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GB0817309D0 - Encapsulation method - Google Patents

Encapsulation method

Info

Publication number
GB0817309D0
GB0817309D0 GBGB0817309.8A GB0817309A GB0817309D0 GB 0817309 D0 GB0817309 D0 GB 0817309D0 GB 0817309 A GB0817309 A GB 0817309A GB 0817309 D0 GB0817309 D0 GB 0817309D0
Authority
GB
United Kingdom
Prior art keywords
encapsulation method
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0817309.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heriot Watt University
Original Assignee
Heriot Watt University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heriot Watt University filed Critical Heriot Watt University
Priority to GBGB0817309.8A priority Critical patent/GB0817309D0/en
Publication of GB0817309D0 publication Critical patent/GB0817309D0/en
Priority to PCT/GB2009/001861 priority patent/WO2010031987A2/en
Priority to CN2009801459977A priority patent/CN102216201A/en
Priority to GB1106000.1A priority patent/GB2476209B/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
GBGB0817309.8A 2008-09-19 2008-09-19 Encapsulation method Ceased GB0817309D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GBGB0817309.8A GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method
PCT/GB2009/001861 WO2010031987A2 (en) 2008-09-19 2009-07-29 Encapsulation method
CN2009801459977A CN102216201A (en) 2008-09-19 2009-07-29 Encapsulation method
GB1106000.1A GB2476209B (en) 2008-09-19 2009-07-29 Encapsulation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0817309.8A GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method

Publications (1)

Publication Number Publication Date
GB0817309D0 true GB0817309D0 (en) 2008-10-29

Family

ID=39951977

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0817309.8A Ceased GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method
GB1106000.1A Expired - Fee Related GB2476209B (en) 2008-09-19 2009-07-29 Encapsulation method

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1106000.1A Expired - Fee Related GB2476209B (en) 2008-09-19 2009-07-29 Encapsulation method

Country Status (3)

Country Link
CN (1) CN102216201A (en)
GB (2) GB0817309D0 (en)
WO (1) WO2010031987A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105565248B (en) * 2016-02-23 2017-11-10 美新半导体（无锡）有限公司 The level Hermetic Package structure and manufacture method of attached cavity device
US9929290B2 (en) * 2016-06-20 2018-03-27 Globalfoundries Inc. Electrical and optical via connections on a same chip
CN110092348B (en) * 2018-01-30 2021-12-24 上海新微技术研发中心有限公司 Eutectic bonding structure and eutectic bonding method
CN113387319B (en) * 2021-06-11 2023-07-14 中国兵器工业集团第二一四研究所苏州研发中心 MEMS chip packaging structure based on multi-through hole silicon substrate and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047718C (en) * 1993-05-03 1999-12-22 艾利森电话股份有限公司 A flexible device for encapsulating electronic components
US7121402B2 (en) * 2003-04-09 2006-10-17 Reactive Nano Technologies, Inc Container hermetically sealed with crushable material and reactive multilayer material
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package
DE60235389D1 (en) * 2001-09-17 2010-04-01 John Stafford CAPSULATION OF POLARIZED MEMS RELAY AND METHOD OF CAPSULATION
SE0202681D0 (en) * 2002-09-10 2002-09-10 Frank Niklaus Hermetic sealing with combined adhesive bonding and sealing rings
CN1799133A (en) * 2003-04-09 2006-07-05 活性纳米技术股份有限公司 Hermetically sealed product and related methods of manufacture
US7285844B2 (en) * 2003-06-10 2007-10-23 California Institute Of Technology Multiple internal seal right micro-electro-mechanical system vacuum package

Also Published As

Publication number Publication date
WO2010031987A3 (en) 2010-06-24
CN102216201A (en) 2011-10-12
GB2476209B (en) 2012-03-28
WO2010031987A2 (en) 2010-03-25
GB2476209A (en) 2011-06-15
GB201106000D0 (en) 2011-05-25

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)