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HK1165906A1 - 發光裝置 - Google Patents

發光裝置

Info

Publication number
HK1165906A1
HK1165906A1 HK12106521.1A HK12106521A HK1165906A1 HK 1165906 A1 HK1165906 A1 HK 1165906A1 HK 12106521 A HK12106521 A HK 12106521A HK 1165906 A1 HK1165906 A1 HK 1165906A1
Authority
HK
Hong Kong
Prior art keywords
led
light emitting
emitting device
led light
device led
Prior art date
Application number
HK12106521.1A
Other languages
English (en)
Inventor
鈴木 弘
小西 淳
裕郎 田中
米田 賢治
Original Assignee
株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社 filed Critical 株式會社
Publication of HK1165906A1 publication Critical patent/HK1165906A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
HK12106521.1A 2009-02-05 2012-07-04 發光裝置 HK1165906A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009024884 2009-02-05
PCT/JP2010/051721 WO2010090289A1 (ja) 2009-02-05 2010-02-05 Led発光装置

Publications (1)

Publication Number Publication Date
HK1165906A1 true HK1165906A1 (zh) 2012-10-12

Family

ID=42542180

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12106521.1A HK1165906A1 (zh) 2009-02-05 2012-07-04 發光裝置

Country Status (10)

Country Link
US (1) US8704244B2 (zh)
EP (1) EP2395568B1 (zh)
JP (1) JP4549438B1 (zh)
KR (1) KR101670107B1 (zh)
CN (1) CN102308398B (zh)
AU (1) AU2010211671A1 (zh)
HK (1) HK1165906A1 (zh)
RU (1) RU2515185C2 (zh)
SG (1) SG173174A1 (zh)
WO (1) WO2010090289A1 (zh)

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US20110186877A1 (en) * 2008-06-05 2011-08-04 Haase Michael A Light emitting diode with bonded semiconductor wavelength converter
JP2013168326A (ja) * 2012-02-16 2013-08-29 Toshiba Lighting & Technology Corp 照明装置
JP2012064925A (ja) 2010-08-18 2012-03-29 Mitsubishi Chemicals Corp Led発光装置及びled発光装置を備えたインジケータ
TWI432668B (zh) * 2010-10-11 2014-04-01 Optromax Corp 白光照明裝置及產生白光之方法
DE102011010895B4 (de) * 2011-02-10 2022-04-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
US9412914B2 (en) 2011-07-25 2016-08-09 Nichia Corporation Light emitting device
CN102588805A (zh) * 2012-03-20 2012-07-18 佛山市国星光电股份有限公司 一种色温可调led器件及色温可调灯具
US9271368B2 (en) 2012-12-07 2016-02-23 Bridgelux, Inc. Method and apparatus for providing a passive color control scheme using blue and red emitters
KR102129780B1 (ko) * 2013-08-30 2020-07-03 엘지이노텍 주식회사 조명 장치
CN103458585B (zh) * 2013-09-11 2015-07-01 北京汽车股份有限公司 一种发光二极管led软光条控制模块及车辆
JP6203147B2 (ja) * 2014-01-29 2017-09-27 シャープ株式会社 発光装置
KR101547480B1 (ko) * 2014-08-20 2015-08-26 유상우 Led 구동 장치
CN107408615A (zh) 2015-03-13 2017-11-28 夏普株式会社 发光装置
FR3038452A1 (fr) * 2015-06-30 2017-01-06 Commissariat Energie Atomique Dispositif electroluminescent a semiconducteur comportant une couche photoluminescente structuree
WO2017192566A1 (en) * 2016-05-02 2017-11-09 Growflux Llc System and method for advanced horticultural lighting
CN109475025B (zh) * 2017-09-08 2023-11-07 三星电子株式会社 照明设备
CN108463024A (zh) * 2018-02-08 2018-08-28 深圳万源光引科技有限公司 多色led混光照明方法及照明系统
KR102497138B1 (ko) * 2019-12-13 2023-02-07 루미레즈 엘엘씨 Led들 및 다색 인광체들
US11398458B2 (en) 2019-12-13 2022-07-26 Lumileds Llc Multi-color phosphor converted LED package with single cavity
US11893215B2 (en) 2021-07-21 2024-02-06 Samsung Electronics Co., Ltd. Electronic device including flexible display and operation method thereof

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USRE26251E (en) * 1961-06-14 1967-08-15 Cathode ray tube having a color- selection electrode with large apertures
US3344301A (en) * 1966-07-25 1967-09-26 Rauland Corp Subtractive type color cathode ray tube having overlapping color phosphor areas
JPS4889678A (zh) * 1972-02-25 1973-11-22
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JP2822819B2 (ja) 1992-11-09 1998-11-11 日亜化学工業株式会社 多色発光素子
JP3536447B2 (ja) 1995-06-26 2004-06-07 カシオ計算機株式会社 カラー液晶表示素子
GB0116991D0 (en) * 2001-07-12 2001-09-05 Qinetiq Ltd Novel compounds
RU2233013C2 (ru) 2002-03-06 2004-07-20 Институт проблем химической физики РАН Полупроводниковый электролюминесцентный источник света и способ его изготовления (варианты)
SG185827A1 (en) 2002-03-22 2012-12-28 Nichia Corp Nitride phosphor and production process thereof, and light emitting device
KR100492938B1 (ko) * 2002-09-11 2005-05-30 강성진 컴팩트형 방전 램프
JP4310093B2 (ja) 2002-10-09 2009-08-05 キヤノン株式会社 固体撮像素子の製造方法
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JP2006237217A (ja) 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置及び面発光装置
JP4692059B2 (ja) * 2005-04-25 2011-06-01 パナソニック電工株式会社 発光装置の製造方法
JP2007049114A (ja) * 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
WO2007034367A1 (en) * 2005-09-19 2007-03-29 Koninklijke Philips Electronics N.V. Variable color light emitting device and method for controlling the same
JP4895574B2 (ja) 2005-11-02 2012-03-14 シャープ株式会社 波長変換部材及び発光装置
CN1988188A (zh) * 2005-12-23 2007-06-27 香港应用科技研究院有限公司 具有荧光层结构的发光二极管晶粒及其制造方法
US7775687B2 (en) * 2006-02-20 2010-08-17 Nichia Corporation Light emitting device
JP2008060129A (ja) * 2006-08-29 2008-03-13 Nec Lighting Ltd フルカラー発光ダイオード
JP5099418B2 (ja) * 2006-11-30 2012-12-19 東芝ライテック株式会社 照明装置
DE102007033026A1 (de) * 2007-07-16 2009-01-22 Osram Gesellschaft mit beschränkter Haftung Leuchtstoffmischung für eine Entladungslampe und Entladungslampe, insbesondere Hg-Niederdruckentladungslampe
TW200919696A (en) * 2007-10-26 2009-05-01 Led Lighting Fixtures Inc Illumination device having one or more lumiphors, and methods of fabricating same
KR100924912B1 (ko) 2008-07-29 2009-11-03 서울반도체 주식회사 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈

Also Published As

Publication number Publication date
EP2395568B1 (en) 2018-04-04
US20110278606A1 (en) 2011-11-17
KR20110120915A (ko) 2011-11-04
AU2010211671A1 (en) 2011-09-01
RU2011136713A (ru) 2013-03-10
WO2010090289A1 (ja) 2010-08-12
CN102308398A (zh) 2012-01-04
SG173174A1 (en) 2011-08-29
CN102308398B (zh) 2015-03-25
JP4549438B1 (ja) 2010-09-22
EP2395568A4 (en) 2012-06-27
JPWO2010090289A1 (ja) 2012-08-09
US8704244B2 (en) 2014-04-22
KR101670107B1 (ko) 2016-11-09
RU2515185C2 (ru) 2014-05-10
EP2395568A1 (en) 2011-12-14

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190208