GB8421094D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number: GB8421094D0
Authority: GB; United Kingdom
Prior art keywords: printed circuit; circuit boards; boards; printed; circuit
Prior art date: 1983-08-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

GB848421094A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujitsu Services Ltd

Original Assignee

Fujitsu Services Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-08-20

Filing date

1984-08-20

Publication date

1984-09-26

1984-08-20 Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd

1984-09-26 Publication of GB8421094D0 publication Critical patent/GB8421094D0/en

1985-03-27 Publication of GB2145574A publication Critical patent/GB2145574A/en

1986-04-09 Application granted granted Critical

1986-04-09 Publication of GB2145574B publication Critical patent/GB2145574B/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

GB08421094A 1983-08-20 1984-08-20 Multi-layer printed circuit boards Expired GB2145574B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB838322474A GB8322474D0 (en)	1983-08-20	1983-08-20	Printed circuit boards

Publications (3)

Publication Number	Publication Date
GB8421094D0 true GB8421094D0 (en)	1984-09-26
GB2145574A GB2145574A (en)	1985-03-27
GB2145574B GB2145574B (en)	1986-04-09

Family

ID=10547638

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GB838322474A Pending GB8322474D0 (en)	1983-08-20	1983-08-20	Printed circuit boards
GB08421094A Expired GB2145574B (en)	1983-08-20	1984-08-20	Multi-layer printed circuit boards

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
GB838322474A Pending GB8322474D0 (en)	1983-08-20	1983-08-20	Printed circuit boards

Country Status (7)

Country	Link
JP (1)	JPS6059799A (en)
AU (1)	AU571886B2 (en)
DE (1)	DE3428812A1 (en)
FR (1)	FR2550906B1 (en)
GB (2)	GB8322474D0 (en)
NL (1)	NL8402527A (en)
ZA (1)	ZA846089B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2551618B1 (en) *	1983-09-02	1989-12-01	Inf Milit Spatiale Aeronaut	METHOD FOR MANUFACTURING A PRINTED CIRCUIT WITH BURIED LAYERS AND PRINTED CIRCUIT OBTAINED BY SUCH A METHOD
GB2207558B (en) *	1987-07-11	1991-10-30	Abdul Hamed	Printed circuit boards
TW526693B (en)	2000-06-15	2003-04-01	Murata Manufacturing Co	Multilayer circuit component and method for manufacturing the same
DE102015111432A1 (en) *	2015-07-15	2017-01-19	Knorr-Bremse Systeme für Nutzfahrzeuge GmbH	Method for processing a mechatronic system for a commercial vehicle and a mechatronic system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2650348A1 (en) *	1976-11-03	1978-05-11	Bosch Gmbh Robert	Electric component soldered on printed circuit board - using layer of nickel covered by gold to ensure strong soldered joint
BR8008696A (en) *	1979-05-24	1981-04-14	Fujitsu Ltd	MULTIPLE LAYER PRINTED CIRCUIT PANEL, HOLLOW, AND PROCESS FOR MANUFACTURING THE SAME
FR2476428A1 (en) *	1980-02-15	1981-08-21	Tech Electro Cie Indle	METHOD FOR FASTENING ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT AND PRODUCT OBTAINED THEREBY
JPS5724775U (en) *	1980-07-17	1982-02-08

1983
- 1983-08-20 GB GB838322474A patent/GB8322474D0/en active Pending
1984
- 1984-08-04 DE DE19843428812 patent/DE3428812A1/en not_active Withdrawn
- 1984-08-06 ZA ZA846089A patent/ZA846089B/en unknown
- 1984-08-17 NL NL8402527A patent/NL8402527A/en not_active Application Discontinuation
- 1984-08-17 AU AU32046/84A patent/AU571886B2/en not_active Ceased
- 1984-08-20 GB GB08421094A patent/GB2145574B/en not_active Expired
- 1984-08-20 FR FR848412980A patent/FR2550906B1/en not_active Expired - Fee Related
- 1984-08-20 JP JP59171699A patent/JPS6059799A/en active Pending

Also Published As

Publication number	Publication date
JPS6059799A (en)	1985-04-06
AU571886B2 (en)	1988-04-28
FR2550906A1 (en)	1985-02-22
GB2145574A (en)	1985-03-27
FR2550906B1 (en)	1992-09-04
GB8322474D0 (en)	1983-09-21
AU3204684A (en)	1985-02-21
NL8402527A (en)	1985-03-18
DE3428812A1 (en)	1985-03-07
ZA846089B (en)	1985-03-27
GB2145574B (en)	1986-04-09

Publication	Publication Date	Title
EP0146241A3 (en)	1987-01-07	Circuit board
GB8421093D0 (en)	1984-09-26	Printed circuit boards
GB8307142D0 (en)	1983-04-20	Printed circuit boards
DE3475592D1 (en)	1989-01-12	Printed circuit board
GB8416503D0 (en)	1984-08-01	Viewing printed circuit boards
GB2124035B (en)	1985-07-31	Printed circuit boards
GB8300836D0 (en)	1983-02-16	Printed circuit board
DE3475023D1 (en)	1988-12-08	Circuit board
GB8309899D0 (en)	1983-05-18	Printed circuit board
GB8412606D0 (en)	1984-06-20	Printed circuit boards
GB8304280D0 (en)	1983-03-23	Printed circuit boards
GB2137422B (en)	1986-10-29	Printed circuit board
GB8419444D0 (en)	1984-09-05	Printed circuit boards
DE3380394D1 (en)	1989-09-14	Improved printed circuit board
GB2101411B (en)	1985-06-05	Flexi-rigid printed circuit boards
GB8322222D0 (en)	1983-09-21	Printed circuit board
GB2118369B (en)	1986-05-21	Making printed circuit boards
GB8322474D0 (en)	1983-09-21	Printed circuit boards
GB8326169D0 (en)	1983-11-02	Printed circuit board
GB8317952D0 (en)	1983-08-03	Printed circuit board
GB2109638B (en)	1984-11-28	Printed circuit boards
GB2139007B (en)	1986-10-01	Multi-layer printed circuit board
GB2150361B (en)	1988-01-27	Circuit board
GB2136211B (en)	1985-12-24	Printed circuit board
SU1157708A1 (en)	1985-05-23	Printed circuit board

Legal Events

Date	Code	Title	Description
1997-06-11	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2003-04-09	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20020820