JP2001244696A - Method for correcting component mounting position and surface mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a component on a substrate with higher precision. SOLUTION: There are provided a main control means 21 for performing a preliminary operation wherein, with a dummy substrate bearing plural marks positioned at a working position, a head unit 5 is moved and a substrate recognizing camera 18 mounted on the head unit 5 images each mark, a calculation means 24 wherein a deviation (error) between a mark position with the substrate recognizing camera 18 and a theoretical position for the mark is acquired and a correction amount for the mounting position of the part by the head unit 5 is acquired on the basis of the deviation, and a storage means 25 where the correction amount acquired by the calculation means 24 is stored. The main control means 21 controls, at normal mounting operation, driving of the head unit 5 based on the correction amount stored in the storage means 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for correcting a mounting position of a surface mounter configured to mount a component such as an IC on a printed circuit board and a surface mounter capable of performing the correction direction.

[0002]

2. Description of the Related Art Conventionally, an electronic component such as an IC is sucked from a component supply unit by a head unit having a component suction head, and the component is transferred onto a printed circuit board positioned at a predetermined work position. A surface mounter adapted to be mounted by mounting is generally known.

In this type of surface mounter (hereinafter referred to as a mounter), the head unit has a simple structure, high reliability, and is easy to control because of the combination of independent linear movements for positioning. An XY table is mainly used as a driving means for the XY table.

The XY table is provided with, for example, a pair of rails extending in the Y-axis direction on a base, and a head unit supporting member is movably mounted on these rails.
A rail extending in the X-axis direction is provided on the head unit support member, and the head unit is movably mounted on the rail. The head unit support member and the head unit are each driven along each of the rails, so that the head unit moves two-dimensionally above the printed circuit board.

[0005]

In the mounting machine as described above, the mounting error due to the drive error of the XY table, the thermal expansion of the members constituting the table, the deterioration over time, or the fluctuation of the load position due to the movement of the head unit, etc. It is known to affect.

Therefore, in order to cope with this, for example, a calibration mark is provided at a specific position on the base, and this is picked up by a camera for recognizing a printed circuit board mounted on a head unit, thereby recognizing the mark. The deviation (error) between the position (the position on the image) and the theoretical (design) position is determined, and taking into account this error, the mounting position of the component at the time of component mounting (that is, the movement of the head unit) The target position is corrected.

However, since the deformation of each part of the XY table and the amount of the deformation vary depending on the location, and the deformation position and the like also vary due to the change in the load position due to the movement of the head unit, the error obtained at a specific point as in the prior art. It is difficult to mount the component with high accuracy only by correcting the mounting position of the component in consideration of the above. In particular, since the calibration mark as described above is usually provided at a location different from the work position, the mounting position of the component on the printed circuit board positioned at the work position is accurately corrected. There is a problem that it is difficult. Therefore, improvement of this point is desired.

It is conceivable that the rigidity of each component of the XY table is increased to suppress the deformation of the components and thereby reduce the above-mentioned error. However, in this case, the apparatus becomes large and the cost increases. It is not desirable because it has adverse effects such as.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and more precisely corrects a component mounting position by a head unit so that components can be mounted on a substrate with higher accuracy. Is to do.

[0010]

In order to solve the above-mentioned problems, the present invention takes out an electronic component from a component supply unit by a component mounting head unit movably supported on an XY plane. This is a method of correcting a mounting position when mounting a component on a substrate positioned at a predetermined work position, and a plurality of marks whose positions on an XY plane are known before a normal mounting operation. The dummy substrate described above is positioned at the working position, and in this state, each mark is imaged by the imaging means mounted on the head unit to detect the position, and the error between the detected position and the theoretical position of the mark is detected. In the mounting operation by the head unit, the mounting position of the component by the head unit is corrected based on the error (claim 1).

According to this method, errors generated when the head unit is moved are obtained at a plurality of locations and at work positions for positioning the mounting substrate, and the mounting positions of the components by the head unit are corrected based on these errors. Therefore, the reliability of the correction is improved.

In this case, it is preferable that the mounting position of the component by the head unit is corrected based on the error in the mark corresponding to the component mounting position on the XY plane or a mark in the vicinity thereof.

With this configuration, the component mounting position can be corrected on the basis of the actual movement error of the head unit at the component mounting position or an error very close to the error. Therefore, the reliability of the correction is extremely high. improves.

In the method of correcting a component mounting position according to the first or second aspect of the present invention, a dummy substrate on which marks are marked in a matrix at regular intervals in the X-axis direction and the Y-axis direction is used as the dummy substrate. It is preferable that a correction amount corresponding to the error is obtained for each mark to generate correction data, and the mounting position is corrected based on the correction data.

In this case, since the marks are regular, the tendency of the error can be easily checked. Therefore, by determining the tendency of the error and correcting the component mounting position based on the correction data based thereon, accurate correction can be performed even when the component mounting position does not match the mark position. Also, the productivity of the dummy substrate is improved.

Further, in the component mounting position correcting method according to the first aspect, a dummy substrate on which the marks are marked in at least one row at a constant interval in each of the X-axis direction and the Y-axis direction is used, and the X-axis direction line is used. X-line correction data for which a correction amount corresponding to an error is obtained for each of a plurality of positions, and Y-line correction data for which a correction amount corresponding to an error is obtained for each of a plurality of positions on a Y-axis direction line. The mounting position may be corrected based on the correction data. In this case, among the marks arranged in the X-axis direction, an error in a mark corresponding to the position of the component mounting position in the X-axis direction or a mark in the vicinity of the mark, and the Y in the component mounting position in the marks arranged in the Y-axis direction. It is desirable to correct the mounting position of the component by the head unit based on an error in a mark corresponding to the position in the axial direction or a mark near the position (claim 5).

According to these methods, it is possible to determine an error during the movement of the head unit over a wide range with a small number of marks, and the mounting position can be corrected rationally.

On the other hand, the surface mounter according to the present invention is an X-Y
An electronic component is sucked from a component supply unit by a component mounting head unit movably supported on a plane, and is mounted on the head unit in a surface mounter that mounts on a substrate positioned at a predetermined work position. Imaging means capable of imaging the substrate positioned at the work position, driving means for driving the head unit, and a dummy substrate having a plurality of marks whose positions on the XY plane are known Control means for controlling a driving means to selectively execute a preparation operation of picking up each mark by the imaging means and a normal mounting operation by moving the head unit in a state where the head unit is positioned, and an imaging means in the preparation operation Calculation means for calculating an error between the position of the mark imaged by the method and the theoretical position of the mark, and when the control means executes a normal mounting operation, In which is configured to correct the mounting position of the component by the head unit in consideration of the error (claim 6).

According to this surface mounter, during the preparatory operation, the head unit moves while the dummy substrate is positioned at the work position, and the imaging means captures each mark on the dummy substrate, and the calculation means calculates the error. Is done automatically. During a normal mounting operation, the mounting position of the component by the head unit is corrected based on the error. In other words, under the control of the control means,
Is automatically performed.

In this surface mounter, the calculating means calculates a correction amount for each mark based on the error, and further stores a data of the correction amount associated with each mark. Means, wherein the control means is configured to correct the mounting position of the component by the head unit based on the correction amount data stored in the storage means.

According to the surface mounter, the mounting efficiency is more advantageous than the case where the correction amount is calculated during the normal mounting operation. That is, the mounting process can be performed by the arithmetic processing without causing the head unit to temporarily wait.

According to a sixth aspect of the present invention, in the surface mounter according to the sixth aspect of the present invention, the arithmetic means comprises a plurality of marks arranged on a line in the X-axis direction and a plurality of marks arranged on a line in the Y-axis direction. A correction amount is calculated based on the error, and further, X-line correction data, which is a correction amount for a plurality of marks arranged on a line in the X-axis direction, and X-line correction data arranged on a line in the Y-axis direction. Storage means for storing the Y-line correction data, which is the correction amount for the plurality of marks, wherein the control means controls the head unit based on the X-line correction data and the Y-line correction data stored in the storage means. It is configured to correct the mounting position of the component (claim 8).

According to this surface mounter, it is possible to determine an error during the movement of the head unit over a wide range with a small number of marks, and the mounting position can be corrected rationally.

In the surface mounter according to any one of claims 6 to 8, when the board recognition camera for picking up the board recognition mark written on the board to be mounted is mounted on the head unit. It is preferable that the substrate recognizing camera is also used as the imaging means (claim 9), thereby rationalizing the configuration.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 schematically shows an example of a surface mounter (hereinafter abbreviated as a mounter) according to the present invention. In this figure, a conveyor 2 constituting a transport line is provided on a base 1.
Are arranged, and the printed board 3 is conveyed on the conveyor 2 and stopped in a state where it is positioned at a predetermined work position.

At the side of the conveyor 2, there is provided a component supply unit 4.
Is arranged. The component supply unit 4 includes, for example, a plurality of rows of tape feeders 4a. Each of the tape feeders 4a stores and holds small pieces of electronic components such as ICs, transistors, and capacitors at predetermined intervals. The tape feed end is provided with a feed mechanism, and the tape is intermittently fed as components are picked up by a head unit 5 described later.

Above the base 1, a head unit 5 for mounting electronic components is provided. The head unit 5 is movable across the component supply unit 4 and the printed circuit board 3 positioned at the work position,
In this embodiment, the X-axis direction (the direction of the conveyor 2) and the Y-axis direction
It can be moved in the axial direction (the direction orthogonal to the X axis on the horizontal plane).

That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 driven to rotate by a Y-axis servomotor 9 are disposed on the base 1. A head unit support member 11 is disposed on the support member 11, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. A guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servomotor 15 are disposed on the support member 11 so that the head unit 5 can move on the guide member 13. A nut portion (not shown) provided in the head unit 5 is screwed to the ball screw shaft 14. The operation of the Y-axis servomotor 9 rotates the ball screw shaft 8 to move the support member 11 in the Y-axis direction, and the operation of the X-axis servomotor 15 rotates the ball screw shaft 14 to rotate the head unit 5. Move in the X-axis direction with respect to the support member 11.
This allows the head unit 5 to move on the XY plane.

The Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detecting means 10 and 16 comprising encoders, respectively, so that the operating position of the head unit 5 can be detected. Has become.

The base 1 further includes a head unit 5
A component recognition camera 17 for recognizing the suction state of the component sucked by the component is provided. After the component suction, the head unit 5 is moved above the component recognition camera 17 so that the suction component is imaged and the component suction is performed. The state can be checked.

Although not shown, the head unit 5 is provided with a suction head having a nozzle for picking up a component at a tip thereof. The suction head can move in the Z-axis direction (up-down direction) and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 5, and a Z-axis servo motor and an R-axis servo motor (not shown) Driven by the The nozzle is connected to a negative pressure supply means via a valve or the like, and a negative pressure for component suction is supplied to the tip of the nozzle when necessary.

Further, a board recognition camera 18 (imaging means) is attached to a side portion of the head unit 5. The board recognition camera 18 captures an image of a fiducial mark provided on the surface of the printed board 3 during the mounting operation, and detects the relative position between the head unit 5 and the printed board 3 based on the detection of the mark. It has become. Further, in a later-described preparation process (preparation operation) performed prior to a normal mounting operation, an image of the mark 32 written on the upper dummy substrate 30 is taken.

FIG. 2 is a block diagram showing a control system of the mounting machine.

The mounting machine comprises a well-known CPU for executing a logical operation, a ROM for storing various programs for controlling the CPU in advance, and a RAM for temporarily storing various data during operation of the apparatus. Control device 20
have.

The control device 20 includes a main control unit 21, a driver 22, an image processing unit 23, a calculation unit 24, a storage unit 25, and the like.

The main control means 21 controls the operation of the mounting machine in a comprehensive manner. The main control means 21 controls the driving of the head unit 5 and the like in order to execute a normal mounting operation in accordance with a program stored in advance. Prior to the start, the drive of the head unit 5 and the like is controlled to perform a preparation process described later. In particular, during mounting operation,
The drive control of the head unit 5 is performed to correct the component mounting position by the head unit 5 based on the correction amount Δ obtained in the preparation processing.

The driver 22 controls the driving of the head unit 5, and the servo motors 15, 9 for the X axis, Y axis, etc., and their position detecting means 16, 10 are connected to the driver 22. ing. The driving of the servo motor 15 and the like is controlled by the main control unit 21 via the driver 22 during the mounting operation and the preparation process.

The image processing means 23 performs predetermined image processing on image signals output from the component recognition camera 17 (not shown in FIG. 2) and the board recognition camera 18.

The arithmetic means 24 is a dummy board 3 which is imaged by the board recognition camera 18 during the preparation process.
The position of the mark 32 on the image 0 is determined on the image, the deviation (error) between the mark position and the theoretical position of the mark 32 is calculated, and the correction at the time of component mounting at the mark position is performed based on the error. The amount Δ (that is, the correction amount for the movement target position by the head unit 5 when a component is mounted at the mark position) is calculated.

The storage means 25 stores the dummy substrate 30
The correction amount Δ obtained by the calculating means 24 for each mark 32 is stored, and the correction amount Δ is stored in association with each mark 32.

Here, preparation processing before mounting performed in the mounting machine will be described.

In this mounting machine, before starting a normal mounting operation, as a preparation process, a dummy substrate having a plurality of marks on its surface is positioned at the working position of the conveyor 2, and in this state, the head unit 5 is mounted. Is moved, and each mark is picked up by the board recognizing camera 18 and recognized, thereby performing processing for obtaining data (correction amount Δ) for correcting the component mounting position by the head unit 5. Less than,
It will be described in detail.

As shown in FIG. 3, the dummy substrate 30
For example, a glass substrate having the same size and the same shape as the target maximum size printed circuit board 3 in this mounting machine is used, and a large number of marks 32 are written in a matrix on the entire surface as shown in FIG. Have been. Specifically, in a state where the dummy substrate 30 is positioned at the above-mentioned working position on the conveyor 2, the marks 32 of N rows in the Y-axis direction and M columns in the X-axis direction are provided at regular intervals in the X-axis and Y-axis directions. In the preparation process, each mark 32 is sequentially imaged by the board recognition camera 18 in a state where the dummy substrate 30 is positioned at the work position as in the case of the normal printed circuit board 3 in the preparation process, and the image processing is performed. The means 23 performs predetermined processing on the image data to recognize each mark. And
In the calculating means 24, the position of the mark 32 on the image (the position on the XY coordinate; hereinafter, referred to as the imaging position) and the theoretical (design) position of each mark (the position on the XY coordinate; , A theoretical position), that is, a movement error of the head unit 5 at the mark position, and a correction amount at the time of mounting based on this error, that is, XY when a component is mounted at the mark position. A correction amount Δ for the movement target position of the head unit 5 on the coordinates is obtained, and the correction amount Δ is stored in the storage unit 25 in association with each mark 32.

The above-described preparation processing is performed by the main control unit 21.
Under the control by the control according to, for example, the flowchart shown in FIG.

That is, when the operator operates the input means (not shown) in a state where the dummy substrate 30 is positioned at the work position, a start signal of the preparation processing is input to the main control means 21. Matrix data (n, m) indicating the recognition mark position of
1, m = 1 is set (step S1).

When the initial value is set, the first mark 3
2, that is, the head unit 5 moves so that the board recognition camera 18 is disposed above the mark 32 in the first row and first column, and the mark 32 is imaged and recognized. Error between the mark position and the theoretical position is obtained, and the correction amount Δ
(ΔX ₁₁ , ΔY ₁₁ ) is obtained (steps S2, S
3).

Next, it is determined whether or not m = M, that is, whether or not the recognition of all the marks 32 of the first row written on the dummy substrate 30 and the calculation of the correction amount Δ have been completed. If it is determined that there is no data, the column data in the matrix data (n, m) is incremented, and the process returns to step S2 (step S2).
7). As a result, the next row of marks 32 (that is, the first
Recognition of the mark 32) located in the row and the second column and calculation of the correction amount Δ (ΔX ₁₂ , ΔY ₁₂ ) are performed.

By repeating the processing of steps S2 to S4 and step S7, dummy substrate 3
0 marks 32, each remaining mark 32 in the first row
Are sequentially performed, and the calculation of the correction amount Δ based on these marks 32 is sequentially performed.

When the calculation of the correction amount Δ for all the marks 32 on the first line is completed (YES in step S4),
Next, it is determined whether or not n = N, that is, whether or not the recognition and the calculation of the correction amount Δ have been completed for all the marks 32 on the N-th row. In the matrix data (n, m), the data on the row is incremented, the data on the column is set to the initial value m = 1, and the process returns to step S2 (steps S5 and S6). As a result, among the marks 32 written on the dummy substrate 30, each mark 32 in the second row is sequentially imaged and recognized, and the calculation of the correction amount Δ based on each mark 32 is sequentially performed.

When the processing of steps S2 to S6 and step S7 is repeated as described above and finally the recognition of all the marks 32 on the N-th row and the calculation of the correction amount Δ are completed (YES in step S5), the process proceeds to step S8. Then, the correction amount Δ obtained in step S3 and the corresponding mark 32 are stored in the storage unit 25 as table data as shown in FIG. 5, for example (step S3).
8).

As a result, the preparation process is completed, and the dummy substrate 30 is removed from the conveyor 2 so that a normal mounting operation can be performed.

Next, a normal mounting operation of the mounting machine configured as described above will be described.

When the mounting operation is started in the mounting machine, first, the printed circuit board 3 is carried in along the conveyor 2, and is positioned at the work position. At substantially the same time, the head unit 5 is disposed above the component supply unit 4, and the mounted component is sucked and removed from the tape feeder 4a as the suction head moves up and down.

Next, with the movement of the head unit 5, the suction component is disposed above the component recognition camera 17, the component recognition camera 17 captures an image of the suction component, and checks the suction status of the component based on the image data. Can be

The suction component is arranged above the predetermined mounting position of the printed board 3 with the movement of the head unit 5, and the suction component is mounted on the printed board 3 by driving the suction head up and down. Become.

In such a mounting operation, when the suction component is arranged above the predetermined mounting position, the main control means 21
In, the mounting position of the component (position on the XY coordinate) is compared with the position of the mark 32 (theoretical position on the XY coordinate) in the above-described preparation processing, and the position corresponds to the mounting position of the component. It is checked whether or not the mark 32 exists. If the matching mark 32 exists, the correction amount Δ in the mark 32 is determined from the table data stored in the storage unit 25 by the main control unit 21. And the target movement position of the head unit 5 is corrected based on the correction amount Δ and the component suction state. On the other hand, when the mark 32 corresponding to the component mounting position does not exist, the mark 32 closest to the component mounting position is selected,
The correction amount Δ in the mark 32 is read out to the main control means 21, and the movement target position of the head unit 5 is corrected based on the correction amount Δ and the component suction state.

The correction amount for the mounting position may be obtained by interpolation from the correction amounts Δ for a plurality of marks near the mounting position.

When the mounting of the component is completed, the head unit 5 moves to the component supply unit 4 to mount the next component, whereby one cycle of the component mounting operation by the head unit 5 ends.

According to the mounting machine described above, as described above, using the dummy substrate 30, the movement errors of the head unit 5 at a plurality of positions at the work position are checked, and the correction amount Δ at that position is obtained in advance. During the normal mounting operation, the correction amount Δ in the mark 32 corresponding to the component mounting position or the mark 32 in the vicinity of the mark 32 among the plurality of positions.
Therefore, the mounting position of the component by the head unit 5 is corrected on the basis of the component mounting position, so that the mounting position of the component is corrected based on a movement error actually occurring at the component mounting position or an error very close thereto. Therefore, the head unit 5
And the amount of deformation due to the location of the component such as the fixed rail 7 is sufficiently taken into account. Therefore, compared to a conventional mounting machine that corrects the component mounting position by the head unit based on recognition of one calibration mark provided at a location different from the work position, the correction of the component mounting position Has a high reliability and the mounting accuracy can be further improved.

In the above mounting machine, preparation processing is performed using a dummy substrate 30 having the same size and the same shape as the maximum size printed circuit board 3 and having a large number of marks 32 written on the entire surface thereof. Therefore, there is an effect that the component mounting position can be accurately corrected for the target printed circuit board 3 of all sizes in the mounting machine.

Further, the marks 32 are regularly (matrix-like) written on the dummy substrate 30. For example, the tendency (regularity) of the error of each mark 32 can be easily checked. By correcting the component mounting position by examining the tendency, it is possible to accurately correct the component mounting position even when the component mounting position does not match the position of the mark 32, for example.

Next, a second embodiment of the present invention will be described with reference to the drawings.

The mounting machine according to the second embodiment differs from the mounting machine according to the first embodiment in the content of the preparation process and the method of correcting the component mounting position by the head unit 5.

That is, in the second embodiment, in the preparation process, the recognition of the mark 32 and the calculation of the correction amount Δ are performed by the mark 3 of the first row among the marks 32 of the dummy substrate 30.
2 and each mark 32 in the first row, and
The correction of the component mounting position by the head unit 5 is also performed based on the correction amount Δ for some of the marks 32. Hereinafter, a preparation process and a mounting operation according to the second embodiment will be described in detail.

In the second embodiment, under the control of the main control means 21, the preparation processing is automatically performed according to, for example, the flowchart shown in FIG.

That is, when the dummy substrate 30 is positioned at the work position and the start signal of the preparation processing is input to the control device 20 by the operation of the operator, the matrix data (n, m) indicating the first recognition mark position is obtained. ) Are set to the initial values n = 1 and m = 1 (step S11).

When the initial value is set, the first mark 3
2, that is, the head unit 5 moves so that the board recognition camera 18 is disposed above the mark 32 in the first row and first column, and the mark 32 is imaged and recognized (step S).
12). Then, an error between the imaging position of the mark 32 and the theoretical position is obtained, and a correction amount Δ (Δ
X ₁₁ , ΔY ₁₁ ) are obtained (step S13).

Next, it is determined whether or not m = M, that is, whether or not the recognition of all the marks 32 of the first row written on the dummy substrate 30 and the calculation of the correction amount Δ have been completed. If it is determined that there is no data, the column data in the matrix data (n, m) is incremented, and the process returns to step S12 (step S1).
4, S20). Thus, the recognition of the mark 32 in the next column (that is, the mark 32 located in the first row and the second column) and the calculation of the correction amount Δ (ΔX ₁₂ , ΔY ₁₂ ) are performed.

Then, by repeating the processing of steps S12 to S14 and step S20, of the marks 32 of the dummy substrate 30, the other marks 3 in the first row
2 and the calculation of the correction amount Δ based on these marks 32 is sequentially performed.

When the calculation of the correction amount Δ for all the marks 32 on the first line is completed (YE in step S14)
S) Then, the data of the row in the matrix data (n, m) is incremented, and the initial value m = 1 is set in the data of the column (step S1).
5).

As a result, the board recognition camera 18 is arranged above the mark 32 in the second row and first column, the mark 32 is imaged and recognized, and the correction amount Δ (ΔX ₂₁ , ΔY ₂₁ )
Is performed (steps S16 and S17).

Next, it is determined whether or not n = N, that is, the mark 32 of the N-th row and the first column written on the dummy substrate 30 is determined.
It is determined whether or not the recognition of and the calculation of the correction amount Δ have been completed. If it is determined that the calculation has not been completed, the process returns to step S15 (step S18). As a result, the recognition and correction amount Δ (ΔX ₃₁ , ΔY) of the mark 32 in the next row (that is, the mark 32 located in the third row and the first column) is obtained.
₃₁ ) is performed.

Thus, steps S15 to S18
Is repeated, and finally the recognition of the mark 32 in the N-th row and the first column and the calculation of the correction amount Δ are completed (YES in step S18), the process proceeds to step S19, and is obtained in steps S13 and S17. The obtained correction amounts Δ and the marks 32 corresponding to the correction amounts Δ are stored as table data as shown in FIG.
Is stored. That is, for a plurality of positions (M positions) on the line in the X-axis direction (on the line on which the marks of the first line are arranged), the correction amounts corresponding to the errors are calculated.
Line correction data (upper side correction data in FIG. 7) and Y
Y-line correction data (correction on the lower side of FIG. 7) in which correction amounts corresponding to errors are obtained for a plurality of positions (N positions) on the axial line (on the line on which the first column of marks are arranged) ) Are stored.

As a result, the preparation process is completed, and the dummy substrate 30 is removed from the conveyor 2 so that a normal mounting operation can be performed.

On the other hand, the normal mounting operation of the mounting machine according to the second embodiment is basically the same as the mounting operation of the first embodiment. Is performed in the following manner.

That is, after the component is sucked by the head unit 5, the main control means 21 checks the coordinates of the component mounting position. Then, a correction amount Δ for the position corresponding to the X coordinate of the mounting position from the X-line correction data.
Is read out, the correction amount Δ for the position corresponding to the Y coordinate of the mounting position is read out from the Y line correction data, and these are added to obtain the correction amount Δ for the mounting position. For example, if the coordinates of the mounting position are (X _m , Y _n ) (see FIG. 3), the correction amount Δ (ΔX _1m , ΔY _1m ) from the X-line correction data and the Y-line correction data from the Y-line correction data Correction amount Δ (ΔX _n1 , Δ
Y _n1 ) are read out, and the correction amount Δ _nm (ΔX, ΔY) for the mounting position is obtained from the following equation.

ΔX = ΔX _1m + ΔX _n1 ΔY = ΔY _1m + ΔY _n1 That is, since the movement of the head unit 5 is a combination of the linear movement in the X-axis direction and the linear movement in the Y-axis direction, it is recognized in the preparation processing. Regarding the movement error (correction amount Δ) at a mark position other than the mark 32 (the mark enclosed by the broken line in FIG. 3), the X-axis of the component mounting position among the marks 32 of the first row obtained in the preparation processing The correction amount Δ of the mark 32 corresponding to the position in the direction, and the mark 3 corresponding to the position in the Y-axis direction of the component mounting position among the marks 32 in the first row
The correction amount Δ of the mark position can be approximated based on the correction amount Δ of (2). Therefore, in the second embodiment, the correction amount Δ is obtained by the above equation for the position corresponding to the mark other than the mark 32 recognized in the preparation processing.

If the X coordinate of the mounting position does not match any position in the X-line correction data, the correction amount Δ at a position close to the X coordinate of the mounting position in the same line is read out, or interpolation calculation is performed. The correction amount Δ may be obtained, and the same may be applied when the Y coordinate of the mounting position does not match any position in the Y line correction data.

According to the mounting machine of the second embodiment, since the correction amount Δ at a position corresponding to another mark is approximated based on recognition of a part of the mark 32,
The number of marks 32 to be recognized in the preparation processing can be reduced. Accordingly, there is an effect that the time required for the preparation process can be reduced while the correction amount Δ is obtained over a wide range.

In this example, for convenience of explanation, the dummy substrate 30 of the first embodiment is used as it is, but in this example, as described above, the mark 32 to be actually recognized is each of the first row. Since only the mark 32 and each mark 32 in the first row are provided, the dummy substrate 30 in which the mark 32 other than the mark 32 recognized in the preparation process is omitted may be used as the dummy substrate 30.

Further, in this example, the correction amount Δ is obtained based on the above equations in the mounting operation.
At the stage of the preparation processing, the correction amounts Δ for all the marks 32 are obtained in advance and stored in the storage means 25 as table data as shown in FIG. 5, for example, and the data is stored in the main control means 21 based on the component mounting position. May be configured to be read out at the same time.

The mounting machines according to the above-described embodiments are only some examples of the surface mounting machine according to the present invention.
The specific method of correcting the component mounting position and the specific configuration of the mounting machine can be appropriately changed without departing from the scope of the present invention.

For example, in the first embodiment, in the preparatory operation, the correction amount Δ at each mark position on the dummy substrate 30 is obtained and the value is stored in the storage means 25. The movement error of the head unit 5 at the mark position is stored, and during normal mounting,
The correction amount Δ may be sequentially calculated based on this error.

In each of the above-described embodiments, the preparation process is performed using one dummy substrate 30 corresponding to the maximum size printed circuit board.
The preparation processing may be performed a plurality of times while moving the position of the dummy substrate 30 using the above method. For example, in the second embodiment, when obtaining the correction amount Δ within a range 41 as shown in FIG. 8A, two small-sized unit substrates 40a as shown in FIG. , 40b are combined to perform a preparation process by changing the position of the dummy substrate 40 between the position indicated by the solid line and the position indicated by the alternate long and short dash line in FIG.
The correction amount Δ may be obtained for the entirety of the range 41 based on the error in each mark 32 in the overlapping portion of. In this manner, the correction amount Δ can be obtained over a wide range with a small-sized dummy substrate, which is rational and has an effect of improving the productivity of the dummy substrate.

In each of the above embodiments, the board recognition camera 18 for picking up the fiducial marks on the printed board 3 is also used as a means for picking up the marks 32 on the dummy board 30. Dedicated imaging means may be provided. In this case, for example, if the mark 32 is imaged by each of the two cameras, the inclination of the head unit 5 (the inclination around the R axis) can be detected. By correcting the mounting position, the component mounting position can be corrected more accurately.

[0087]

As described above, according to the mounting position correcting method of the present invention, errors occurring when the head unit is moved are determined at a plurality of locations and at work positions for positioning the mounting substrate. Since the mounting position of the component by the head unit is corrected based on the error, an error at the time of moving the head unit is obtained based on one mark provided at a position distant from the working position, and based on this error, The reliability of the correction is remarkably improved as compared with the conventional method of correcting the mounting position of the component. Therefore,
Components can be mounted on the substrate with higher accuracy.

[Brief description of the drawings]

FIG. 1 shows a surface mounter according to the present invention (first embodiment).
FIG.

FIG. 2 is a block diagram showing a control system of the surface mounter.

FIG. 3 is a schematic plan view showing a dummy substrate.

FIG. 4 is a flowchart illustrating control of a preparation process.

FIG. 5 is a diagram (table) showing table data.

FIG. 6 is a flowchart illustrating control of preparation processing of a surface mounter according to a second embodiment.

FIG. 7 is a diagram (table) showing table data.

FIG. 8 is a schematic diagram illustrating another method of the preparation process.

[Explanation of symbols]

 2 Conveyor 3 Printed circuit board 4 Component supply section 5 Head unit 7 Fixed rail 8, 14 Ball screw shaft 9 Y-axis servo motor 10, 16 Position detecting means 11 Support member 13 Guide member 15 X-axis servo motor 18 Board recognition camera 20 Control device DESCRIPTION OF SYMBOLS 21 Main control means 22 Driver 23 Image processing means 24 Calculation means 25 Storage means

Claims (9)

[Claims] An electronic component is picked up from a component supply unit by a component mounting head unit movably supported on an XY plane, and the electronic component is mounted on a board positioned at a predetermined work position. In this method, prior to a normal mounting operation, a dummy substrate on which a plurality of marks whose positions on the XY plane are known is positioned at the working position, Then, each of the marks is imaged by the imaging means mounted on the head unit, and its position is detected, and the error between the detected position and the theoretical position of the mark is obtained. A component mounting position correction method, wherein a component mounting position by a head unit is corrected based on an error. 2. The component mounting position correction method according to claim 1, wherein the mounting position of the component by the head unit is determined based on the error in a mark corresponding to the component mounting position on the XY plane or a mark near the mark. A component mounting position correction method characterized by performing correction. 3. The component mounting position correcting method according to claim 1, wherein the dummy substrate is a dummy substrate on which marks are marked in a matrix at regular intervals in the X-axis direction and the Y-axis direction. A component mounting position correction method, wherein a correction amount corresponding to an error is obtained for each mark to generate correction data, and a mounting position is corrected based on the correction data. 4. The component mounting position correcting method according to claim 1, wherein said marks are marked at least in one row in the X-axis direction and in the Y-axis direction at regular intervals, and the marks are marked on a line in the X-axis direction. X-line correction data for which a correction amount corresponding to an error is obtained for each of a plurality of positions;
Y-line correction data for each of which a correction amount corresponding to an error is obtained for a plurality of positions on an axial line, and a mounting position is corrected based on these correction data. Method. 5. The component mounting position correcting method according to claim 4, wherein, among the marks arranged in the X-axis direction, the error in the mark corresponding to the position in the X-axis direction of the component mounting position or a mark in the vicinity thereof. Correcting the component mounting position by the head unit based on the error in the mark corresponding to the component mounting position in the Y-axis direction among the marks arranged in the Y-axis direction or the mark in the vicinity thereof. Mounting position correction method. 6. A surface mounting device for picking up an electronic component from a component supply unit by a component mounting head unit movably supported on an XY plane and mounting the electronic component on a board positioned at a predetermined work position. In the machine, imaging means mounted on the head unit and capable of imaging a substrate positioned at the work position, driving means for driving the head unit, and a position on the XY plane are known. In a state where the dummy substrate on which a plurality of marks are written is positioned at the work position, the head unit is moved to selectively execute a preparation operation of imaging the marks by the imaging unit and a normal mounting operation. Control means for controlling the driving means to calculate the error between the position of the mark imaged by the imaging means and the theoretical position of the mark in the preparation operation Means for correcting the mounting position of the component by the head unit in consideration of the error when performing a normal mounting operation. 7. The surface mounter according to claim 6, wherein the calculating means calculates a correction amount for each mark based on the error, and further calculates the correction amount associated with each mark. A surface mounter comprising storage means for storing amount data, wherein the control means corrects a mounting position of a component by a head unit based on the correction amount data stored in the storage means. 8. The surface mounter according to claim 6, wherein the calculating means is configured to determine a plurality of marks arranged on a line in the X-axis direction and a plurality of marks arranged on a line in the Y-axis direction. A correction amount is calculated based on each of the errors, and further, X-line correction data, which is a correction amount for a plurality of marks arranged on a line in the X-axis direction, and a plurality of marks arranged on a line in the Y-axis direction. Storage means for storing Y-line correction data, which is the correction amount for the component, and the control means mounts the component by the head unit based on the X-line correction data and the Y-line correction data stored in the storage means. A surface mounting machine characterized by correcting the position. 9. The surface mounting machine according to claim 6, wherein the image pickup means is a board recognition camera for picking up a board recognition mark written on a board to be mounted. And surface mounter.