JP2002288619A - Manufacturing method for ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an IC card which requires no milling process for a jointing of an IC module and an antenna coil, and is capable of diverting conventional device for the jointing. SOLUTION: In the manufacturing method for the IC card provided with an antenna coil 2 for carrying out data communication using non-contact communication, by at least an external instrument and an electro-magnetic induction and an IC module 1 including an IC for generating a signal, in response to an input from the outside; a molding of the card is carried out by injecting a hot melt adhesive 5 melted to the inside of a metal mold in which an outer layer resin sheet 7; and self-contained electronic components are disposed after the IC module 1 and the antenna coil 2 are jointed to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC including at least an antenna coil for performing data communication with an external device by non-contact communication by electromagnetic induction, and an IC for generating a signal in response to an external input. The present invention relates to a method for manufacturing an IC card including a module.

[0002]

2. Description of the Related Art In recent years, instead of magnetic cards such as telephone cards, cash cards, and commuter passes which have been conventionally used, IC chips (integrated circuits) have been provided in order to increase the amount of information handled and to prevent forgery. An IC card with a built-in IC module has been introduced and is rapidly spreading.

[0003] As an information transmission form of an IC card,
There are a contact type, a non-contact type and a combination type thereof (combination type IC card). Of these, the composite IC card is a memory,
I that generates signals in response to CPU and external inputs
C is a card provided with an IC module comprising C, a contact terminal as an electrical contact mechanism for contacting and responding to an external device, and an antenna coil for responding to the external device by communication in a non-contact manner; The contents of the memory can be written and changed by an external device connected to the electrical contact mechanism, and when responding by communication without contact with the external device, the specific information in the memory is modulated and output from the antenna coil. It is composed of

FIG. 2 shows an example of this composite IC card. The composite IC card 20 has an outer resin coating 3 (card body) formed of a resin having a thickness of about 0.7 mm.
And an IC module 1 including a contact terminal 1a, an IC chip (semiconductor chip) 1b electrically connected to the contact terminal 1a, and the like, as shown in a part A in FIG.
It is composed of an information transmitting antenna coil 2 and the like electrically connected to the C chip 1b.

FIG. 3 is an explanatory view showing an example of a conventional manufacturing method. In the figure, reference numeral 1 denotes an IC module having contact terminals for external contact, 2 denotes an antenna coil, 3 denotes an outer resin coating,
Denotes a bump electrode connecting the IC module 1 and the antenna coil 2, 5 denotes a conductive adhesive, and 6 denotes a milling drill.

In the conventional manufacturing method shown in FIG. 3, first, a card in which only the antenna coil 2 is incorporated in the outer resin coating 3 is molded by a conventional molding method such as a laminating method or an injection molding method. (FIG. 3A). Next, the cavity 11 for bonding the IC module 1 is formed by the milling drill 6 and the antenna coil 2 is formed.
Is exposed to the outside (FIG. 3B).
Next, the IC module 1 (FIG. 3C) is inserted into the formed cavity 11 (FIG. 3D). This allows
At the same time that the IC module 1 is fixed by the conductive adhesive 5, the bump electrodes 4 of the IC module 1 and the lead portions 2a of the antenna coil 2 are electrically connected.

[0007]

However, in the conventional manufacturing method shown in FIG. 3, the lead portion 2a of the antenna coil 2 needs to be exposed by the milling drill 6, so that the lead position accuracy and the milling drill 6 Processing accuracy is strictly required.

Further, since the bonding between the bump electrode 4 of the IC module 1 and the lead portion 2a of the antenna coil 2 is performed by a face-down method using a conductive adhesive 5 or the like, it is generally used in comparison with metal bonding such as welding. In this case, the bonding strength is weak, and there is a high possibility that a connection failure may occur due to bending or the like when using the card.

In addition, in molding the cavity 11 and inserting the IC module 1 into the cavity, the lead portion of the antenna coil 2 is exposed and the IC module is Since a special process such as joining the antenna 1 and the antenna coil 2 is added, it is difficult to convert a conventional contact IC card manufacturing apparatus, and it is necessary to introduce a dedicated machine.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide a method of manufacturing an IC card which does not require a milling step for bonding an IC module and an antenna coil, and which can be diverted to a conventional device for the bonding. Is to do.

[0011]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

(1) The method of manufacturing an IC card according to the present invention comprises:
An IC including at least an antenna coil for performing data communication by non-contact communication with an external device by electromagnetic induction, and an IC for generating a signal in response to an external input
A method of manufacturing an IC card having a module and
The card is formed by injecting a molten hot-melt adhesive into a mold in which an outer layer sheet material and built-in electronic components are arranged after bonding an IC module and an antenna coil. (Claim 1).

Here, the concept of the built-in electronic components is as follows.
An IC module and an antenna coil are included.

The present invention includes the following three embodiments. First, an outer layer sheet material is arranged inside a mold, an IC module and an antenna coil are further arranged inside the mold, and the IC module and the antenna coil are electrically joined to each other and then melted inside the mold. This is a method for manufacturing an IC card in which a hot melt adhesive is injected to form a card.

Second, an outer layer sheet material is arranged inside a mold, and a joined body of an IC module and an antenna coil which have been electrically joined to each other outside the mold is brought into the mold and arranged. Thereafter, a molten hot melt adhesive is injected into a mold to form an IC card.

Thirdly, after a bonded body of the IC module and the antenna coil, which are electrically connected to each other in advance outside the mold, is mounted on an outer layer sheet material in advance, and then brought into the mold and arranged. And a method of manufacturing an IC card in which a molten hot melt adhesive is injected into a mold to form a card.

Typical types of IC cards to which the present invention can be applied include contact terminals for performing data communication by contacting electrodes with an external device, and contact terminals for performing data communication by non-contact communication with an external device by electromagnetic induction. A composite IC comprising an antenna coil and an IC module including an IC for generating a signal in response to an external input, wherein the contact terminal and the antenna coil are connected to a common IC and can share data. Card. However, the present invention is not limited to this, and does not have a contact terminal for performing data communication by contact between an external device and an electrode, that is, for performing data communication by non-contact communication by electromagnetic induction with an external device. The present invention can also be applied to a non-contact type IC card or the like including an antenna coil and an IC module including an IC that generates a signal in response to an external input.

In the present invention, as a card molding method, IC
After joining the module and the antenna coil, in order to use the method of injecting the molten hot melt adhesive into the mold in which the outer layer sheet material and the built-in electronic components are arranged, the cavity is formed by milling drill after card molding. No molding is required, and the positional accuracy of the lead portion of the antenna coil is not required. In addition, since the bonding between the IC module and the antenna coil is performed before molding the card, the bonding can be performed in a face-up manner. High metal bonding can be performed. Also, since there is no milling step and the conventional device can be diverted for joining, there is no need to prepare a special dedicated machine.

A more specific embodiment of the present invention includes at least an antenna coil for performing data communication with an external device by non-contact communication by electromagnetic induction, and an IC for generating a signal in response to an external input. In the method of manufacturing an IC card provided with an IC module, the outer layer sheet material is arranged inside the mold, and the IC module and the antenna coil are electrically connected inside or outside the mold. Then, the molten hot melt adhesive is injected into the mold to form a card (claim 2). This includes the first and second forms of the above three forms.

In the present invention, it is convenient for the manufacture to arrange the joined body of the IC module and the antenna coil inside the mold in a face-up manner with the bump electrodes of the IC module facing upward (claim 3). ). In the case of this embodiment, a hole for accommodating the IC module is provided in the outer layer sheet material, and the IC module of the joined body of the IC module and the antenna coil is accommodated in this hole in a face-up manner, whereby a thin IC card is manufactured. (Claim 4).

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows an embodiment of the present invention. Here, a contact terminal for performing data communication by contacting an electrode with an external device, an antenna coil for performing data communication by non-contact communication with the external device by electromagnetic induction, and a signal in response to an external input are provided. An example is the production of a composite IC card that includes an IC module including an IC to be generated and has a contact terminal and an antenna coil connected to a common IC and can share data.

In the method of manufacturing a composite IC card according to this embodiment, first, an IC module-sized hole (storage hole for IC module) 8 is punched in one of a pair of outer layer resin sheets 7 which is a pair of outer layer sheets. (FIG. 1)
(A)).

Next, the outer resin sheet material 7 having the hole 8 formed therein is arranged inside one of the upper and lower molds 9 (lower mold) made of an aluminum material which is easy to process and has excellent heat conduction. The IC module 1 and the antenna coil 2 joined to each other are arranged in a face-up manner, that is, with the bump electrodes 4 of the IC module 1 facing upward (FIG. 1B).

Here, the bonding between the IC module 1 and the antenna coil 2 is performed by connecting the IC module 1 to the antenna coil 2.
Is placed inside the mold, and I
After the C module 1 is housed and arranged in the hole 8 of the outer resin sheet material 7, the process is performed on the outer resin sheet material 7.

However, at some other place inside the mold, the IC
The module 1 and the antenna coil 2 are joined, and the IC module 1 may be arranged in the hole 8 of the outer resin sheet material 7 already arranged inside the mold by a face-up method, or may be arranged outside the mold. IC module 1 in other places
After joining the antenna module 2 and the antenna coil 2, the IC module 1 is brought into the mold 9 in which the outer resin sheet material 7 is already disposed, and the IC module 1 is inserted into the hole 8 of the outer resin sheet material 7.
May be arranged in a face-up manner.

Next, the outer resin sheet material 7 is disposed on the other (upper die) surface of the mold 9 and is superimposed on the outer resin sheet material 7 of the lower die (FIG. 1C). 1) Between the two sheet materials 7, the molten hot melt adhesive 10 is injected and filled by a general-purpose hot melt applicator (FIG. 1 (d)).

After the hot melt adhesive 10 is cured by cooling, the formed card is taken out,
The IC card is completed (FIG. 1 (e)).

In the above embodiment, the outer layer resin sheet member 7 is provided with the hole 8 for accommodating the IC module, and the IC module 1 is accommodated in the hole 8 in a face-up manner. If there is no, in the mold 9, the I
An IC card can be formed by disposing the C module 1 and injecting the melted hot melt adhesive 10. In this embodiment, the IC modules 1 joined to each other
And the antenna coil 2 can be arranged in either face-up or face-down form.

[0030]

As described above, according to the present invention, the following excellent effects can be obtained.

According to the present invention, as a card molding method,
After joining the IC module and the antenna coil, the cavity is formed by milling drill after card molding to use the method of injecting the molten hot melt adhesive into the mold where the outer layer sheet material and the built-in electronic components are arranged. Is not required, and the positional accuracy of the lead portion of the antenna coil is not required.

Also, since the IC module and the antenna coil are joined before molding the card, the joining can be performed in a face-up manner.
The bonding strength such as soldering is high, and highly reliable metal bonding can be performed.

Further, since there is no milling step and the conventional apparatus can be diverted for joining, there is no need to prepare a special dedicated machine.

Further, in the case where a hole for accommodating an IC module is provided in the outer layer sheet material and the IC module is accommodated in the hole, a thin IC card can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an example of a method for manufacturing an IC card of the present invention.

FIG. 2 is a diagram illustrating a configuration example of a composite IC card.

FIG. 3 is an explanatory view illustrating a method for manufacturing a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC module 2 Antenna coil 4 Bump electrode 7 Outer resin sheet material (outer sheet material) 8 Hole 9 Die 10 Hot melt adhesive

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B29K 105: 18 B29L 31:00 B29L 7:00 G06K 19/00 K 31:00 HF term (Reference 2C005 MA15 NA09 NB13 PA18 RA07 TA22 4F206 AA49 AD08 AD35 AG01 AG03 AH37 JA07 JB12 JB17 JB20 JF05 5B035 BA03 BA05 BB09 CA01 CA23 5F061 AA04 BA07 CA21 FA03

Claims (4)

[Claims] An IC comprising at least an antenna coil for performing data communication with an external device by non-contact communication by electromagnetic induction, and an IC module including an IC for generating a signal in response to an external input. In the method for manufacturing a card, the molding of the card is performed by injecting a molten hot melt adhesive into a mold in which an outer layer sheet material and a built-in electronic component are arranged after bonding an IC module and an antenna coil. A method of manufacturing an IC card. 2. An IC comprising at least an antenna coil for performing data communication with non-contact communication by electromagnetic induction with an external device, and an IC module including an IC for generating a signal in response to an external input. In a method for manufacturing a card, an outer sheet material is arranged inside a mold, and
An IC card characterized in that a C module and an antenna coil are electrically connected and arranged inside or outside a mold, and a molten hot melt adhesive is injected into the inside of the mold to form a card. Manufacturing method. 3. The method for manufacturing an IC card according to claim 1, wherein the joined body of the IC module and the antenna coil is arranged inside the mold in a face-up manner with the bump electrodes of the IC module facing upward. A method of manufacturing an IC card. 4. The method for manufacturing an IC card according to claim 3, wherein a hole for accommodating an IC module is provided in the outer layer sheet material, and the IC module of the joined body of the IC module and the antenna coil is face-up in the hole. A method for manufacturing an IC card, wherein the IC card is stored in a form.