GB8317952D0 - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- GB8317952D0 GB8317952D0 GB838317952A GB8317952A GB8317952D0 GB 8317952 D0 GB8317952 D0 GB 8317952D0 GB 838317952 A GB838317952 A GB 838317952A GB 8317952 A GB8317952 A GB 8317952A GB 8317952 D0 GB8317952 D0 GB 8317952D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08317952A GB2142478A (en) | 1983-07-01 | 1983-07-01 | Printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08317952A GB2142478A (en) | 1983-07-01 | 1983-07-01 | Printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8317952D0 true GB8317952D0 (en) | 1983-08-03 |
GB2142478A GB2142478A (en) | 1985-01-16 |
Family
ID=10545133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08317952A Withdrawn GB2142478A (en) | 1983-07-01 | 1983-07-01 | Printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2142478A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112867240A (en) * | 2019-11-27 | 2021-05-28 | 三星电机株式会社 | Printed circuit board |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19607212C1 (en) * | 1996-02-26 | 1997-04-10 | Richard Herbst | Prodn. of smart cards and data cards as composite injection moulding |
CN112584628A (en) * | 2019-09-27 | 2021-03-30 | 宁波言成电子科技有限公司 | Preparation method of riveted bonding pad printed circuit board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT294955B (en) * | 1966-12-01 | 1971-12-10 | Photocircuits Corp | Process for the production of printed circuit boards |
FR2183567B1 (en) * | 1972-05-10 | 1976-08-06 | Thomson Csf | |
GB1410780A (en) * | 1972-09-29 | 1975-10-22 | Exacta Circuits Ltd | Through-hole plated printed circuits |
US4170819A (en) * | 1978-04-10 | 1979-10-16 | International Business Machines Corporation | Method of making conductive via holes in printed circuit boards |
JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
FR2439478A1 (en) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS |
JPS58106971U (en) * | 1982-01-14 | 1983-07-21 | 棚沢 日佐司 | printed wiring board |
GB2118369B (en) * | 1982-04-06 | 1986-05-21 | Kanto Kasei Company Limited | Making printed circuit boards |
-
1983
- 1983-07-01 GB GB08317952A patent/GB2142478A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112867240A (en) * | 2019-11-27 | 2021-05-28 | 三星电机株式会社 | Printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB2142478A (en) | 1985-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |