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GB2476209A - Encapsulation method - Google Patents

Encapsulation method Download PDF

Info

Publication number
GB2476209A
GB2476209A GB1106000A GB201106000A GB2476209A GB 2476209 A GB2476209 A GB 2476209A GB 1106000 A GB1106000 A GB 1106000A GB 201106000 A GB201106000 A GB 201106000A GB 2476209 A GB2476209 A GB 2476209A
Authority
GB
United Kingdom
Prior art keywords
cavity
facing
loop
substrate
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1106000A
Other versions
GB2476209B (en
GB201106000D0 (en
Inventor
Changhai Wang
Jun Zeng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heriot Watt University
Original Assignee
Heriot Watt University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heriot Watt University filed Critical Heriot Watt University
Publication of GB201106000D0 publication Critical patent/GB201106000D0/en
Publication of GB2476209A publication Critical patent/GB2476209A/en
Application granted granted Critical
Publication of GB2476209B publication Critical patent/GB2476209B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a cavity-containing package (1) for a MEMS device (17) comprising a first substrate (3) having a surface (4) facing the cavity (15), a second substrate (5) having a surface (6) facing the cavity (15) and a loop of composite material (7), the loop having a surface (8) facing the cavity (15), a surface (10) facing away from the cavity (15) and two substrate-abutting surfaces (12, 14) and comprising a layer of polymeric material (11, 13, 29) and a layer of metal (9, 99) each of which layers' edges face the cavity-facing surfaces (4, 6) of the substrates, said cavity-facing surfaces (4, 6) of the substrates (3, 5) being connected to each other by said loop of composite material (7), wherein the substrate-abutting surfaces (12, 14) abut the cavity-facing surfaces (4, 6) continuously along the length of said loop (7), whereby said cavity-facing surfaces (4, 6) of the substrates (3, 5) and the loop (7) define the cavity (15).
GB1106000.1A 2008-09-19 2009-07-29 Encapsulation method Expired - Fee Related GB2476209B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0817309.8A GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method
PCT/GB2009/001861 WO2010031987A2 (en) 2008-09-19 2009-07-29 Encapsulation method

Publications (3)

Publication Number Publication Date
GB201106000D0 GB201106000D0 (en) 2011-05-25
GB2476209A true GB2476209A (en) 2011-06-15
GB2476209B GB2476209B (en) 2012-03-28

Family

ID=39951977

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0817309.8A Ceased GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method
GB1106000.1A Expired - Fee Related GB2476209B (en) 2008-09-19 2009-07-29 Encapsulation method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB0817309.8A Ceased GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method

Country Status (3)

Country Link
CN (1) CN102216201A (en)
GB (2) GB0817309D0 (en)
WO (1) WO2010031987A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105565248B (en) * 2016-02-23 2017-11-10 美新半导体（无锡）有限公司 The level Hermetic Package structure and manufacture method of attached cavity device
US9929290B2 (en) * 2016-06-20 2018-03-27 Globalfoundries Inc. Electrical and optical via connections on a same chip
CN110092348B (en) * 2018-01-30 2021-12-24 上海新微技术研发中心有限公司 Eutectic bonding structure and eutectic bonding method
CN113387319B (en) * 2021-06-11 2023-07-14 中国兵器工业集团第二一四研究所苏州研发中心 MEMS chip packaging structure based on multi-through hole silicon substrate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20040200736A1 (en) * 2003-04-09 2004-10-14 Van Heerden David Peter Hermetically sealed product and related methods of manufacture
US20050017329A1 (en) * 2003-06-10 2005-01-27 California Institute Of Technology Multiple internal seal ring micro-electro-mechanical system vacuum package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047718C (en) * 1993-05-03 1999-12-22 艾利森电话股份有限公司 A flexible device for encapsulating electronic components
DE60235389D1 (en) * 2001-09-17 2010-04-01 John Stafford CAPSULATION OF POLARIZED MEMS RELAY AND METHOD OF CAPSULATION
CN1799133A (en) * 2003-04-09 2006-07-05 活性纳米技术股份有限公司 Hermetically sealed product and related methods of manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20040200736A1 (en) * 2003-04-09 2004-10-14 Van Heerden David Peter Hermetically sealed product and related methods of manufacture
US20050017329A1 (en) * 2003-06-10 2005-01-27 California Institute Of Technology Multiple internal seal ring micro-electro-mechanical system vacuum package

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
'BCB Contact printing for patterned adhesive full-wafer bonded O-level packages', J. Oberhammer et al., Journal of Microelectromechanical systems, Vol. 14 (2), Pages 419-425, 1st April 2005 [XP011129677] *
'Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies', G. J. Carchon et al., IEEE Transactions on Advanced Packaging, Vol. 30 (3), Pages 369-376, 1st August 2003 [XP011189593] *
'Laser assisted polymer bonding technology for advanced MEMS packaging', J. Zeng et al., Electronics System Integration Technology Conference, IEEE, Pages 1225-1230, 1st September 2008 [XP031364659] *

Also Published As

Publication number Publication date
GB0817309D0 (en) 2008-10-29
WO2010031987A3 (en) 2010-06-24
CN102216201A (en) 2011-10-12
GB2476209B (en) 2012-03-28
WO2010031987A2 (en) 2010-03-25
GB201106000D0 (en) 2011-05-25

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20140807 AND 20140813

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20200729