[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP1170431A1 - Dispositif de collage et système de montage des plaques de plâtre - Google Patents

Dispositif de collage et système de montage des plaques de plâtre Download PDF

Info

Publication number
EP1170431A1
EP1170431A1 EP01250248A EP01250248A EP1170431A1 EP 1170431 A1 EP1170431 A1 EP 1170431A1 EP 01250248 A EP01250248 A EP 01250248A EP 01250248 A EP01250248 A EP 01250248A EP 1170431 A1 EP1170431 A1 EP 1170431A1
Authority
EP
European Patent Office
Prior art keywords
gypsum board
metallic plate
bonding member
hot melt
electromagnetic induction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01250248A
Other languages
German (de)
English (en)
Inventor
Masakatsu Yamaguchi
Keijiro Murayama
Mitsuhiro Takatsuru
Takashi Takayama
Tsutomu Shioya
Hiroshi Skiokawa
Hiroyuki Nishikawa
Nobuaki Sekiguchi
Takumi Harigaya
Kigen Agehara
Motoshige Akatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max Co Ltd
Original Assignee
Max Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000202645A external-priority patent/JP2002021297A/ja
Priority claimed from JP2000202643A external-priority patent/JP2002021298A/ja
Priority claimed from JP2000202644A external-priority patent/JP4038964B2/ja
Priority claimed from JP2000202646A external-priority patent/JP2002021299A/ja
Application filed by Max Co Ltd filed Critical Max Co Ltd
Publication of EP1170431A1 publication Critical patent/EP1170431A1/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
    • E04B2/7407—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts
    • E04B2/7453—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts with panels and support posts, extending from floor to ceiling
    • E04B2/7457—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts with panels and support posts, extending from floor to ceiling with wallboards attached to the outer faces of the posts, parallel to the partition
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/72—Non-load-bearing walls of elements of relatively thin form with respect to the thickness of the wall
    • E04B2/723—Non-load-bearing walls of elements of relatively thin form with respect to the thickness of the wall constituted of gypsum elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
    • E04B2002/7461—Details of connection of sheet panels to frame or posts
    • E04B2002/7468—Details of connection of sheet panels to frame or posts using magnets
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
    • E04B2002/7461—Details of connection of sheet panels to frame or posts
    • E04B2002/7472—Details of connection of sheet panels to frame or posts using adhesives

Definitions

  • the present invention relates to a bonding member for bonding, for example, gypsum board or panel to a pillar or the like, as well as a gypsum board mounting method for mounting a gypsum board with use of the bonding member.
  • a gypsum board is fixed to a pillar using nails, staples, or wood screws as in the prior art, there occurs a striking noise or a noise from a motor-operated driver or the like.
  • the gypsum board may be broken when stripped from the pillar and it may become impossible to recycle the gypsum board, or the gypsum board may be damaged into a more bulky mass, requiring much time and labor for classifying work and a higher cost for discarding the board.
  • a gypsum board is fixed with screws, if the screws are removed one by one, the gypsum board will not be damaged.
  • a gypsum board is usually fixed using 40 or more screws, 40 or more tapped holes will be left after removal of the screws; besides, the gypsum collapses in the holes, so it is difficult to use those holes for re-clamping the gypsum board, and thus such a gypsum board is not suitable for recycling.
  • 40 or more screws are used, much time is required for removing the screws one by one. Actually, therefore, the gypsum board is destroyed for removal.
  • a first aspect of the present invention is characterized in a bonding member comprising a metallic plate formed as a small piece onto which a hot melt adhesive layer is formed at least one side of said metallic plate.
  • a second aspect of the present invention is characterized in a gypsum board mounting method for mounting the gypsum board to a portion where said gypsum board is to be mounted using a bonding member comprising a metallic plate formed as a small piece onto which a hot melt adhesive layer is formed at least one side of said metallic plate, characterized in that said method comprising: fixing said bonding member temporarily to said portion; pushing said gypsum board onto said bonding member; heating said metallic plate of the bonding member with electromagnetic induction from above said gypsum board to melt said hot melt adhesive layer; and thereby allowing the gypsum board to be bonded to said portion.
  • a bonding member 1 shown in Fig. 1 is made up of a metallic plate 2 and hot melt adhesive layers 3 formed on both sides of the metallic plate 2.
  • the metallic plate 2 is formed of, for example, aluminum or iron and may be in a square or rectangular shape (length and width: 1-10 cm) or may be in any other shape, including a circular shape.
  • the thickness of the metallic plate 2 is set at a value suitable for induction heating, such as 0.1-2 mm.
  • the hot melt adhesive layers 3 are each formed by heat-melting a solid thermoplastic resin adhesive at a high temperature and applied with painting the thus melted adhesive to the metallic plate 2.
  • the hot melt adhesive is a contact bonding adhesive and is constituted, for example, by any or a mixture of polyvinyl acetate, ethylene/vinyl acetate copolymer, polyimide, phenoxy resin, ethyl cellulose, polyisobutylene, petroleum resin, polyester, terpene resin, asphalt, rosin, and derivatives thereof.
  • a double-side coated adhesive tape 6 may be used to affix beforehand to the surface of a hot melt adhesive layer 3 and a releasing paper may be used to affix onto the double-side coated adhesive tape 6.
  • a plurality of bonding members 1 are temporarily fixed to pillars 4, 4 beforehand with double side coated adhesive tapes 6.
  • the double side coated adhesive tapes 6 are affixed beforehand to either the pillars 4, 4 or the bonding members 1.
  • a gypsum board 5 is put on the temporarily fixed bonding members 1 so as to cover the bonding members, then is established its positional relation with respect to the pillars 4, 4 and is held in that positional relation.
  • a high frequency is generated from above the gypsum board 5 by means of an electromagnetic induction system 7 and applied to heat the metallic plate 2 of each bonding member 1 by induction heating.
  • the hot melt adhesive layers 3 begin to melt.
  • the gypsum board 5 is pushed toward the pillars 4, 4, with the result that the gypsum board 5 is bonded to the pillars 4, 4.
  • Heating of the metallic plate 2 is done efficiently because the metallic plate is a small piece and the hot melt adhesive layers 3 are formed on both sides thereof and they function as heat insulating layers. As a result, heating of the hot melt adhesive layers 3 is done efficiently. Moreover, if the area of the metallic plate 2 is preset to an appropriate value, it becomes possible to install the gypsum board 5 with a certain holding force. Further, since small metallic plates 2 are arranged at predetermined intervals, the weight per unit area applied to the hot melt adhesive layers 3 can be taken large when pushing the gypsum board 5 for bonding. Consequently, the gypsum board 5 can be bonded to the pillars 4, 4 surely.
  • the gypsum board 5 When the gypsum board 5 is applied to the temporarily fixed metallic plates 2, it becomes impossible to detect the positions of the metallic plates 2 where they are, however, it can be detected easily by using such a detecting means as a metal detector.
  • a metal detector For the metal detection there may be utilized a characteristic of the electromagnetic induction system 7 which is used for heating the hot melt adhesive layers 3. That is to say, when the electromagnetic induction system 7 is placed in a position facing to a metallic plate 2, an electric current will flow through the metallic plate 2 due to electromagnetic induction effect, with consequent a high frequency current flowing in the coil of the electromagnetic induction system 7 increases. By detecting this increase it is possible to detect the position of the metallic plate 2.
  • the electromagnetic induction system 7 comprises a high-frequency coil 21, a high-frequency current generating circuit 22 for generating a high-frequency current through the high-frequency coil 21, a detecting coil 23 for detecting the high-frequency current flowing through the high-frequency coil 21, a voltage output circuit 24 which outputs a voltage corresponding to the electric current detected by the detecting coil 23, a controller 25 for controlling the high-frequency current generating circuit 22, and a display 26.
  • the controller 25 compares an output voltage Vt provided from the voltage output circuit 24 with a predetermined reference voltage V0 and, when the output voltage Vt is not lower than the reference voltage V0, the controller judges that a metallic plate 2 is present at the position, causing the display 26 to make an indication that the metallic plate 2 is present.
  • the controller 25 is constituted by a CPU for example. Instead of the display 26 there may be used a lamp or a buzzer, causing the lamp to go on or the buzzer to generate a detection sound such as an alarm sound.
  • the electromagnetic induction system 7 is moved along the pillars 4, 4 and is stopped for a predetermined time at a position at which the display 26 has indicated an increase of the high-frequency current, it is possible to heat the metallic plate 2 surely.
  • the electromagnetic induction system 7 causes a high-frequency current for beating a metallic plate 2 to flow through the high-frequency coil 21 also during detection of a metallic plate 2, but a modification may be made such that during the detection a weak high-frequency current is only allowed to flow to detect the metallic plate 2 and a high-frequency current for heating is allowed to flow after detection of the metallic plate.
  • the electromagnetic induction system 7 uses the detecting coil 23 and the voltage output circuit 24, there may be used a metal detector instead.
  • each bonding member 1 is a band-like long metallic plate 8, as shown in Fig. 5, the metallic plate 8 is shaded by the gypsum board 5 and therefore it is impossible to determine which portion of the metallic plate 8 is bonded. Consequently, there occurs a case when a portions A which has once been induction-heated and bonded, are melted again and peeled off by subjecting those portions to induction heating. But such an inconvenience does not occur in this embodiment because the metallic plate 2 is a small piece, allowing the whole surface of each bonding member 1 to be bonded to a pillar 4, 4 and the gypsum board 5 in induction heating, and further because the induction heating can be done for each bonding member 1. Consequently, it is possible to effect the bonding with high reliability, to attain a high heating efficiency, shorten the time required for the bonding work, to reduce the amount of the hot melt adhesive layers 3 used and hence to execute an interior finish work at low cost.
  • hot melt adhesive layers 3 are formed on both sides of the metallic plate 2
  • such hot melt adhesive layer may be formed on only one side of the metallic plate. In this case, if an ordinary type of an adhesive is applied to the other side of the metallic plate, it becomes unnecessary to temporarily fix the bonding member 1 with a double-side coated adhesive tape or the like.
  • each metallic plate 2 is heated by the electromagnetic induction system 7 with the same manner as above described to melt the hot melt adhesive layers 3. Since the hot melt adhesive layers 3 are in a melted state during removal of the gypsum board 5, it is possible to peel off, or remove, the gypsum board easily from the pillars 4, 4 without damage.
  • the gypsum boards 5 can be peeled off in a simple manner moreover it is done without damage, the gypsum board 5 can be recycled.
  • the gypsum board 5 is mounted with the bonding member 1, a wooden board for example can be mounted instead.
  • Fig. 6 illustrates a mounting method for the gypsum board 5 according to a second embodiment of the present invention.
  • Each bonding member 10 shown in Fig. 7 comprises a metallic plate (not shown) and hot melt adhesive layers 3 formed on both sides of the metallic plate, like the bonding member 1 shown in Fig. 1,
  • the double-side coated adhesive tape 11 which has adhesiveness, is affixed onto the hot melt adhesive layer 3 on one side and the bonding members 10 are arranged to locate at approximately equal intervals on the double-side coated adhesive tape 11.
  • a connected bonding member 12 which is constituted by affixing a large number of bonding members 10 to the double-side coated adhesive tape 11, when the connected bonding member 12 is not in use, a releasing paper, for example, which is made of silicon coated paper, is affixed to the adhesive portion of the double-side coated adhesive tape 11.
  • the double-side coated adhesive tape 11 is used as a continuously elongated member in this embodiment, it may be substituted by a string or tape which has the adhesive force not throughout the whole surface thereof but it has the adhesive force on its only surface of abutting with the bonding members 10.
  • string or tape can be formed using paper or plastic film.
  • the bonding member 10 located at the top position may be fastened with pin or a small double-side coated adhesive tape and then the gypsum board 5 may be mounted while covering the connected bonding member 12 and the pin, even by these manner there will arise no problem.
  • Fig. 8 illustrates a bonding member 13 according to the second embodiment of the present invention.
  • the bonding member 13 of this embodiment is provided with a pair of inserting projections 15, 15 formed at corners of a metallic plate 14 and the top of it have sharp tips.
  • Hot melt adhesive layers 14A and 14B are formed on both surfaces, front and back, of the metallic plate 14.
  • the inserting projections 16, 15 are inserted into the pillar 4 shown in Fig. 5 by hand or with a hammer.
  • the inserting projections 15, 15 there may be formed a chevron shaped projection 15' near a central part of the metallic plate 14 as shown in Fig. 8.
  • Fig. 9 illustrates a bonding member 16 according to a third embodiment of the present invention.
  • the bonding member 16 which is formed by bending a metallic plate in roughly U shape, comprises a flat plate portion 18 and a pair of holding plate portions 17, 17 formed on both sides of the flat plate portion 18, The distal end sides of the holding plates 17, 17 are bent slightly inwards so as to become narrower.
  • the flat plate portion 18 is formed flat and hot melt adhesive layers (not shown) are formed on both surfaces, front and back of the flat plate portion 18.
  • the distal end sides of the holding plate portions 17, 17 are slightly expanded and the pillar 4 is inserted between the holding plate portions 17, 17.
  • the pillar 4 is inserted until the whole of the hot melt adhesive layer (not shown) formed on the back of the flat plate portion 18 comes into contact with the surface of the pillar 4.
  • the gypsum board 5 (see Fig. 3) is pushed against the flat plate portion 18 of the bonding member 16 and in this state the gypsum board is heated from above by means of the electromagnetic induction system 7 (see Fig. 3), allowing the bonding member 16 to be bonded to the pillar 4 and also to the gypsum board 5.
  • a small, rectangular, double-side coated adhesive tape may be used to affix to flat plate portion 18 on the side which comes into contact with the gypsum board 5, thereby allowing the flat plate portion to lightly hold the gypsum board before the electromagnetic induction heating.
  • Fig. 10 illustrates another method for temporarily fixing the bonding member at the time of mounting the gypsum board 5 to the pillar 4.
  • a pin (inserting member) 19 is driven into the pillar 4 through the bonding member 1 as shown in Fig. 1 to fix the bonding member to the pillar temporarily.
  • other inserting members employable than the pin 19 there are mentioned nail, wooden screw, and staple.
  • the pillar 4 is a steel frame such as H shaped steel though it is not shown in the drawings, if the metallic plate of the bonding member 1 is magnetized to allow the bonding member to be adhered to the steel frame magnetically, it becomes easier to effect the temporary fixing of the bonding member 1.
  • the gypsum board 5 is pushed against the bonding member 1 and is subjected to electromagnetic induction heating from above, as noted above.
  • the gypsum board 5 can be peeled off easily from the pillars 4, 4 without damage thereto and it is possible to obtain the same effects as in the first embodiment.
  • the bonding members 1, 13, and 16 are small pieces, they can be removed easy, and even when they are to be discarded, the discarding work can be done at low cost in a simple manner.
  • the numeral 101 denotes a building, which is provided with a pillar 102 and walls 103. Between the pillar (support pillar) 102 and a pillar (not shown) are disposed wooden or steel frame studs (support posts) 104 and 105. A gypsum board 106 is attached to the support pillar 102 and the stud 104. Further, the gypsum board 106 and a gypsum board 107 are attached to the stud 105, as shown in Fig. 13.
  • the bonding members 112 respectively comprise a metallic plate 110 made of iron or aluminum for example and hot melt adhesive layers 111 formed on both sides of the metallic plate 110.
  • the metallic plate 110 is about 0.1 to 2 mm thick and about 1 to 10 cm in length and width.
  • each metallic plate 110 can be detected easily by using a detecting means such as a metal detector.
  • a characteristic of an electromagnetic induction system 120 (see Fig. 16) used for heating the hot melt adhesive layers 111 may be utilized for metal detection.
  • a metallic plate 110 is detected by the electromagnetic induction system (electromagnetic induction heating means) 120, then the thus-detected metallic plate 110 is heated with an electromagnetic induction system 120 to melt the hot melt adhesive layers 111, and the gypsum boards 106 and 107 are pushed and bonded to the pillar 102 and studs 104, 105.
  • the electromagnetic induction system 120 is of completely the same configuration as that of the electromagnetic induction system 7 shown in Fig. 4 and therefore an explanation thereof will here be omitted.
  • a high-frequency current is allowed to flow through the high-frequency coil 21 in the electromagnetic induction system 120.
  • the electromagnetic induction system 120 is moved along the pillar 102 and studs 104, 105, as shown in Fig. 17.
  • an electric current is flowed in the metallic plate 110 with electromagnetic induction, with consequent increase of the high-frequency current flowing through the high-frequency coil 21 in the electromagnetic induction system 120.
  • the electric current detected by the detecting coil 23 increases and the output voltage Vt provided from the voltage output circuit 24 takes a value of not lower than the reference voltage V0.
  • the controller 25 judges that a metallic plate 110 is present, and causes the display 26 to provide an indication that the metallic plate 110 is present.
  • the movement of the electromagnetic induction system 120 is stopped at that position by the user and is operated to heat the metallic plate 110 for a predetermined time (several seconds), causing the hot melt adhesive layers 111 to melt. Thereafter, the electromagnetic induction system 120 is again moved along the pillar 102 and studs 104, 105 while searching for the position of another metallic plate 110 in the same manner as above, followed by heating the metallic plate 110 and melting the hot melt adhesive layers 111.
  • the metallic plate 110 is a small piece and the hot melt adhesive layers 111 applied to both sides of the metallic plate function as a heat insulating material, the metallic plate 110 is heated efficiently. Consequently, heating of the hot melt adhesive layers 111 is done efficiently. Besides, since the heat of the metallic plate 110 is retained by the hot melt adhesive layers 111 and plural such metallic plates 110 are arranged at predetermined intervals, heat docs not escape to the other metallic portion than the heated portion in comparison with the case where a metallic plate is disposed throughout the whole of opposing surfaces of the gypsum boards 106, 107 and the studs 104, 105, thus making it possible to effect efficient heating.
  • the gypsum board 106 For removal of the gypsum board 106, the gypsum board is peeled off from the heated portions in a successive manner. At this time, since the hot melt adhesive layers 111 on each metallic plate 110 are in a melted state, the removal of the gypsum board 106 can be done easily without being damaged.
  • the gypsum boards 106 and 107 can be peeled off in a simple manner moreover it is done without damage, the gypsum board 106 and 107 can be recycled.
  • the hot melt adhesive layers 111 are applied to both sides of each metallic plate 110, only one of either side of the metallic plate may be coated with such adhesive layer. In this case, an ordinary type of an adhesive may be applied to the other side.
  • the electromagnetic induction system 120 causes a high-frequency current to flow in the high-frequency coil 21 for heating the metallic plate
  • a modification such that during the detection a weak high-frequency current is allowed to flow to detect a metallic plate 110 and a high-frequency current for heating is allowed to flow upon detection of the metallic plate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finishing Walls (AREA)
EP01250248A 2000-07-04 2001-07-02 Dispositif de collage et système de montage des plaques de plâtre Withdrawn EP1170431A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2000202644 2000-07-04
JP2000202643 2000-07-04
JP2000202645A JP2002021297A (ja) 2000-07-04 2000-07-04 接合材
JP2000202645 2000-07-04
JP2000202646 2000-07-04
JP2000202643A JP2002021298A (ja) 2000-07-04 2000-07-04 石膏ボードの取付方法と石膏ボードの取付構造
JP2000202644A JP4038964B2 (ja) 2000-07-04 2000-07-04 建築物の解体方法
JP2000202646A JP2002021299A (ja) 2000-07-04 2000-07-04 石膏ボードの取付方法

Publications (1)

Publication Number Publication Date
EP1170431A1 true EP1170431A1 (fr) 2002-01-09

Family

ID=27481420

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01250248A Withdrawn EP1170431A1 (fr) 2000-07-04 2001-07-02 Dispositif de collage et système de montage des plaques de plâtre

Country Status (2)

Country Link
US (1) US20020002805A1 (fr)
EP (1) EP1170431A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2278472A1 (es) * 2004-03-08 2007-08-01 Bpb Iberpalco, S.A. Elemento magnetico para colocacion de paneles ultraligeros y proceso de aplicacion.
EP2066850A1 (fr) * 2006-08-29 2009-06-10 Patrick Johansson Procédé et dispositif servant à monter une planche sur un support
FR2955874A1 (fr) * 2010-01-29 2011-08-05 Madeco Systeme de fixation de panneaux suspendus amovibles
WO2019101761A1 (fr) * 2017-11-22 2019-05-31 Dsm Ip Assets B.V. Procédé de production et de recyclage d'un objet constitué d'un panneau pourvu durablement d'un revêtement de surface

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7707783B2 (en) * 2005-05-11 2010-05-04 Lifetime Products, Inc. Modular enclosure
US7698857B2 (en) * 2006-05-25 2010-04-20 Rubbermaid Incorporated Roof assembly method and apparatus
DE102008060511A1 (de) * 2008-12-04 2010-07-22 Insu-Fast Gmbh Montagevorrichtung zur beabstandeten Montage von Fassadenplatten und Fassadensystemen
KR20110035039A (ko) * 2009-09-29 2011-04-06 엘지전자 주식회사 접착 테이프 및 이를 포함하는 이동 단말기, 이동 단말기의 제조 방법 및 제조 장치
PL2630310T3 (pl) * 2010-10-22 2016-08-31 Syma Intercontinental Sa System profili ramowych
AT512642B1 (de) * 2012-04-19 2013-10-15 Jan Werner Flexibles Wandsystem
US20160053478A1 (en) * 2014-08-19 2016-02-25 Charles Porter Interlocking Clip System
DE202015100079U1 (de) 2015-01-09 2016-04-13 C3 Technologies Gmbh Schnellbau-Sandwichwandelementsystem zur Ausbildung einer rückbaubaren Wand

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069640A (en) * 1976-10-20 1978-01-24 National Gypsum Company Method of mounting and demounting a wallboard wall
US5593120A (en) * 1994-11-21 1997-01-14 Minnesota Mining And Manufacturing Company Quick-mounting fastening assembly
WO1997014855A1 (fr) * 1995-10-19 1997-04-24 Pehrson Claes Goeran Procede de montage de batiments

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069640A (en) * 1976-10-20 1978-01-24 National Gypsum Company Method of mounting and demounting a wallboard wall
US5593120A (en) * 1994-11-21 1997-01-14 Minnesota Mining And Manufacturing Company Quick-mounting fastening assembly
WO1997014855A1 (fr) * 1995-10-19 1997-04-24 Pehrson Claes Goeran Procede de montage de batiments

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2278472A1 (es) * 2004-03-08 2007-08-01 Bpb Iberpalco, S.A. Elemento magnetico para colocacion de paneles ultraligeros y proceso de aplicacion.
EP2066850A1 (fr) * 2006-08-29 2009-06-10 Patrick Johansson Procédé et dispositif servant à monter une planche sur un support
EP2066850A4 (fr) * 2006-08-29 2014-03-05 Patrick Johansson Procédé et dispositif servant à monter une planche sur un support
FR2955874A1 (fr) * 2010-01-29 2011-08-05 Madeco Systeme de fixation de panneaux suspendus amovibles
WO2019101761A1 (fr) * 2017-11-22 2019-05-31 Dsm Ip Assets B.V. Procédé de production et de recyclage d'un objet constitué d'un panneau pourvu durablement d'un revêtement de surface

Also Published As

Publication number Publication date
US20020002805A1 (en) 2002-01-10

Similar Documents

Publication Publication Date Title
EP1170431A1 (fr) Dispositif de collage et système de montage des plaques de plâtre
JP2001322104A (ja) 建築用化粧板の接合、接着方法
JP2002021299A (ja) 石膏ボードの取付方法
JP2002235421A (ja) 建材のホットメルト接着工法及び建材
JP4038964B2 (ja) 建築物の解体方法
JP2002021297A (ja) 接合材
JPS5813698B2 (ja) 断熱材打込工法
JP2674610B2 (ja) 防水シートの固定構造及びその固定方法
JP2005155189A (ja) 床材の施工方法及び床構造
JPH11172895A (ja) 床材施工方法及びその床材
JP2003165176A (ja) 誘導加熱対応型シート材並びにシート材張着構造及び方法
JP2004324339A (ja) 床仕上げ材及び床仕上げ材の施工方法
JP3487913B2 (ja) 温度調整装置及び温度調整装置の施工方法
JP2006037566A (ja) 床材の取付構造
JP4341946B2 (ja) 床暖房装置、床暖房パネル、床材および結合材
JPS6141167A (ja) クリ−ニングブレ−ドの保持方法
JP5653668B2 (ja) 防水構造、及び防水構造の改修方法
JP3929754B2 (ja) 内装材の施工方法
JP4151156B2 (ja) Ｌ型化粧材及びその製造方法及びその施工構造
JP2000213759A (ja) 暖房マット
JP4071078B2 (ja) 内装材の施工方法
JP2002047464A (ja) 両面接着部材及びこれを用いた建築材の取付方法
JPS6132980Y2 (fr)
JP2002021295A (ja) 建築板及びその施工方法
JP2878766B2 (ja) 平面調整部材及び該部材を用いる内装方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

Kind code of ref document: A1

Designated state(s): DE FR GB NL SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20020705

AKX Designation fees paid

Free format text: DE FR GB

RBV Designated contracting states (corrected)

Designated state(s): AT BE DE FR GB

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB NL SE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20040203