JP2002223002A - Package molded object and light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package molded object for a light emitting device in which imperfect soldering in the case of packaging can be reduced, and a light emitting device. SOLUTION: This package molded object is provided with a recessed part 14 for accommodating a light emitting element chip, and a positive and a negative lead electrodes 21, 22. The electrodes are molded in an unified body by using resin, in such a manner that the electrodes are exposed on a bottom surface of the recessed part, bent in an end portion of a bonding surface, and exposed along the bonding surface. In the package molded body, a first protruding part 11 formed on the bonding surface, along the end surface of the positive electrode 21 exposed on the bonding surface, and a second protruding part 12 formed on the bonding surface, along the end surface of the negative electrode 22 exposed on the bonding surface are disposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded package for a light emitting device and a light emitting device using the molded package.

[0002]

2. Description of the Related Art In recent years, surface mount type light emitting devices have been increasingly used in place of lead type light emitting devices for the purpose of miniaturization and thinning. In this surface mount type light emitting device, a light emitting element chip is provided inside a package molded body, and the package is formed by integrally molding positive and negative lead electrodes to which positive and negative electrodes of the light emitting element chip are respectively connected. . In this package, the positive and negative lead electrodes are bent inward at both ends of the bonding surface of the package along the bonding surface,
It is configured to be soldered at the part bent inside. In the light emitting device of the surface mounting type configured as described above, the bent positive and negative lead electrodes are joined to the electrode pattern on the substrate by flow soldering. Are temporarily fixed by a thermosetting resin applied by a dispenser between the lead electrodes of the first and second electrodes, and then flow soldered.

[0003]

However, since the application amount of the thermosetting resin by the dispenser is relatively large and fluctuates, in the conventional surface mount type light emitting device, heat is applied to the soldering surface of the positive or negative lead electrode. There is a problem that the soldering failure occurs due to the curable resin flowing out.

In view of the above, the present invention can prevent the outflow of the thermosetting resin even when the thermosetting resin for temporary fixing is applied by a dispenser at the time of mounting, and can reduce the soldering failure. An object of the present invention is to provide a package molded product and a light emitting device for a device.

[0005]

In order to achieve the above object, a package molded article for a light emitting device according to the present invention comprises:
A concave portion for accommodating the light emitting element chip and positive and negative lead electrodes, wherein the positive lead electrode and the negative lead electrode are respectively exposed at the bottom surface of the concave portion and bent at one end of the joint surface to form a joint surface; In a package molded body in which the positive lead electrode and the negative lead electrode are integrally formed of resin so as to be respectively exposed along, the bonding along the end surface of the positive electrode exposed on the bonding surface A first convex portion provided on the surface; and a second convex portion provided on the joining surface along an end surface of the negative electrode exposed on the joining surface.

Further, a light emitting device according to the present invention includes the package molded product according to the present invention, and a light emitting element chip provided in the concave portion of the package molded product, wherein the light emitting element chip is transparent in the concave portion. It is molded with optical resin.

[0007] The package molded product and the light emitting device for a light emitting device according to the present invention having the above-described structure have the first convex portion and the second convex portion on the joint surface. Accordingly, when the thermosetting resin for temporary fixing is applied, the outflow of the thermosetting resin can be prevented, so that the soldering failure at the time of mounting can be reduced.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light emitting device according to an embodiment of the present invention will be described. The light emitting device according to the embodiment of the present invention is configured as follows. In the light emitting device of the present embodiment, the package molded body 1 is, for example, as shown in FIG.
As shown in FIG. 1A, a positive lead electrode 21 and a negative lead electrode 22 are integrally formed with the molding resin 10 to produce the same. More specifically, a concave portion 14 for accommodating the light emitting element chip 30 is formed on the upper surface of the package molded body 1, and a positive lead electrode 21 and a negative lead electrode 22 are separated from each other on the bottom surface of the concave portion 14. And one main surface of each is exposed. In this specification, the upper surface of the package molded body 1 refers to a surface on which the light emitting element chip is mounted, and the lower surface refers to a surface facing the mounting substrate.

Further, one end of the positive lead electrode 21 and one end of the negative lead electrode 22 are provided so as to face each other at the bottom of the concave portion 14, and one end of the positive lead electrode 21 and one end of the negative lead electrode 22 are provided. Is filled with a molding resin, and the bottom surface of the concave portion 14 is formed. Further, in the package molded body 1, the other end of the positive lead electrode 21 and the other end of the negative lead electrode 22 are provided so as to protrude from the end face of the package molded body 1, and the protruding portion is shown in FIG.
As shown in (b), the package molding 1 is bent inside the bonding surface, which is the lower surface, to form positive and negative connection terminal portions.

Here, in the light emitting device of the present embodiment, in particular, the first convex portion 11 is integrated with the molding resin 10 along the other end of the bent positive lead electrode 21 on the bonding surface of the package molding 1. The second protrusion 12 is formed along the other end of the bent negative electrode lead 22 by the molding resin 1.
The light emitting device of the present embodiment is characterized by being formed integrally with the substrate, thereby reducing soldering defects when the light emitting device of the embodiment is mounted on a substrate. Further, in the light emitting device of the present embodiment, it is preferable that first convex portion 11 and second convex portion 12 have the same shape as each other and have a rectangular or trapezoidal cross-sectional shape. Further, the outer surfaces of the positive and negative electrode leads facing the mounting substrate and the outer surfaces of the mounting substrates of the first convex portion 11 and the second convex portion 12 are substantially flush with each other so that each comes into contact with the mounting substrate. Preferably, it is configured to be located above. The light emitting element chip is provided in the concave portion 14 of the package molded body 1 configured as described above, and the light transmitting device is filled in the concave portion 14 so as to cover the light emitting element chip. Is done.

Next, a method for manufacturing the light emitting device of the present embodiment will be described. (Step 1) In the present manufacturing method, first, in Step 1, for example, a long metal plate made of copper containing iron having a thickness of 0.15 mm is punched using a press to form a plurality of positive and negative lead electrodes of each package molded body. To form a part. Here, in the present embodiment, the punching direction of the press (the direction in which the punch is moved relative to the die) is made to coincide with the direction in which the molding resin flows in the injection molding described later.

The positive lead electrode 21 is formed at a portion corresponding to each package formed body of the long metal plate after pressing.
The negative lead electrode 22 is separated from the negative lead electrode 22 such that one end surface of the concave portion 14 after molding is opposed to one end surface of the negative lead electrode 22. Also, the positive lead electrode 21
In order to increase the bonding strength with the molding resin, an opening is formed around a center line perpendicular to one end surface of the positive lead electrode 21, and the negative lead electrode 22 is formed with the molding resin. In order to increase the coupling strength, an opening centered on a center line perpendicular to one end face of the negative lead electrode 22 is formed. The opening is provided so as to straddle the inside and outside of the end of the package molded body, and the positive and negative lead electrodes 21 and
22 and the molding resin, and the positive lead electrode 2 protruding from the end face of the package molding 1.
1 and the negative lead electrode 22 have a terminal structure of J-bend (Ben) so that a large force is not applied to the package resin.
d) It can be bent into a structure. Further, two cuts or openings are formed in the positive lead electrode 21 at positions symmetrical with respect to a center line perpendicular to one end face thereof, and the negative lead electrode 22 is formed with a center line perpendicular to one end face thereof. Two notches or openings are formed at symmetrical positions with respect to. The cuts or openings formed in the left and right symmetrical positions in the positive electrode lead and the negative electrode lead have such depths or positions that the tip or opening of the cut is located on the bottom surface of the recess 14 after injection molding. Is formed. Here, in the present embodiment, the center line perpendicular to one end face of the positive lead electrode 21 and the negative lead electrode 22
Are aligned with each other, and the center line is aligned with the longitudinal axis of the concave portion 14 (in this specification, one of the two axes orthogonal to the concave portion 14 that coincides with the above-mentioned central axis is referred to for convenience) , And the other axis is referred to as a horizontal axis).

(Step 2) In step 2, the long metal plate punched out in step 1 is subjected to Ag plating, then set in a molding die, and is adapted to each package molded product by injection molding. The molding resin part 10 is formed in each part.

In the present embodiment, a molding die for molding the molded resin portion 10 includes (1) a peak-shaped first convex portion 11 and a second convex portion 11 on the joining surfaces on both sides of the gate in the molded resin portion 10. (2) The molded resin portion 10 is formed so that the convex portion 12 is formed.
In (3) the bottom surface of the concave portion 14 is formed such that the concave portion 14 for housing the light emitting element chip is formed symmetrically with respect to the longitudinal axis of the package molded body on the surface opposite to the bonding surface.
(4) The bottom surface of the recess 14 so that the positive lead electrode 21 and the negative lead electrode 22 separated from each other are exposed and the molding resin is filled between the positive lead electrode 21 and the negative lead electrode 22. Are formed symmetrically with respect to the longitudinal axis of the recess 14 in the positive lead electrode 21, and the negative lead electrode 2
2, two resin exposed portions 22 a are formed symmetrically with respect to the longitudinal axis of the concave portion 14.

Further, in the present embodiment, the gate of the molding die is provided between the first convex portion 11 and the second convex portion 12 on the joint surface so that the resin is injected from the joint surface side of the package molded body 1. In the molding die, the long metal plate that has been pressed is provided such that the punching direction of the press matches the direction of injecting the resin into the molding die. As described above, in the present embodiment, the end faces 21ef and 22ef of the positive and negative lead electrodes 21 and 22 are matched by making the punching direction of the press coincide with the direction of injecting the resin when the package molded body 1 is manufactured. Can be filled without gaps, so that the injected molding resin can be prevented from flowing out onto one of the main surfaces 21f1 and 22f1.

That is, in press stamping,
The die which is the receiving mold is connected to the positive and negative lead electrodes 21 and
Since the long metal plate 201 is set so as to be in contact with one of the surfaces 21f1 and 22f1, and the punch is moved from the other surfaces 21f2 and 22f2 of the positive and negative lead electrodes 21 and 22, the punching is performed. And negative lead electrode 2
End portions 21e and 22 at which the other main surfaces 21f2 and 22f2 intersect with one end surfaces 21ef and 22ef, respectively.
The internal angle θ of e becomes an obtuse angle (FIG. 4A). This allows
Since the flow of the molding resin injected from the direction shown by the arrow in FIG. 4A is not hindered at the end portions 21e and 22e, the molding resin is directly in contact with the surface of the molding die formed corresponding to the bottom surface 14f. And one end face 2 of negative lead electrodes 21 and 22
The cavity formed by 1ef and 22ef can be filled without gaps. In the press punching process, the punch is connected to the positive and negative lead electrodes 21 as described above.
22 are punched while being moved from the other surface 21f2, 22f2 side, so that the positive and negative lead electrodes 21, 22 are respectively connected to one main surface 21f1, 22f1 and one end surface 21f2.
Burrs 21h and 22h are formed at the ends where the ef and ef intersect (FIG. 4A). Thus, one main surface 2
Burr 21 rising so that the inner angle of the end where 1f1, 22f1 intersects with one end face 21ef, 22ef becomes an acute angle.
h, 22h are formed, the outflow of the injected molding resin onto the one main surface 21f1, 22f1 is prevented by the burr 21.
h and 22h, it is possible to prevent defective die bonding and poor wire bonding of the light emitting element. Further, in the present invention, one end faces 21ef, 22e
It is preferable that the resin injected into the cavity formed by f has an upper surface of the injected resin positioned substantially on the same plane as one of the main surfaces 21f1 and 22f1. In this way, when the light-transmitting resin 41 is formed, the burrs 21h and 22h can be cut into the light-transmitting resin 41. Can be strengthened.

On the other hand, when the punching direction of the press and the resin injection direction are reversed, the molding resin injected from the direction indicated by the arrow in FIG.
At the ends where 1h and 22h are formed, the flow of resin is hindered, and cavities 21g and 22h are located near burrs 21h and 22h.
g is formed, and there arises a problem that the positive and negative electrode leads and the molding resin are easily peeled off. Further, the ends 21e, 2
Since the angle θ of 2e becomes an obtuse angle, the molding resin injected from the direction shown by the arrow in FIG. 4B easily flows out from the ends 21e and 22e on the bottom surfaces of the concave portions onto the surfaces 21f2 and 22f2. As shown in FIG.
On the bottom surface, there is a problem that the molding resin flows out onto the surface 21f1 of the positive electrode lead 21 and the surface 22f1 of the negative electrode lead 22, which causes a bonding failure.

(Step 3) In step 3, FIG.
(A) As shown in (b), the light emitting element chip 30 is provided on the negative lead electrode 22 exposed on the bottom surface of the concave portion 14,
The n electrode 33 and the negative lead electrode 22 are connected by wire bonding, and the p electrode 34 and the positive lead electrode 21 are connected.
And are connected by wire bonding. Here, the light emitting element chip 30 is, for example, a gallium nitride-based compound semiconductor element capable of emitting blue light, and is formed of, for example, a nitride including an n-type layer, an active layer, and a p-type layer on a sapphire substrate 31. A semiconductor layer 32 is formed, an n-electrode 33 is formed on an n-type layer that is exposed by removing a part of the active layer and the p-type layer, and a p-electrode 34 is formed on the p-type layer. .

(Step 4) In step 4, the concave portion 14
Then, a translucent resin 41 is filled so as to cover the light emitting element chip 30. In the present embodiment, the molding resin is exposed to the bottom surface 14f of the recess 14 of the package molded body 1 through the tip or opening of the cut formed in the positive lead electrode 21 on the bottom surface 14f of the recess 14. Since the molding resin is exposed to the bottom surface 14f of the concave portion 14 through the leading end portion or opening of the cut formed in the lead electrode 22, the exposed molding resin and the translucent resin are firmly joined, The bonding between the optical resin 41 and the molded package 1 can be strengthened. In particular, in the present embodiment, two resin exposed portions 21a are formed on the positive lead electrode 21 located on the bottom surface 14f of the recess 14 symmetrically with respect to the longitudinal axis of the package. The two exposed resin portions 22 are symmetrically arranged on the negative lead electrode 22 with respect to the longitudinal axis of the package.
Since a is formed, the bonding between the translucent resin 41 and the package molded body 1 can be further strengthened as compared with the case where the symmetrical arrangement is not taken. Further, in the present embodiment, two resin exposed portions 21a are formed symmetrically with respect to the longitudinal axis of concave portion 14, and two resin exposed portions 22a are formed symmetrically with respect to the longitudinal axis of concave portion 14. Therefore, a symmetrical directional characteristic can be obtained.

(Step 5) In step 5, each element is separated. (Step 6) In Step 6, as shown in FIG. 1B, the positive lead electrode 21 and the negative lead electrode 22 protruding from the end face of the package molded body 1 are connected as shown in FIG. It is bent inside the joint surface of the package molded body 1 to form a J-Bend type positive / negative connection terminal portion. The structure of the connection terminal portion of the present invention is not limited to the J-bend type, but may be another structure such as a gull wing type. Through the steps described above, the light emitting device of this embodiment is manufactured.

The light emitting device of the embodiment manufactured as described above is surface-mounted on a mounting board 60 as shown in FIG. First, in the light emitting device of the present embodiment, the first convex portion 11 and the second
A thermosetting resin 52 for temporary fixing is applied between the protrusions 12 by a dispenser, and the positive lead electrode 21 and the positive electrode pattern 61 are opposed to each other on the mounting substrate 60, and the negative lead electrode 22 and the negative lead electrode 22 are opposed to each other. So that the electrode pattern 62 of
The light emitting device of this embodiment mode is mounted. Next, preliminary heating is performed by a rod-shaped heater or a panel heater, and the thermosetting resin 52 is cured and temporarily fixed (preliminary heating step). Then, soldering is performed by immersing the mounting substrate 60 in a solder bath that is heated and melted, with the surface on which the light emitting device is temporarily fixed facing down. After soldering, cool.

In the light emitting device of the embodiment configured as described above, since the first convex portion 11 and the second convex portion 12 are provided on the joint surface of the package molded body 1, the resin 52 for temporary fixing is used. When applied by a dispenser and temporarily fixed to a mounting board, it is possible to prevent the resin 52 from adhering to a soldered portion, and to prevent poor soldering during mounting.

[0023]

As described in detail above, the package molded product for a light emitting device according to the present invention is a package molded product having a recess for accommodating a light emitting element chip and positive and negative lead electrodes. A first protrusion provided on the bonding surface along an end surface of the positive electrode exposed on the surface; and a second protrusion provided on the bonding surface along an end surface of the negative electrode exposed on the bonding surface. Since it has a convex portion, a thermosetting resin for temporary fixing can be applied by a dispenser between the first convex portion and the second convex portion during mounting, and the thermosetting resin Outflow can be prevented. Thereby, the outflow of the thermosetting resin onto the positive and negative lead electrodes can be prevented, so that defective soldering can be reduced.
Further, the molded package for a light emitting device according to the present invention,
Since it has the first convex portion and the second convex portion, it is formed at the time of molding with a molding die in which a cavity number is engraved in a concave portion between the first convex portion and the second convex portion. Numbers can be assigned together. When the cavity number is integrally formed at the time of molding in this manner, irregularities are formed between the first convex portion and the second convex portion, and when the first convex portion and the second convex portion are not formed, Although the light emitting device may be inclined at the time of mounting, the present invention can eliminate such inconvenience because the first convex portion and the second convex portion are formed.

Further, since the light emitting device according to the present invention includes the molded package for the light emitting device according to the present invention,
At the time of mounting, when a thermosetting resin for temporary fixing is applied by a dispenser, the outflow of the thermosetting resin can be prevented, and defective soldering can be reduced.

[Brief description of the drawings]

FIG. 1A is a perspective view of a light emitting device according to an embodiment of the present invention as viewed obliquely from above, and FIG. 1B is a perspective view of the light emitting device according to the embodiment of the present invention as viewed obliquely from below. FIG.

FIG. 2A is a plan view of the light emitting device according to the embodiment after a light emitting element chip is provided in a concave portion 14 of a package molded body, and the concave portion 14 is filled with a translucent resin;
FIG. 3A is a cross-sectional view taken along line BB ′ of FIG.

FIG. 3 is a cross-sectional view when the light emitting device of the present embodiment is mounted on a substrate.

FIG. 4 is a cross-sectional view showing a part of a cross section taken along line AA ′ of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Package molding, 10 ... Molding resin, 11 ... 1st convex part, 12 ... 2nd convex part, 14 ... recessed part, 14f ... Bottom surface, 21 ... Positive lead electrode, 22 ... Negative lead electrode, 30 ... Light emission Element chip, 41: translucent resin, 52: resin for temporary fixing, 60: mounting board

Claims (2)

[Claims] 1. A semiconductor device comprising: a recess accommodating a light emitting element chip; and positive and negative lead electrodes, wherein the positive lead electrode and the negative lead electrode are respectively exposed at a bottom surface of the recess and at one end of a bonding surface. An end face of the positive electrode exposed on the joint surface in a package molded body in which the positive lead electrode and the negative lead electrode are integrally formed of resin so as to be bent and exposed along the joint surface. And a second convex portion provided on the bonding surface along an end surface of the negative electrode exposed on the bonding surface. Molded package for light emitting device. 2. The package molded product according to claim 1,
A light emitting element chip provided in the concave portion of the package molded body, wherein the light emitting element chip is molded with a translucent resin in the concave portion.