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JP2001267798A - 部品装着装置 - Google Patents

部品装着装置

Info

Publication number
JP2001267798A
JP2001267798A JP2000075828A JP2000075828A JP2001267798A JP 2001267798 A JP2001267798 A JP 2001267798A JP 2000075828 A JP2000075828 A JP 2000075828A JP 2000075828 A JP2000075828 A JP 2000075828A JP 2001267798 A JP2001267798 A JP 2001267798A
Authority
JP
Japan
Prior art keywords
component
mounting
unit
supply unit
component supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000075828A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267798A5 (ko
Inventor
Kouta Tamura
孝太 田村
Toshiyuki Ishibe
敏幸 石部
Hozumi Nashima
穂積 菜嶋
Teruki Nishi
輝樹 西
Masatoshi Kajiwara
正敏 梶原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2000075828A priority Critical patent/JP2001267798A/ja
Priority to TW090101773A priority patent/TW488191B/zh
Priority to CNB200410083513XA priority patent/CN1323574C/zh
Priority to KR1020010013728A priority patent/KR20010090483A/ko
Priority to CNB011120088A priority patent/CN1183818C/zh
Publication of JP2001267798A publication Critical patent/JP2001267798A/ja
Publication of JP2001267798A5 publication Critical patent/JP2001267798A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2000075828A 2000-03-17 2000-03-17 部品装着装置 Pending JP2001267798A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000075828A JP2001267798A (ja) 2000-03-17 2000-03-17 部品装着装置
TW090101773A TW488191B (en) 2000-03-17 2001-01-30 Device assembly device
CNB200410083513XA CN1323574C (zh) 2000-03-17 2001-03-16 元器件安装装置
KR1020010013728A KR20010090483A (ko) 2000-03-17 2001-03-16 부품 장착 장치
CNB011120088A CN1183818C (zh) 2000-03-17 2001-03-16 元器件安装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000075828A JP2001267798A (ja) 2000-03-17 2000-03-17 部品装着装置

Publications (2)

Publication Number Publication Date
JP2001267798A true JP2001267798A (ja) 2001-09-28
JP2001267798A5 JP2001267798A5 (ko) 2005-07-07

Family

ID=18593659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000075828A Pending JP2001267798A (ja) 2000-03-17 2000-03-17 部品装着装置

Country Status (4)

Country Link
JP (1) JP2001267798A (ko)
KR (1) KR20010090483A (ko)
CN (2) CN1183818C (ko)
TW (1) TW488191B (ko)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7181833B2 (en) 2002-09-11 2007-02-27 Tdk Corporation Method of mounting an electronic part
KR101009670B1 (ko) * 2004-03-30 2011-01-19 엘지디스플레이 주식회사 검사 장비
CN103220900A (zh) * 2013-04-09 2013-07-24 深圳市东旭发自动化有限公司 一种自动贴片机
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
CN103841764A (zh) * 2014-03-15 2014-06-04 深圳市鹰眼在线电子科技有限公司 Fpc补强片智能贴装机
WO2014083618A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 部品実装機
JP2014182128A (ja) * 2013-03-20 2014-09-29 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi 動釣り合い検知装置
KR101465125B1 (ko) * 2014-04-25 2014-11-26 안재은 오링 자동 조립 장치
CN109287112A (zh) * 2018-09-21 2019-01-29 创维电子器件（宜春）有限公司 一种pcba自动组装设备
CN109348701A (zh) * 2018-12-04 2019-02-15 东莞市南部佳永电子有限公司 振动型管式飞达
CN114496848A (zh) * 2022-01-06 2022-05-13 浙江鼎炬电子科技股份有限公司 一种半导体元件组装方法
WO2025109413A1 (en) * 2023-11-24 2025-05-30 G.D S.P.A. Operating station to feed electronic components, in particular microprocessors, in an article manufacturing machine

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
JP4203303B2 (ja) * 2002-03-28 2008-12-24 Ｊｕｋｉ株式会社 電子部品実装装置
DE10236004B4 (de) * 2002-08-06 2007-08-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
JP4147963B2 (ja) * 2003-02-10 2008-09-10 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP3879679B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
CN1592574B (zh) * 2003-09-01 2010-06-09 重机公司 电子器件安装机中的电子器件的吸附位置修正装置
KR100552884B1 (ko) * 2003-11-04 2006-02-20 티디케이가부시기가이샤 전자 부품을 장착하기 위한 장치 및 방법
CN100359770C (zh) * 2004-12-31 2008-01-02 技嘉科技股份有限公司 一种针脚座送料装置
DE102005013283B4 (de) * 2005-03-22 2008-05-08 Siemens Ag Bestückautomat zum Bestücken von Substraten mit elektrischen Bauelementen
CN101662928B (zh) * 2009-09-14 2011-07-06 邓智军 一种具有影像定位的电路板校位装置和钻铣装置
CN102641821A (zh) * 2011-02-17 2012-08-22 一诠精密工业股份有限公司 用于黏着光学透镜的点胶机
JP6135598B2 (ja) * 2013-08-20 2017-05-31 株式会社村田製作所 チップの振込装置
CN104105356B (zh) * 2014-07-30 2017-04-05 东莞市新泽谷机械制造股份有限公司 双叉片定位送料机构
CN105149924A (zh) * 2015-09-09 2015-12-16 舒建文 一种贴件机
CN105722382A (zh) * 2016-03-23 2016-06-29 广东工业大学 一种设有横置式同步供料机构的贴片机及供料方法
JP7018709B2 (ja) * 2017-01-24 2022-02-14 Thk株式会社 加工制御システム、及び運動案内装置
CN107454820A (zh) * 2017-08-03 2017-12-08 江门市高翔电气智能化有限公司 一种插件机
KR20190091018A (ko) * 2018-01-26 2019-08-05 한화정밀기계 주식회사 부품 실장 장치
CN109247008A (zh) * 2018-10-30 2019-01-18 重庆隆成电子设备有限公司 一种软硬贴合机及贴片方法
CN113035745B (zh) * 2021-02-25 2022-03-18 东莞普莱信智能技术有限公司 一种芯片贴装装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100840A (ja) * 1988-10-08 1990-04-12 Tdk Corp 部品搭載機におけるランダム搭載方式
JPH03257896A (ja) * 1990-03-07 1991-11-18 Sanyo Electric Co Ltd 部品供給装置
JPH0730292A (ja) * 1993-07-12 1995-01-31 Yamaha Motor Co Ltd 表面実装機
JPH08148895A (ja) * 1994-11-15 1996-06-07 Matsushita Electric Ind Co Ltd 電子部品実装装置
JPH11340686A (ja) * 1998-05-28 1999-12-10 Sony Corp チップ部品供給方法及び装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765993A (en) * 1987-01-20 1988-08-23 Owades Joseph L Preparation of alcohol-free barley malt-based beverage
JPH11330799A (ja) * 1998-05-21 1999-11-30 Sony Corp 部品装着装置
JP3562325B2 (ja) * 1998-07-16 2004-09-08 松下電器産業株式会社 電子部品の実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100840A (ja) * 1988-10-08 1990-04-12 Tdk Corp 部品搭載機におけるランダム搭載方式
JPH03257896A (ja) * 1990-03-07 1991-11-18 Sanyo Electric Co Ltd 部品供給装置
JPH0730292A (ja) * 1993-07-12 1995-01-31 Yamaha Motor Co Ltd 表面実装機
JPH08148895A (ja) * 1994-11-15 1996-06-07 Matsushita Electric Ind Co Ltd 電子部品実装装置
JPH11340686A (ja) * 1998-05-28 1999-12-10 Sony Corp チップ部品供給方法及び装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7181833B2 (en) 2002-09-11 2007-02-27 Tdk Corporation Method of mounting an electronic part
KR101009670B1 (ko) * 2004-03-30 2011-01-19 엘지디스플레이 주식회사 검사 장비
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
WO2014083618A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 部品実装機
JPWO2014083618A1 (ja) * 2012-11-27 2017-01-05 富士機械製造株式会社 部品実装機
JP2014182128A (ja) * 2013-03-20 2014-09-29 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi 動釣り合い検知装置
CN103220900B (zh) * 2013-04-09 2016-10-05 深圳市东旭发自动化有限公司 一种自动贴片机
CN103220900A (zh) * 2013-04-09 2013-07-24 深圳市东旭发自动化有限公司 一种自动贴片机
CN103841764A (zh) * 2014-03-15 2014-06-04 深圳市鹰眼在线电子科技有限公司 Fpc补强片智能贴装机
KR101465125B1 (ko) * 2014-04-25 2014-11-26 안재은 오링 자동 조립 장치
CN109287112A (zh) * 2018-09-21 2019-01-29 创维电子器件（宜春）有限公司 一种pcba自动组装设备
CN109287112B (zh) * 2018-09-21 2020-12-29 创维电子器件（宜春）有限公司 一种pcba自动组装设备
CN109348701A (zh) * 2018-12-04 2019-02-15 东莞市南部佳永电子有限公司 振动型管式飞达
CN109348701B (zh) * 2018-12-04 2023-12-15 东莞市南部佳永电子有限公司 振动型管式飞达
CN114496848A (zh) * 2022-01-06 2022-05-13 浙江鼎炬电子科技股份有限公司 一种半导体元件组装方法
WO2025109413A1 (en) * 2023-11-24 2025-05-30 G.D S.P.A. Operating station to feed electronic components, in particular microprocessors, in an article manufacturing machine

Also Published As

Publication number Publication date
CN1592575A (zh) 2005-03-09
CN1183818C (zh) 2005-01-05
CN1317926A (zh) 2001-10-17
KR20010090483A (ko) 2001-10-18
CN1323574C (zh) 2007-06-27
TW488191B (en) 2002-05-21

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