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FR2815953B1 - Composant micromecanique et procede de fabrication d'un tel composant - Google Patents

Composant micromecanique et procede de fabrication d'un tel composant

Info

Publication number
FR2815953B1
FR2815953B1 FR0113866A FR0113866A FR2815953B1 FR 2815953 B1 FR2815953 B1 FR 2815953B1 FR 0113866 A FR0113866 A FR 0113866A FR 0113866 A FR0113866 A FR 0113866A FR 2815953 B1 FR2815953 B1 FR 2815953B1
Authority
FR
France
Prior art keywords
component
manufacturing
micromechanical
micromechanical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0113866A
Other languages
English (en)
Other versions
FR2815953A1 (fr
Inventor
Hubert Benzel
Heribert Weber
Frank Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2815953A1 publication Critical patent/FR2815953A1/fr
Application granted granted Critical
Publication of FR2815953B1 publication Critical patent/FR2815953B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/56Investigating or analyzing materials by the use of thermal means by investigating moisture content
    • G01N25/66Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point
    • G01N25/68Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point by varying the temperature of a condensing surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081Thermal properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111Bulk micromachining
    • B81C2201/0115Porous silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Materials For Medical Uses (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Prostheses (AREA)
  • Radiation Pyrometers (AREA)
  • Micromachines (AREA)
FR0113866A 2000-10-27 2001-10-26 Composant micromecanique et procede de fabrication d'un tel composant Expired - Fee Related FR2815953B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10053326A DE10053326A1 (de) 2000-10-27 2000-10-27 Mikromechanisches Bauelement und Herstellungsverfahren

Publications (2)

Publication Number Publication Date
FR2815953A1 FR2815953A1 (fr) 2002-05-03
FR2815953B1 true FR2815953B1 (fr) 2006-02-03

Family

ID=7661286

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0113866A Expired - Fee Related FR2815953B1 (fr) 2000-10-27 2001-10-26 Composant micromecanique et procede de fabrication d'un tel composant

Country Status (5)

Country Link
US (1) US6832523B2 (fr)
JP (1) JP2002205299A (fr)
DE (1) DE10053326A1 (fr)
FR (1) FR2815953B1 (fr)
IT (1) ITMI20012128A1 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080044939A1 (en) * 2002-01-24 2008-02-21 Nassiopoulou Androula G Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology
GR1004106B (el) * 2002-01-24 2003-01-13 Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης Ολοκληρωμενοι θερμικοι αισθητηρες πυριτιου χαμηλης ισχυος και διαταξεις μικρο-ροης βασισμενοι στην χρηση τεχνολογιας κοιλοτητας αερα σφραγισμενης με μεμβρανη πορωδους πυριτιου ή τεχνολογιας μικρο-καναλιων
DE10220705A1 (de) * 2002-05-10 2003-11-27 Abb Patent Gmbh Einrichtung zur chemischen oder biochemischen Analyse von Proben oder Reagenzien unter Verwendung von Wasser als Lösungsmittel
DE102004010295A1 (de) 2004-03-03 2005-09-22 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102004015442A1 (de) * 2004-03-30 2005-10-20 Bosch Gmbh Robert Verfahren zum Verschließen von perforierten Membranen
US7531002B2 (en) * 2004-04-16 2009-05-12 Depuy Spine, Inc. Intervertebral disc with monitoring and adjusting capabilities
US20060276008A1 (en) * 2005-06-02 2006-12-07 Vesa-Pekka Lempinen Thinning
US7691130B2 (en) * 2006-01-27 2010-04-06 Warsaw Orthopedic, Inc. Spinal implants including a sensor and methods of use
WO2007139123A1 (fr) 2006-05-25 2007-12-06 Panasonic Electric Works Co., Ltd. Capteur d'infrarouge
JP5016397B2 (ja) * 2007-06-08 2012-09-05 パナソニック株式会社 赤外線センサ
JP5016398B2 (ja) * 2007-06-08 2012-09-05 パナソニック株式会社 赤外線センサ
DE102008002579A1 (de) * 2008-06-23 2009-12-24 Robert Bosch Gmbh Mikro-elektromechanisches Sensorelement
JP5302596B2 (ja) * 2008-08-08 2013-10-02 パナソニック株式会社 固体真空デバイス
JP4976469B2 (ja) * 2009-08-28 2012-07-18 日立オートモティブシステムズ株式会社 熱式湿度センサ
JP5590454B2 (ja) * 2010-10-05 2014-09-17 株式会社リコー 電気素子、集積素子及び電子回路
JP5590461B2 (ja) * 2010-12-08 2014-09-17 株式会社リコー 露点計測装置および気体特性測定装置
JP5590460B2 (ja) * 2010-12-08 2014-09-17 株式会社リコー 露点計測装置および気体特性測定装置
JP5590459B2 (ja) * 2010-12-08 2014-09-17 株式会社リコー 露点計測装置および気体特性測定装置
DE102013003328A1 (de) * 2013-02-28 2014-08-28 Man Truck & Bus Ag Drucksensor zur Messung eines Drucks, insbesondere in einem Abgassystem einer Brennkraftmaschine
DE102015107560A1 (de) 2015-05-13 2016-11-17 USound GmbH Schallwandleranordnung mit MEMS-Schallwandler
EP3211404B1 (fr) 2016-02-25 2018-08-22 ams AG Dispositif de détection de point de rosée cmos-compatible et procédé de détermination d'un point de rosée
CN111024279B (zh) * 2019-12-30 2022-03-18 浙江清华柔性电子技术研究院 压力传感器单元及压力传感器
IT202000001879A1 (it) * 2020-01-31 2021-07-31 St Microelectronics Srl Generatore termoelettrico

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170618A (ja) * 1985-01-24 1986-08-01 Toyota Central Res & Dev Lab Inc 流速検出用半導体センサ
JPH0743215A (ja) * 1993-05-24 1995-02-14 Mitsubishi Electric Corp 赤外線検知素子
US5616514A (en) * 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
AU3356995A (en) * 1994-08-16 1996-03-07 Industrial Research Limited A dew point sensor
US5714791A (en) * 1995-12-22 1998-02-03 International Business Machines Corporation On-chip Peltier cooling devices on a micromachined membrane structure
US5852245A (en) * 1996-12-13 1998-12-22 Caterpillar Inc. Piezoelectric pressure sensor suitable for sensing pressure at high temperatures
GR1003010B (el) * 1997-05-07 1998-11-20 "����������" Ολοκληρωμενος αισθητηρας ροης αεριων χρησιμοποιωντας τεχνολογια πορωδους πυριτιου
CN1118103C (zh) * 1998-10-21 2003-08-13 李韫言 微细加工热辐射红外传感器
DE10136164A1 (de) * 2001-07-25 2003-02-20 Bosch Gmbh Robert Mikromechanisches Bauelement

Also Published As

Publication number Publication date
US20020139171A1 (en) 2002-10-03
DE10053326A1 (de) 2002-05-08
FR2815953A1 (fr) 2002-05-03
US6832523B2 (en) 2004-12-21
JP2002205299A (ja) 2002-07-23
ITMI20012128A1 (it) 2003-04-16

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140630