Instead of this method, for example, it is also possible to use a polyimide base material having no copper foil on both sides as a starting material, and to form a circuit using this additive base material using an additive method or a semi-additive method.

  Next, as shown in FIG. 1C, an interlayer adhesive layer 22 is formed on the surface opposite to the conductive layer 3 forming the wiring pattern of the polyimide base material 21 in the circuit-formed wiring board 12, thereby forming a multilayer. A wiring board substrate 1 is prepared.

  As the interlayer adhesive layer 22, a thermoplastic polyimide provided with a thermosetting function can be used. In addition to this, for example, a thermosetting resin typified by epoxy or the like, or a thermoplastic resin such as thermoplastic polyimide may be used as the interlayer adhesive layer.

  However, the interlayer adhesive layer 22 is preferably made of a material having a lower Young's modulus than the polyimide base material 21 and is preferably made of a material having a lower dielectric constant than the polyimide base material 21.

  Next, as shown in FIG. 1 (d), a through-hole 4 penetrating the interlayer adhesive layer 22 and the polyimide substrate 21 is formed at a position corresponding to the conductive layer 3 of the multilayer wiring board substrate 1. The through hole 4 is a via hole, and can be formed by performing desmearing by performing soft etching by plasma irradiation after drilling with a UV-YAG laser.

  Instead of the UV-YAG laser, for example, a carbon dioxide laser, an excimer laser, or the like can be used to process at higher speed. Further, as a desmear method, wet desmear using a permanganate is very common and can be used.

  From FIG. 1D, the via hole 4 is formed by the polyimide base material 21 and the interlayer adhesive layer 22, and a boundary 23 between different materials (the polyimide base material 21 and the interlayer adhesive layer 22) is present in the via hole 4. You can see that it exists.

  Next, as shown in FIG. 1 (e), a conductive substance 6 is filled into the via hole 4 of the multilayer wiring board substrate 1. As the conductive material 6, a conductive composition that shrinks and hardens when heated can be used.

  For example, as the conductive material 6, a conductive composition made of nano-sized silver oxide, an organic silver compound, or an organic solvent can be used. In the case of such a conductive composition, by heating and pressing at a required temperature and a required pressure, a structure in which silver particles are welded is obtained by reduction of silver oxide nanoparticles and decomposition of an organic silver compound. The volume of the composition shrinks to about half.

  In addition, as the conductive material 6, all kinds of conductive materials such as a conductive composition using a metal filler of 1 μm or more and a conductive paste capable of obtaining a metal bond by heating using nano metal particles are used. Is possible.

  Next, as shown in FIG. 2F, a plurality of multilayer wiring board substrates 1 (two in the figure) and the circuit-formed wiring board 12 are aligned to the lowermost layer. In other words, the conductive materials 6a and 6b of the two multilayer wiring board substrates 1a and 1b provide interlayer conduction between the conductive layers 3a and 3b, and the conductive layer 3 of the circuit-formed wiring board 12 and the conductive layers 3 and 3b. Align so that interlayer conduction is established.

  For this alignment, it is possible to adopt a pin alignment method. However, in this case, a space for opening a pin hole is required, which is not preferable. For this reason, it is preferable to employ alignment by image recognition.

Next, as shown in FIG. 2 (g), these multilayer wiring board substrates 1a and 1b and the circuit-formed wiring board 12 are superposed, and the degree of vacuum is 1 kPa or less, the temperature is 200 ° C., using a vacuum heat press. The multilayer wiring board 8 is produced by heating and pressurizing and joining under the condition of a pressure of 40 kgf / cm ² .

  Conductive substance 6 composed of a conductive composition comprising nano-sized silver oxide, organic silver compound, and organic solvent causes reduction of silver oxide nanoparticles and decomposition of organic silver compound by heating and pressurization at this time. A structure in which silver particles are welded together is obtained, and the volume of the conductive composition shrinks to half or less and is cured.

  At the same time, the gap between the conductive material 6 and the side surface of the through-hole 4 by the volume shrinkage / curing of the conductive material 6 is formed into a substantial gap between the layers by heating and pressing at this time. The protective insulating layer 5 is formed by intrusion of the material forming the adhesive layer 22.

  As shown in FIG. 2G, the multilayer wiring board 8 thus completed has a protective insulating layer 5 formed between the conductive material 6 and the polyimide base material 21. The phenomenon caused by the difference in material characteristics from the polyimide base material 21 can be alleviated by the protective insulating layer 5.

  In addition, the multilayer wiring board 8 has a boundary 23 between the polyimide base material 21 and the interlayer adhesive layer 22 that is covered with the protective insulating layer 5 so that it does not come into direct contact with the conductive material 6. Since the barrier is made from the substance 6, the occurrence of ion migration can be suppressed.

  Further, in this multilayer wiring board 8, the protective insulating layer 5 made of a material having a lower Young's modulus than the polyimide base material 21 is generated due to the difference in linear expansion coefficient between the conductive material 6 and the polyimide base material 21. The stress can be relaxed and the resistance in the thermal shock test can be improved.

  Further, in this multilayer wiring board 8, the protective insulating layer 5 made of a material having a lower dielectric constant than that of the polyimide base material 21 can avoid a delay in transmission speed.

  When the multilayer wiring board 8 thus manufactured was subjected to a migration test under the conditions of 85 ° C., 85 RH%, and 30 V, the insulation resistance was maintained at 1 GΩ or more after 1000 hours or more when the via pitch was 500 μm. did.

  On the other hand, when a similar migration test was performed for comparison on a multilayer wiring board produced using a conventional multilayer wiring board base material in which a protective insulating layer was not formed on the side surface of the via hole, the via pitch was 500 μm. In some cases, the insulation resistance decreased to 1 GΩ or less in about 500 hours.

  Also, a multilayer wiring board 8 in which a protective insulating layer 5 made of a material having a Young's modulus smaller than that of the polyimide substrate 21 is formed on the side surface of the via hole 4, and a conventional multilayer wiring board in which such a protective insulating layer is not formed When the stress generated on the side surface of the via hole was compared by the finite element method, superiority was recognized in the multilayer wiring board 8 on which the protective insulating layer 5 was formed.

  In the above embodiment, a via hole is exemplified as the through hole 4, but the present invention is not limited to this, and can be applied to a through hole, for example.

It is explanatory drawing which shows one Embodiment of the multilayer wiring board by this invention. It is explanatory drawing which shows one Embodiment of the multilayer wiring board by this invention.

Explanation of symbols

1 Substrate for multilayer wiring board 3 Conductive layer 4 Through hole (via hole)
5 Protective Insulating Layer 6 Conductive Substance 8 Multilayer Wiring Board 21 Polyimide Base Material 22 Interlayer Adhesive Layer

Claims (9)

In a multilayer wiring board in which a through hole is formed together with an interlayer adhesive layer in an insulating layer provided with a conductive layer forming a wiring pattern on one side, and a conductive material for obtaining interlayer conduction of the conductive layer is disposed in the through hole ,
Forming a protective insulating layer made of a material forming the interlayer adhesive layer between the conductive material and the side surface of the through hole by using a conductive composition that shrinks and hardens when heated as the conductive material. A multilayer wiring board characterized by Passing through the interlayer adhesive layer and the insulating substrate through a multilayer wiring board substrate with a conductive layer forming a wiring pattern on one side of the insulating substrate and an interlayer adhesive layer on the other side In the multilayer wiring board that is formed by forming a through hole and laminating a conductive material for obtaining interlayer conduction of the conductive layer in the through hole,
By using a conductive composition that shrinks and cures by heating as the conductive substance, the interlayer adhesive layer is formed between the conductive substance and the side surface of the through hole by being heated and pressurized during multilayer lamination. A multilayer wiring board, wherein a protective insulating layer is formed of a material formed.   The multilayer wiring board according to claim 1, wherein the protective insulating layer is formed so as to cover a boundary between the insulating layer or the insulating base material and the interlayer adhesive layer.   The multilayer wiring board according to claim 1, wherein the protective insulating layer is made of a material having a Young's modulus smaller than that of the insulating layer or the insulating base material.   5. The multilayer wiring board according to claim 1, wherein the protective insulating layer is made of a material having a dielectric constant lower than that of the insulating layer or the insulating base material.   The multilayer wiring board according to claim 1, wherein the insulating layer or the insulating base is made of a flexible resin such as polyimide.   The multilayer wiring board according to claim 1, wherein the conductive material is a conductive composition comprising nano-sized silver oxide, an organic silver compound, and an organic solvent. A through hole is formed in an insulating layer having a conductive layer forming a wiring pattern on one side together with an interlayer adhesive layer, and the volume shrinks and cures by heating as a conductive material for obtaining interlayer conduction of the conductive layer in the through hole. A method for producing a multilayer wiring board in which a protective insulating layer is formed of a material forming the interlayer adhesive layer between the conductive substance and a side surface of the through-hole by disposing a conductive composition,
Forming the through hole in the insulating layer together with the interlayer adhesive layer;
Filling the through hole with the conductive material;
By heating and pressurizing the multilayer wiring board, the filled conductive substance is contracted and cured in volume, and the material forming the interlayer adhesive layer is infiltrated between the conductive substance and the side surface of the through hole. Forming a protective insulating layer;
A method for producing a multilayer wiring board, comprising: Passing through the interlayer adhesive layer and the insulating substrate through a multilayer wiring board substrate with a conductive layer forming a wiring pattern on one side of the insulating substrate and an interlayer adhesive layer on the other side A through hole is formed, and a conductive composition that shrinks and hardens by heating as a conductive material for obtaining interlayer conduction of the conductive layer is disposed in the through hole, and is heated and pressurized during multilayer lamination. A method for manufacturing a multilayer wiring board in which a protective insulating layer is formed by a material forming the interlayer adhesive layer between the conductive substance and the side surface of the through hole,
Forming the through hole in the interlayer adhesive layer and the insulating substrate;
Filling the through hole with the conductive material;
By heating and pressurizing at the time of multilayer lamination, the filled conductive material is contracted and cured in volume, and the material forming the interlayer adhesive layer is infiltrated between the conductive material and the side surface of the through hole to protect the material. Forming an insulating layer;
A method for producing a multilayer wiring board, comprising:

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