[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SE435343B - Forfarande vid beleggning vid skarpa kanter pa metallforemal - Google Patents

Forfarande vid beleggning vid skarpa kanter pa metallforemal

Info

Publication number
SE435343B
SE435343B SE7812499A SE7812499A SE435343B SE 435343 B SE435343 B SE 435343B SE 7812499 A SE7812499 A SE 7812499A SE 7812499 A SE7812499 A SE 7812499A SE 435343 B SE435343 B SE 435343B
Authority
SE
Sweden
Prior art keywords
coating
exposed
edge
etched
metal
Prior art date
Application number
SE7812499A
Other languages
English (en)
Swedish (sv)
Other versions
SE7812499L (sv
Inventor
Johan-Petter Brynjulf Thams
Original Assignee
Thams Johan Petter B
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thams Johan Petter B filed Critical Thams Johan Petter B
Priority to SE7812499A priority Critical patent/SE435343B/sv
Priority to CA000340850A priority patent/CA1145207A/fr
Priority to FR7929634A priority patent/FR2443519A1/fr
Priority to US06/099,754 priority patent/US4321290A/en
Priority to DK515479A priority patent/DK151459C/da
Priority to IT69336/79A priority patent/IT1119588B/it
Priority to AU53422/79A priority patent/AU525331B2/en
Priority to BE0/198436A priority patent/BE880447A/fr
Priority to DE2948940A priority patent/DE2948940C2/de
Priority to GB7942020A priority patent/GB2040186B/en
Priority to NL7908794A priority patent/NL7908794A/nl
Priority to CH1080679A priority patent/CH645042A5/de
Priority to JP54156951A priority patent/JPS6014627B2/ja
Priority to AT0771079A priority patent/AT370012B/de
Publication of SE7812499L publication Critical patent/SE7812499L/xx
Publication of SE435343B publication Critical patent/SE435343B/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09581Applying an insulating coating on the walls of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0323Working metal substrate or core, e.g. by etching, deforming
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/135Electrophoretic deposition of insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1438Treating holes after another process, e.g. coating holes after coating the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Physical Vapour Deposition (AREA)
SE7812499A 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal SE435343B (sv)

Priority Applications (14)

Application Number Priority Date Filing Date Title
SE7812499A SE435343B (sv) 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal
CA000340850A CA1145207A (fr) 1978-12-05 1979-11-29 Enduction d'un article en metal sur ses rives et a leur voisinage
FR7929634A FR2443519A1 (fr) 1978-12-05 1979-12-03 Procede pour le revetement des aretes d'articles metalliques, notamment par electrophorese
US06/099,754 US4321290A (en) 1978-12-05 1979-12-03 Process for coating a metal article on and at an edge
DK515479A DK151459C (da) 1978-12-05 1979-12-04 Fremgangsmaade til overtraekning af en metalgenstand i et kantomraade
IT69336/79A IT1119588B (it) 1978-12-05 1979-12-04 Procedimento per il rivestimento di articoli metallici in corrispondenza di uno spigolo
AU53422/79A AU525331B2 (en) 1978-12-05 1979-12-04 Process for coating a metal article
BE0/198436A BE880447A (fr) 1978-12-05 1979-12-05 Procede d'enduction d'un article metallique
DE2948940A DE2948940C2 (de) 1978-12-05 1979-12-05 Anwendung eines Beschichtungsverfahrens, um an Kanten eines beschichteten Metallkörpers eine Beschichtungsmittelschicht zu erzeugen
GB7942020A GB2040186B (en) 1978-12-05 1979-12-05 Process for coating a metal article on and at an edge
NL7908794A NL7908794A (nl) 1978-12-05 1979-12-05 Werkwijze voor het bekleden van een metalen voorwerp op en bij een rand.
CH1080679A CH645042A5 (de) 1978-12-05 1979-12-05 Verfahren zum gleichmaessigen beschichten der oberflaeche und der kanten eines metallischen gegenstandes.
JP54156951A JPS6014627B2 (ja) 1978-12-05 1979-12-05 金属物品のへりを被覆する方法
AT0771079A AT370012B (de) 1978-12-05 1979-12-05 Verfahren zum ueberziehen von metallgegenstaenden auf und an einer kante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7812499A SE435343B (sv) 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal

Publications (2)

Publication Number Publication Date
SE7812499L SE7812499L (sv) 1980-06-06
SE435343B true SE435343B (sv) 1984-09-24

Family

ID=20336533

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7812499A SE435343B (sv) 1978-12-05 1978-12-05 Forfarande vid beleggning vid skarpa kanter pa metallforemal

Country Status (14)

Country Link
US (1) US4321290A (fr)
JP (1) JPS6014627B2 (fr)
AT (1) AT370012B (fr)
AU (1) AU525331B2 (fr)
BE (1) BE880447A (fr)
CA (1) CA1145207A (fr)
CH (1) CH645042A5 (fr)
DE (1) DE2948940C2 (fr)
DK (1) DK151459C (fr)
FR (1) FR2443519A1 (fr)
GB (1) GB2040186B (fr)
IT (1) IT1119588B (fr)
NL (1) NL7908794A (fr)
SE (1) SE435343B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763294A (en) * 1980-10-06 1982-04-16 Fuji Photo Film Co Ltd Photosensitive printing plate for lithography
JPS59102237U (ja) * 1982-12-25 1984-07-10 筒井 将裕 端面を防蝕加工した塩ビ鋼板
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE3517796A1 (de) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
US4714646A (en) * 1986-03-24 1987-12-22 International Business Machines Corporation Electrophoretic insulation of metal circuit board core
US5422167A (en) * 1993-09-17 1995-06-06 Infosight Corporation High temperature-resistant, thermally-printable label for attachment to hot metal stock and method thereof
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5714234A (en) * 1996-06-10 1998-02-03 Infosight Corporation Identification tag with preform attachment
US6423907B1 (en) * 1998-02-09 2002-07-23 Tessera, Inc. Components with releasable leads
US6492201B1 (en) * 1998-07-10 2002-12-10 Tessera, Inc. Forming microelectronic connection components by electrophoretic deposition
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6588095B2 (en) * 2001-04-27 2003-07-08 Hewlett-Packard Development Company, Lp. Method of processing a device by electrophoresis coating
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
WO2004004432A1 (fr) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Carte de circuit imprime simple ou multicouches a languettes de rupture en retrait ou allongees
CN101203629B (zh) 2005-05-19 2012-01-18 海德鲁铝业德国有限责任公司 石印条的处理

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US813618A (en) * 1905-07-10 1906-02-27 Arlington Company Coated strip and method of making the same.
US3218187A (en) * 1962-04-16 1965-11-16 Anaconda Wire & Cable Co Coating method
DE1764612C3 (de) * 1967-07-04 1975-01-23 Fuji Shashin Film K.K., Ashigara, Kanagawa (Japan) Verfahren zur Herstellung eines magnetischen Aufzeichnungsmaterials
GB1144844A (en) * 1967-08-03 1969-03-12 Pyrene Co Ltd Coating of metals
US3682785A (en) * 1971-03-30 1972-08-08 Rca Corp Process for forming an isolated circuit pattern on a conductive substrate

Also Published As

Publication number Publication date
DK151459B (da) 1987-12-07
AU5342279A (en) 1980-06-12
ATA771079A (de) 1982-07-15
JPS6014627B2 (ja) 1985-04-15
DE2948940C2 (de) 1986-02-27
CA1145207A (fr) 1983-04-26
BE880447A (fr) 1980-04-01
CH645042A5 (de) 1984-09-14
IT1119588B (it) 1986-03-10
GB2040186A (en) 1980-08-28
AU525331B2 (en) 1982-10-28
GB2040186B (en) 1983-01-26
SE7812499L (sv) 1980-06-06
FR2443519A1 (fr) 1980-07-04
DK515479A (da) 1980-06-06
AT370012B (de) 1983-02-25
FR2443519B1 (fr) 1984-01-13
IT7969336A0 (it) 1979-12-04
DE2948940A1 (de) 1980-06-19
US4321290A (en) 1982-03-23
DK151459C (da) 1988-05-30
NL7908794A (nl) 1980-06-09
JPS55116469A (en) 1980-09-08

Similar Documents

Publication Publication Date Title
SE435343B (sv) Forfarande vid beleggning vid skarpa kanter pa metallforemal
EP0048406B1 (fr) Panneau à circuit imprimé dissipateur de chaleur
US3620933A (en) Forming plastic parts having surfaces receptive to adherent coatings
US3745095A (en) Process of making a metal core printed circuit board
US3698940A (en) Method of making additive printed circuit boards and product thereof
US3742597A (en) Method for making a coated printed circuit board
US3666549A (en) Method of making additive printed circuit boards and product thereof
JPH02128492A (ja) 印刷配線板の製造方法
US4783247A (en) Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
US3558441A (en) Method of making a metal core printed circuit board
CN105696037A (zh) 对工件进行电镀的方法和电镀保护胶
CN104411099B (zh) 厚铜电路板电路图形的转移方法
US3240684A (en) Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards
US3695927A (en) Electrodeposition process for producing perforated foils with raised portions at the edges of the holes
CN105228357B (zh) 一种阶梯线路板的制作方法
USRE28042E (en) Method of making additive printed circuit boards and product thereof
GB2080630A (en) Printed circuit panels
US3131103A (en) Method of making circuit components
US3764485A (en) Method of making and using electroplating matrix
ES349275A1 (es) Un metodo de producir un dibujo de circuito conductor de configuracion previamente determinada.
CN114501801A (zh) 一种线路板的加工方法及线路板
JPS5843920B2 (ja) 印刷配線板の製造方法
JPH0344823B2 (fr)
JPH02144988A (ja) スルーホール付配線板の製造方法
GB1321010A (en) Method of manufacturing metal core printed circuit board

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7812499-7

Effective date: 19930709

Format of ref document f/p: F