GB2101411B - Flexi-rigid printed circuit boards - Google Patents

Flexi-rigid printed circuit boards

Info

Publication number: GB2101411B
Authority: GB; United Kingdom
Prior art keywords: flexi; printed circuit; circuit boards; rigid printed; rigid
Prior art date: 1981-06-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB08117140A

Other versions

GB2101411A (en

Inventor

John Alan Scarlett

James Alexander Grant

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

STC PLC

Original Assignee

Standard Telephone and Cables PLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-06-04

Filing date

1981-06-04

Publication date

1985-06-05

1981-06-04 Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC

1981-06-04 Priority to GB08117140A priority Critical patent/GB2101411B/en

1983-01-12 Publication of GB2101411A publication Critical patent/GB2101411A/en

1985-06-05 Application granted granted Critical

1985-06-05 Publication of GB2101411B publication Critical patent/GB2101411B/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

GB08117140A 1981-06-04 1981-06-04 Flexi-rigid printed circuit boards Expired GB2101411B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
GB08117140A GB2101411B (en)	1981-06-04	1981-06-04	Flexi-rigid printed circuit boards

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB08117140A GB2101411B (en)	1981-06-04	1981-06-04	Flexi-rigid printed circuit boards

Publications (2)

Publication Number	Publication Date
GB2101411A GB2101411A (en)	1983-01-12
GB2101411B true GB2101411B (en)	1985-06-05

Family

ID=10522276

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB08117140A Expired GB2101411B (en)	1981-06-04	1981-06-04	Flexi-rigid printed circuit boards

Country Status (1)

Country	Link
GB (1)	GB2101411B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59144968A (en) *	1983-02-08	1984-08-20	Sharp Corp	Thin type electronic instrument
DE3318717C1 (en) *	1983-05-21	1984-05-30	Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth	Process for manufacturing printed circuit boards with rigid and flexible areas
JP2631287B2 (en) *	1987-06-30	1997-07-16	日本メクトロン株式会社	Manufacturing method of hybrid multilayer circuit board
JPH0635499Y2 (en) *	1989-08-09	1994-09-14	ファイン電子株式会社	Double sided printed circuit board
US7172805B2 (en)	2003-07-08	2007-02-06	Viasytems Group, Inc.	Method for manufacturing a sequential backplane
ES2234430B1 (en) *	2003-12-11	2006-11-01	Vitelcom Mobile Technology, S.A.	PRINTED CIRCUIT PLATE STRUCTURE (PCB) CONFIGURED WITH DIFFERENT LEVELS.

1981
- 1981-06-04 GB GB08117140A patent/GB2101411B/en not_active Expired

Also Published As

Publication number	Publication date
GB2101411A (en)	1983-01-12

Publication	Publication Date	Title
GB2080629B (en)	1983-09-01	Printed circuit boards
GB8307142D0 (en)	1983-04-20	Printed circuit boards
GB8421093D0 (en)	1984-09-26	Printed circuit boards
GB2124035B (en)	1985-07-31	Printed circuit boards
GB2092830B (en)	1985-04-17	Multilayer printed circuit board
GB8304280D0 (en)	1983-03-23	Printed circuit boards
GB8308882D0 (en)	1983-05-11	Printed circuit boards
GB8419444D0 (en)	1984-09-05	Printed circuit boards
GB2101411B (en)	1985-06-05	Flexi-rigid printed circuit boards
GB2087654B (en)	1984-04-26	Printed circuit boards
HK38887A (en)	1987-05-22	Printed circuit boards
JPS57197889A (en)	1982-12-04	Printed circuit board
GB2095916B (en)	1984-11-28	Circuit boards
GB2109638B (en)	1984-11-28	Printed circuit boards
GB8421094D0 (en)	1984-09-26	Printed circuit boards
JPS57211793A (en)	1982-12-25	Printed circuit board
GB2098809B (en)	1984-08-15	Printed circuit board
JPS57178398A (en)	1982-11-02	Circuit board
JPS57204195A (en)	1982-12-14	Printed circuit board
JPS57130499A (en)	1982-08-12	Printed circuit board
JPS57118699A (en)	1982-07-23	Case for printed circuit board
JPS57139994A (en)	1982-08-30	Printed circuit board
JPS57141988A (en)	1982-09-02	Printed circuit board
JPS57166094A (en)	1982-10-13	Printed circuit board
JPS57111084A (en)	1982-07-10	Printed circuit board

Legal Events

Date	Code	Title	Description
1986-05-08	PCNP	Patent ceased through non-payment of renewal fee