JP2000269239A - Ic chip transfer system, ic chip mounting system, ic chip transfer method and ic chip mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an IC chip transfer system and an IC chip mounting system, which are simple in constitution but capable of causing less damages to an IC chip. SOLUTION: Dummy bumps 43 are formed on an active surface 42 of an IC chip 41 before an IC chip 41 is transferred. A lower end 44a of a chucking collet 44 is brought into contact with the dummy bumps 43 and sucks up the IC chip 41 so as to hold it. By this setup, while the chip 41 is being transferred, the chucking collet 44 is prevented from coming into contact with the active surface of the active surface of the chip 41, so that the IC chip 41 is less damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip carrying system and a carrying method for carrying an IC chip, and an IC chip carrying system and a carrying method for carrying an IC chip on a substrate.

[0002]

2. Description of the Related Art When mounting an IC chip on a substrate,
After transporting the manufactured IC chip to a position on the substrate,
It is designed to be mounted on a substrate. Conventionally, when transferring an IC chip to a position on a substrate, the transfer device is
The IC chip is transported by sucking and holding the C chip and moving it to a position on the substrate. Here, FIG.
Shows a state in which a conventional transport device holds an IC chip. As shown in FIG. 1, this transporting device has a holding portion 1 formed in a cylindrical shape, and sucks the IC chip 2 upward to attach the holding portion 1 to the active surface 3 of the IC chip 2.
The IC chip 2 is held in a state where the end portions are in contact with each other.

[0003]

However, when the IC chip 2 is held by the above-described holding method, the active surface 3 of the IC chip 2 is in contact with the holding portion 1 and thus the active surface 3
May be damaged, or the active surface 3 may be destroyed by static electricity.

As a device for reducing the damage to the active surface 3 of the IC chip 2, a transfer device having a holding portion called a "pyramid collet" as shown in FIG. 2 is used. As shown in the figure, this transport device has a holding portion 4 shaped so as to be in contact with the side portion 5 instead of the active surface 3 of the IC chip 2, and the IC chip 2 is sucked upward. Thus, the IC chip 2 can be held without contacting the active surface 3. Therefore, it is possible to prevent the active surface 3 from being damaged due to the contact between the holding portion and the active surface 3.

[0005] However, in recent years, as electronic devices have become multifunctional and miniaturized, IC chips 2 of different sizes have been developed.
May be mounted on one substrate. In such a case,
In the transfer device having the holding portion 4 called a pyramid collet described above, the holding portion 4 is provided for each size of the IC chip 2 to be transferred.
It is necessary to prepare. Further, the holding part 4 is the IC chip 2
It is required to make accurate contact with the side portion 5 of the side, so that it takes time, and an expensive conveying device having excellent positioning accuracy of the holding section 4 is required.

The present invention has been made in view of the above circumstances, and has an IC chip transport system, an IC chip transport method, and an IC that can reduce damage to an IC chip while having a simple configuration. An object of the present invention is to provide an IC chip mounting system and an IC chip mounting method capable of mounting a chip.

[0007]

In order to solve the above problems, an IC chip transport system according to the present invention is an IC chip transport system for transporting an IC chip having an active surface, wherein the active surface of the IC chip is provided. A projecting portion forming means for forming a projecting portion, and movably provided in a predetermined section, and contacting the projecting portion formed on the IC chip by the projecting portion forming means to suck the IC chip. And a transporting means for holding the IC chip, wherein the transporting means moves while holding the IC chip, thereby transporting the IC chip.

In the above structure, the protrusion forming means may form protrusions at three positions which are not linear with the active surface of the IC chip.

Further, an IC chip mounting system according to the present invention provides an IC for mounting an IC chip having an active surface on a substrate.
A chip mounting system, comprising: a protrusion forming means for forming a protrusion on the active surface of the IC chip; a receiving position for receiving the IC chip; and a mounting position for mounting the IC chip on the substrate. The IC which is provided so as to be movable and on which the protrusion is formed by the protrusion forming means.
And mounting means for moving the chip to the mounting position after receiving and holding the chip at the receiving position, and mounting the IC chip on the substrate at the mounting position. The IC chip is held by sucking the IC chip by contacting the protrusion formed on the IC chip by means.

[0010] An IC chip mounting system according to the present invention is an IC chip mounting system for flip-chip mounting an IC chip having an active surface on a substrate.
A protrusion forming means for forming a protrusion on the active surface of the chip; an electrode bump forming means for forming an electrode bump used as an electrode on the active surface of the IC chip;
C is provided movably between a receiving position for receiving the C chip and a mounting position for mounting the IC chip on the substrate;
After receiving and holding the IC chip on which the protrusion is formed by the protrusion forming means at the receiving position, the IC chip is moved to the mounting position, and the IC is mounted on the substrate such that the active surface faces the substrate. Mounting means for mounting the chip, wherein the mounting means contacts the protrusion formed on the IC chip by the protrusion forming means and sucks the IC chip to attach the IC chip. It is characterized by holding.

Further, in the IC chip mounting system having the above-mentioned structure, the projecting portion forming means sets the projecting portion to a height larger than a height from the active surface of the electrode bump formed by the electrode bump forming means. It may be formed.

Further, in the IC chip mounting system having the above-mentioned structure, the IC chip mounting system further comprises a concave portion forming means for forming a concave portion on the substrate, wherein the mounting means is provided in the concave portion formed on the substrate by the concave portion forming means. The IC chip may be mounted on the substrate such that the protrusion is arranged.

Further, in the IC chip mounting system having the above-mentioned structure, the projecting portion forming means may form the projecting portion using a material having a lower melting point than the electrode bumps formed by the electrode bump forming means. Good.

Further, in the IC chip mounting system having the above-mentioned structure, when the protrusion forming means receives a pressing force from a direction substantially orthogonal to the active surface, the electrode formed by the electrode bump forming means is provided. The protrusion may be formed in a shape that is more easily crushed than a bump.

Further, when the protruding portion receives a pressing force from a direction substantially perpendicular to the active surface, the protruding portion is formed of a material which is more easily crushed than the electrode bump formed by the electrode bump forming means. You may.

Further, in the IC chip mounting system having the above-mentioned configuration, the protrusion forming means may form bumps at three places which are not linear on the active surface of the IC chip.

Further, an IC chip carrying method according to the present invention is an IC chip carrying method for carrying an IC chip having an active surface, the method comprising a step of forming a projecting portion on the active surface of the IC chip. Holding the IC chip by contacting the protrusion formed on the IC chip by the protrusion forming step and sucking the IC chip; and holding the IC chip by the holding step. And a transporting step of moving.

An IC chip mounting method according to the present invention is an IC chip mounting method for wire bonding mounting an IC chip having an active surface to a substrate.
A step of forming a protrusion on the active surface of the chip; and holding the IC chip by attracting the IC chip by contacting the protrusion formed on the IC chip by the step of forming the protrusion. Holding step, a transfer step of moving the IC chip held by the holding step to a mounting position on the substrate, and a mounting step of mounting the IC chip moved by the transfer step on the substrate. It is characterized by having.

An IC chip mounting method according to the present invention is an IC chip mounting method for flip-chip mounting an IC chip having an active surface on a substrate, wherein the protrusion is formed on the active surface of the IC chip. Forming an electrode bump used as an electrode on the active surface of the IC chip, forming an electrode bump, and contacting the protrusion formed on the IC chip by the protrusion forming step. A holding step of holding the IC chip by sucking the IC chip, a transferring step of moving the IC chip held by the holding step to a mounting position on the substrate, and a moving step of the transferring step. Mounting an IC chip on the substrate.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. A. First embodiment A-1. Configuration First, FIG. 3 is a block diagram showing the configuration of the IC chip mounting system according to the first embodiment of the present invention. As shown in FIG. 1, the IC chip mounting system 10 includes a dummy bump forming section (projecting section forming section) 11 and a bonding section (transporting section, mounting section) 12.

The dummy bump forming section 11 forms a dummy bump (projection) on the active surface of the IC chip supplied from the IC chip manufacturing apparatus 14. The bonding section 12 has a suction collet, which will be described later.
After receiving the C chip from the dummy bump forming unit 11,
The received IC chip is mounted on a substrate.

A-2. IC Chip Mounting Method Next, the IC chip mounting system 10 having the above configuration
A method for mounting the C chip on the substrate will be described with reference to FIG. First, an IC chip is supplied from the IC chip manufacturing apparatus 14 to the dummy bump forming unit 11. Here, FIG.
As shown in (a), the plurality of wafer-cut IC chips 41 are arranged on the plastic thin film sheet 40 and are supplied to the dummy bump formation unit 11.

As shown in FIG. 4B, in the dummy bump formation section 11, each IC supplied as described above is provided.
A dummy bump 43 is formed on the active surface 42 of the chip 41. Here, a metal material such as solder is used as the dummy bump 43 in the same manner as a normal bump (projection electrode).
Like a normal bump, the bump is formed by a transfer bump method, a plating method, or the like. In the present invention, since the dummy bumps do not need to have a function as an electrode, they may be formed of a material having no conductivity.

Here, FIG. 5 shows the dummy bump forming portion 11.
IC chip 41 on which dummy bumps 41 are formed
FIG. As shown in FIG.
Dummy bumps 43 are formed at three places on one active surface 42. Here, the three dummy bumps 43 are arranged so as not to be located on a straight line.

The IC chip 41 on which the dummy bumps 43 are formed is taken out of the plastic thin film sheet 40 by the suction collet 44 as shown in FIG. It is moved up.

FIG. 6 is a view showing the holding state of the IC chip 41 by the suction collet 44. As shown in FIG. As shown in the figure, the lower end 4 of a cylindrical suction collet 44 is formed.
4a is in contact with three dummy bumps 43 formed on the IC chip 41, and holds the IC chip 41 by sucking the IC chip 41 upward in this state. Therefore, the active surface 42 of the IC chip 41 is configured not to contact the suction collet 44. At this time,
A dummy bump 4 is provided between the lower end 44a and the active surface 42.
However, the gap is actually about 20 μm in size, and the suction collet 44 sucks the IC chip 41 with a sufficient suction force. However, the IC chip 41 can be sucked.

After the suction collet 44 moves above the mounting position on the substrate 45 while holding the IC chip 41, the suction collet 44 descends toward the substrate 45 as shown in FIG. IC at a predetermined position on the substrate 45
The chip 41 is mounted. After the IC chip 41 is mounted on the substrate 45 in this manner, as shown in FIG.
A wiring pattern (not shown) formed on the substrate 45 and an electrode (not shown) on the active surface 42 are connected by wires 46. Therefore, in the present embodiment, the bonding portion 1
Reference numeral 2 denotes an IC chip 41 mounted on a substrate 45 by a wire bonding method.

In the IC chip mounting method using the IC chip mounting system according to the present embodiment, when the IC chip 41 is transported until the IC chip 41 is taken out from the plastic thin film sheet 40 and mounted on the substrate 45, the suction collet 4
4 and the active surface 42 of the IC chip 41 are not in contact with each other. Therefore, the suction collet 44 and the active surface 42
Damage to the active surface 42 due to contact with the semiconductor device, electrostatic destruction, and the like are prevented.

Further, if the suction collet 44 having a shape capable of contacting the dummy bump 43 formed on the active surface 42 of the IC chip 41 is used, it is not necessary to prepare a suction collet for each size of the IC chip 41. Therefore, the equipment cost of the IC chip mounting system can be reduced.

Further, as described above, the dummy bump 43
Are not arranged in a straight line, so that contact between the lower end portion 44a and the active surface 42 can be reliably prevented. This is because, as shown in FIG.
When the IC chip 41 is formed in two places (arranged on a straight line), as shown in FIG. 7B, the IC chip 41 is held while the suction collet 44 is inclined with respect to the active surface 42. In this case, the lower end portion 44a
Is in contact with the active surface 42.

When the dummy bumps 43 are formed at two places, as shown in FIG. 8, the lower end portion 44a of the suction collet 44 is not in contact with the active surface 42 but in contact with the side portion 42a of the IC chip 41. If the IC chip 41 is held, the dummy bumps 43 may be formed at two places. Also, if the dummy bump 43 to be formed is 1
At least, any one that can prevent contact between the suction collet 44 and the active surface 42 when the suction collet 44 suctions the IC chip 41 may be used. If there is a space on the active surface 42, the dummy bumps 43 may be provided at four or more places.

B. Second Embodiment Next, FIG. 9 shows a configuration of an IC chip mounting system according to a second embodiment of the present invention. Note that, in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 9, the I according to the second embodiment
The C chip mounting system 100 according to the first embodiment
C chip mounting system 10 includes a dummy bump forming section 11
Accordingly, an electrode bump forming portion (electrode bump forming means) 111 for forming a bump functioning as an electrode is added to an IC chip on which dummy bumps are formed.

An IC chip mounting method using the IC chip mounting system 100 having such a configuration will be described with reference to FIG. First, as shown in FIG. 10A, an IC chip is supplied from the IC chip manufacturing apparatus 14 to the dummy bump forming unit 11 as in the first embodiment.

As shown in FIG. 10B, the dummy bumps 43 are formed on the active surface 42 of each of the supplied IC chips 41 in the dummy bump forming section 11, as in the first embodiment. . Thereafter, the IC chip 41 arranged on the plastic thin film sheet 40 is moved to the electrode bump forming section 111. And FIG.
As shown in (c), the bump 101 made of a conductive material used as an electrode by the electrode bump forming part 111
Are formed at predetermined positions on the active surface 42.

FIG. 11 is a view showing the IC chip 41 on which the dummy bumps 43 and the bumps 101 are formed. As shown in FIG.
It is formed higher than 01. In the second embodiment, the material of the dummy bump 43 formed by the dummy bump formation unit 11 has a lower melting point than that of the bump 101 formed by the electrode bump formation unit 111. For example, the dummy bump 43 and the bump 10
When both are formed by solder, the dummy bumps 43 may be formed by using a solder having a lower melting point than the bump 101.

The IC chip 41 on which the dummy bumps 43 and the bumps 101 are formed as described above is shown in FIG.
As shown in (d), it is taken out of the plastic thin film sheet 40 by the suction collet 44. Then, the suction collet 44 is moved above the substrate 45 as the suction collet 44 moves.

FIG. 12 is a diagram showing the holding state of the IC chip 41 by the suction collet 44. As shown in FIG. As shown in the figure, the lower end 4 of a cylindrical suction collet 44 is formed.
4a is in contact with three dummy bumps 43 formed on the IC chip 41, and holds the IC chip 41 by sucking the IC chip 41 upward in this state. As described above, since the dummy bump 43 is formed higher than the bump 101, the active surface 42 of the IC chip 41 and the bump 101 do not come into contact with the suction collet 44.

The IC chip 41 conveyed above the substrate 45 in this manner is mounted on a bump 1 by a mounting device (not shown).
The upper and lower surfaces are inverted so that the active surface 42 on which the 01 is formed and the substrate 45 face each other. Then, as shown in FIG. 10E, the circuit is mounted so that a wiring pattern (not shown) formed on the substrate 45 is connected to the bump 101 as an electrode. Therefore, in the second embodiment, the bonding portion 1
2 is an IC chip 41 mounted on a substrate 4 by a flip chip method.
5 is mounted.

FIG. 13 is a diagram showing a state in which the IC chip 41 is mounted on the substrate 45 after being turned over. In the mounting process of the IC chip 41, FIG.
As shown in (a), when the IC chip 41 is positioned on the substrate 45, the IC chip 41 is heated and pressed to mount the IC chip 41 on the substrate 45. As described above, since the material having a lower melting point than the bump 101 is used for the dummy bump 43, FIG.
As shown in (b), the dummy bump 43 is melted and crushed by being heated and pressed. In this manner, the dummy bump 4 formed higher than the bump 101
By crushing 3, the wiring pattern on the substrate 45 and the bump 101 can be connected.

The dummy bump 43 is made of a material having a low melting point.
In addition to forming the dummy bumps 43, the dummy bumps 43 may be formed in an elongated shape as shown in FIG. In this way, as shown in FIG.
When the chip 41 is heated and pressurized, the dummy bump 43 is crushed by the pressing force, and the bump 101 and the wiring pattern on the substrate 45 can be connected. Here, the dummy bumps 43 are not limited to those having the shape shown in FIG. 14.
Any shape can be used as long as it is more easily crushed than 01. Further, the dummy bump 43 may be formed using a material that is more easily crushed than the bump 101.

As shown in FIG. 16, the substrate 45 is provided with a recess forming portion for forming the recess 160, and
The dummy bump 43 formed on the chip 41 is
The IC chip 41 may be mounted so that the IC chip 41 is arranged in the IC chip 41. Also in this case, as shown in FIG. 17, the dummy bump 43 enters the recess 160, so that the bump 101 and the wiring pattern on the substrate 45 can be connected. Further, the IC chip 41 may be mounted so that the dummy bumps 43 are arranged in the concave portions 160 formed in the substrate 45.
Positioning becomes easy.

Also, as shown in FIG.
Alternatively, the dummy bump 43 may be formed lower than that. In this case, as shown in the drawing, if the IC chip 41 is sucked using the suction collet 44 having a shape in which only the lower end portion 44a contacting the dummy bump 43 extends downward, the suction collet 44 is in contact with the active surface 42 and the bump 101. Contact can be prevented.

In the IC chip mounting method by the IC chip mounting system according to the second embodiment, when the IC chip 41 is transported until the IC chip 41 is taken out from the plastic thin film sheet 40 and mounted on the substrate 45, the suction collet 44 and the IC are mounted. Active surface 42 of chip 41 and bump 101
And are kept from contacting. Therefore, the active surface 4
Damage due to contact between the suction collet 44 and the suction collet 44 and destruction due to static electricity are prevented.

Also, as in the first embodiment, the IC chip 4
If a suction collet 44 having a shape capable of contacting the dummy bump 43 formed on one active surface 42 is used, it is not necessary to prepare a suction collet for each size of the IC chip 41.

C. Modified Example In the first and second embodiments described above, I
Although the IC chip mounting system in which the C chip 41 is transported by the suction collet 44 and mounted on the substrate 45 has been described, the present invention is not limited to this, and is applied to an IC chip transport system that transports IC chips. You may do so.

For example, as shown in FIG. 19, an IC chip 4 cut into a wafer on a plastic thin film sheet 40 is formed.
1 may be applied to an IC chip transport system that transfers the data to the tray 180. As shown in FIG.
In the C chip transport system, the plastic thin sheet 4
It is checked whether or not there is a defective product in the IC chip 41 that has been wafer-cut on the wafer 0, and only a good product is taken out of the plastic thin film sheet 40 and transferred onto the tray 180.
Prior to this transfer operation, a dummy bump 43 is formed on the active surface 42 of the IC chip 41 in the same manner as in the above-described embodiment.
The chip 41 is held and transferred from the plastic thin film sheet 40 to the tray 180. After only the non-defective products are transferred to the tray 180 in this manner, the bonding unit 12 shown in the first and second embodiments described above is
The C chip 41 may be taken out and mounted on the substrate 45.

[0048]

As described above, according to the present invention,
Even with a simple configuration, contact between the active surface of the IC chip and the portion holding the IC chip during transportation or the like is prevented, and damage to the active surface of the IC chip can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing an IC chip holding state of a conventional IC chip transport tool.

FIG. 2 is a diagram showing an IC chip holding state of another conventional IC chip transport tool.

FIG. 3 is a block diagram showing a configuration of an IC chip mounting system according to the first embodiment of the present invention.

FIG. 4 is a diagram for explaining an IC chip mounting method by the IC chip mounting system according to the first embodiment.

FIG. 5 is a front view showing an IC chip on which dummy bumps are formed by the IC chip mounting system according to the first embodiment.

FIG. 6 is a diagram showing a state where the suction collet of the IC chip mounting system according to the first embodiment is holding an IC chip.

FIG. 7 is a diagram for explaining an inappropriate IC chip holding state by the suction collet.

FIG. 8 is a diagram showing another example of a state of holding the IC chip by the suction collet in the IC chip mounting system according to the first embodiment.

FIG. 9 is a block diagram illustrating a configuration of an IC chip mounting system according to a second embodiment of the present invention.

FIG. 10 is a diagram for explaining an IC chip mounting method by the IC chip mounting system according to the second embodiment.

FIG. 11 is a view showing an IC chip on which dummy bumps and bumps are formed by the IC chip mounting system according to the second embodiment.

FIG. 12 is a diagram illustrating a state where a suction collet of the IC chip mounting system according to the second embodiment is holding an IC chip.

FIG. 13 is a diagram for explaining a state when an IC chip is mounted on a substrate by the IC chip mounting system according to the second embodiment.

FIG. 14 is a diagram for explaining the shape of another dummy bump formed on an IC chip by the IC chip mounting system according to the second embodiment.

15 is a diagram showing a state where the IC chip shown in FIG. 14 is mounted on a substrate.

FIG. 16 is a diagram for explaining another example of mounting an IC chip on a substrate by the IC chip mounting system according to the second embodiment.

17 is a diagram showing a state where the IC chip shown in FIG. 16 is mounted on a substrate.

FIG. 18 is a diagram illustrating a state in which an IC chip is held by a modification of the suction collet of the IC chip mounting system according to the second embodiment.

FIG. 19 is a diagram for explaining the operation of the IC chip transport system according to the present invention.

[Explanation of symbols]

10: IC chip mounting system, 11: Dummy bump forming part (projection forming means), 12: Bonding part (mounting means, transporting means), 14: IC chip manufacturing apparatus, 40: Plastic thin film sheet, 41 ... IC chip, 42, active surface, 43, dummy bump (projection), 44, suction collet, 45, substrate, 100
... IC chip mounting system, 101 ... Bump, 111
..., Electrode bump forming section (electrode bump forming means), 160
... recess, 180 ... tray

Claims (13)

[Claims] 1. An IC for transporting an IC chip having an active surface.
A C chip transport system, comprising: a protrusion forming means for forming a protrusion on the active surface of the IC chip; and a movable portion provided in a predetermined section, wherein the protrusion is formed on the IC chip by the protrusion forming means. Transport means for holding the IC chip by sucking the IC chip in contact with the protruding portion, and moving the transport means while holding the IC chip, thereby providing the IC. An IC chip transfer system for transferring chips. 2. The IC chip transport system according to claim 1, wherein said projection forming means forms projections at three positions which are not linear on said active surface of said IC chip. 3. An IC chip mounting system for mounting an IC chip having an active surface on a substrate, a projection forming means for forming a projection on the active surface of the IC chip, and a receiving position for receiving the IC chip. And, after receiving and holding the IC chip on which the protrusion is formed by the protrusion forming means at the receiving position, the IC chip is provided movably between a mounting position for mounting the IC chip on the substrate, Mounting means for moving to the mounting position and mounting the IC chip on the substrate at the mounting position, wherein the mounting means is formed on the IC chip by the protrusion forming means. And holding the IC chip by sucking the IC chip by contacting the IC chip. 4. An IC chip mounting system for flip-chip mounting an IC chip having an active surface on a substrate, comprising: a protrusion forming means for forming a protrusion on the active surface of the IC chip; An electrode bump forming means for forming an electrode bump used as an electrode on the active surface; a receiving position for receiving the IC chip; and a mounting position for mounting the IC chip on the substrate, movably provided. After receiving and holding the IC chip on which the protrusion is formed by the protrusion forming means at the receiving position, the IC chip is moved to the mounting position, and the IC chip is mounted on the substrate such that the active surface faces the substrate. And mounting means for mounting the IC chip on the IC chip by the protrusion forming means. IC chip mounting system, characterized by holding the IC chip by sucking an IC chip. 5. The device according to claim 1, wherein the protrusion forming unit forms the protrusion at a height greater than a height of the electrode bump formed by the electrode bump forming unit from the active surface. 5. The IC chip mounting system according to 4. 6. The semiconductor device according to claim 1, further comprising a concave portion forming means for forming a concave portion in the substrate, wherein the mounting means includes a step of disposing the IC so that the protrusion is arranged in the concave portion formed in the substrate by the concave portion forming means. The IC chip mounting system according to claim 5, wherein a chip is mounted on the substrate. 7. The projection according to claim 4, wherein the projection forming unit forms the projection using a material having a lower melting point than the electrode bump formed by the electrode bump forming unit. IC chip mounting system. 8. The protruding portion forming means, when receiving a pressing force from a direction substantially perpendicular to the active surface, has a shape that is more easily crushed than the electrode bumps formed by the electrode bump forming means. The IC chip mounting system according to claim 4, wherein a part is formed. 9. The protrusion is made of a material that is more easily crushed than the electrode bump formed by the electrode bump forming means when receiving a pressing force from a direction substantially orthogonal to the active surface. The IC chip mounting system according to claim 4 or 5, wherein: 10. The IC chip mounting according to claim 3, wherein said projection forming means forms bumps at three positions which are not linear on said active surface of said IC chip. system. 11. An IC chip transport method for transporting an IC chip having an active surface, comprising: a projection forming step of forming a projection on the active surface of the IC chip; and the IC chip by the projection forming step. A holding step of holding the IC chip by sucking the IC chip by contacting the projection formed on the IC chip; and a transporting step of moving the IC chip held by the holding step. Characteristic I
C chip transport method. 12. An IC chip mounting method for mounting an IC chip having an active surface on a substrate, the method comprising the steps of: forming a protrusion on the active surface of the IC chip; A holding step of holding the IC chip by sucking the IC chip by contacting the protrusion formed on the IC chip; and moving the IC chip held by the holding step to a mounting position on the substrate. And a mounting step of mounting the IC chip moved by the transporting step on the substrate. 13. An IC chip mounting method for flip-chip mounting an IC chip having an active surface on a substrate, comprising: forming a projection on the active surface of the IC chip; An electrode bump forming step of forming an electrode bump used as an electrode on an active surface; and the IC chip by attracting the IC chip by contacting the protrusion formed on the IC chip by the protrusion forming step. Holding step; holding the IC chip held by the holding step to a mounting position on the board; and mounting the IC chip transferred by the transferring step on the board. A method of mounting an IC chip, comprising: