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EP0995808B1 - Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold - Google Patents

Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold Download PDF

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Publication number
EP0995808B1
EP0995808B1 EP99939202A EP99939202A EP0995808B1 EP 0995808 B1 EP0995808 B1 EP 0995808B1 EP 99939202 A EP99939202 A EP 99939202A EP 99939202 A EP99939202 A EP 99939202A EP 0995808 B1 EP0995808 B1 EP 0995808B1
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EP
European Patent Office
Prior art keywords
weight
copper
alloy
based alloy
blanking die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99939202A
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German (de)
English (en)
French (fr)
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EP0995808A4 (en
EP0995808A1 (en
Inventor
Akihito Mitsubishi Shindoh Co. Wakamatsu MORI
Takeshi Mitsubishi Shindoh Co. Wakamatsu SUZUKI
Tadao Mitsubishi Shindoh Co. Wakama. SAKAKIBARA
Yoshiharu Mitsubishi Shindoh Co. Wakamatsu MAE
Keishi Nogami
Yutaka Mitsubishi Materials Corporation KOSHIBA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
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Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/ja
Priority claimed from JP4432299A external-priority patent/JP4186201B2/ja
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Publication of EP0995808A1 publication Critical patent/EP0995808A1/en
Publication of EP0995808A4 publication Critical patent/EP0995808A4/en
Application granted granted Critical
Publication of EP0995808B1 publication Critical patent/EP0995808B1/en
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Definitions

  • This invention relates to a copper-based alloy having a small blanking die wear property (hereinafter referred to as "blanking die wear resistance”) and a copper-based alloy and sheet thereof having excellent blanking die wear resistance and resin adhesion.
  • this invention relates to a copper-based alloy having excellent repeated bending fatigue resistance and excellent solderability, and to a copper-based alloy and sheet thereof having excellent repeated bending fatigue resistance and excellent solderability, as well as having excellent blanking die wear resistance and resin adhesion.
  • lead frames for semiconductor devices such as ICs and LSIs, and terminals and connectors for various electrical and electronic parts, are manufactured by cutting a copper-based alloy sheet into strips, which are then subjected to metal working, such as punching, pressing and bending.
  • Lead frames of many kinds of semiconductor devices as well as many kinds of terminals and connectors are used in resin packaging with thermosetting resin.
  • the copper-based alloy sheets which are known to be used to manufacture these lead frames for semiconductor devices include:
  • JP-A-2 111 829 , JP-A-2 111 828 and JP-A-2 111 850 respectively disclose a copper-based alloy for lead frame that contains similar elements as of the present invention, but not carbon.
  • JP-A-7 242 965 and JP-A-10 017 956 disclose the use of carbon in a copper-based alloy.
  • US-A-4 668 471 , US-A-3 522 038 and US-A-3 522 039 disclose the use of Mg, Si and Al in a copper alloy lead material, respectively.
  • pins on the ICs, LSIs and the like tend to bend during handling when the ICs, LSIs and the like are being manufactured.
  • semiconductor devices on the market are used for special applications or re-used. In such cases, it is necessary to rectify the pins of the semiconductor devices by repeated bending.
  • These pins of the semiconductor devices with reduced thickness and narrower pitch can occasionally break during the repeated bending process due to fatigue. When the pins break, the semiconductor devices can no longer be used and must be disposed, thus resulting in a tremendous decrease in productivity. Therefore, there is demand for a copper-based alloy sheet having such excellent resistance to fatigue during repeated bending that it will not break during the repeated bending process.
  • the lead frames for semiconductor devices, and the terminals and connectors for various electrical and electronic parts are usually soldered, and the soldering area is more strongly required to be smaller and the soldering temperature and time are required to be as low and short as possible.
  • activated flux used in soldering accelerates corrosion, in recent years, low activated or non-activated flux is becoming used for soldering the lead frames, terminals and connectors.
  • the lead frames, terminals and connectors of poor soldering materials are soldered with a low activated or non activated flux and over the small soldering area, an incomplete soldering can occur. This is one of the reasons that the product has spoiled reliability, and thus a copper-based alloy sheet with further improved solderability is desired.
  • semiconductor chips such as ICs and LSIs are subjected to die-bonding and wire-bonding at approximately 200°C or higher temperatures and then are resin packaged for protection from the external environment. Molding for the resin packaging is conducted at a temperature of 160°C or higher, but if the adhesion strength of the resin and the lead frames is weak, then separation of the resin and the lead frames can occur. A device with such separation undergoes moisture absorption and the package can occasionally break during the following reflow soldering process due to the vapor pressure of the moisture. This problem has been a serious obstacle to fulfillment of severe reliability requirements.
  • the object of this invention is to provide a copper-based alloy having excellent blanking die wear resistance, repeated bending fatigue resistance and solderability as well as excellent high resin adhesion.
  • copper-based alloy having excellent blanking die wear resistance, repeated bending fatigue resistance, solderability and resin adhesion, comprising 1.5 to 2.4 weight % of Fe, 0.008 to 0.08 weight % of P, 0.01 to 0.5 weight % of Zn, 0.003 to 0.5 weight % of Ni, 0.003 to 0.5 weight % of Sn, and 0.0005 to 0.02 weight % of C, and further containing one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si in a total amount of 0.0007 to 0.5 weight %, and the balance being Cu and inevitable impurities.
  • the at least one element includes Mg.
  • the at least one element includes Si.
  • the at least one element includes Mg and Si.
  • the inevitable impurities contain one or two or more elements selected from the group consisting ofNb, Ti, Zr, Ta, Hf, W, V and Mo in a total amount which is limited to less than 0.01 weight %.
  • the invention also relates to a copper-base alloy sheet formed of the copper-base alloy as defined above.
  • the resin adhesion of the above mentioned copper-based alloy having excellent blanking die wear resistance, repeated bending fatigue resistance and solderability, containing 0.0005 to 0.02 weight % of C is improved when one element selected from the group consisting of Al, Be, Ca, Cr, Mg and Si is added in an amount of 0.0007 to 0.5 weight % of Al, 0.0007 to 0.5 weight % of Ca, 0.0007 to 0.5 weight % of Be, 0.0007 to 0.5 weight % of Cr, 0.0007 to 0.5 weight % of Mg, or 0.0007 to 0.5 weight % of Si.
  • two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si may be added in a total amount of 0,0007 weight % to 0.5 weight %.
  • the group of Al, Be, Ca, Cr, Mg and Si it is more preferable to add Mg and Si.
  • Mg or Si may be added in an amount of 0.0007 weight % to 0.5 weight % of Mg or 0.0007 weight % to 0.5 weight % of Si, or both Mg and Si may be added in amounts of 0.0007 weight % to 0.5 weight % of Mg and 0.0007 weight % to 0.5 weight % of Si so that they coexist in the alloy.
  • this invention is preferably characterized by:
  • this invention is characterized by:
  • raw materials are prepared, which include highly pure electrolytic copper, iron-based alloy or copper-based alloy containing a reduced amount of carbide-forming elements, Cu-Zn mother alloy, Cu-Ni mother alloy, Cu-Sn mother alloy, Fe-C mother alloy, Cu-P mother alloy, Cu-Al mother alloy, Cu,-Be mother alloy, Cu-Ca mother alloy, Cu-Cr mother alloy, Cu-Mg mother alloy, and Cu-Si mother alloy.
  • the highly pure electrolytic copper is melted in an induction type smelting furnace using a crucible formed of graphite under a reducing atmosphere with the molten alloy meniscus being covered with a graphite solid, to obtain a molten alloy.
  • the Cu and other elements-containing mother alloys are then added to obtain molten alloys according to test pieces, and finally the Fe-C mother alloy is added so as to adjust the composition.
  • the resulting molten alloys are cast by a semi-continuous casting method using a graphite mold, to form copper-based alloy ingots.
  • ingots are annealed at a temperature of 750 - 980 °C in a reducing atmosphere, and then are hot rolled, followed by being quenched and then scalped. Further, the ingots are repeatedly alternately cold rolled at a reduction ratio of 40 to 80 % and process-annealed at a temperature of 400 - 650 °C. Then, the ingots are subjected to final cold rolling, followed by stress relieving annealing at a temperature of 250 - 350 °C, and other treatments, to obtain sheets.
  • the Fe component is solid solved in the Cu matrix and forms a compound with P, to increase the strength and hardness of the alloy.
  • the Fe content is less than 1.5 weight %, the above effects cannot be achieved to a desired extent, whereas, if the Fe content exceeds 2.4 weight %, the alloy has drastically degraded platability due to surface discontinuity, and further, decreases in both electrical conductivity and workability. Therefore, the Fe content has been limited to the range of 1.5 to 2.4 weight %, and preferably to a range of 1.8 to 2.3 weight %.
  • the P component has a deoxidation effect and also acts to improve the strength of the alloy by forming a compound with Fe.
  • the P content is less than 0.008 weight %, the above effects cannot be achieved to a desired extent, whereas, if the P content exceeds 0.08 weight %, the alloy decreases in both electrical conductivity and workability. Therefore, the P content has been limited to the range of 0.008 to 0.08 weight %, and preferably to a range of 0.01 to 0.05 weight %.
  • the Zn component is solid solved in the Cu matrix to increase the soldering thermal peeling resistance of the alloy.
  • the Zn content is less than 0.01 weight %, the above effect cannot be achieved to a desired extent.
  • the Zn content exceeds 0.50 weight %, the above effect is saturated. Therefore, the Zn content has been limited to the range of 0.01 to 0.50 weight %, and preferably to a range of 0.05 to 0.35 weight %.
  • the C component is an element which is extremely difficult to solid solve in copper.
  • adding a very small amount of C refines the crystal grains of the cast ingot which restrains intergranular cracking during hot rolling, and further, improves blanking die wear resistance.
  • the C content has been limited to the range of 0.0005 to 0.02 weight %.
  • the C content should be limited to a range of 0.001 to 0.02 weight %, and more preferably to a range of 0.001 to 0.008 weight %
  • the Ni component is solid solved in the Cu matrix to strengthen and improve the fatigue resistance to lead bending (repeated bending fatigue resistance) of the same.
  • the Ni content is less than 0.003 weight %, the above effects cannot be achieved to a desired extent, whereas, if the Ni content exceeds 0.5 weight %, the alloy drastically decreases in electrical conductivity. Therefore, the Ni content has been limited to the range of 0.003 to 0.5 weight %, and preferably to a range of 0.008 to 0.2 weight %.
  • the Sn component is solid solved in the Cu matrix to increase the strength and improve the solderability.
  • the Sn content is less than 0.003 weight %, the above effects cannot be achieved to a desired extent, whereas, if the Sn content exceeds 0.5 weight %, the alloy drastically decreases in electrical conductivity. Therefore, the Sn content has been limited to the range of 0.003 to 0.5 weight %, and preferably to a range of 0.008 to 0.2 weight %.
  • these components are contained in the copper-based alloy, because they each have a deoxidation effect as well as an effect to suppress the exhaustion of C by forming an antioxidant film on the molten alloy meniscus. Further, these components act to improve the strength of the Fe-Zn-P alloy, as well as to improve the resin adhesion of the same.
  • the total content of one or two or more components of this group of Al, Be, Ca, Cr, Mg and Si is less than 0.0007 weight %, the above effects cannot be achieved to a desired extent, whereas, if the total content of the same exceeds 0.5 weight %, electrical conductivity decreases, and further, large oxides and precipitates easily become formed and the surface cleanness is lost.
  • the content of these components has been limited to the range of 0.0007 to 0.5 weight %, and preferably to a range of 0.005 to 0.15 weight %.
  • Mg and Si are most preferable
  • Be is the next most preferable
  • Al, Ca and Cr are preferable next to Be.
  • Carbide-forming elements (Nb, Ti, Zr, Ta, Hf, W, V and Mo) :
  • the total content of one or two or more elements of the carbide-forming elements has been limited to less than 0.01 weight %, and preferably to less than 0.001 weight %.
  • highly pure electrolytic copper, iron-based alloy or copper-based alloy containing carbide-forming elements, Cu-Zn mother alloy, Cu-P mother alloy, Fe-C mother alloy and pure iron were prepared.
  • the highly pure electrolytic copper, iron-based alloy or copper-based alloy containing carbide-forming elements and pure iron were melted in a CO + N2 gaseous atmosphere in a coreless induction smelting furnace using a crucible formed of graphite, with the molten alloy meniscus being covered with a graphite solid, to obtain a molten alloy.
  • the Cu-P mother alloy was added to the obtained molten alloy for deoxidation, then the Cu-Zn mother alloy, and lastly, the Fe-C mother alloy were added so as to adjust the composition.
  • the resulting molten alloys were cast using a graphite nozzle and a graphite mold, into ingots, each having a size of 160mm in thickness, 450mm in width, and 1600mm in length, to obtain ingots having chemical compositions shown in Tables 1 to 3, as copper-based alloys Nos. 1 to 16 according to example 1 comparative copper-based alloys Nos. 1. to 3 and a conventional copper-based alloy No. 1.
  • the sheets were process-annealed at 530°C for 1 hour and cold-rolled at a reduction ratio of 69% into cold-rolled sheets having a thickness of 0.50mm.
  • the sheets were then again process-annealed at a temperature within a range of 460 ⁇ 500°C for 1 hour.
  • the sheets were cold-rolled at a reduction ratio of 50% into cold-rolled sheets having a thickness of 0.25mmn.
  • the sheets were annealed at 300°C for 2 minutes for stress relief.
  • copper-based alloy sheet strips of the copper-based alloys Nos. 1 to 16 according to example 1 comparative copper-based alloys Nos. 1 to 3 and conventional copper-based alloy No. 1 were prepared.
  • a compact dieing machine (Model LEM 3201, manufactured by Noritsu Kikai) with a commercially available blanking die formed of a WC-based hard alloy having a composition of 16 weight % of Co, and the balance of WC was used to carry out continuous blanking to obtain one million blanked circular chips with a diameter of 5mm, from the Cu alloy sheet strips having a size of 0.25mm in thickness and 25mm in width. 20 bores obtained immediately after the start of the blanking and 20 bores obtained immediately before the termination of the same were selected, and the diameter of each bore was measured. An amount of change in the diameter was determined from two average diameter values of the respective groups of 20 bores, to adopt it as the amount of wear of the blanking die.
  • the amount of wear of the blanking die by the conventional copper-based alloy No. 1 in Table 3 was set as a reference value of 1, and the wear amounts by the other copper-based alloys were converted into values relative to the reference value, as shown in Tables 1 to 3, to thereby evaluate the blanking die wear resistance.
  • Tables 1 to 3 show that the sheets of the present invention copper-based alloys Nos. 1 to 16 all exhibit more excellent blanking die wear resistance compared with the sheet of the conventional copper-based alloy No. 1.
  • the results also show that the comparative copper-based alloy No. 1, containing less than 0.0005 weight % of C, and comparative copper-based alloy No. 3, containing totally 0.01 or more weight % of the carbide-forming elements both exhibit insufficient blanking die wear resistance.
  • comparative copper-based alloy No. 2 which contain more than 0.02 weight % of C exhibits intergranular cracking during the hot-rolling process and is therefore not preferable.
  • Molten alloys with almost desired Fe, P, Zn compositions were prepared in a manner similar to that of Example 1. Then, one or two or more elements, selected from the group consisting of Al, Be, Ca, Cr, Mg and Si was/were added in the form of a mother alloy(s) with Cu, to form an antioxidant film on the molten alloy meniscus. Then, an Fe-C mother alloy was added, to obtain the copper-based alloys having chemical compositions shown in Tables 4 to 7 as copper-based alloys Nos. 17 to 38 according to example 2 , comparative copper-based alloys Nos. 4 to 6 and conventional copper-based alloy No. 2.
  • Example 2 Under the same conditions as Example 1, the copper-based alloys were cold-rolled into a thickness of 0.25mm, and finally annealed for stress relief at a temperature of 300°C for 2 minutes, to prepare sheet strips of the copper-based alloys Nos. 17 to 38 according to example 2, comparative copper-based alloys Nos. 4 to 6 and conventional copper-based alloys No. 2.
  • Tables 4 to 9 show that the sheet strips of the present invention copper-based alloys Nos. 17 to 38, which contain 0.0005 - 0.02 weight % of C, and further totally contains 0.0007 - 0.5 weight % of one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si, exhibit superior blanking die wear resistance and resin adhesion compared with the sheet strip of the conventional copper-based alloy No. 2.
  • the results also show that the comparative copper-based alloy No. 4, containing less than 0.0005 weight % of C, and comparative copper-based alloy No. 6, containing 0.01 or more weight % of carbide-forming elements, both exhibit insufficient blanking die wear resistance.
  • comparative copper-based alloy No. 5 which contains more than 0.02 weight % of C exhibits intergranular cracking during the hot-rolling process and is therefore not preferable.
  • highly pure electrolytic copper, iron-based alloy or copper-based alloy containing carbide-forming elements Cu-Zn mother alloy, Cu-P mother alloy, Cu-Ni mother alloy, Cu-Sn mother alloy, Fe-C mother alloy and pure iron were prepared.
  • the highly pure electrolytic copper, iron-based alloy or copper-based alloy containing carbide-forming elements, Cu-Ni mother alloy, Cu-Sn mother alloy and pure iron were melted in a CO + N2 gaseous atmosphere in a coreless induction smelting furnace using a crucible formed of graphite, with the molten alloy being covered with a graphite solid, to obtain a molten alloy.
  • the Cu-P mother alloy was added to the obtained molten alloy for deoxidation, then the Cu-Zn mother alloy, and lastly, the Fe-C mother alloy were added so as to adjust the composition.
  • the resulting molten alloys were cast using a graphite nozzle and a graphite mold, into ingots, each having a size of 160mm in thickness, 450mm in width, and 1600mm in length, to obtain ingots having chemical compositions shown in Tables 10 to 12, as copper-based alloys Nos. 39 to 54 according to the present invention, comparative copper-based alloys Nos. 7 to 11 and conventional copper-based alloy No. 3.
  • the sheets were process-annealed at 530°C for 1 hour and cold-rolled at a reduction ratio of 80% into cold-rolled sheets having a thickness of 0.32mm.
  • the sheets were then again process-annealed at a temperature of 480°C for 1 hour.
  • the sheets were cold-rolled at a reduction ratio of 53% into cold-rolled sheets having a thickness of 0.15mm.
  • the sheets were annealed at 300°C for 2 minutes for stress relief.
  • sheet strips of the copper-based alloys Nos. 39 to 54 according to the present invention, comparative copper-based alloys Nos. 7 to 11 and conventional copper-based alloy No. 3 were prepared.
  • a compact dieing machine (Model LEM 3201, manufactured by Noritsu Kikai) with a commercially available blanking die formed of a WC-based hard alloy having a composition of 16 weight % of Co, and the balance of WC was used to carry out continuous blanking to obtain one million blanked circular chips with a diameter of 5mm, from the Cu alloy sheet strips of the copper-based alloys Nos. 39 to 54 according to the present invention, comparative copper-based alloys Nos. 7 to 11 and conventional copper-based alloy No. 3, having a size of 0.15mm in thickness and 25mm in width. 20 bores obtained immediately after the start of the blanking and 20 bores obtained immediately before the termination of the same were selected, and the diameter of each bore was measured.
  • An amount of change in the diameter was determined from two average diameter values of the respective groups of 20 bores, to adopt it as the amount of wear of the blanking die.
  • the amount of wear of the blanking die by the conventional copper-based alloy No. 3 in Table 12 was set as a reference value of 1, and the wear amounts by the other copper-based alloys were converted into values relative to the reference value, as shown in Tables 13 and 14, to thereby evaluate the blanking die wear resistance.
  • the increased width portion of each test piece was fixed to a lead fatigue tester (manufactured by Hybrid Machine Products Co.), and the reduced width portion was loaded with an 8oz. (226.8g) weight.
  • the reduced width portion of the test piece was bent by 90 degrees in one direction (first bending), then bent back by 90 degrees in the opposite direction into the original position (second bending), the first and second bendings being counted as one.
  • the above bending operations were repeated until the test piece ruptured, and the number of bending before the rupture was counted.
  • Five test pieces were cut out from the sheet of the copper-based alloy in a direction parallel with the rolling direction, and further five test pieces cut out from the sheet in a direction perpendicular to the rolling direction, per each copper-based alloy. An average value of the number of bending before the rupture was calculated for all the test pieces, and the results are shown in Tables 13 and 14, to thereby evaluate the repeated bending fatigue resistance.
  • test pieces each having a size of 0.15mm in thickness, 10mm in width, and 50mm in length, were cut out from the copper-based alloys Nos. 39 to 54 according to the present invention, comparative copper-based alloys Nos. 7 to 11 and conventional copper-based alloy No. 3.
  • the test pieces were polished with a #1000 emery paper, and then degreased with acetone. Then, the test pieces were acid pickled with an 10% aqueous sulfuric acid solution at 40°C for 1 minute, followed by washing and drying, and then coated with a low-activated rosin flux.
  • test pieces coated with the low-activated rosin flux were then dipped in a bath of a 60 weight % Sn - 40 weight % Pb solder held at a temperature of 230°C, under conditions of dipping depth: 2mm, dipping speed: 16mm/sec, and sensitivity: 5g.
  • Time t was measured, that elapses from the start of dipping when buoyancy starts acting upon the test piece to the time the buoyancy becomes zero after reaching a peak value.
  • the measurement results are shown in Tables 13 and 14.
  • the solderability was evaluated by the value t, such that the smaller the value t, the better the wettability with respect to the solder.
  • Tables 10 to 14 show that the sheets of the present invention copper-based alloys Nos. 39 to 54 all exhibit superiority in blanking die wear resistance, repeated bending fatigue resistance, and solderability to the sheet of the conventional copper-based alloy No. 3.
  • the results also show that the comparative copper-based alloy No. 7, containing less than 0.0005 weight % of C, and comparative copper-based alloy No. 9, containing totally 0.01 or more weight % of the carbide-forming elements, both exhibit insufficient blanking die wear resistance. Further, comparative copper-based alloy No.
  • Molten alloys were prepared with addition of Fe, P, Zn, Ni and Sn in a manner similar to that in Example 3. Then, one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si was/were added to form an antioxidant film on the molten alloy meniscus. Lastly, an Fe-C mother alloy was added so as to adjust the contents of C and Fe to obtain copper-based alloys having chemical compositions shown in Tables 15 to 18, as copper-based alloys Nos. 55 to 76 according to the present invention, comparative copper-based alloys Nos. 12 to 16 and conventional copper-based alloy No. 4.
  • Example 3 Under the same conditions as in Example 3, the copper-based alloys were cold-rolled into cold-rolled sheets having a thickness of 0.15mm, and finally annealed for stress relief at a temperature of 300 °C for 2 minutes, to prepare sheet strips of the copper-based alloys Nos. 55 to 76 according to the present invention, comparative copper-based alloys Nos. 12 to 16 and conventional copper-based alloy No. 4.
  • a blanking die wear resistance test was conducted on these sheet strips using the same method as adopted in Example 3, with the amount of die wear by the conventional copper based alloy No. 4 set as a reference value of 1, and relative values thereto are shown in Tables 19 to 22, to thereby evaluate the blanking die wear resistance.
  • a repeated bending fatigue resistance test was conducted using the same method as adopted in Example 3, to measure the number of times each test piece was bent before rupture occurred, and the measurement results are shown in Tables 19 to 22, to thereby evaluate the repeated bending fatigue resistance.
  • a solderability test was conducted using the same method as adopted in Example 1 to determine the value t, which is also shown in Tables 19 to 22. The solderability was evaluated by the value t, such that the smaller the value t,the better the wettability with respect to the solder.
  • Tables 15 to 22 show that the sheet strips of the present invention copper-based alloys Nos. 55 to 70, 72, 76, which contain one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si, exhibit superiority in both blanking die wear resistance and repeated bending fatigue resistance as well as superiority in resin adhesion, to the sheet strip of the conventional copper-based alloy No. 4.
  • the results also show that the comparative copper-based alloy No. 12, containing less than 0.0005 weight % of C, and one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si, and the comparative copper-based alloy No.
  • the results show that the comparative copper-based alloy No. 13, which contains more than 0.02 weight % of C and less than 0.003 weight % of Sn, exhibits intergranular cracking during the hot-rolling process and thus is inferior in solderability. Further, the results show that electrical conductivity undesirably decreases when Ni is added in an amount exceeding 0.5 weight % and also when Sn is contained in an amount exceeding 0.5 weight %.
  • the copper-based alloys of the present invention are superior in blanking die wear resistance, repeated bending fatigue resistance and solderability to the conventional copper-based alloy, and also superior in resin adhesion to the latter. Therefore, the copper-based alloy of the present invention can greatly contribute to the development of the electronic industry.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
EP99939202A 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold Expired - Lifetime EP0995808B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP5798998 1998-03-10
JP15454598 1998-06-03
JP15454598A JP4186199B2 (ja) 1998-06-03 1998-06-03 耐打抜き金型摩耗性、耐繰り返し曲げ疲労特性およびはんだ付け性に優れた銅合金
JP4432299A JP4186201B2 (ja) 1998-03-10 1999-02-23 耐打抜き金型摩耗性および樹脂密着性に優れた銅合金および銅合金薄板
JP4432299 1999-02-23
PCT/JP1999/001116 WO1999046415A1 (fr) 1998-03-10 1999-03-09 Alliage de cuivre et feuille mince en alliage de cuivre possedant une resistance a l'usure amelioree en tant que moule metallique d'estampage

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EP0995808A1 EP0995808A1 (en) 2000-04-26
EP0995808A4 EP0995808A4 (en) 2006-04-12
EP0995808B1 true EP0995808B1 (en) 2009-08-26

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EP99939202A Expired - Lifetime EP0995808B1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

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EP (1) EP0995808B1 (ko)
KR (1) KR100562790B1 (ko)
CN (1) CN1102177C (ko)
DE (1) DE19980583T1 (ko)
HK (1) HK1028425A1 (ko)
TW (1) TW442576B (ko)
WO (1) WO1999046415A1 (ko)

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FR2783336B1 (fr) 1998-09-11 2001-10-12 Schlumberger Ind Sa Procede de transmission de donnees et carte pour une telle transmission
JP3918397B2 (ja) 2000-04-11 2007-05-23 三菱マテリアル株式会社 耐密着性無酸素銅荒引線、その製造方法及び製造装置
KR100415959B1 (ko) 2000-03-14 2004-01-24 닛코 킨조쿠 가부시키가이샤 하드디스크 드라이브 서스펜션용 구리합금박
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CN1256715A (zh) 2000-06-14
EP0995808A4 (en) 2006-04-12
CN1102177C (zh) 2003-02-26
TW442576B (en) 2001-06-23
DE19980583T1 (de) 2000-04-13
EP0995808A1 (en) 2000-04-26
HK1028425A1 (en) 2001-02-16
WO1999046415A1 (fr) 1999-09-16

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