JP2012038834A - Calibration method of electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a calibration method of an electronic component mounting apparatus capable of mounting an electronic component based on accurate control data even when a distance between an installation head and imaging means is large.SOLUTION: After positioning a substrate type gauge 50 with a calibration mark M using a substrate conveyance path 12, a substrate camera 16 mounted on an installation head 15 recognizes an image of the mark M on the substrate type gauge 50 to obtain a calibration value of control data for the installation head 15 when the substrate camera 16 is positioned above the substrate type gauge 50. Then, while mounting a plate type gauge 60 with a calibration mark m on an opposite installation head 15 and moving the mark m above an expansion region R set outside the substrate type gauge 50, the substrate camera 16 recognizes an image of the mark m to obtain a calibration value of control data for the installation head 15 when the substrate camera 16 is positioned above the expansion region R.

Description

  The present invention relates to a calibration method for an electronic component mounting apparatus that calibrates control data of a mounting head.

  The electronic component mounting apparatus mounts an electronic component on a substrate transported and positioned by a substrate transport path provided on a base by a mounting head that is moved in a horizontal plane by a robot mechanism. In such an electronic component mounting apparatus, it is normal that a positional deviation occurs between the position on the control data of the mounting head and the actual position due to an assembly error between members constituting the robot mechanism. Therefore, it is possible to calibrate the control data so that the positional deviation amount between the position on the control data and the actual position is canceled, and to control the operation of the mounting head with accurate control data. Calibration to be performed is performed before the start of substrate production.

  As a method for performing such calibration, for example, an image pickup means (camera) provided on the mounting head with a plurality of calibration marks provided at equal intervals on the upper surface of the substrate type gauge positioned by the substrate conveyance path. By comparing the position of the mark obtained by the image recognition (the position of the mark with reference to the imaging means) and the position on the control data of the imaging means, the difference between the two positions is recognized. There is known a technique in which the amount is calculated and canceled (Patent Document 1). In this case, since the adjacent marks provided on the substrate type gauge are provided at equal intervals, a straight line (which is easy to process and has high accuracy for the area between the adjacent marks) There is an advantage that the control data of the mounting head can be calibrated by (linear) interpolation.

JP 2000-353899 A

  However, in the above-described conventional calibration method, when the imaging unit is located above the area outside the substrate type gauge, there is no calibration mark immediately below the imaging unit. The head control data could not be calibrated. For this reason, for example, there is a large interval between the mounting head and the imaging means, and the mounting head is located above the substrate gauge, but the imaging means is located above an area outside the substrate gauge. If there is a moving area of the head, it may not be possible to mount the electronic component with accurate control data even in the area where the mounting head should mount the electronic component on the board. There has been a problem that the mounting accuracy of components on the board may be reduced.

  Therefore, the present invention provides a calibration method for an electronic component mounting apparatus that enables mounting of an electronic component using accurate control data even when the interval between the mounting head and the imaging means is large. For the purpose.

  The electronic component mounting apparatus calibration method according to claim 1 is provided with a base, a substrate transport path that is provided on the base and transports and positions the substrate, and is movably provided with respect to the base. A calibration method for an electronic component mounting apparatus comprising a mounting head for mounting an electronic component on a substrate positioned by a transport path, wherein a substrate type gauge provided with a calibration mark on an upper surface is provided by the substrate transport path. The imaging unit is positioned above the substrate type gauge by recognizing an image by the imaging step attached to the mounting head and the calibration mark on the substrate type gauge positioned by the substrate transport path. When obtaining the calibration value of the control data of the mounting head, and moving the plate type gauge with calibration marks on the upper surface relative to the base The plate mold is moved while the calibration mark on the plate type gauge is moved above the extended area set outside the substrate type gauge by the moving means for which the control data is calibrated and the moving means for which the control data is calibrated. Obtaining a calibration value of the control data of the mounting head when the imaging unit is positioned above the expansion region by recognizing an image of a calibration mark on the gauge by the imaging unit.

  The electronic component mounting apparatus calibration method according to claim 2 is the electronic component mounting apparatus calibration method according to claim 1, wherein the electronic component mounting apparatus includes two mounting heads that operate independently of each other. And the moving means comprises a mounting head on a side opposite to a side on which the calibration value of the control data is to be obtained using the plate type gauge.

  According to the present invention, it is possible to calibrate the control data of the mounting head when the imaging unit is positioned above the extended region set outside the substrate type gauge, so that the interval between the mounting head and the imaging unit is large. The mounting head is located above the board-type gauge, but the imaging means is located above the area outside the board-type gauge. Can be implemented.

The top view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention The flowchart which shows the flow of the component mounting process which the electronic component mounting apparatus in one embodiment of this invention performs The top view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The flowchart which shows the flow of the calibration execution process which the electronic component mounting apparatus in one embodiment of this invention performs 1 is a partially enlarged plan view of an electronic component mounting apparatus according to an embodiment of the present invention. (A) (b) The figure which shows the mark in the imaging visual field of the board | substrate camera with which the electronic component mounting apparatus in one embodiment of this invention is provided. 1 is a partially enlarged plan view of an electronic component mounting apparatus according to an embodiment of the present invention. 1 is a partially enlarged plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

  Embodiments of the present invention will be described below with reference to the drawings. An electronic component mounting apparatus 1 shown in FIG. 1 and FIG. 2 is a kind of electronic component mounting apparatus that constitutes an electronic component mounting line for producing a mounting board. After carrying out the component mounting step of mounting the component (electronic component) 4 on the electrode 3 on the surface of the substrate 2 (arrow A shown in FIG. 1) carried in from a screen printing machine or other electronic component mounting apparatus 1), The operation of carrying out the board 2 to another electronic component mounting apparatus (for example, another electronic component mounting apparatus 1 or a reflow furnace) on the downstream side (not shown) is continuously executed. Hereinafter, for convenience of explanation, the conveyance direction of the board 2 (the left-right direction in FIG. 1) in the electronic component mounting apparatus 1 is the X-axis direction, and the horizontal plane direction orthogonal to the X-axis direction is the Y-axis direction (up and down in FIG. 1). Direction), and the vertical direction is the Z-axis direction. The Y-axis direction is the front-rear direction of the electronic component mounting apparatus 1, and the X-axis direction is the lateral (left-right) direction of the electronic component mounting apparatus 1. Further, in the front-rear direction, the operator OP (FIG. 1) of the electronic component mounting apparatus 1 performs the operation on the electronic component mounting apparatus 1 (the lower side in the drawing in FIG. 1) in front of the electronic component mounting apparatus 1, The opposite side (upper side in the drawing) is the rear of the electronic component mounting apparatus 1.

  1 and 2, an electronic component mounting apparatus 1 according to the present embodiment includes a base 11 and board transport that is provided on the base 11 and transports and positions the board 2 in a horizontal plane direction (X-axis direction). It is movable with respect to the base 11 via a path 12, a plurality of tape feeders 13 as electronic component supply units that are installed on the base 11 and supply the parts 4, and a robot mechanism 14 provided on the base 11. And two mounting heads 15 (front mounting head 15a and rear mounting head 15b) for mounting the component 4 picked up from the tape feeder 13 on the substrate 2 positioned by the substrate transport path 12.

  In FIG. 1 and FIG. 2, the substrate transport path 12 is composed of a pair of belt conveyors, and transports (loads) the substrate 2 sent from another electronic component mounting apparatus (for example, a screen printing machine) (not shown) on the upstream side. 1 (arrow A shown in FIG. 1), and is positioned at the center work position of the base 11 (position shown in FIG. 1), and transports (unloads) the substrate 2 on which the component mounting process by the two mounting heads 15 has been executed. ) And sent to another electronic component mounting apparatus (not shown) on the downstream side.

  1 and 2, the robot mechanism 14 includes two beam-like left and right Y-axis tables 14a provided on the left and right ends of the base 11 so as to extend in the Y-axis direction so as to straddle the substrate transport path 12. Both ends are supported by two Y-axis tables 14a and are movable in the Y-axis direction. The front and rear two beam-shaped X-axis tables 14b extending in the X-axis direction and each X-axis table 14b move in the X-axis direction. It consists of two plate-like moving stages 14c provided front and rear, and a front mounting head 15a is attached to the front moving stage 14c, and a rear mounting head 15b is attached to the rear moving stage 14c. . Each mounting head 15 is provided with a plurality of suction nozzles 15 </ b> N extending downward so as to be able to move up and down and rotate around the vertical axis (Z axis).

  1 and 2, each of the two front and rear moving stages 14c included in the robot mechanism 14 is provided with a substrate camera 16 with the imaging field of view facing downward, and sandwiches the substrate conveyance path 12 on the base 11. In each of the two regions on the base 11 facing each other, a component camera 17 having an imaging field of view upward is provided. As can be seen from FIGS. 1 and 2, in the electronic component mounting apparatus 1 according to the present embodiment, the distance between the mounting head 15 and the board camera 16 attached to the same moving stage 14 c is the front-rear direction (Y-axis direction) of the base 11. ) To some extent.

  In FIG. 1 and FIG. 2, the plurality of tape feeders 13 are provided side by side in the X-axis direction at both front and rear ends of the base 11 that face each other across the substrate transport path 12. The component 4 is continuously supplied to the component supply port 13a provided at the end portion on the component side (board conveyance path 12 side).

  The substrate transport path 12 is transported and positioned by the substrate transport path 12 by the work execution control unit 40a (FIG. 3) of the control device 40 (FIG. 3) provided in the electronic component mounting apparatus 1 as a substrate transport path drive unit including an actuator (not shown). 41 (FIG. 3) is performed, and the operation of supplying the component 4 to the component supply port 13a by each tape feeder 13 is performed by the work execution control unit 40a of the control device 40. This is done by controlling the operation of the drive unit 42 (FIG. 3).

  The movement operation of each mounting head 15 in the horizontal plane by the robot mechanism 14 is performed by the operation control (Y-axis table 14a) of the robot mechanism driving unit 43 (FIG. 3) including an actuator (not shown) by the work execution control unit 40a of the controller 40. The movement of each X-axis table 14b in the Y-axis direction and the movement control of each movement stage 14c in the X-axis direction with respect to each X-axis table 14b) are performed to move the suction nozzle 15N up and down with respect to the mounting head 15. The rotation operation about the vertical axis is performed when the work execution control unit 40a of the control device 40 controls the operation of the nozzle drive unit 44 (FIG. 3) including an actuator (not shown). Further, the suction and detachment operation of the component 4 by each suction nozzle 15N is performed by the work execution control unit 40a of the control device 40 controlling the operation of the vacuum pressure supply unit 45 (FIG. 3) including an actuator (not shown). This is done by supplying a vacuum pressure inside and releasing the vacuum pressure.

  The imaging operation by the board camera 16 and the component camera 17 is controlled by the work execution control unit 40a of the control device 40 (FIG. 3). Image data obtained by the imaging operations of the board camera 16 and the component camera 17 is captured and stored in the image data storage unit 46 (FIG. 3), and is image-recognized by the image recognition unit 40b (FIG. 3) included in the control device 40. The

  When the control device 40 of the electronic component mounting apparatus 1 executes a component mounting process on the board 2, it is detected by a detection unit (not shown) from another electronic component mounting apparatus upstream of the electronic component mounting apparatus 1 to the board transport path 12. When it is detected that the board 2 has been loaded, the board transport path 12 is actuated to carry the board 2 into the electronic component mounting apparatus 1 (board loading process in step ST1 shown in FIG. 4). When the means detects that the substrate 2 loaded in the substrate transport path 12 has reached a predetermined work position, the operation of the substrate transport path 12 is stopped and the substrate 2 is positioned (the substrate in step ST2 shown in FIG. 4). Positioning process).

  In this substrate positioning step, the control device 40 controls the operation of the robot mechanism drive unit 43 to move the substrate camera 16 (the front mounting head 15a or the rear mounting head 15b) above the substrate 2 to thereby move the substrate 2 An image of a substrate mark (not shown) provided on is taken. Then, by causing the image recognition unit 40b to recognize the obtained image of the substrate mark, the positional deviation of the substrate 2 from the normal work position is obtained.

  When the above-described substrate positioning step is completed, the control device 40 performs operation control of the robot mechanism driving unit 43, moves the mounting head 15 above the tape feeder 13, and performs operation control of the nozzle driving unit 44. The suction nozzle 15N of the mounting head 15 is brought into contact with the component 4 supplied to the component supply port 13a of the tape feeder 13, and the vacuum pressure is supplied to the suction nozzle 15N by controlling the operation of the vacuum pressure supply unit 45. Then, the component 4 is picked up (sucked) by the suction nozzle 15N (pickup step in step ST3 shown in FIG. 4).

  When the control device 40 picks up the component 4 by the suction nozzle 15N, the control device 40 controls the operation of the robot mechanism drive unit 43, and moves the mounting head 15 so that the picked-up component 4 passes above the component camera 17. The part 17 is imaged by the camera 17. Then, the image recognition unit 40b recognizes the obtained image, checks whether there is an abnormality (deformation, defect, etc.) of the component 4, and obtains a displacement (suction displacement) of the component 4 with respect to the suction nozzle 15N ( Image recognition step in step ST4 shown in FIG.

  When the image recognition process in step ST4 is completed, the control device 40 controls the operation of the robot mechanism drive unit 43 and moves the mounting head 15 so that the component 4 picked up by the suction nozzle 15N moves above the substrate 2. . Then, the control device 40 controls the operation of the nozzle drive unit 44 to place the picked-up component 4 on the target mounting position on the substrate 2 (on the electrode 3 at the target mounting position, upstream of the electronic component mounting apparatus 1). The solder is printed by a screen printing machine arranged on the side), and the vacuum pressure supply to the suction nozzle 15N is released by controlling the operation of the vacuum pressure supply unit 45, and the component 4 is mounted on the substrate. 2 (part mounting step of step ST5 shown in FIG. 4).

  Here, when mounting the component 4 on the substrate 2, the control device 40 detects the positional deviation of the substrate 2 obtained during the execution of the substrate positioning step in step ST2, and the component 4 obtained during the execution of the image recognition step in step ST4. The position correction (including the rotation correction) of the suction nozzle 15N with respect to the substrate 2 is performed so that the suction deviation of the second position is corrected.

  When the component mounting process in step ST5 is completed, the control device 40 determines whether or not the mounting of all the components 4 to be mounted on the substrate 2 is completed by the mounting head 15 (mounting in step ST6 shown in FIG. 4). End determination step). As a result, when the mounting of all the components 4 to be mounted on the board 2 by the mounting head 15 has not been completed, the control device 40 repeatedly executes the steps ST3 to ST5. When the mounting of all the components 4 to be mounted on the board 2 has been completed, the board 2 is carried out of the electronic component mounting apparatus 1 through the board conveying path 12 (board unloading in step ST7 shown in FIG. 4). Process).

  When the board unloading process in step ST7 is completed, the control device 40 determines whether or not the board 2 on which the component 4 is to be mounted still remains (the board presence / absence determining process in step ST8 shown in FIG. 4). As a result, when the board 2 on which the component 4 is to be mounted remains, the control device 40 returns to step ST1 to carry in a new board 2, and the board 2 on which the component 4 is to be mounted remains. If not, the series of component mounting process is terminated.

  The component mounting process by the electronic component mounting apparatus 1 is performed according to the procedure described above, but is grasped when the control device 40 moves the mounting head 15 by controlling the operation of the robot mechanism driving unit 43 from the work execution control unit 40a. The position of the mounting head 15 is a position on the control data obtained from the position of the X-axis table 14b relative to the Y-axis table 14a and the position of the moving stage 14c relative to the X-axis table 14b in the robot mechanism 14. However, since the robot mechanism 14 has an assembly error between its constituent members, the position on the control data of the mounting head 15 does not necessarily coincide with the actual position of the mounting head 15, and the control is performed. In order to mount the component 4 on the board 2 by the apparatus 40 accurately according to the control data, the amount of positional deviation between the position on the control data of the mounting head 15 and the actual position is obtained. It is necessary to calibrate the control data so that this is canceled.

  Hereinafter, the procedure of the calibration execution process for calibrating the control data of the two mounting heads 15 will be described.

  In the calibration execution step, the substrate type gauge 50 and the plate type gauge 60 shown in FIGS. 5 and 6 are used. The board-type gauge 50 is a board-like (plate-like) member having a size substantially equal to that of the largest board 2 that can be carried and positioned by the board carrying path 12, and has a plurality of calibrations on its upper surface. The marks M are provided in a matrix that spreads in the X direction and the Y axis direction at equal intervals.

  The plate-type gauge 60 is attached to the mounting head 15 on the side opposite to the mounting head 15 to be calibrated among the two front and rear mounting heads 15 (to the moving stage 14c to which the mounting head 15 is attached). ) It is detachably attached, and is attached to the lower part of the moving stage 14c and extends vertically downward, and extends horizontally from the lower end of the vertical part 61 toward the mounting head 15 to be calibrated. A horizontal portion 62 is provided. The horizontal portion 62 is provided with one calibration mark m, and this calibration mark m is provided at a position where the relative position with respect to the mounting head 15 to which the plate type gauge 60 is attached can be grasped. Yes. Here, it is important to know the relative position of the calibration mark m with respect to the mounting head 15, and it does not matter where the calibration mark m is provided on the horizontal portion 62. This is because if the position of the mounting head 15 after the control data is calibrated is accurately known, the position of the calibration mark m can also be accurately identified.

  When the operator OP calibrates the control data of the mounting head 15, the operator operates the calibration execution button 71 (FIG. 3) connected to the control device 40 after placing the substrate type gauge 50 on the substrate conveyance path 12. I do.

  When detecting that the calibration execution button 71 is operated by the operator OP, the control device 40 drives the substrate conveyance path drive unit 41 from the work execution control unit 40a of the control device 40 to operate the substrate conveyance path 12, The substrate type gauge 50 on the substrate transport path 12 is positioned at the normal work position of the substrate 2 (substrate type gauge positioning step of step ST11 shown in FIG. 7).

  After positioning the substrate type gauge 50, the control device 40 operates the robot mechanism 14 to move the front mounting head 15a over the substrate type gauge 50, and the substrate attached to the front mounting head 15a. By repeating the operation of individually recognizing a plurality of calibration marks M on the substrate type gauge 50 by the camera 16, the substrate camera 16 attached to the front mounting head 15a is positioned above the substrate type gauge 50. The calibration value of the control data of the front mounting head 15a is acquired (first calibration value acquisition process of the front mounting head in step ST12 shown in FIG. 7).

  In acquiring calibration values for the individual marks M in step ST12, the control device 40 moves the front mounting head 15a according to the control data, and the center position of the imaging field of the substrate camera 16 is determined as the target on the substrate type gauge 50. The substrate camera 16 captures an image so as to move directly above the mark M to be performed. If there is no displacement between the position on the control data of the front mounting head 15a and the actual position, as shown in FIG. 9A, the mark M imaged by the substrate camera 16 is the substrate. When it is located at the center position of the imaging field SC of the camera 16 but there is a displacement between the position on the control data of the front mounting head 15a and the actual position, as shown in FIG. In addition, since the mark M is not located at the center position of the imaging field SC of the board camera 16, the control device 40 determines the center position of the imaging field SC of the board camera 16 (position on the control data of the board camera 16). ) And the position of the mark M on the basis of the substrate camera 16 obtained by image recognition, and when there is a positional deviation between the position on the control data of the front mounting head 15a and the actual position. That much Deviation amount (positional reference shift amount ΔY positional deviation amount ΔX and the Y-axis direction of the X-axis direction shown in to FIG. 9 (b)) determined. The obtained positional deviation amount becomes a calibration value of the control data of the front mounting head 15a.

  Here, if the assembly error between the members such as the Y-axis table 14a and the X-axis table 14b constituting the robot mechanism 14 increases from the center of the base 11 in the direction along the Y-axis direction, the assembly error increases. In such a case, as the mark M on the substrate type gauge 50 moves away from the center of the base 11 in the direction along the Y-axis direction, the detected positional deviation amount increases. (It becomes larger in the extended region R described later).

  When the above step ST12 is completed, the control device 40 moves the rear mounting head 15b above the substrate type gauge 50, and the substrate camera 16 attached to the moving stage 14c of the rear mounting head 15b uses the substrate camera 16 to mount the substrate. By repeating the operation of recognizing a plurality of calibration marks M on the mold gauge 50 individually, the rear camera when the substrate camera 16 attached to the rear mounting head 15b is positioned above the substrate mold gauge 50 is displayed. The calibration value of the control data of the mounting head 15b is acquired (the first calibration value acquisition step of the rear mounting head in step ST13 shown in FIG. 7). The procedure for acquiring the calibration value for each mark M in step ST13 is the same as that for acquiring the calibration value of the control data of the front mounting head 15a in step ST12 described above.

  When step ST13 is completed, the control device 40 moves the display device 72 (FIG. 3) connected to the control device 40 to the rear mounting head 15b (that is, the side opposite to the front mounting head 15a to be calibrated from now on). A message for the operator OP is displayed so as to attach the plate type gauge 60 to the mounting head 15) (first message display step of step ST14 shown in FIG. 7).

  The operator OP receiving the message displayed on the display device 72 attaches the plate type gauge 60 to the moving stage 14c of the rear mounting head 15b (first plate type gauge attaching step). Then, the operator OP operates the operation resuming button 73 connected to the control device 40 after the plate type gauge 60 is attached to the rear mounting head 15b.

  The control device 40 determines whether or not the operation restart button 73 has been operated by the operator OP (first determination step of step ST15 shown in FIG. 7), and confirms that the operation restart button 73 has been operated by the operator OP. When detected, the calibration mark m on the plate type gauge 60 is placed outside the substrate type gauge 50 by the rear mounting head 15b (the control data of the rear mounting head 15b has already been calibrated in step ST13). Here, the calibration mark m on the plate type gauge 60 is moved to the front mounting head while being moved above the extended region R (the region shown by hatching in FIG. 10) set on the front mounting head 15a side. By repeating the image recognition operation by the substrate camera 16 attached to 15a, the substrate camera 16 is moved to the extended region R. Obtaining calibration values of the control data of the front of the mounting head 15a when located at the upper (front mounting head second calibration value acquisition process of step ST16 shown in FIG. 11).

  Here, as shown in FIG. 10, the extended region R set outside the board type gauge 50 is in the same plane as the board type gauge 50, and the suction nozzle 15N places the component 4 at an arbitrary position on the board 2. , The optical axis of the imaging field of the substrate camera 16 (this optical axis extends downward through the center of the imaging field of the substrate camera 16) exceeds the internal region of the substrate type gauge 50. This is an area that can move, and is located on the side of the base 11 of the substrate type gauge 50 in the front-rear direction (Y-axis direction) of the mounting head 15 (here, the front mounting head 15a) to be calibrated. This is a region formed to protrude to the side.

  The number of locations where the calibration values are acquired in the second calibration value acquisition step of the front mounting head in step ST16 is arbitrary, but if calibration values are acquired at least at the four corners of the extended region R, the subsequent linear (linear) interpolation is performed. The control data of the front mounting head 15a can be calibrated for the entire extended region R.

  When the above step ST16 is completed, the control device 40 removes the plate type gauge 60 attached to the rear mounting head 15b from the display device 72 and removes the front mounting head 15a (ie, the rear to be calibrated from now on). A message for the operator OP is displayed so as to be attached to the mounting head 15 on the opposite side of the mounting head 15b (second message display step of step ST17 shown in FIG. 7).

  Upon receiving the message displayed on the display device 72, the operator OP removes the plate type gauge 60 attached to the rear mounting head 15b and attaches the plate type gauge 60 to the front mounting head 15a (second plate). Mold gauge installation process). Then, the operator OP operates the operation resuming button 73 connected to the control device 40 when the plate type gauge 60 is attached to the front mounting head 15a.

  The control device 40 determines whether or not the operation restart button 73 has been operated by the operator OP (second determination step in step ST18 shown in FIG. 7), and confirms that the operation restart button 73 has been operated by the operator OP. If detected, this time, the calibration mark m on the plate type gauge 60 is placed on the substrate type gauge 50 by the front mounting head 15a (this front mounting head 15a has already been calibrated with the control data in step ST12). The substrate camera 16 attached to the rear mounting head 15b is moved with the calibration mark m on the plate type gauge 60 while moving above the extended region R set outside (here, the rear mounting head 15b side). When the substrate camera 16 is positioned above the extended region R by repeating the image recognition operation by Obtaining calibration values of the control data of the square of the mounting head 15b (the rear mounting head second calibration value acquisition process of step ST19 shown in FIG. 7).

  Note that the expansion region R set outside the substrate type gauge 50 in this step ST19 is the side in the front-rear direction of the base 11 of the substrate type gauge 50 and the rear of the mounting head 15 to be calibrated. This is an area formed on the mounting head 15b side.

  Even in the second calibration value acquisition step of the rear mounting head in step ST19, the number of locations where the calibration values are acquired is arbitrary, but if calibration values are acquired at least at the four corners of the extended region R, a straight line (linear ) The control data of the rear mounting head 15b can be calibrated for the entire extended region R by interpolation.

  When the above-described step ST19 is completed, the control device 40 carries the board type gauge 50 out of the electronic component mounting apparatus 1 through the board conveyance path 12 (board type gauge carry-out process of step ST20 shown in FIG. 7). This completes a series of calibration execution steps.

  As described above, the calibration method of the electronic component mounting apparatus 1 according to the present embodiment includes the step of positioning the substrate type gauge 50 having the calibration mark M provided on the upper surface by the substrate conveyance path 12 (substrate type gauge). Positioning process), and the substrate camera 16 (imaging means) attached to the front mounting head 15a recognizes the image of the calibration mark M on the substrate type gauge 50 positioned by the substrate transport path 12, thereby recognizing the substrate camera. A step of acquiring a calibration value of control data of the front mounting head 15a when 16 is positioned above the substrate type gauge 50 (first mounting value acquisition step of the front mounting head), and a calibration mark m on the upper surface A plate-type gauge 60 provided on the rear side opposite to the mounting head 15, which is a moving means movable with respect to the base 11. The calibration mark m on the plate type gauge 60 is set to the outside of the substrate type gauge 50 by the mounting step 15b (first plate type gauge attaching step) and the rear mounting head 15b in which the control data is calibrated. The calibration mark m on the plate type gauge 60 is image-recognized by the substrate camera 16 while being moved above the extended region R, so that the front of the substrate camera 16 when the substrate camera 16 is positioned above the extended region R is recognized. Including a step of acquiring the calibration value of the control data of the mounting head 15a (front mounting head second calibration value acquiring step) and a similar step in which the front mounting head 15a and the rear mounting head 15b are interchanged. It has become.

  According to the calibration method of the electronic component mounting apparatus 1, it is possible to calibrate the control data of the mounting head 15 when the board camera 16 is positioned above the extended region R set outside the board type gauge 50. Therefore, the gap between the mounting head 15 and the substrate camera 16 is large, and the mounting head 15 is located above the substrate type gauge 50, but the substrate camera 16 is located above the area outside the substrate type gauge 50. Even in such a situation, the component 4 can be mounted using accurate control data.

  In particular, in the present embodiment, the electronic component mounting apparatus 1 has two mounting heads 15 that operate independently of each other, and the moving means of the plate type gauge 60 uses the plate type gauge 60 to calibrate control data. Since it is composed of the mounting head 15 on the side opposite to the side from which the value is to be acquired, no separate moving means for moving the plate type gauge 60 is required, and the calibration value in the extended region R is acquired. The configuration is simpler.

  Although the present embodiment has been described so far, the present invention is not limited to the above-described one. For example, in the above-described embodiment, the electronic component mounting apparatus 1 having two mounting heads 15 is taken as an example. However, the electronic component mounting apparatus to which the present invention can be applied is not limited to one having two mounting heads. When there is only one mounting head, a plate type gauge having a calibration mark provided on the upper surface is attached to a moving means that is movable with respect to the base and for which control data is calibrated. do it. Moreover, the shape of a plate type gauge, etc. is arbitrary and is not limited to what was shown in the above-mentioned embodiment.

  Provided is a calibration method for an electronic component mounting apparatus that enables mounting of an electronic component using accurate control data even when the interval between the mounting head and the imaging means is large.

1 Electronic component mounting device 2 Substrate 4 Component (electronic component)
DESCRIPTION OF SYMBOLS 11 Base 12 Board | substrate conveyance path 15a Front mounting head (mounting head)
15b Rear mounting head (moving means)
16 Substrate camera (imaging means)
50 Substrate type gauge 60 Plate type gauge M, m Mark for calibration R Extended area

Claims (2)

A base, a substrate transport path provided on the base for transporting and positioning the substrate, and a mounting head that is movably provided with respect to the base and mounts electronic components on the substrate positioned by the substrate transport path A calibration method for an electronic component mounting apparatus comprising:
A step of positioning a substrate type gauge provided with a calibration mark on the upper surface by a substrate conveyance path;
The mounting head when the imaging unit is positioned above the substrate type gauge by recognizing an image of a calibration mark on the substrate type gauge positioned by the substrate transport path by an imaging unit attached to the mounting head. Obtaining a calibration value of the control data of
Attaching a plate-type gauge having a calibration mark on the upper surface to a movable means movable relative to the base;
While moving the calibration mark on the plate type gauge above the extended area set outside the substrate type gauge by the moving means for which the control data has been calibrated, the calibration mark on the plate type gauge is moved to the position described above. Calibration of the electronic component mounting apparatus, comprising: obtaining a calibration value of control data of the mounting head when the imaging unit is positioned above the expansion region by recognizing an image by the imaging unit Method.   The electronic component mounting apparatus has two mounting heads that operate independently of each other, and the moving means has a mounting head on a side opposite to the side on which the calibration value of the control data is to be obtained using the plate type gauge. The electronic component mounting apparatus calibration method according to claim 1, comprising:

Images