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FI20031341A0 - Menetelmä elektroniikkamoduulin valmistamiseksi - Google Patents

Menetelmä elektroniikkamoduulin valmistamiseksi

Info

Publication number
FI20031341A0
FI20031341A0 FI20031341A FI20031341A FI20031341A0 FI 20031341 A0 FI20031341 A0 FI 20031341A0 FI 20031341 A FI20031341 A FI 20031341A FI 20031341 A FI20031341 A FI 20031341A FI 20031341 A0 FI20031341 A0 FI 20031341A0
Authority
FI
Finland
Prior art keywords
manufacturing
electronic module
module
electronic
Prior art date
Application number
FI20031341A
Other languages
English (en)
Swedish (sv)
Other versions
FI20031341A (fi
Inventor
Antti Iihola
Timo Jokela
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27839004&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI20031341(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20031341A priority Critical patent/FI20031341A/fi
Publication of FI20031341A0 publication Critical patent/FI20031341A0/fi
Priority to PCT/FI2004/000538 priority patent/WO2005027602A1/en
Priority to JP2006526649A priority patent/JP4977464B2/ja
Priority to DE112004001727.0T priority patent/DE112004001727B4/de
Priority to KR1020067005383A priority patent/KR20060066115A/ko
Priority to CN2004800267977A priority patent/CN1853451B/zh
Priority to US10/572,340 priority patent/US7696005B2/en
Priority to GB0605377A priority patent/GB2422054B/en
Publication of FI20031341A publication Critical patent/FI20031341A/fi
Priority to US12/753,329 priority patent/US9232658B2/en
Priority to US14/580,257 priority patent/US10798823B2/en
Priority to US16/788,701 priority patent/US20200187358A1/en
Priority to US17/364,593 priority patent/US11716816B2/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
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    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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    • H05K1/00—Printed circuits
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Adjustable Resistors (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FI20031341A 2003-09-18 2003-09-18 Menetelmä elektroniikkamoduulin valmistamiseksi FI20031341A (fi)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FI20031341A FI20031341A (fi) 2003-09-18 2003-09-18 Menetelmä elektroniikkamoduulin valmistamiseksi
GB0605377A GB2422054B (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module
US10/572,340 US7696005B2 (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module in an installation base
CN2004800267977A CN1853451B (zh) 2003-09-18 2004-09-15 用于制造电子模块的方法
JP2006526649A JP4977464B2 (ja) 2003-09-18 2004-09-15 電子モジュールの製造方法及び電子モジュール
DE112004001727.0T DE112004001727B4 (de) 2003-09-18 2004-09-15 Verfahren zur Herstellung eines elektronischen Moduls
KR1020067005383A KR20060066115A (ko) 2003-09-18 2004-09-15 전자 모듈 제조 방법
PCT/FI2004/000538 WO2005027602A1 (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module
US12/753,329 US9232658B2 (en) 2003-09-18 2010-04-02 Method for manufacturing an electronic module
US14/580,257 US10798823B2 (en) 2003-09-18 2014-12-23 Method for manufacturing an electronic module and electronic module
US16/788,701 US20200187358A1 (en) 2003-09-18 2020-02-12 Method for manufacturing an electronic module and electronic module
US17/364,593 US11716816B2 (en) 2003-09-18 2021-06-30 Method for manufacturing an electronic module and electronic module

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US11716816B2 (en) 2023-08-01
CN1853451B (zh) 2010-06-16
US20100188823A1 (en) 2010-07-29
DE112004001727T5 (de) 2006-10-19
CN1853451A (zh) 2006-10-25
US20210329788A1 (en) 2021-10-21
FI20031341A (fi) 2005-03-19
US9232658B2 (en) 2016-01-05
JP4977464B2 (ja) 2012-07-18
US20150124411A1 (en) 2015-05-07
KR20060066115A (ko) 2006-06-15
US20070166886A1 (en) 2007-07-19
JP2007506273A (ja) 2007-03-15
GB2422054B (en) 2007-05-16
WO2005027602A1 (en) 2005-03-24
DE112004001727B4 (de) 2020-10-08
GB0605377D0 (en) 2006-04-26
US7696005B2 (en) 2010-04-13
US20200187358A1 (en) 2020-06-11
US10798823B2 (en) 2020-10-06

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