JP2001137640A - Gas treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gas treating device capable of treating the gas even in the case when the vapor of a high boiling material such as photoresist is contained in the air to be treated. SOLUTION: The air stream quick in flow than that of regenerated air flowing in the desorption zone 5 is generated at the periphery of a desorption zone 5 with a blower for a separator to prevent the regenerated air flowing in the desorption zone 5 from flowing to other than desorption zone 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic solvent vapor concentrating apparatus used for concentrating and removing organic solvent vapor contained in exhaust gas from, for example, a semiconductor production plant, and an adsorption type dehumidifying apparatus used for dehumidifying. The present invention relates to a gas processing device that generically refers to devices.

[0002]

2. Description of the Related Art Conventionally, there has been a gas treatment apparatus using a honeycomb-shaped adsorption rotor made of activated carbon paper or paper carrying hydrophobic zeolite, or paper carrying hydrophilic zeolite or silica gel. Such a gas processing apparatus divides a chamber having an adsorption rotor into an adsorption zone and a desorption zone, and flows an organic solvent vapor or moisture-containing treated air into the adsorption zone while rotating the adsorption rotor so that the organic solvent flows through the adsorption zone. While adsorbing steam and moisture, making the air that has exited the adsorption zone clean or dry, apply hot air to the adsorption rotor in the desorption zone to desorb organic solvents and moisture so that the air that has flowed out of the desorption zone The organic solvent vapor and moisture are concentrated.

The concentrated organic solvent vapor leaving the desorption zone in this way is rendered harmless by means such as combustion treatment, and the moisture is released to the atmosphere. In other words, in the case of the organic solvent vapor, the concentration of the organic solvent vapor at the outlet side of the desorption zone becomes 10 times by making the amount of air sent to the desorption zone, for example, 1/10 of the amount of air sent to the adsorption zone. It becomes easy to perform the treatment with the catalyst.

[0004]

The conventional gas processing apparatus as described above can process many types of organic solvent vapor without any problem. There is such a problem.

That is, the vapor of the organic solvent vapor discharged from the semiconductor factory includes the vapor of the unpolymerized and post-polymerized photoresist cleaning liquid applied to the semiconductor wafer. This is because an electronic circuit is formed on the semiconductor wafer by etching the semiconductor wafer, and a photoresist is used as an etching mask.

[0006] Therefore, an unpolymerized photoresist is applied to a semiconductor wafer, covered with a mask corresponding to a circuit pattern, and irradiated with ultraviolet rays to partially polymerize the photoresist, and the unpolymerized photoresist is washed away with a cleaning liquid. Thereafter, etching is performed, and after the etching, the polymerized photoresist is removed with a solvent.

[0007] Since such a process is involved in the manufacture of a semiconductor, a mixed vapor of an unpolymerized and polymerized photoresist and a solvent is generated. Photoresist is a substance that is very easily polymerized from the beginning, and has a property of being easily polymerized by heat or a catalyst.

[0008] Accordingly, the solvent-containing solvent vapor treatment apparatus divides the chamber having an adsorption rotor into an adsorption zone and a desorption zone, and the organic solvent vapor splits a chamber having an adsorption rotor into an adsorption zone while rotating the adsorption rotor. By flowing treated air containing organic solvent vapor and adsorbing organic solvent vapor in the adsorption zone and cleaning the air leaving the adsorption zone, applying hot air to the adsorption rotor in the desorption zone to desorb the organic solvent The organic solvent vapor is concentrated in the air coming out of the desorption zone.

The concentrated organic solvent vapor leaving the desorption zone is rendered harmless by means such as combustion treatment. That is, by setting the amount of air sent to the desorption zone to, for example, 1/10 of the amount of air sent to the adsorption zone, the concentration of the organic solvent vapor at the outlet side of the desorption zone becomes 10 times, so that the combustion treatment and the treatment with the catalyst can be easily performed. Become.

When the gas processing device is a dehumidifying device, high-temperature air such as compressed air discharged from a compressor may be dehumidified.

[0011]

The conventional gas processing apparatus as described above can process many kinds of organic solvent vapors and water vapors without any problem. There are the following problems when dehumidifying high-temperature air.

That is, the vapor of the organic solvent vapor discharged from the semiconductor factory contains the vapor of the unpolymerized and post-polymerized photoresist cleaning liquid applied to the semiconductor wafer. This is because an electronic circuit is formed on the semiconductor wafer by etching the semiconductor wafer, and a photoresist is used as an etching mask.

For this purpose, an unpolymerized photoresist is applied to a semiconductor wafer, covered with a mask corresponding to a circuit pattern, and irradiated with ultraviolet rays to partially polymerize the photoresist, and the unpolymerized photoresist is washed away with a cleaning liquid. Thereafter, etching is performed, and after the etching, the polymerized photoresist is removed with a solvent.

Since such a process is involved in the manufacture of a semiconductor, a mixed vapor of an unpolymerized and polymerized photoresist and a solvent is generated. Photoresist is a substance that is very easily polymerized from the beginning, and has a property of being easily polymerized by heat or a catalyst.

Therefore, if the vapor of the cleaning solution for the photoresist is contained in the vapor of the organic solvent, the photoresist is catalyzed by the heat of the desorption air of the adsorption rotor or the catalytic action of the activated carbon when the adsorption rotor is made of activated carbon. Polymerization may occur.

If the temperature of the desorption air sent to the desorption zone is raised to, for example, about 250 to 300 ° C., the desorption of the polymerized photoresist is completely performed. However, if the temperature of the desorption air is too high, the seal of the adsorption rotor becomes hot. The problem of damage caused by the In other words, a silicone rubber or a fluorine-based rubber is used for sealing to separate the adsorption zone and the desorption zone of the adsorption rotor. If the temperature of the regeneration air is increased, this rubber is damaged by heat. In other words, even a fluorine-based rubber having high heat resistance has a heat resistance temperature of about 220 ° C., and the temperature of the regeneration air cannot be raised any more.

As a result, the temperature of the regeneration air cannot be increased so much that the polymerized photoresist remains and adheres without being completely desorbed from the adsorption rotor.
In such a case, there arises a problem that the adsorption pores of the adsorption rotor are closed and the adsorption ability is reduced.

An object of the present invention is to provide a gas processing apparatus capable of processing even when processing air contains a vapor of a high boiling substance such as a photoresist.

In the case of dehumidifying high-temperature air such as outlet air from a compressor, the temperature of the treated air is high, and the temperature of the regenerated air must be further increased, thereby shortening the life of the seal member. appear.

[0020]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention generates an airflow at the periphery of a desorption zone, which has a higher flow rate than the regeneration air flowing through the desorption zone, and generates regeneration air flowing through the desorption zone. It did not flow outside the desorption zone.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has an adsorption rotor, divides the adsorption rotor into an adsorption zone and a desorption zone, and uses the regeneration air flowing to the desorption zone at the periphery of the desorption zone. This is to generate a fast-flowing air flow so that regenerated air flowing to the desorption zone does not flow to other than the desorption zone, and has an effect of sealing the air flowing to the desorption zone in a non-contact state.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an exploded perspective view of the gas processing apparatus of the present invention.

Reference numeral 1 denotes an adsorbing rotor, for example, an adsorbing rotor for organic solvent vapor formed by forming ceramic paper carrying hydrophobic zeolite in a honeycomb shape or activated carbon paper in a honeycomb shape. Is held in. The casing 2 is divided into an adsorption zone 4 and a desorption zone 5 by a front separator 3 and a rear separator (described later).

The adsorption rotor 1 is, for example, a honeycomb paper made of ceramic paper carrying hydrophilic zeolite or a moisture adsorption rotor obtained by synthesizing silica gel on ceramic paper, other than the organic solvent vapor adsorption rotor.

The suction rotor 1 has a geared motor 6,
The drive belt 7 is configured to be driven to rotate in the direction of the arrow. Reference numeral 10 denotes a desorption heater, which communicates with the desorption zone 5. Reference numeral 9 denotes a detachable blower, and a suction port communicates with the outlet side of the detachable zone 5. As a result, the air heated by the heater 10 passes through the desorption zone 5.

Reference numeral 11 denotes a processing air blower for sending processing air containing an organic solvent vapor or moisture. Also 12
Is a separator blower for generating a high-speed air flow in the front separator 3.

Here, the separator 3 will be described in detail with reference to FIG. FIG. 2 schematically shows a cross section of FIG. A discharge nozzle 13 is provided in the front separator 3, and high-pressure air generated by the separator blower 12 is supplied to the discharge nozzle 13. The front separator 3 is in close proximity to the suction rotor 1.

Reference numeral 14 denotes a rear separator, in which a suction nozzle 15 is provided. The suction nozzle 15 is connected to the suction side of the separator blower 12.

The rear separator 14 is provided with the suction rotor 1.
The seal member 16 made of heat-resistant silicon is arranged so as to keep airtight between the suction rotor and the suction rotor.

That is, the air discharged from the front separator 3 enters the adsorption rotor 1 as a high-speed flow faster than the desorbed air, passes through the adsorption rotor 1 and is sucked from the rear separator 14. Further, the discharge nozzle 13 is configured to surround the desorption zone 5 as shown in FIG. Although not shown in each figure, the suction nozzle 15
Also, it is configured to surround the desorption zone 5 on the back surface of the suction rotor 1 similarly to the discharge nozzle 13.

The gas processing apparatus of the present invention is formed as described above, and its operation will be described below. First, power is supplied to the desorption blower 9, the processing air blower 11, the geared motor 6, the separator blower 12, and the desorption heater 10.

As a result, the processing air containing the organic solvent vapor and moisture is separated by the processing air blower 11 into the adsorption zone 4.
And the organic solvent vapor and moisture in the processing air are adsorbed by the adsorption rotor 1. Further, the air heated by the desorption heater 10 passes through the desorption zone 5, the adsorbed organic solvent vapor is desorbed, and sent to a combustion treatment device or a catalyst treatment device (not shown) by the desorption blower 9 to be harmless. Conversion processing is performed.

When the adsorbed moisture is desorbed, it is released to the atmosphere by the desorption blower 9.

Since a high-speed air flow is formed between the front separator 3 and the suction rotor 1 by the separator blower 12, the front separator 3 is in a non-contact state with the suction rotor 1; The air exiting 4 and the air entering desorption zone 5 hardly mix.

The high-speed air flowing out of the discharge nozzle 13 of the front separator 3 passes through the adsorption rotor 1 and is sucked from the suction nozzle 16 in the rear separator 14 and returns to the suction port of the separator blower 12. At this time, the space between the suction rotor 1 and the rear separator 14 is sealed by the sealing member 16 provided on the rear separator 14, and the air entering the adsorption zone 4, the air flowing out of the desorption zone 5, and the discharge nozzle 13 are discharged. The air that comes out will not mix.

The air that has exited the desorption zone 5 is deprived of energy for desorption, and its temperature drops. Therefore, the seal member 16 is not damaged by the temperature of the regeneration air.

For example, assuming that the temperature of the air entering the desorption zone 5 is 300 ° C., the temperature of the air exiting the desorption zone 5 is reduced to about 90 ° C., and heat resistant rubber such as silicon rubber or fluorine rubber is used. And sufficient heat resistance can be secured.

Hereinafter, a second embodiment of the present invention will be described. FIG. 4 is a sectional view of a gas processing apparatus according to a second embodiment of the present invention. Differences from the first embodiment shown in FIG. 2 will be described.

In FIG. 4, a sealing member 17 made of heat-resistant silicone rubber or the like is provided on the outer peripheral side of the front separator 3, that is, on a portion corresponding to the outer periphery of the desorption zone 5, in addition to that of FIG. . Blower for separator 1
Outside air is supplied to the suction port 2. A pipe is formed so that the air sucked from the suction nozzle 15 in the rear separator 14 is sucked into the suction port of the processing air blower 11 together with the processing air.

As described above, in the second embodiment, the sealing member 17 is also provided on the outer peripheral side of the front separator 3, that is, the portion corresponding to the outer periphery of the desorption zone 5, so that the desorption air can be more reliably sealed. Done. Further, the inside of the seal member 17 is exposed to the high-speed airflow discharged from the discharge nozzle 13, and the high-temperature desorbed air does not come into direct contact with the inside, so that thermal damage to the seal member can be avoided.

Since the air sucked from the suction nozzle 16 is piped so as to be sucked together with the processing air into the suction port of the processing air blower 11, the organic solvent vapor is mixed in the air sucked from the suction nozzle 16. However, there is no problem because the organic solvent vapor is adsorbed by the adsorption rotor 1 in the adsorption zone 4.

Hereinafter, a third embodiment of the present invention will be described. FIG. 5 is a partial plan view of Embodiment 3 of the gas treatment apparatus of the present invention, and different points from Embodiment 1 shown in FIGS. 1 to 3 will be described.

In the third embodiment shown in FIG. 5, the position of the suction nozzle 15 is shifted with respect to the discharge nozzle 13 in the rotation direction of the suction rotor 1. This corresponds to the angle at which the suction rotor 1 rotates while the airflow from the discharge nozzle 13 passes through the suction rotor 1.

In other words, the air flow coming out of the discharge nozzle 13 is sucked by the suction nozzle 15. Thereby, one surface of the sealing member 16 comes into contact with the airflow. Therefore, even if the organic solvent vapor contained in the air leaving the desorption zone 5 chemically damages the seal member 16, one surface of the seal member 16 is not damaged.

For this reason, the surface of the seal member 16 which is in contact with the air flow is secured without being damaged, and the seal member 16 is not completely damaged. There is no loss of elasticity entirely.

[0046]

Since the gas processing apparatus of the present invention is constructed as described above, it is not necessary to use rubber or the like for the sealing of the desorption zone, it is possible to raise the temperature of the regeneration air, The process can be performed without any trouble even when a vapor of a high-boiling substance such as a resist is contained, or the high-temperature air can be dehumidified.

Further, the gas processing apparatus of the present invention has a long life because the parts exposed to high temperatures are in a non-contact state.

Although the sealing of the desorption zone is basically performed by air flow, rubber may be used for the sealing member in an auxiliary manner. In this case, the sealing member is not directly exposed to high-temperature air. Even when rubber is used, it is possible to increase the temperature of the air sent to the desorption zone.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a gas processing apparatus of the present invention.

FIG. 2 is a sectional view of Embodiment 1 of the gas treatment apparatus of the present invention.

FIG. 3 is a perspective view of a suction rotor and a discharge nozzle of the gas processing apparatus of the present invention.

FIG. 4 is a sectional view of a gas processing apparatus according to a second embodiment of the present invention.

FIG. 5 is a partial plan view of a gas processing apparatus according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Suction rotor 2 Casing 3 Front separator 4 Suction zone 5 Desorption zone 6 Geared motor 7 Drive belt 9 Desorption blower 10 Desorption heater 11 Process air blower 12 Separator blower 13 Discharge nozzle 14 Rear separator 15 Suction nozzle 16, 17 Seal member

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D002 AB03 AC10 BA04 CA05 DA41 DA45 DA46 EA08 GA02 GB03 HA03 4D012 CA01 CA11 CC04 CC05 CD05 CE02 CF02 CF04 CF05 CG02 CK05 CK06 CK08 4D052 AA08 CB02 DA01 DA06 DB01 FA01 FA03 GA03 GB01 GB03 HA01 HA03 HA21 HB02

Claims (3)

[Claims] 1. A gas adsorption rotor, wherein the adsorption rotor is divided into an adsorption zone and a desorption zone,
A gas processing apparatus, wherein an airflow having a higher flow rate than the regeneration air flowing in the desorption zone flows at the periphery of the desorption zone, so that the regeneration air flowing in the desorption zone does not flow to other than the desorption zone. 2. The gas processing apparatus according to claim 1, wherein a sealing material in contact with the adsorption rotor is provided on an outflow side from the desorption zone of the air flow that flows faster than the regeneration air flowing into the desorption zone. 3. A method according to claim 1, wherein a sealing material is provided outside of the air flow that flows faster than the regeneration air flowing through the desorption zone, so that the regeneration air flowing into the desorption zone does not flow to other than the desorption zone. 2. The gas processing apparatus according to 1.