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EP1669802A3 - Machine d'impression et procédé de sa fabrication - Google Patents

Machine d'impression et procédé de sa fabrication Download PDF

Info

Publication number
EP1669802A3
EP1669802A3 EP05026844A EP05026844A EP1669802A3 EP 1669802 A3 EP1669802 A3 EP 1669802A3 EP 05026844 A EP05026844 A EP 05026844A EP 05026844 A EP05026844 A EP 05026844A EP 1669802 A3 EP1669802 A3 EP 1669802A3
Authority
EP
European Patent Office
Prior art keywords
device manufacturing
imprinting machine
mold
imprinting
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05026844A
Other languages
German (de)
English (en)
Other versions
EP1669802A2 (fr
EP1669802B1 (fr
Inventor
Takashi Nakamura
Hirohisa Ota
Eigo Kawakami
Kazuyuki Kasumi
Toshinobu Tokita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to EP10002526A priority Critical patent/EP2189843B1/fr
Publication of EP1669802A2 publication Critical patent/EP1669802A2/fr
Publication of EP1669802A3 publication Critical patent/EP1669802A3/fr
Application granted granted Critical
Publication of EP1669802B1 publication Critical patent/EP1669802B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
EP05026844A 2004-12-09 2005-12-08 Machine d'impression et procédé pour la fabrication d'un dispositif utilisant ladite machine Not-in-force EP1669802B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10002526A EP2189843B1 (fr) 2004-12-09 2005-12-08 Machine d'impression et procédé pour la fabrication d'un dispositif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004356284A JP2006165371A (ja) 2004-12-09 2004-12-09 転写装置およびデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP10002526.1 Division-Into 2010-03-10

Publications (3)

Publication Number Publication Date
EP1669802A2 EP1669802A2 (fr) 2006-06-14
EP1669802A3 true EP1669802A3 (fr) 2009-04-22
EP1669802B1 EP1669802B1 (fr) 2011-03-09

Family

ID=35892420

Family Applications (2)

Application Number Title Priority Date Filing Date
EP10002526A Not-in-force EP2189843B1 (fr) 2004-12-09 2005-12-08 Machine d'impression et procédé pour la fabrication d'un dispositif
EP05026844A Not-in-force EP1669802B1 (fr) 2004-12-09 2005-12-08 Machine d'impression et procédé pour la fabrication d'un dispositif utilisant ladite machine

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP10002526A Not-in-force EP2189843B1 (fr) 2004-12-09 2005-12-08 Machine d'impression et procédé pour la fabrication d'un dispositif

Country Status (4)

Country Link
US (2) US7815424B2 (fr)
EP (2) EP2189843B1 (fr)
JP (1) JP2006165371A (fr)
DE (1) DE602005026767D1 (fr)

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CN105974731B (zh) * 2016-07-25 2020-01-03 京东方科技集团股份有限公司 一种压印板、检测方法及检测装置
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EP2189843A3 (fr) 2010-06-02
US8834144B2 (en) 2014-09-16
EP1669802A2 (fr) 2006-06-14
DE602005026767D1 (de) 2011-04-21
US20060157444A1 (en) 2006-07-20
EP2189843B1 (fr) 2012-05-16
JP2006165371A (ja) 2006-06-22
US20100148397A1 (en) 2010-06-17
US7815424B2 (en) 2010-10-19
EP1669802B1 (fr) 2011-03-09

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