JP5999544B2 - Mounting apparatus, mounting position correction method, program, and board manufacturing method - Google Patents

Description

  The present technology relates to a technique such as a mounting position for correcting the mounting position of an electronic component when the electronic component is mounted on a substrate.

  2. Description of the Related Art Conventionally, a mounting apparatus that mounts various electronic components such as resistors, capacitors, and coils on a substrate is widely known (see Patent Document 1 below). In the component mounting machine described in Patent Document 1, is the electronic component sucked in a correct posture with respect to the mounting head that sucks the electronic component supplied from the supply unit and mounts it on the substrate, or the suction nozzle of the mounting head? It has a component recognition device for recognizing whether or not.

  The mounting head is a turret rotation type head, and this mounting head sucks electronic components by a plurality of suction nozzles in order according to the rotation of the turret, and then picks up the electronic components sucked by the plurality of suction nozzles. Mount on the board in order.

  The component recognition apparatus includes a first imaging unit that captures an image of an electronic component sucked by the suction nozzle from below via a mirror, and a second imaging unit that images the electronic component from the side. The component mounting machine recognizes the suction posture of the electronic component with respect to the suction nozzle based on the image of the electronic component picked up by the image pickup unit, corrects the mounting position of the electronic component, and then mounts the electronic component on the substrate. .

  The mounting head and the component recognition device are provided below the Y beam extending in the Y axis direction, and this Y beam is provided below the X beam extending in the X axis direction. The mounting head and the component recognition apparatus are integrally moved in the XY plane in accordance with driving of the X beam and the Y beam.

JP 2001-77594 A

  The X beam and Y beam generally move the moving object by a mechanical mechanism such as a rail. However, a mechanical mechanism such as a rail cannot be created with complete accuracy. As an example, for example, a case where two rails are not completely parallel is assumed. In this case, the member moved by the two rails is deformed in accordance with the movement, and due to the effect of the deformation, the mounting head and the imaging unit are relatively moved at each position within the movement range of the mounting head and the imaging unit. The positional relationship may change.

  In such a case, there is a problem that it is impossible to accurately recognize the suction position of the electronic component with respect to the suction nozzle, and as a result, the electronic component cannot be mounted at an accurate position on the substrate.

  In view of the circumstances as described above, the purpose of the present technology is to change the relative positional relationship between the mounting unit and the imaging unit at each position within the movement range of the mounting unit and the imaging unit. It is an object of the present invention to provide a technique such as a mounting apparatus capable of mounting an electronic component at an accurate position on a substrate.

The mounting apparatus according to the present technology includes a mounting unit, an imaging unit, and a control unit.
The mounting portion is movable within a moving range, and holds electronic components and mounts them on a substrate.
The imaging unit is movable together with the mounting unit, and images the electronic component held by the mounting unit when the electronic component is mounted.
Prior to mounting the electronic component, the control unit images the mounting unit or a holding object held by the mounting unit at a different position of the moving range by the imaging unit, and obtains an image obtained by imaging. On the basis of the amount of displacement based on the amount of displacement when calculating the relative displacement amount between the mounting unit and the imaging unit at each position within the movement range. Correct.

  In this technology, prior to mounting the electronic component, a relative shift amount between the mounting unit and the imaging unit at each position within the movement range is calculated in advance, and the calculated shift amount is calculated when mounting the electronic component. Based on this, the mounting position of the electronic component is corrected. Therefore, even when the relative positional relationship between the mounting unit and the imaging unit changes at each position within the movement range of the mounting unit and the imaging unit, the electronic component is mounted at an accurate position on the board. be able to.

In the mounting apparatus, the mounting portion may be rotatable and may include a holding member that holds the electronic component and mounts the electronic component on the substrate.
In this case, the control unit rotates the holding member at each position within the movement range, images the holding member or the holding object held by the holding member a plurality of times, and acquires a plurality of acquired A rotation center of the holding member at each position may be calculated based on an image, and a relative shift amount between the mounting unit and the imaging unit at each position may be calculated based on the rotation center. .

  Thus, by calculating the relative shift amount between the mounting unit and the imaging unit based on the rotation center of the holding member, the shift amount can be calculated more accurately.

  In the mounting apparatus, the control unit includes a reference position rotation center that is a rotation center of the holding member calculated based on the plurality of images captured at a reference position within the movement range, and a position other than the reference position. The difference from the rotation center of the holding member calculated based on the plurality of images captured in step may be calculated as the shift amount.

  In the mounting apparatus, the control unit includes a first shift amount in the first direction between the mounting apparatus and the imaging unit, and a second shift amount in a second direction orthogonal to the first direction. The mounting position of the electronic component may be corrected based on at least one of them.

The mounting position correction method according to an embodiment of the present technology is movable within a moving range, and can be moved together with the mounting unit that holds the electronic component and is mounted on the substrate, and can be moved together with the mounting unit. Prior to mounting the electronic component by a mounting apparatus having an imaging unit that images the electronic component held by the mounting unit, the mounting unit or the mounting unit at a different position within the moving range by the imaging unit. Imaging the holding object held by.
Based on an image obtained by imaging, a relative shift amount between the mounting unit and the imaging unit at each position within the movement range is calculated.
When the electronic component is mounted, the mounting position of the electronic component is corrected based on the shift amount.

The program according to the present technology is movable within a movement range, and can be moved together with the mounting unit that holds the electronic component on the substrate and mounted on the substrate, and is mounted by the mounting unit when the electronic component is mounted. In a mounting apparatus having an imaging unit that images the held electronic component,
Prior to mounting the electronic component, the imaging unit images the mounting unit or a holding object held by the mounting unit at different positions within the moving range;
Calculating a relative shift amount between the mounting unit and the imaging unit at each position within the movement range based on an image obtained by imaging;
Correcting the mounting position of the electronic component based on the deviation amount when mounting the electronic component.

The substrate manufacturing method according to an embodiment of the present technology is movable within a movement range, and can be moved together with the mounting unit that holds the electronic component and is mounted on the substrate, and the electronic component is mounted when the electronic component is mounted. Prior to mounting the electronic component by a mounting apparatus having an imaging unit that images the electronic component held by the mounting unit, the mounting unit or the mounting unit at a different position within the moving range by the imaging unit. Imaging the held object.
Based on an image obtained by imaging, a relative shift amount between the mounting unit and the imaging unit at each position within the movement range is calculated.
When the electronic component is mounted, the mounting position of the electronic component is corrected based on the shift amount, and the electronic component is mounted on the substrate.

  As described above, according to the present technology, even when the relative positional relationship between the mounting unit and the imaging unit changes at each position within the movement range of the mounting unit and the imaging unit, It is possible to provide a technique such as a mounting apparatus that can mount an electronic component at an accurate position.

It is a front view showing a mounting device concerning one embodiment of this art. It is a side view which shows a mounting apparatus. It is a top view which shows a mounting apparatus. It is a block diagram which shows the structure of a mounting apparatus. It is a flowchart which shows a process when collecting the data about the relative positional relationship of a mounting head and an imaging part in each position within the movement range of a mounting head and an imaging part. It is a flowchart which shows a process when collecting the data about the relative positional relationship of a mounting head and an imaging part in each position within the movement range of a mounting head and an imaging part. It is a figure which shows a mode when a mounting head and an imaging part are located in the reference position A, and a mode when a mounting head and an imaging part are located in the position B which is positions other than a reference position. 6 is a diagram illustrating an example of an image of an electronic component captured at a reference position A. FIG. It is a figure which shows an example of the image of the electronic component imaged at a certain specific position B. It is a figure which shows an example of the relationship between each position in XY plane, and deviation | shift amount (DELTA) X of an X-axis direction. It is a flowchart which shows a process when mounting the electronic component 2 on a board | substrate.

[Configuration of Mounting Device 100 and Configuration of Each Part]
FIG. 1 is a front view showing a mounting apparatus 100 according to the first embodiment of the present technology. FIG. 2 is a side view of the mounting apparatus 100, and FIG. 3 is a top view of the mounting apparatus 100. FIG. 4 is a block diagram illustrating a configuration of the mounting apparatus 100.

  As shown in these drawings, the mounting apparatus 100 includes a frame structure 10 and a transport unit 15 that is provided in the mounting apparatus 100 along the X-axis direction and transports the substrate 1 in the X-axis direction. Prepare. The mounting apparatus 100 is provided on both sides of the mounting apparatus 100 in the front-rear direction of the mounting apparatus 100 with the back-up unit 20 supporting the substrate 1 transported to a predetermined position by the transport unit 15 from below and the transport unit 15 therebetween. 2 is provided.

  The mounting apparatus 100 sucks the electronic component 2 supplied from the supply unit 25 and mounts the sucked electronic component 2 on the substrate 1 and the mounting head 30 in the XY plane. And a head moving mechanism 40 to be moved. In addition, the mounting apparatus 100 includes an imaging unit 36 that can move in the XY plane together with the mounting head 30 and images the electronic component 2 held by the mounting head 30 when the electronic component 2 is mounted.

  With reference to FIG. 4, the mounting apparatus 100 further includes a control unit 5, a storage unit 6, a display unit 7, an input unit 8, an air compressor 33, a turret driving unit 34, a nozzle driving unit 35, and the like.

  The frame structure 10 includes a base 11 provided at the bottom and a plurality of support columns 12 fixed to the base 11.

  The transport unit 15 (see FIGS. 2 and 3) includes a guide 16 disposed along the X-axis direction and a conveyor belt 17 provided on the inner surface side of the guide 16. The conveyance unit 15 drives the conveyor belt 17 to carry the substrate 1 and position it at a predetermined position, or discharge the substrate 1 on which the electronic component 2 has been mounted. The guide 16 is formed so that the upper end portion 16a is bent inward, and the upper end portion 16a of the guide 16 supports the substrate 1 from above when the substrate 1 is moved upward by the backup unit 20. can do.

  The backup unit 20 (see FIG. 2) includes a backup plate 21, a plurality of support pins 22 erected on the backup plate 21, and a plate lifting mechanism 23 that lifts and lowers the backup plate 21.

  When the board 1 on which the electronic component 2 is scheduled to be mounted is transported to a predetermined position by the transport unit 15, the backup plate 21 is moved upward by the plate lifting mechanism 23. When the backup plate 21 is moved upward, the substrate 1 is supported from below by the plurality of support pins 22, and the substrate 1 is pushed upward. When the substrate 1 is pushed upward, the substrate 1 is separated from the conveyor belt 17, and both ends of the substrate 1 are supported from above by the upper end portions 16 a of the guides 16. Thereby, the board | substrate 1 is pinched | interposed between the backup part 20 and the upper end part 16a of the guide 16, the board | substrate 1 is fixed to a predetermined position, and the electronic component 2 is mounted on the board | substrate 1 in this state.

  The supply unit 25 includes a plurality of tape cassettes 26 arranged along the X-axis direction. The tape cassette 26 can be attached to and detached from the mounting apparatus 100, and stores a carrier tape therein. Each of the tape cassettes 26 includes a reel around which the carrier tape is wound, and a feed mechanism that feeds the carrier tape by step feed. A carrier tape (not shown) accommodates electronic components 2 of the same type, such as resistors, capacitors, coils, and IC chips (ICs), for example. A supply window 27 is formed on the upper surface of the end of the tape cassette 26, and the electronic component 2 is supplied to the mounting head 30 through the supply window 27.

  The head moving mechanism 40 (see FIGS. 1 and 2) includes a Y-axis moving mechanism 41 that moves the mounting head 30 in the Y-axis direction, and an X-axis moving mechanism 46 that moves the mounting head 30 in the X-axis direction. Have.

  The Y-axis moving mechanism 41 has a Y-axis frame 42 provided along the Y-axis direction, and two rails 43 provided in parallel along the Y-axis direction below the Y-axis frame 42. The Y-axis moving mechanism 41 includes a Y-axis moving body 45 attached to the lower side of the two rails 43, and a Y-axis driving unit for driving the Y-axis moving body 45 along the Y-axis direction (see FIG. Not shown). The Y-axis moving body 45 is attached to the lower side of the two rails 43 via four slide members 44 that can slide on the two rails 43.

  The X-axis moving mechanism 46 is attached to the side surface of the Y-axis moving body 45 and is provided in parallel to the X-axis frame 47 provided along the X-axis direction and parallel to the side surface of the X-axis frame 47 along the X-axis direction. And two rails 48. The X-axis moving mechanism 46 includes an X-axis moving body 50 attached to two rails 48, and an X-axis driving unit (not shown) for driving the X-axis moving body 50 along the X-axis direction. ). The X-axis moving body 50 is attached to the side of the two rails 48 via four slide members 49 that can slide on the two rails 48.

  A support body 51 that supports both the mounting head 30 and the imaging unit 36 is attached to the side surface of the X-axis moving body 50. The support 51 includes a head support 52 that supports the mounting head 30 and an imaging unit support 53 that supports the imaging unit 36.

  Examples of the X-axis drive unit and the Y-axis drive unit include a ball screw drive mechanism, a belt drive mechanism, and a linear motor drive mechanism. In accordance with the driving of the X-axis drive unit and the Y-axis drive unit, the mounting head 30 and the imaging unit 36 supported by the support body 51 are integrally moved within the movement range in the XY plane.

  The mounting head 30 includes a turret 31 rotatably attached to a base shaft 54 provided on the support 51 and a plurality of suction nozzles 32 (attached to the turret 31 along the circumferential direction of the turret 31 ( Holding member). In the present embodiment, the number of mounting heads 30 is one, but the number of mounting heads 30 may be two or more. Further, in the present embodiment, the number of suction nozzles 32 is 12 (see FIG. 3), but the number of suction nozzles 32 is not particularly limited. For example, the number of suction nozzles 32 may be one.

  The turret 31 is rotatable with an oblique axis as a central axis of rotation. The turret 31 is rotated about the axis as a central axis by driving of the turret driving unit 34 (see FIG. 4).

  The suction nozzle 32 is attached to the turret 31 such that the axis of the suction nozzle 32 is inclined with respect to the rotation axis of the turret 31.

  Each of the suction nozzles 32 is supported so as to be movable along the axial direction with respect to the turret 31. The suction nozzle 32 is supported so as to be rotatable with respect to the turret 31. The suction nozzle 32 is moved along the axial direction (vertical direction) at a predetermined timing or rotated about the axis at a predetermined timing by driving of the nozzle driving unit 35 (see FIG. 4).

  Among the plurality of suction nozzles 32, the suction nozzle 32 positioned at the lowest position (the suction nozzle 32 positioned at the rightmost side in FIG. 1) has its axis line oriented in the vertical direction. Hereinafter, the position of the suction nozzle 32 in which the axis is oriented in the vertical direction is referred to as an operation position. The suction nozzle 32 located at the operation position is sequentially switched by the rotation of the turret 31.

  The suction nozzle 32 is connected to an air compressor 33 (see FIG. 4). The adsorption nozzle 32 can adsorb or desorb the electronic component 2 according to the switching of the negative pressure and the positive pressure of the air compressor 33.

  The imaging unit 36 (see FIG. 1) includes a first imaging unit 37 and a second imaging unit 38. The first imaging unit 37 images the suction nozzle 32 located at the highest position among the plurality of suction nozzles 32 (the suction nozzle 32 located on the left side in FIG. 1) from below via the mirror 39. Is arranged at a position where possible. The 2nd imaging part 38 is arrange | positioned in the position which can image the suction nozzle 32 located in the highest position among several suction nozzles 32 from a side. Hereinafter, the position of the suction nozzle 32 imaged by the imaging unit 36 is referred to as an imaging position. The suction nozzle 32 located at the imaging position is sequentially switched according to the rotation of the turret 31.

  The first imaging unit 37 and the second imaging unit 38 are configured by, for example, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), or the like. Although not shown, the imaging unit 36 further includes another imaging unit such as an imaging unit arranged downward to capture an alignment mark provided on the substrate 1. ing.

  The control part 5 is comprised by CPU (Central processing Unit), for example. The control unit 5 executes various calculations based on various programs stored in the storage unit 6 and controls each unit of the mounting apparatus 100 in an integrated manner. The processing of the control unit 5 will be described in detail later.

  The storage unit 6 includes a nonvolatile memory in which various programs necessary for the control of the control unit 5 are stored, and a volatile memory used as a work area for the control unit 5. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The display unit 7 includes a liquid crystal display, an EL (Electro-Luminescence) display, and the like, and displays various data on the screen. The input unit 8 includes, for example, a keyboard, a touch panel, and the like, and inputs various instructions from the operator.

[Description of operation]
Next, the operation of the mounting apparatus 100 will be described.

  Here, in the mounting apparatus 100 according to the present embodiment, the Y-axis moving body 45 attached to the lower side of the two rails 43 disposed on the lower side of the Y-axis frame 42 moves in the Y-axis direction. As a result, the mounting head 30 and the imaging unit 36 are integrally moved in the Y-axis direction. Similarly, when the X-axis moving body 50 attached to the side of the two rails 48 disposed on the side of the X-axis frame 47 moves in the X-axis direction, the mounting head 30 and the imaging unit 36 are moved. It is moved integrally in the X-axis direction.

  For example, it is assumed that there is an error in the distance between the two rails 48 disposed on the side surface of the X-axis frame 47 and the two rails 48 are not completely parallel. In addition, it is difficult to make the two rails 48 completely parallel due to a problem of mechanical accuracy. In such a case, when the X-axis moving body 50 is moved in the X-axis direction, the X-axis moving body 50 is deformed in accordance with the movement in the X-axis direction. Due to the influence, the support body 51 attached to the X-axis moving body 50 is deformed. When the support 51 is deformed, the relative positions of the mounting head 30 and the imaging unit 36 supported by the support 51 are changed.

  Similarly, it is assumed that there is an error in the distance between the two rails 43 disposed on the lower side of the Y-axis frame 42 and the two rails 43 are not completely parallel. Even in this case, when the Y-axis moving body 45 is moved in the Y-axis direction, the Y-axis moving body 45 is deformed. Then, the support 51 is not deformed due to the deformation of the Y-axis moving body 45, and the relative positions of the mounting head 30 and the imaging unit 36 supported by the support 51 are changed.

  That is, when the mounting head 30 and the imaging unit 36 move, the relative position between the mounting head 30 and the imaging unit 36 changes at each position within the movement range of the mounting head 30 and the imaging unit 36. In such a case, the suction position of the electronic component 2 with respect to the suction nozzle 32 cannot be accurately recognized, and as a result, the electronic component 2 cannot be mounted at an accurate position on the substrate 1. Note that the deformation of the support 51 based on the movement of the mounting head 30 and the imaging unit 36 may be caused by the mechanical accuracy of other portions of the head moving mechanism 40 instead of the rail.

  The mounting apparatus 100 according to the present embodiment executes a process for removing the influence of the change in the relative positional relationship between the mounting head 30 and the imaging unit 36 caused by the movement of the mounting head 30 and the imaging unit 36.

“Operation for Collecting Data on Relative Positional Relationship between Mounting Head 30 and Imaging Unit 36 at Each Position within the Movement Range of Mounting Head 30 and Imaging Unit 36”
In order to remove the influence of the change in the relative positional relationship between the mounting head 30 and the imaging unit 36, first, the mounting apparatus 100 performs each operation within the movement range prior to mounting the electronic component 2 on the substrate 1. Data on the relative positional relationship between the mounting head 30 and the imaging unit 36 is collected at the position.

  FIG. 5 and FIG. 6 are flowcharts showing processing when data on the relative positional relationship between the mounting head 30 and the imaging unit 36 is collected at each position within the movement range.

  With reference to FIG. 5, the control unit 5 moves the mounting head 30 and the imaging unit 36 in the XY directions by the head moving mechanism 40, and positions the mounting head 30 above the supply window 27 of the supply unit 25. Then, the control unit 5 sucks the electronic component 2 (holding material) by the suction nozzle 32 of the mounting head 30 (step 101). In step 101, the control unit 5 first controls the nozzle driving unit 35 to move the suction nozzle 32 located at the operation position downward, and then controls the air compressor 33 to control the pressure of the suction nozzle 32. Switch to negative pressure. The electronic component 2 is attracted to the tip of the suction nozzle 32 in accordance with the switching of the pressure to a negative pressure. Thereafter, the control unit 5 controls the nozzle driving unit 35 to move the suction nozzle 32 that has sucked the electronic component 2 upward.

  The object (holding material) sucked by the suction nozzle 32 in step 101 is not limited to the electronic component 2. For example, the object sucked by the suction nozzle 32 is a dummy part created by imitating the electronic part 2 specially for collecting data on the relative positional relationship between the mounting part and the imaging part 36. May be. Note that the object sucked by the suction nozzle 32 may be any object as long as it can be picked up by the suction nozzle 32 and can be picked up by the image pickup unit 36.

  Typically, the number of electronic components 2 sucked by the suction nozzle 32 in step 101 is one. After the electronic component 2 is sucked by the specific suction nozzle 32, the control unit 5 controls the turret driving unit 34 to rotate the turret 31 and position the suction nozzle 32 that sucks the electronic component 2 at the imaging position. deep.

  Next, the control unit 5 controls the head moving mechanism 40 to move the mounting head 30 and the imaging unit 36 to the reference position A within the moving range on the XY plane (step 102). FIG. 7 illustrates a state in which the mounting head 30 and the imaging unit 36 are located at the reference position A and a state in which the mounting head 30 and the imaging unit 36 are located at a position B that is a position other than the reference position. Has been.

  Here, the reference position will be described. This reference position is a position that serves as a reference for the relative positional relationship between the mounting unit and the imaging unit 36, and the reference position is used for the shift amount (ΔX, ΔY) between the mounting unit and the imaging unit 36. The

  In addition, the mounting accuracy of the reference position is already guaranteed. For example, before data on the relative positional relationship between the mounting head 30 and the imaging unit 36 is collected, the control unit 5 mounts the electronic component 2 on the substrate 1 with the mounting head 30 positioned at the reference position. To do. At this time, the control unit 5 images the position of the electronic component 2 mounted on the substrate 1 by an imaging unit (not shown) for imaging the alignment mark, and determines the position of the electronic component 2 on the substrate 1. recognize. And the control part 5 correct | amends the XY coordinate used for mounting of the electronic component 2 on the basis of the position of the electronic component 2 on the board | substrate 1. FIG. Thereby, the mounting accuracy at the reference position is guaranteed.

  When the control unit 5 moves the mounting head 30 and the imaging unit 36 to the reference position A, the first imaging unit 37 images the electronic component 2 from below via the mirror 39, and the electronic component 2 is picked up. Is determined (step 103). FIG. 8 is a diagram illustrating an example of an image of the electronic component 2 captured at the reference position A. As illustrated in FIG. In the example shown in FIG. 8, the case where the electronic component 2 is located at the center in the image is shown, but the electronic component 2 may be displaced from the center of the image.

  Next, the control part 5 determines whether the imaging frequency of the electronic component 2 has reached a specified value (step 104). The specified value is a value that determines the number of times the electronic component 2 is imaged, and this value is three or more times. If the number of imaging of the electronic component 2 is 3 or more, the center of rotation of the electronic component 2 can be calculated in step 106 described later.

  When the number of imaging has not reached the specified value (NO in Step 104), the control unit 5 controls the nozzle driving unit 35 to rotate the suction nozzle 32 by a predetermined amount (Step 105). And the control part 5 images the electronic component 2 again from the lower side by the 1st imaging part 37 (step 103). By such processing, a plurality of images of the electronic component 2 having different angles around the axis are acquired.

  When the imaging number of the electronic component 2 has reached the specified value (YES in step 104), the control unit 5 calculates the rotation center of the electronic component 2 based on the acquired plurality of images (step 106). The rotation center of the electronic component 2 calculated at this time corresponds to the rotation center of the suction nozzle 32. In this way, by calculating the center of rotation of the suction nozzle 32, the position of the suction nozzle 32 (which is hidden behind the electronic component 2 and cannot be seen) can be accurately determined. 30 and the relative positional relationship between the imaging unit 36 can be accurately determined.

  When the rotation center of the electronic component 2 is calculated, the control unit 5 stores the calculated position of the rotation center in the storage unit 6 as the reference position rotation center.

  Referring to FIG. 6, next, control unit 5 controls head moving mechanism 40 to move mounting head 30 and imaging unit 36 to the next position within the moving range (step 108) (FIG. 6). 7). The position where the mounting head 30 and the imaging unit 36 are moved next is set in advance.

  Next, the control unit 5 uses the first imaging unit 37 to image the electronic component 2 from below via the mirror 39, and determines the suction posture of the electronic component 2 (step 109). FIG. 9 is a diagram illustrating an example of an image of the electronic component 2 captured at a specific position B. As illustrated in FIG.

  7 to 9, when it is assumed that the positional relationship between the mounting head 30 and the imaging unit 36 is an invariable relationship within the movement range in the XY plane, the electronic component 2 in the image in FIG. The position and the position of the electronic component 2 in the image in FIG. 9 should be the same. However, actually, the support 51 is deformed in accordance with the movement of the mounting head 30 and the imaging unit 36 due to the mechanical accuracy of each member (for example, rail) constituting the head moving mechanism 40. As a result, the relative positional relationship between the mounting position and the imaging unit 36 changes at each position within the movement range. Thereby, the position of the electronic component 2 in the image shown in FIG. 9 is different from the position of the electronic component 2 shown in FIG.

  Once the electronic component 2 has been imaged, the control unit 5 next determines whether or not the number of times of imaging of the electronic component 2 has reached a specified value (step 110). This specified value is three times or more. The default value in step 110 is typically the same as the default value in step 104, but may be different.

  When the number of imaging has not reached the specified value (NO in step 110), the control unit 5 controls the nozzle driving unit 35 to rotate the suction nozzle 32 by a predetermined amount (step 111). And the control part 5 images the electronic component 2 again from the lower side by the 1st imaging part 37 (step 109).

  When the imaging number of the electronic component 2 has reached the specified value (YES in Step 110), the control unit 5 calculates the rotation center of the electronic component 2 based on the acquired plurality of images (Step 112).

  When the rotation center of the electronic component 2 is calculated, the control unit 5 calculates a difference (ΔX, ΔY) (deviation amount) between the calculated rotation center position and the rotation center of the reference position (step 113). Then, the control unit 5 associates the calculated difference (ΔX, ΔY) with the positions (X, Y) of the mounting head 30 and the imaging unit 36 at that time and stores them in the storage unit 6 (step). 114).

  Next, the control unit 5 determines whether difference data (ΔX, ΔY) has been acquired in the entire movable range of the mounting head 30 and the imaging unit 36 in the XY plane (step 115). When the position (X, Y) from which the difference data (ΔX, ΔY) is to be acquired still remains (NO in step 115), the control unit 5 controls the head moving mechanism 40 to control the mounting head 30 and the imaging. The part 36 is moved to the next position. The processing of step 108 to step 115 is repeated until difference data (ΔX, ΔY) (deviation amount) is acquired in the entire movable range.

  When the difference data (ΔX, ΔY) is acquired in the entire movable range of the mounting head 30 and the imaging unit 36 (YES in step 115), the control unit 5 ends the process. FIG. 10 shows an example of the relationship between each position on the XY plane and the amount of deviation ΔX in the X-axis direction. Although not shown, the relationship between each position on the XY plane and the amount of deviation ΔY in the Y-axis direction is similar to the example shown in FIG.

"Operation when mounting electronic component 2 on board 1"
Next, an operation when the electronic component 2 is mounted on the substrate 1 will be described. FIG. 11 is a flowchart showing processing when the electronic component 2 is mounted on the substrate 1.

  First, the control unit 5 positions the mounting head 30 above the supply window 27 of the supply unit 25 and sucks the electronic component 2 by the suction nozzle 32 positioned at the operation position (step 201). Next, the control unit 5 determines whether all the electronic components 2 scheduled to be sucked in one process are sucked by the suction nozzle 32 (step 202).

  When the electronic component 2 to be picked up by the suction nozzle 32 remains (NO in step 202), the control unit 5 controls the turret drive unit 34 to rotate the turret 31 and the suction nozzle 32 located at the operation position. Are switched (step 203). And the control part 5 adsorb | sucks the electronic component 2 with the adsorption | suction nozzle 32 newly located in the operation position (step 202).

  When all the electronic components 2 scheduled to be sucked in one process are picked up by the suction nozzle 32 (YES in Step 202), the control unit 5 proceeds to the next Step 204. In step 204, the control unit 5 controls the head moving mechanism 40 to start moving the mounting head 30 and the imaging unit 36 toward the substrate 1 side.

  Next, the control unit 5 uses the time during which the mounting head 30 and the imaging unit 36 are moved toward the substrate 1 side to capture the electronic component 2 sucked by the suction nozzle 32 located at the imaging position. The image is picked up by 36 (step 205). At this time, the control unit 5 images the electronic component 2 from the lower side through the mirror 39 by the first imaging unit 37 and images the electronic component 2 from the side by the second imaging unit 38.

  Next, the control unit 5 stores the position coordinates (X, Y) of the mounting head 30 and the imaging unit 36 when the electronic component 2 is imaged in the storage unit 6 (step 206).

  Next, the control unit 5 recognizes the suction posture of the electronic component 2 based on the image captured by the imaging unit 36 (step 207). In step 207, the control unit 5 determines the suction position of the electronic component 2 with respect to the suction nozzle 32, the angle of the electronic component 2 around the axis of the suction nozzle 32, and the like based on the image captured from the lower side of the electronic component 2. recognize. Further, the control unit 5 recognizes whether or not the electronic component 2 is sucked in a standing state by the suction nozzle 32 based on an image obtained by imaging the electronic component 2 from the side. In addition, when the suction position of the electronic component 2 with respect to the suction nozzle 32 is inappropriate, or when the electronic component 2 is sucked in a standing state by the suction nozzle 32, the control unit 5 has a suction failure. And processing such as discarding the electronic component 2 is executed.

  When the suction posture of the electronic component 2 is recognized, the control unit 5 corrects the mounting position of the electronic component 2 on the substrate 1 based on the recognized suction posture of the electronic component 2 (step 208). The correction process executed in step 208 is a correction process that is generally performed.

  Next, the control unit 5 uses the correction amount (ΔX, ΔY) corresponding to the coordinates (X, Y) of the mounting head 30 and the imaging unit 36 when the electronic component 2 is imaged (see FIG. 10), and the electronic component 2 is further corrected (step 209). As a result, the influence that the relative positional relationship between the mounting head 30 and the imaging unit 36 changes at each position within the movement range in the XY plane is removed, and the mounting position on the substrate 1 is accurately determined. Can be calculated. The order of the correction processing in step 208 (normal correction processing) and the correction processing in step 209 (correction processing unique to the present technology) may be reversed.

  Next, the control unit 5 determines whether or not all the electronic components 2 sucked by the suction nozzle 32 have been imaged (step 210). When the electronic component 2 to be imaged remains (NO in step 210), the control unit 5 controls the turret driving unit 34 to rotate the turret 31 and switch the suction nozzle 32 located at the image capturing position (step 211). ). And the control part 5 images the electronic component 2 attracted | sucked by the suction nozzle 32 newly located in the imaging position by the imaging part 36 (step 205). Thereafter, the processing from step 205 to step 209 is executed for all the electronic components 2 sucked by the suction nozzle 32.

  When all the electronic components 2 sucked by the suction nozzle 32 are picked up by the image pickup unit 36 and the mounting position of the electronic component 2 is corrected (YES in step 210), the control unit 5 proceeds to the next step 212. In step 212, the control unit 5 determines whether or not the mounting head 30 has arrived at the mounting position of the electronic component 2 that is initially scheduled to be mounted. When it arrives (YES in step 212), the control unit 5 controls the head moving mechanism 40 to stop the movement of the mounting head 30 and the imaging unit 36 (step 213).

  Next, the control unit 5 mounts the electronic component 2 sucked by the suction nozzle 32 located at the operation position on the substrate 1 (step 214). At this time, the control unit 5 controls the nozzle driving unit 35 to move the suction nozzle 32 located at the operation position downward, and then controls the air compressor 33 to change the suction nozzle 32 from negative pressure to positive pressure. By switching, the electronic component 2 is mounted on the substrate 1. Before the suction nozzle 32 is moved downward, the suction nozzle 32 of the electronic component 2 is rotated around the axis based on the suction posture recognized in step 207, and the angle around the Z axis of the electronic component 2 is adjusted. Is done.

  In the present embodiment, since the mounting position of the electronic component 2 on the substrate 1 can be accurately calculated, the electronic component 2 can be mounted at an accurate position on the substrate 1. In recent years, miniaturization of the electronic component 2 has progressed. Under such circumstances, accurate mounting of the electronic component 2 as in the present technology is particularly effective.

  When the electronic component 2 is mounted on the substrate 1, the control unit 5 determines whether all the electronic components 2 held by the mounting head 30 are mounted on the substrate 1 (step 215). When the electronic component 2 to be mounted remains (NO in step 215), the control unit 5 controls the head moving mechanism 40 toward the mounting position of the electronic component 2 scheduled to be mounted next. The mounting head 30 and the imaging unit 36 are started to move (step 216).

  Next, the control unit 5 uses the time during which the mounting head 30 and the imaging unit 36 are moving to rotate the turret 31 and switch the suction nozzle 32 located at the operation position (step 217). Then, the control unit 5 determines whether or not the mounting head 30 has arrived at the next mounting position. Mounting on the substrate 1 (steps 212 to 214).

  Then, when all the electronic components 2 held by the mounting head 30 are mounted on the substrate 1 (YES in Step 215), the control unit 5 ends the process.

[Action etc.]
As described above, in the mounting apparatus 100 according to the present technology, prior to mounting the electronic component 2, the mounting unit and the imaging unit at each position within the movement range of the mounting head 30 and the imaging unit 36 on the XY plane in advance. A relative shift amount (ΔX, ΔY) with respect to the portion 36 is calculated. Then, when the electronic component 2 is mounted, the mounting position of the electronic component 2 is corrected based on the calculated shift amount (ΔX, ΔY). Therefore, even when the relative positional relationship between the mounting unit and the imaging unit 36 changes at each position within the movement range, the electronic component 2 can be mounted at an accurate position on the substrate 1. .

<Various modifications>
In the above description, the electronic component 2 (or the dummy component) held by the suction nozzle 32 when collecting the deviation amount (ΔX, ΔY) at each position within the movement range of the mounting head 30 and the imaging unit 36. Etc.) has been described. On the other hand, the object to be imaged by the imaging unit 36 when collecting data on the deviation amount may be the suction nozzle 32 itself (the mounting head itself).

  In the above description, when calculating the shift amount (ΔX, ΔY) at each position within the movement range of the mounting head 30 and the imaging unit 36, the suction nozzle 32 is rotated at each position, and the rotation center of the electronic component 2 is calculated. In the above description, the shift amount is calculated based on the rotation center. By such processing, the amount of deviation can be accurately calculated, but such processing does not necessarily have to be executed. For example, the position of the electronic component 2 (dummy component, suction nozzle 32) may be determined at each position without rotating the suction nozzle 32, and the shift amount may be determined.

  In the above description, the case where the mounting position of the electronic component 2 is corrected based on both ΔX (first deviation amount) and ΔY (second deviation amount) has been described. Of ΔX and ΔY, Based on one, the mounting position of the electronic component 2 may be corrected.

  In the above description, using the time during which the mounting head 30 and the imaging unit 36 are moved from the supply unit 25 onto the substrate 1, the electronic component 2 is imaged within this time, and the mounting position of the electronic component 2 is determined. The case where the correction process (steps 205 to 209) is executed has been described. On the other hand, this process can be executed when the electronic component 2 is sucked by the mounting head 30, or can be executed after the mounting head 30 is moved onto the substrate 1.

  In the above description, the suction nozzle 32 has been described as an example of the holding member that holds the electronic component 2, but the holding member is not limited to the suction nozzle 32. For example, the holding member may be a holding member of a type that holds and holds the electronic component 2 from both sides by a mechanical mechanism.

  In the above description, the mounting head 30 and the imaging unit 36 have been described as being movable in both the X-axis direction and the Y-axis direction within the XY plane. However, the present technology can also be applied to a form in which the mounting head 30 and the imaging unit 36 move in one of the X-axis direction and the Y-axis direction (a form in which the movement range is one direction).

This technique can also take the following composition.
(1) A mounting part that is movable within a moving range and that holds electronic components and mounts on a substrate;
An imaging unit that is movable with the mounting unit and that images the electronic component held by the mounting unit when the electronic component is mounted;
Prior to mounting the electronic component, the mounting unit or the holding object held by the mounting unit is imaged by the imaging unit at a different position in the moving range, and the movement is performed based on an image obtained by imaging. A control unit that calculates a relative shift amount between the mounting unit and the imaging unit at each position within a range, and corrects the mounting position of the electronic component based on the shift amount when mounting the electronic component. A mounting apparatus comprising:
(2) The mounting device according to (1) above,
The mounting portion is rotatable and has a holding member that holds the electronic component and mounts it on the substrate,
The control unit rotates the holding member at each position within the moving range, images the holding member or a holding object held by the holding member a plurality of times, and based on the acquired plurality of images. Then, a rotation center of the holding member at each position is calculated, and a relative shift amount between the mounting unit and the imaging unit at each position is calculated based on the rotation center.
(3) The mounting device according to (2) above,
The control unit is imaged at a reference position rotation center that is a rotation center of the holding member calculated based on the plurality of images captured at a reference position within the movement range, and at a position other than the reference position. A mounting device that calculates a difference from the rotation center of the holding member calculated based on a plurality of images as the shift amount.
(4) The mounting device according to any one of (1) to (3),
The control unit includes at least one of a first shift amount in a first direction and a second shift amount in a second direction orthogonal to the first direction between the mounting device and the imaging unit. A mounting apparatus that corrects the mounting position of the electronic component based on the above.
(5) A mounting part that is movable within a moving range, that is mounted on a substrate while holding an electronic component, and that is movable together with the mounting part, and that is held by the mounting part when the electronic component is mounted. Prior to mounting of the electronic component by a mounting apparatus having an imaging unit that images the component, the imaging unit images the mounting unit or a holding object held by the mounting unit at different positions within the moving range by the imaging unit. And
Based on the image obtained by imaging, a relative shift amount between the mounting unit and the imaging unit at each position within the moving range is calculated,
A mounting position correction method that corrects the mounting position of the electronic component based on the deviation amount when mounting the electronic component.
(6) A mounting unit that is movable within a moving range, that is mounted on a substrate while holding an electronic component, and that is movable together with the mounting unit, and that is held by the mounting unit when the electronic component is mounted. In a mounting apparatus having an imaging unit for imaging a component,
Prior to mounting the electronic component, the imaging unit images the mounting unit or a holding object held by the mounting unit at different positions within the moving range;
Calculating a relative shift amount between the mounting unit and the imaging unit at each position within the movement range based on an image obtained by imaging;
Correcting the mounting position of the electronic component based on the deviation amount when mounting the electronic component.
(7) A mounting unit that is movable within a moving range, that is mounted on a substrate while holding an electronic component, and that is movable together with the mounting unit, and that is held by the mounting unit when the electronic component is mounted. Prior to mounting of the electronic component by a mounting apparatus having an imaging unit that images the component, the imaging unit images the mounting unit or a holding object held by the mounting unit at different positions within the moving range by the imaging unit. And
Based on the image obtained by imaging, a relative shift amount between the mounting unit and the imaging unit at each position within the moving range is calculated,
A method for manufacturing a substrate, wherein the electronic component is mounted on the substrate by correcting the mounting position of the electronic component based on the shift amount when mounting the electronic component.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Electronic component 5 ... Control part 15 ... Conveyance part 20 ... Backup part 25 ... Supply part 30 ... Mounting head 31 ... Turret 32 ... Adsorption nozzle 36 ... Imaging part 37 ... 1st imaging part 38 ... 2nd Imaging unit 39 ... Mirror 40 ... Head moving mechanism 51 ... Support body 100 ... Mounting device

Claims (7)

A mounting part that is movable within a moving range, holds electronic components and is mounted on a substrate;
An imaging unit that is movable with the mounting unit and that images the electronic component held by the mounting unit when the electronic component is mounted;
Wherein prior to the mounting of electronic components, to calculate the relative shift amount between the imaging section and the mounting section at each position in the previous SL within the moving range, the when the electronic component mounting, the calculated the moving A control unit that corrects the mounting position of the electronic component based on the amount of deviation at each position within a range, and
The control unit includes an image of the mounting unit captured at a reference position within the movement range by the imaging unit, and an image of the mounting unit captured at each position within the movement range by the imaging unit. Or the image of the holding object held by the mounting unit photographed at the reference position by the imaging unit, and the mounting unit photographed at each position within the moving range by the imaging unit The deviation amount is calculated by comparing each of the images of the holding object held by the
Mounting device. The mounting apparatus according to claim 1,
The mounting portion is rotatable and has a holding member that holds the electronic component and mounts it on the substrate,
The control unit rotates the holding member at each position within the moving range, images the holding member or a holding object held by the holding member a plurality of times, and based on the acquired plurality of images. A mounting device that calculates a rotation center of the holding member at each position. The mounting apparatus according to claim 2,
Wherein the control unit includes a reference position the center of rotation as the rotational axis of the retaining member which is calculated based on the plurality of images captured by said reference position within the moving range is imaged at a position other than the reference position A mounting apparatus that calculates a difference from the rotation center of the holding member calculated based on the plurality of images as the shift amount. The mounting apparatus according to claim 1,
The control unit includes at least one of a first shift amount in the first direction between the mounting unit and the imaging unit and a second shift amount in a second direction orthogonal to the first direction. A mounting apparatus that corrects the mounting position of the electronic component based on the above. A mounting unit that is movable within a moving range, holds an electronic component and is mounted on a substrate, and is movable together with the mounting unit, and images the electronic component held by the mounting unit when the electronic component is mounted. Prior to mounting of the electronic component by the mounting device having the imaging unit, the imaging unit captures an image of the mounting unit or a holding object held by the mounting unit at a reference position within the movement range ,
Prior to mounting the electronic component, the mounting unit or the holding object held by the mounting unit is imaged by the imaging unit at each position within the moving range,
The image of the mounting unit taken at the reference position obtained by imaging is compared with each of the images of the mounting unit taken at each position within the moving range, or obtained by imaging Comparing the image of the holding object captured by the mounting unit taken at the reference position with each of the images of the holding object held by the mounting unit taken at each position within the moving range. And calculating a relative shift amount between the mounting unit and the imaging unit at each position within the movement range,
A mounting position correction method that corrects the mounting position of the electronic component based on the deviation amount when mounting the electronic component. A mounting unit that is movable within a moving range, holds an electronic component and is mounted on a substrate, and is movable together with the mounting unit, and images the electronic component held by the mounting unit when the electronic component is mounted. A mounting apparatus having an imaging unit
Prior to mounting the electronic component, the imaging unit images the mounting unit or a holding object held by the mounting unit at a reference position within the moving range ;
Prior to mounting the electronic component, the imaging unit images the mounting unit or a holding object held by the mounting unit at each position within the moving range;
The image of the mounting unit taken at the reference position obtained by imaging is compared with each of the images of the mounting unit taken at each position within the moving range, or obtained by imaging Comparing the image of the holding object captured by the mounting unit taken at the reference position with each of the images of the holding object held by the mounting unit taken at each position within the moving range. And calculating a relative shift amount between the mounting unit and the imaging unit at each position within the moving range;
Correcting the mounting position of the electronic component based on the deviation amount when mounting the electronic component. A mounting unit that is movable within a moving range, holds an electronic component and is mounted on a substrate, and is movable together with the mounting unit, and images the electronic component held by the mounting unit when the electronic component is mounted. Prior to mounting of the electronic component by the mounting device having the imaging unit, the imaging unit captures an image of the mounting unit or a holding object held by the mounting unit at a reference position within the movement range ,
Prior to mounting the electronic component, the mounting unit or the holding object held by the mounting unit is imaged by the imaging unit at each position within the moving range,
The image of the mounting unit taken at the reference position obtained by imaging is compared with each of the images of the mounting unit taken at each position within the moving range, or obtained by imaging Comparing the image of the holding object captured by the mounting unit taken at the reference position with each of the images of the holding object held by the mounting unit taken at each position within the moving range. And calculating a relative shift amount between the mounting unit and the imaging unit at each position within the movement range,
A method for manufacturing a substrate, wherein the electronic component is mounted on the substrate by correcting the mounting position of the electronic component based on the shift amount when mounting the electronic component.

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