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FR2443519A1 - Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese - Google Patents

Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese

Info

Publication number
FR2443519A1
FR2443519A1 FR7929634A FR7929634A FR2443519A1 FR 2443519 A1 FR2443519 A1 FR 2443519A1 FR 7929634 A FR7929634 A FR 7929634A FR 7929634 A FR7929634 A FR 7929634A FR 2443519 A1 FR2443519 A1 FR 2443519A1
Authority
FR
France
Prior art keywords
coating
electrophoresis
article
metal articles
coating areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7929634A
Other languages
English (en)
Other versions
FR2443519B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THAMS JOHAN PETTER B
Original Assignee
THAMS JOHAN PETTER B
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THAMS JOHAN PETTER B filed Critical THAMS JOHAN PETTER B
Publication of FR2443519A1 publication Critical patent/FR2443519A1/fr
Application granted granted Critical
Publication of FR2443519B1 publication Critical patent/FR2443519B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Procédé de revêtement du bord d'un article métallique, à l'intersection d'au moins deux surfaces planes. On recouvre d'abord au moins partiellement l'article, on dégage mécaniquement le bord de la surface de son revêtement, par exemple par sciage ou découpage d'une partie de l'article. On décape ensuite la surface exposée pour former des surplombs protecteurs de revêtement et on recouvre sélectivement la surface décapée. Application au revêtement de tôles ou plaques, notamment pour circuits imprimés, appareils ménagers, revêtements de façade, etc.
FR7929634A 1978-12-05 1979-12-03 Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese Granted FR2443519A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7812499A SE435343B (sv) 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal

Publications (2)

Publication Number Publication Date
FR2443519A1 true FR2443519A1 (fr) 1980-07-04
FR2443519B1 FR2443519B1 (fr) 1984-01-13

Family

ID=20336533

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7929634A Granted FR2443519A1 (fr) 1978-12-05 1979-12-03 Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese

Country Status (14)

Country Link
US (1) US4321290A (fr)
JP (1) JPS6014627B2 (fr)
AT (1) AT370012B (fr)
AU (1) AU525331B2 (fr)
BE (1) BE880447A (fr)
CA (1) CA1145207A (fr)
CH (1) CH645042A5 (fr)
DE (1) DE2948940C2 (fr)
DK (1) DK151459C (fr)
FR (1) FR2443519A1 (fr)
GB (1) GB2040186B (fr)
IT (1) IT1119588B (fr)
NL (1) NL7908794A (fr)
SE (1) SE435343B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763294A (en) * 1980-10-06 1982-04-16 Fuji Photo Film Co Ltd Photosensitive printing plate for lithography
JPS59102237U (ja) * 1982-12-25 1984-07-10 筒井　将裕 端面を防蝕加工した塩ビ鋼板
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE3517796A1 (de) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
US4714646A (en) * 1986-03-24 1987-12-22 International Business Machines Corporation Electrophoretic insulation of metal circuit board core
US5422167A (en) * 1993-09-17 1995-06-06 Infosight Corporation High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5714234A (en) * 1996-06-10 1998-02-03 Infosight Corporation Identification tag with preform attachment
US6423907B1 (en) * 1998-02-09 2002-07-23 Tessera, Inc. Components with releasable leads
US6492201B1 (en) * 1998-07-10 2002-12-10 Tessera, Inc. Forming microelectronic connection components by electrophoretic deposition
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6588095B2 (en) * 2001-04-27 2003-07-08 Hewlett-Packard Development Company, Lp. Method of processing a device by electrophoresis coating
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
WO2004004432A1 (fr) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Carte de circuit imprime simple ou multicouches a languettes de rupture en retrait ou allongees
CN101203629B (zh) 2005-05-19 2012-01-18 海德鲁铝业德国有限责任公司 石印条的处理

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US813618A (en) * 1905-07-10 1906-02-27 Arlington Company Coated strip and method of making the same.
US3218187A (en) * 1962-04-16 1965-11-16 Anaconda Wire & Cable Co Coating method
DE1764612C3 (de) * 1967-07-04 1975-01-23 Fuji Shashin Film K.K., Ashigara, Kanagawa (Japan) Verfahren zur Herstellung eines magnetischen Aufzeichnungsmaterials
GB1144844A (en) * 1967-08-03 1969-03-12 Pyrene Co Ltd Coating of metals
US3682785A (en) * 1971-03-30 1972-08-08 Rca Corp Process for forming an isolated circuit pattern on a conductive substrate

Also Published As

Publication number Publication date
SE435343B (sv) 1984-09-24
DK151459B (da) 1987-12-07
AU5342279A (en) 1980-06-12
ATA771079A (de) 1982-07-15
JPS6014627B2 (ja) 1985-04-15
DE2948940C2 (de) 1986-02-27
CA1145207A (fr) 1983-04-26
BE880447A (fr) 1980-04-01
CH645042A5 (de) 1984-09-14
IT1119588B (it) 1986-03-10
GB2040186A (en) 1980-08-28
AU525331B2 (en) 1982-10-28
GB2040186B (en) 1983-01-26
SE7812499L (sv) 1980-06-06
DK515479A (da) 1980-06-06
AT370012B (de) 1983-02-25
FR2443519B1 (fr) 1984-01-13
IT7969336A0 (it) 1979-12-04
DE2948940A1 (de) 1980-06-19
US4321290A (en) 1982-03-23
DK151459C (da) 1988-05-30
NL7908794A (nl) 1980-06-09
JPS55116469A (en) 1980-09-08

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Legal Events

Date Code Title Description
ST Notification of lapse