JP4311075B2 - IC card and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card having a built-in IC chip and an external electrode for contact communication on its surface, and a method for manufacturing the same, and more particularly, a connection reliability between a circuit board having the external electrode on its surface and a card body. In particular, the present invention relates to an IC card and a method for manufacturing the same, which are intended to improve performance and connection workability.
[0002]
[Prior art]
Conventionally, in the fields of home appliances, computer / mobile products, etc., higher functionality and higher density have been promoted in the light, thin and small trend. There is a growing demand for aging. In conventional credit cards, cash cards, etc., recording by embossing and magnetic stripes has been the mainstream as data to be described. However, in recent years, attention has been paid to high functions and multi-functions such as multi-function payments such as credits using IC cards and electronic money.
[0003]
There is a need for higher capacity and higher density of IC chips to cope with higher functionality and multi-functionality of IC cards, but not only reading and writing a lot of information on the card, but also applications that make use of it There is a movement of writing, and the current situation is that IC chips are required to have higher capacity and higher density.
[0004]
In terms of high functionality, multiple interfaces are also required. Up to now, there is a track record of cards having functions of embossing, magnetic stripe, and contact IC, but recently, there is a trend of embossing, magnetic stripe, and non-contact IC.
[0005]
On the other hand, two types of cards are known, a hybrid card and a dual interface card, which have both a contact type and a non-contact type in the IC card communication method. The hybrid card is a card having an IC chip for each contact / non-contact. The dual interface card is also called a combination card, and can satisfy both contact / contactless functions with a single IC chip, and is advantageous over a hybrid card in terms of cost.
[0006]
FIG. 12 shows one manufacturing process of the conventional dual interface card D.
First, as shown in FIG. 12A, an IC chip (semiconductor chip) 2 is mounted on the center of the back surface of the tab substrate 1 having external electrodes formed on the front surface, and the joint 3 and the IC chip 2 are sealed with a sealing resin 5. Seal with.
[0007]
On the other hand, as shown in FIG. 12B, after a pair of exterior sheets 9a and 9b are laminated on both sides of an antenna substrate 8 for non-contact communication via adhesive sheets 4a and 4b, a card body 10 manufactured by a hot press is used. prepare. The antenna substrate 8 is configured, for example, by forming wiring patterns 12 such as antenna wiring on both surfaces of a heat-resistant film such as polyimide. As shown in FIG. 12C, a recess 11 for accommodating the IC module 7 is provided in a predetermined portion of the surface of the card body 10.
[0008]
Then, as shown in FIG. 12D, the tab substrate 1 is electrically connected to the wiring pattern 12 exposed at the step portion of the recess 11 via the conductive paste 6, and at the same time, an adhesive made of a thermosetting resin or the like. 13 is used to bond the peripheral edge of the tab substrate 1 to the stepped portion of the recess 11 to be integrated with the card body 10.
[0009]
Thereby, the conventional dual interface card D is manufactured. FIG. 13 shows the surface form of the tab substrate 1. A plurality of external electrodes 15 are formed on the surface of the substantially rectangular tab substrate 1 by patterning a copper foil into a predetermined shape, and these external electrodes 15 are incorporated so as to be exposed on the surface of the card body 1. When the dual interface card D is used by the contact communication method, the terminal of an external device (card reader / writer) is in contact with the external electrode 15 to exchange data.
[0010]
In this example, the case where the connection between the tab substrate 1 and the IC chip 2 is performed by flip chip connection has been described. However, for example, the following Patent Document 1 discloses a structure in which these connections are performed by bonding wires. .
[0011]
[Patent Document 1]
JP 2001-109865 A
[Patent Document 2]
JP 2001-154252 A
[0012]
[Problems to be solved by the invention]
By the way, in the bonding between the tab substrate 1 and the antenna substrate 8, after stabilizing the contact, the portion is fixed with the adhesive 13, but the stabilized state of the contact is maintained until the adhesive 13 is cured. It is necessary to hold, and the length of this holding time (curing time of the adhesive 13) impairs workability and card productivity.
For this reason, adhesives with a short curing time will be developed and selected, but there are restrictions due to the adherend (such as the card being deformed when the curing temperature of the adhesive is high), and the types of adhesives are also limited. As a result, it was difficult to select an adhesive that satisfies both quality and cost.
[0013]
On the other hand, photocuring adhesives such as UV-curing adhesives are tab substrates due to various properties after curing (weather resistance, chemical resistance, moisture resistance, high / low temperature resistance, hardness, peel / tensile strength, etc.) Has been found to be suitable as a bonding adhesive between the card and the card body.
[0014]
However, as shown in FIG. 14, when the tab substrate 1 is pressed and held on the card body 10 using the pressure holding head 14, almost the entire area of the surface of the tab substrate 1 is made of a copper foil that does not transmit light. In addition, the card body is thick and the card body is too thick to irradiate light from the back side. Therefore, it is impossible to irradiate the adhesive 13 in the recess 11 with ultraviolet rays. Therefore, in the conventional structure, an ultraviolet curable adhesive cannot be used as a bonding adhesive between the tab substrate 1 and the card body 10.
[0015]
The present invention has been made in view of the above-described problems, and provides an IC card that can improve workability and productivity while maintaining connection reliability between a tab substrate and a card body, and a manufacturing method thereof. Is an issue.
[0016]
[Means for Solving the Problems]
In solving the above problems, the IC card of the present invention includes a card body, a circuit board fixed on the surface of the recess formed in the card body with an adhesive material and having an external electrode for contact communication on the surface, An IC card comprising an IC chip electrically connected to the external electrode, wherein the adhesive material is a photo-curing adhesive, and the circuit board transmits light in the front and back direction. It has the part.
[0017]
In the IC card of the present invention, since the circuit board having the external electrode for contact communication on the surface has a light transmitting portion that transmits light in the front and back direction, the bonding for bonding between the circuit board and the card body A photo-curing adhesive can be selected as the material, and the adhesive can be cured by the irradiation light introduced through the light transmitting part.
[0018]
Therefore, according to the present invention, it is possible to greatly reduce the bonding time while ensuring the bonding reliability between the circuit board and the card body, and to improve the productivity. Further, since the heat curing step is not required, deformation due to heating of the card body can be avoided.
[0019]
The circuit board is composed of a double-sided circuit board in which a plurality of external electrodes for contact communication are formed on the front surface and various terminals are formed on the back surface for electrically connecting the external electrodes to the IC chip. It is common. Therefore, it is preferable that the translucent part is constituted by a metal foil punching pattern provided on the front and back surfaces of the circuit board.
Moreover, you may comprise a translucent part by forming metal foil itself with translucent materials, such as a material for transparent electrodes.
[0020]
As the photocurable adhesive, an ultraviolet curable adhesive is generally used, but in addition to this, a visible light polymerization type adhesive that cures with visible light, a xenon lamp, a laser beam, or the like is also applicable.
[0021]
In addition, the IC card manufacturing method of the present invention includes a step of forming a light-transmitting portion that transmits light in the front and back direction on a circuit board, and a circuit board through a photocurable adhesive in a recess on the card body. A housing step, and a step of irradiating the photocurable adhesive with light through the translucent portion to cure.
[0022]
In the IC card manufacturing method of the present invention, by using the circuit board provided with the translucent portion, it is possible to perform bonding between the circuit board and the card body using a photocurable adhesive. As a result, the pressurization holding time (curing time of the adhesive) of the joint portion can be greatly shortened compared to the conventional case, and the productivity can be improved.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0024]
(First embodiment)
1 to 5 show a first embodiment of the present invention.
Here, FIG. 1 is a process sectional view showing the manufacturing process of the IC card C1 of the present embodiment, FIG. 2 is a plan view showing the surface form of the tab substrate 35 constituting the IC card C1, and FIG. FIG. 4 is a cross-sectional view illustrating a bonding process between the tab substrate 35 and the card body 34, and FIG. 5 is a side cross-sectional view of the tab substrate 35.
[0025]
As shown in FIG. 1D, the IC card C1 according to the present embodiment is configured as a dual interface card (combination card) having both a contact communication function and a non-contact communication function.
[0026]
The IC card C1 is electrically connected to the IC chip 41 via the antenna substrate 31 embedded in one surface of the card body 34 and the card body 34 containing the antenna substrate 31 and the IC chip 41 on which antenna wiring is formed. The tab substrate 35 is provided. The surface of the tab substrate 35 is flush with the surface of the card body 34.
[0027]
The card body 34 is formed by laminating exterior sheet materials 33a and 33b on which patterns and characters are printed on the front and back surfaces of the antenna substrate 31 via adhesive sheets 32a and 32b, and then integrating them with a heating press. Composed.
As the adhesive sheets 32a and 32b, for example, a thermoplastic sheet material such as hot melt or polyethylene terephthalate glycol (PETG) is used. Moreover, as a constituent material of the exterior sheet materials 33a and 33b, for example, a mixed sheet of PETG and polycarbonate (PC) is used.
[0028]
The antenna substrate 31 has a mechanical strength higher than that of the adhesive sheets 32a and 32b and the exterior sheet materials 33a and 33b and has heat resistance on both surfaces of a film 38 made of, for example, polyimide (PI). It is configured by forming wiring patterns 37a and 37b made of copper or aluminum formed by the subtractive method. The wiring patterns 37a and 37b are connected to each other through vias or through holes.
The antenna wiring is formed in a spiral shape in the plane of the film 38, but the formation surface may be any. In addition to the IC chip 41, necessary passive components such as a capacitor and a resistor are mounted on the antenna substrate 31.
[0029]
In the present embodiment, the IC chip 41 is electrically connected to the wiring pattern 37b on the antenna substrate 31 by flip chip mounting, but a wire bonding method may be used. The IC chip 41 on the antenna substrate 31 is sealed together with the metal plate 42b by a sealing resin 43b. The metal plate 42b is for increasing the mechanical strength of the IC chip 41 mounting portion, and is formed of, for example, a circular stainless steel piece.
Further, as shown in the drawing, a metal plate 42a is further attached from the opposite side of the antenna substrate 31 via a sealing resin 43a to enhance the protection of the IC chip 41.
[0030]
The tab board 35 corresponds to the “circuit board” of the present invention, and is embedded in the surface of the card body 34 on the side of the exterior sheet material 33a. The recess 39 for accommodating the tab substrate 35 has substantially the same planar shape as the tab substrate 35, and the bottom of the recess 39 corresponds to the upper surface of the antenna substrate 31. That is, the wiring pattern 37 a on the antenna substrate 31 is exposed at the bottom of the recess 39.
[0031]
A plurality of bumps (projection electrodes) 36 are formed on the back side of the tab substrate 35 and are electrically connected to the wiring pattern 37a. In the present embodiment, the bumps 36 are made of a stud type made of gold (Au), but of course, the invention is not limited to this, and other known forms of bumps such as ball bumps and electroless / electroplated bumps are used. It may be adopted.
[0032]
The tab substrate 35 is bonded to the recess 39 of the card body 34 via an adhesive 40. In the present embodiment, an ultraviolet curable adhesive is used as the adhesive 40.
[0033]
On the surface of the tab substrate 35, a plurality of external electrodes 45 are formed as shown in FIG. The external electrode 45 is electrically connected to the bump 36 (FIG. 1) on the back surface side through the through hole 46. These external electrodes 45 function as external terminals for contact-type communication of the IC card C1, and read information recorded on the IC chip 41 and / or contact with a contact terminal of a card reader / writer (not shown). Alternatively, information is written to the IC chip 41.
[0034]
The tab substrate 35 is composed of, for example, a rigid double-sided circuit substrate, and metal foils 48a and 48b are provided on both sides of the insulating substrate 47 as shown in FIG. Of these, the external electrode 45 is formed by patterning the metal foil 48a on the front surface side into a predetermined shape, and the through holes 46 and the bumps 36 are connected by patterning the metal foil 48b on the back surface side into a predetermined shape. Wiring or the like to be formed is formed.
[0035]
In addition, a plurality of through holes 49a are formed on the surface of the tab substrate 35 as shown in the figure. The through holes 49a are formed by a punched pattern of the metal foil 48a. Corresponding to the positions where these through holes 49a are formed, a plurality of through holes 49b are also formed in the back side of the metal foil 48b in the pattern of the metal foil 48b. The insulating substrate 47 is made of a light-transmitting material such as transparent or translucent so that light (ultraviolet rays) can be transmitted in the front and back direction of the tab substrate 35 together with the through holes 49a and 49b. "Optical part".
[0036]
The insulating substrate 47 can be formed of a glass epoxy substrate having a thickness of about 0.1 mm to 0.2 mm, for example. In addition, the insulating substrate 47 can be made of an insulating material having optical transparency such as glass.
[0037]
The metal foils 48a and 48b can be formed of a single layer or a multilayer structure of metal thin films. In the present embodiment, the metal foils 48a and 48b are formed in a multilayer structure in which nickel plating and gold plating are performed on a copper foil.
[0038]
The size, formation range, formation density, and the like of the through holes 49a and 49b can be arbitrarily selected, and are formed so that a sufficient amount of ultraviolet rays can be irradiated to the adhesive 40 in the recess 39. That's fine. In addition, it is preferable to form the through-hole 49a so as not to impair the sliding property of the contact terminal of the card reader / writer.
In the present embodiment, through-holes 49a and 49b are constituted by a blanking pattern formed along the peripheral edge between the external electrodes 45 and a rectangular fine hole formed inside and outside the formation region of the external electrode 45. .
[0039]
Next, a method for manufacturing the IC card C1 of the present embodiment configured as described above will be described.
FIG. 3 is a process flow for explaining the manufacturing process of the IC card C1.
[0040]
First, as shown in FIG. 1A, the front and back surfaces of the antenna substrate 31 on which the IC chip 41 is mounted are sandwiched between the card bases of the adhesive sheets 32a and 32b and the exterior sheet materials 33a and 33b, thereby producing the card body 34. (Step S1).
The manufacturing process of the card body 34 is performed by heating and pressing the antenna substrate 31, the adhesive sheets 32a and 32b, and the exterior sheet materials 33a and 33b.
[0041]
Next, the recess 39 is formed by digging the tab board mounting portion of the manufactured card body 34 into a predetermined shape (step S2).
In the step of forming the recess 39, it is processed to a depth reaching the wiring pattern 37a of the antenna substrate 31 by a router, a milling cutter or the like. The recess 39 may be formed by chemical etching.
[0042]
Subsequently, after the manufactured card body 34 is transported and positioned to a bonding machine (not shown) (step S3), the ultraviolet curable adhesive 40 is applied to the bottom of the recess 39 (step S4).
[0043]
The step of applying the adhesive 40 includes not only the case where the liquid adhesive 40 is applied and formed using a dispenser, but also the case where, for example, a small piece of sheet-like adhesive resin is disposed and formed at the bottom of the recess 39.
[0044]
On the other hand, in parallel with the manufacture of the card body 34, the tab substrate 35 is manufactured (step S5). In this step, the metal foils 48a and 48b on the front and back surfaces of the tab substrate 35 are patterned into a predetermined shape, thereby forming the external electrode 45, the through hole 46, the through holes 49a and 49b, various wirings, and the like.
Thus, since the through holes 49a and 49b are formed by the pattern of the metal foils 48a and 48b, the “translucent portion” of the present invention can be formed simultaneously with the patterning process of the tab substrate 35.
[0045]
Bumps 36 are formed at predetermined locations on the back surface of the manufactured tab substrate 35 (step S6). As a method for forming the bump 36, for example, a bonding tool for manufacturing a semiconductor device can be used.
[0046]
Next, the surface of the manufactured tab substrate 35 is held using a suction tool such as a square collet, positioned in the recess 39 of the card body 34, and the tab substrate 35 is embedded in the recess 39 (step S7).
[0047]
The tab substrate 35 accommodated in the recess 39 is pressurized by the pressure holding head 50 as shown in FIG. 4, and pushes the adhesive 40 away to electrically connect the bump 36 and the antenna substrate 31 (wiring pattern 37a). Continuity is achieved (step S8).
[0048]
At this time, if ultrasonic vibration is applied to the tab substrate 35 (step S9), the tip of the bump 36 can be activated by the vibration friction action, and the contact with the wiring pattern 37a can be stabilized. it can.
Also, the bump 36 is bonded to the wiring pattern 37a by mechanically removing the adhesive 40 covering the wiring pattern 37a, the resin residue when forming the recess 39, and the oxide film on the wiring pattern 37a by mechanical vibration action. Therefore, the reliability of electrical connection is ensured.
[0049]
Next, a process of irradiating the adhesive 40 with ultraviolet rays and curing the adhesive 40 is performed (step S10).
In this step, as shown in FIG. 4, the adhesive 40 is irradiated with ultraviolet rays through the light transmitting portion of the tab substrate 35.
[0050]
In the present embodiment, an optical fiber or an ultraviolet irradiation lamp is inserted into the hollow pressure holding head 50, and a transparent tempered glass plate 51 for pressing the tab substrate 35 is attached to the tip of the pressure holding head 50. ing. Then, the card body 34 is placed on the receiving jig 52 and bonded via the through holes 49a and 49b of the tab substrate 35 while applying a pressing action by the glass plate 51 to the entire surface of the tab substrate 35. The adhesive 40 is cured by irradiating the agent 40 with ultraviolet rays.
[0051]
After the adhesive 40 is cured, the card body 34 to which the tab substrate 35 is fixed is taken out from the bonding machine, and the IC card C1 of the present embodiment is manufactured (step S11).
[0052]
As described above, according to the present embodiment, since the tab substrate 35 is provided with the light transmitting portion that transmits ultraviolet rays, the ultraviolet curable adhesive 40 encapsulated between the tab substrate 35 and the card body 34 is provided. Can be properly cured. In addition, since almost the entire area of the back surface of the tab substrate 35 is an adhesive region with the card body 34, the bonding strength between the card body 34 and the tab substrate 35 can be improved.
[0053]
Thereby, while ensuring the bonding reliability between the tab substrate 35 and the antenna substrate 31, it is possible to significantly shorten the curing time of the adhesive 40 as compared with the conventional case. This can improve the productivity of the IC card C1. Moreover, since a high temperature is not required for the curing process of the adhesive, the card can be prevented from being deformed. Moreover, since expensive equipment is not required for the process, capital investment can be reduced and cost can be reduced.
[0054]
Further, according to the present embodiment, by using the tab substrate 35 provided with the translucent part, it becomes possible to use the photo-curing adhesive, so that the selection range of the adhesive 40 is expanded, and more It can contribute to quality improvement by selecting the optimum adhesive.
[0055]
(Second Embodiment)
6 to 10 show a second embodiment of the present invention.
Here, FIG. 6 is a process cross-sectional view showing the manufacturing process of the IC card C2 of the present embodiment, FIG. 7 is a plan view showing the surface form of the tab substrate 35 constituting the IC card C2, and FIG. 8]-[8] line direction sectional view, FIG. 9 is a sectional view showing a modified example of the configuration of FIG. 8, and FIG. 10 is a sectional view for explaining a joining process between the tab substrate 35 and the card body 64.
In the figure, portions corresponding to those of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.
[0056]
As shown in FIG. 6D, the IC card C2 of this embodiment is a dual interface card (combination card) having both a contact communication function and a non-contact communication function, as in the first embodiment. It is configured.
[0057]
The IC card C2 includes a card main body 64 containing the antenna substrate 31 on which antenna wiring is formed, a tab substrate 35 embedded in one surface of the card main body 64 and electrically connected to the antenna substrate 31, a tab substrate 35, An IC chip 41 that is electrically connected to each of the antenna substrates 31 is provided.
[0058]
Similarly to the first embodiment described above, the card body 64 has exterior sheet materials 33a and 33b on which patterns and characters are printed on the front and back surfaces of the antenna substrate 31 via the adhesive sheets 32a and 32b. After laminating, they are integrated by a heating press.
[0059]
In the present embodiment, the IC chip 41 is mounted at a substantially central portion on the back surface of the tab substrate 35 and is sealed with a sealing resin 68 together with the joint portion 67. Around the back surface of the tab substrate 35, a plurality of bumps 69 are formed as metallic protruding electrodes.
[0060]
As a mounting form of the IC chip 41 on the tab substrate 35, a flip chip mounting method through a joint portion (bump or the like) 67 as shown in FIG. 8 or wire bonding using a bonding wire 66 as shown in FIG. The law is applicable. The IC chip 41 is electrically connected to the bumps 69 via the wiring part on the back surface of the tab substrate 35.
[0061]
The tab substrate 35 is embedded in a recess 60 formed on the surface of the card body 64 on the exterior sheet material 33a side. The recess 60 includes a first recess 61 that accommodates the tab substrate 35 and a second recess 62 that accommodates the IC sealing portion on the tab substrate 35, and has a stepped shape as a whole. The second recess 62 is formed through a part of the antenna substrate 31 inside the card body 64, but is provided in a portion where the wiring pattern on the antenna substrate 31 is not formed.
[0062]
The wiring pattern 37a on the antenna substrate 31 is exposed to the outside at the step portions of the first recess 61 and the second recess 62, and as shown in FIG. 40 is applied. The bumps 69 of the tab substrate 35 are connected to the lower wiring pattern 37a through the adhesive 40.
[0063]
On the surface of the tab substrate 35, as shown in FIG. 7, a plurality of external electrodes 45 functioning as external terminals for contact communication are formed. The external electrode 45 is electrically connected to the IC chip 41 on the back surface side through the through hole 46. And the through-hole 49a (49b) is formed in the front and back of the tab board | substrate 35 similarly to the above-mentioned 1st Embodiment.
[0064]
Here, in the present embodiment, the light shielding portion 55 is formed leaving the metal foil at the substantially central portion of the surface of the tab substrate 35. The light shielding part 55 is formed so as to correspond to the mounting part of the IC chip 41, and prevents transmission of ultraviolet rays at the center part of the tab substrate 35. This is to prevent the information stored in the IC chip 41 from being altered or erased by irradiating the IC chip 41 composed of a semiconductor element such as an EEPROM with ultraviolet rays.
[0065]
The IC card C2 of the present embodiment configured as described above is manufactured through the following steps.
[0066]
That is, as shown in FIG. 7, the IC chip 41 is mounted and sealed on the back surface of the tab substrate 35 in which the through holes 49a are formed, and the bumps 69 are formed (FIG. 6A). On the other hand, the antenna substrate 31 is sandwiched between the adhesive sheets 32a and 32b and the exterior sheet materials 33a and 33b to manufacture the card body 64 (FIG. 6B), and a recess 60 for accommodating the tab substrate 35 is formed on one surface thereof. (FIG. 6C).
[0067]
Next, an ultraviolet curable adhesive 40 is applied to the bottom of the first recess 61 (exposed surface of the wiring pattern 37 a), and the bumps 69 of the tab substrate 35 are pressure bonded to the wiring pattern 37 a via the adhesive 40. To do. At this time, as in the first embodiment, if the ultrasonic wave is applied to the tab substrate 35, the bonding reliability between the bump 69 and the wiring pattern 37a can be improved.
[0068]
For the curing process of the adhesive 40, as shown in FIG. 10, the pressure holding head 50 having the above-described configuration is used. The pressure holding head 50 introduces ultraviolet rays in a state where the entire surface of the tab substrate 35 is pressed, and irradiates the adhesive agent 40 with ultraviolet rays through the glass plate 51 and the light transmitting portion of the tab substrate 35 to cure.
Further, the light shielding unit 55 can avoid irradiation of the IC chip 41 with ultraviolet rays, thereby preventing alteration or disappearance of stored data of the IC chip 41.
[0069]
As described above, according to the present embodiment, since the tab substrate 35 is provided with the light transmitting portion that transmits the ultraviolet rays, the ultraviolet curable adhesive encapsulated between the tab substrate 35 and the card body 64 is provided. 40 can be properly cured.
[0070]
Thereby, while ensuring the bonding reliability between the tab substrate 35 and the antenna substrate 31, it is possible to significantly shorten the curing time of the adhesive 40 as compared with the conventional case. This can improve the productivity of the IC card C2. Moreover, since a high temperature is not required for the curing process of the adhesive, the card can be prevented from being deformed.
[0071]
As mentioned above, although each embodiment of this invention was described, of course, this invention is not limited to these, A various deformation | transformation is possible based on the technical idea of this invention.
[0072]
For example, in each of the embodiments described above, the electrical connection between the tab substrate 35 and the antenna substrate 31 is performed via the bumps 36 and 69. However, the present invention is not limited thereto, and is conventionally known such as a conductive paste or solder. It is also possible to use the conductive material.
[0073]
In each of the above embodiments, the antenna wiring for non-contact communication is configured by the antenna wiring pattern 37a (37b) of the antenna substrate 31. Instead of this, the antenna substrate is not used. Alternatively, a metal winding may be used as an antenna wiring, and this may be sandwiched between card bases to constitute a card body.
[0074]
In the second embodiment described above, the tab substrate 35 on which the IC chip 41 is mounted is joined to the antenna substrate 31 inside the card body 64. However, a configuration without an antenna substrate is also possible. . That is, the present invention can be applied to a contact IC card that does not have a non-contact communication function.
[0075]
Further, in each of the embodiments described above, the through holes 49a (49b) formed in the tab substrate 35 have a square hole shape. However, of course, the present invention is not limited to this. For example, as shown in FIG. You may make it comprise. Furthermore, not only the round holes but also a lattice shape or an ultraviolet light transmitting portion can be configured in a form simulating a predetermined shape.
[0076]
【The invention's effect】
As described above, according to the present invention, the circuit board having the external electrodes for contact communication on the surface has the translucent part that transmits light in the front and back direction, so that there is a gap between the circuit board and the card body. A photo-curing adhesive can be selected as a joining material to be joined, and the adhesive can be cured by irradiation light introduced through the light-transmitting portion.
[0077]
As a result, it is possible to significantly reduce the bonding operation time while ensuring the bonding reliability between the circuit board and the card body, and to improve the productivity. Further, since a high temperature is not required for the curing process of the adhesive, deformation due to heating of the card body can be avoided.
[Brief description of the drawings]
FIG. 1 is a process cross-sectional view showing a manufacturing process of an IC card C1 according to a first embodiment of the present invention.
FIG. 2 is a plan view showing a surface form of a tab substrate 35 constituting the IC card C1.
FIG. 3 is a process flow illustrating a manufacturing process of the IC card C1.
FIG. 4 is a cross-sectional view illustrating a bonding process between the tab substrate 35 and the card body 34.
5 is a side sectional view of a tab substrate 35. FIG.
FIG. 6 is a process sectional view showing a process for manufacturing an IC card C2 according to the second embodiment of the invention.
FIG. 7 is a plan view showing a surface form of a tab substrate 35 constituting the IC card C2.
8 is a cross-sectional view taken along line [8]-[8] in FIG.
9 is a cross-sectional view showing a modification of the configuration of FIG.
10 is a cross-sectional view illustrating a joining process between the tab substrate 35 and the card body 64. FIG.
11 is a plan view showing a modified example of the configuration of the tab substrate 35. FIG.
FIG. 12 is a process cross-sectional view showing a conventional IC card manufacturing process.
FIG. 13 is a plan view of a conventional tab substrate.
FIG. 14 is a cross-sectional view for explaining a problem of the prior art.
[Explanation of symbols]
31 ... Antenna substrate, 34, 64 ... Card body, 35 ... Tab substrate, 36, 69 ... Bump, 37a ... Wiring pattern, 39, 60 ... Recess, 40 ... UV curable adhesive, 41 ... IC chip, 45 ... External electrode, 46 ... through hole, 47 ... insulating substrate, 48a, 48b ... metal foil, 49a, 49b ... through hole (translucent part), 50 ... pressure holding head, 55 ... light shielding part, C1, C2 ... IC card.

Claims (2)

A recess is formed on the surface of the card body containing the antenna wiring for non-contact communication and the IC chip electrically connected to the antenna wiring so that the joined portion that is a part of the antenna wiring is exposed. Forming,
By patterning the first metal layer formed on the first surface of the light-transmitting insulating layer to be the circuit board, the contact-type communication external electrode and the first metal layer are extracted. Forming a plurality of first through holes;
The second metal layer formed on the second surface of the insulating layer is patterned to form a plurality of second through holes formed by removing the second metal layer, thereby forming the first through holes. Forming corresponding to the position,
Providing a protruding electrode electrically connected to the second metal layer on the second surface,
The circuit board is accommodated in the recess on the card body via a photocurable adhesive so that the first surface is on the surface side of the card body ,
While applying ultrasonic vibration by a pressurizing head having a hollow part, the circuit board is pressed toward the card body to weld and bond the bonded part and the protruding electrode,
While holding the pressurizing action by the pressure head, the light curable adhesive is irradiated with light from the hollow portion through the first and second through holes to cure the light curable adhesive. IC card manufacturing method. On the surface of the card body in which the antenna wiring for non-contact communication is built, a recess is formed so that the bonded portion that is a part of the antenna wiring is exposed,
By patterning the first metal layer formed on the first surface of the light-transmitting insulating layer to be the circuit board, the contact-type communication external electrode and the first metal layer are extracted. Forming a plurality of first through holes;
The second metal layer formed on the second surface of the insulating layer is patterned to form a plurality of second through holes formed by removing the second metal layer, thereby forming the first through holes. Forming corresponding to the position,
Protruding electrodes and IC chips that are electrically connected through the second metal layer are provided on the second surface,
The circuit board is accommodated in the recess on the card body via a photocurable adhesive so that the first surface is on the surface side of the card body ,
While applying ultrasonic vibration by a pressurizing head having a hollow part, the circuit board is pressed toward the card body to weld and bond the bonded part and the protruding electrode,
While holding the pressurizing action by the pressure head, the light curable adhesive is irradiated with light from the hollow portion through the first and second through holes to cure the light curable adhesive. IC card manufacturing method.

Images