Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/14—Mounting supporting structure in casing or on frame or rack
  • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
  • H05K7/1468—Mechanical features of input/output (I/O) modules
  • H05K7/1472—Bus coupling modules, e.g. bus distribution modules
• • G—PHYSICS
  • G05—CONTROLLING; REGULATING
  • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
  • G05B19/00—Programme-control systems
  • G05B19/02—Programme-control systems electric
  • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
  • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
  • G05B19/0423—Input/output
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/14—Mounting supporting structure in casing or on frame or rack
  • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
  • H05K7/1475—Bus assemblies for establishing communication between PLC modules
  • H05K7/1478—Bus assemblies for establishing communication between PLC modules including a segmented bus

Definitions

• the present invention relates to a modular, assembly-wise expandable peripheral device for controlling and / or monitoring a technical process.
• the peripheral device consists of a base module, to which at least one supply voltage can be supplied, to which at least one expansion module can be added. Both the base module and the at least one add-on expansion module can be connected to actuators and / or sensors for controlling and / or monitoring the technical process.
• Peripherals of the type described above are well known in the art.
• Siemens AG supplies the ET200U modular peripheral device.
• sensors and actuators are connected directly to the central automation device.
• the processing and implementation of the process signals - the interaction with sensors and actuators - takes place directly on site, that is, spatially assigned to the process or the sub-process.
• the connection between the peripheral device and the central automation device is usually made via a fieldbus and thus via a single connection.
• peripheral devices with a high degree of protection are also known - for example the peripheral device ET200C sold by Siemens AG - which are particularly suitable for use in harsh industrial environments.
• Peripheral devices which are modularly expandable with a high protection class are not known. Furthermore, no modularly expandable peripheral devices are known in the prior art, in which the necessary electrically conductive connections between the individual modules can be made without additional contact means, such as, for example, Result in plugs or cables during expansion.
• the object of the invention is to provide a peripheral device for controlling and / or monitoring a technical process which can be modularly expanded in modules.
• the base module consists of a base module lower part and a base module upper part
• the expansion module consists of an extension module lower part and an extension module upper part and that the base module lower part and the extension module lower part have a side-by-side profile , so that the base module lower part and the extension module lower part or the extension module lower part and a further extension module lower part can be arranged in a form-fitting manner.
• the peripheral device is characterized in that the modular structure is self-supporting. This is achieved through the form-fitting, releasable connection of the module lower parts.
• the peripheral device is characterized in that each module upper part is depending ⁇ wells attached only to the corresponding module base with at least one fastening means and that the actuation of the fastening means duluntermaschine by other module upper parts or Mo ⁇ not obstructed.
• FIG. 1 shows a modular peripheral device that can be expanded in modules, in the assembled state
• FIG. 2 shows a modular peripheral device that can be expanded in modules in the partial exploded view
• FIG. 3 shows a plan view of modular sub-parts lined up
• FIG. 4 shows a section through the peripheral device along the
• Section line IV and FIG. 5 shows a section through the peripheral device along section line V.
• the basic module BM consists of a basic module lower part BMU and a basic module upper part BMO.
• the EM expansion module consists of an EMU expansion module lower section and an EMO expansion module upper section.
• the base module lower part BMU and extension module lower part EMU have a stackable profile, so that the base module lower part BMU and the extension module lower part EMU or the extension module lower part EMU and a further extension lower part EMU can be form-fit.
• a step profile is used.
• FIG. 2 shows the peripheral device PG in a partial explosion, the module lower parts BMU, EMU already being strung together.
• the module bottom parts BMU, EMU are arranged in a precisely fitting manner, since the module bottom parts BMU, EMU work together Form-fit receptacles 1 and form-locking elements (not shown), for example dovetail and dovetail receptacle 1, are guided.
• the form-fitting connection of the module lower parts BMU, EMU means that the modular peripheral device PG is self-supporting.
• the sealing system is designed as a tongue and groove combination in the exemplary embodiment.
• the tongue of the upper part of the module BMO, EMO engages in the groove N of the lower part of the module BMU, EMU.
• the seal is foamed into the groove N of the lower part of the module BMU, EMU with closed pores.
• Both the individual modules BM, EM and the expandable peripheral device PG thus meet the criteria of protection class IP65 according to DIN IEC 529.
• the module lower parts BMU, EMU are usually fastened on a support surface, for this purpose the module lower parts BMU, EMU have holes 2 into which fastening means, such as e.g.
• the BMU, EMU module lower parts can be individually fixed to the support surface using the fasteners.
• the BMU and EMU module lower parts which are lined up next to one another, are fastened to one another by screwing or using fastening means with the same effect.
• the module lower parts BMU, EMU have holes 3, 3 'into which, for example, screws can be inserted.
• the attachment of the juxtaposed module lower parts BMU, EMU caused forward by the insertion of wedge-shaped locking ⁇ .
• each module upper part BMO, EMO is only attached to the corresponding module lower part BMU, EMU with at least one fastening means and that the actuation of the fastening means by other module upper parts BMO, EMO or module lower parts BMU, EMU is not locked.
• the module upper part BMO, EMO bores 4 'through which fastening means, for example screws, can be passed, which engage in corresponding bores 4 in the module lower part BMU, EMU, so that the module upper parts BMO, EMO on the module lower parts BMU, EMU are fixable.
• the base module BM has three connector plugs AS1, AS2, AS3. Two of these connectors AS2, AS3 are mounted together on a connector plate SP.
• the at least one supply voltage is usually supplied to the peripheral device PG via the connector AS1.
• the fieldbus line is looped through the peripheral device via the connector plugs AS2, AS3. It is advantageous that the connectors AS2, AS3 are mounted on a connector plate SP, because then - when the incoming and outgoing fieldbus line is connected in the connector AS2, AS3 - the fieldbus line is not necessary when the connector is disconnected to interrupt the plug connectors AS2, AS3 and the plug plate SP formed plug unit. The communication link between any further peripheral devices PG thus remains.
• the module lower parts BMU, EMU of the individual modules BM, EM of the modular peripheral device PG have a multiplicity of contact elements LE, which forward the signal or supply voltage.
• the contact elements LE are designed as essentially U-shaped contact elements LE and are arranged in the module lower parts on the side of the profile which can be arranged in a row.
• One leg of the U-shaped contact elements LE is located when the module upper part BMO, EMO is placed inside the module BM, EM, so that the large number of these legs of the U-shaped contact elements LE have an internal contact arrangement IML - in the exemplary embodiment an internal knife contact strip IML - forms.
• the other leg of the U-shaped contact elements LE is also when the module upper part BMO, EMO is placed outside the module BM, EM, so that the large number of these legs of the U-shaped contact elements LE is an external contact arrangement EML - in the exemplary embodiment, an external measurement Seruttonmann EML - forms.
• the external knife contact strip EML of the base module BM engages in the extension module EM such that the external knife contact strip EML of the base module BM is opposite the internal knife contact strip IML of the extension module EM in series.
• the relationships described apply accordingly to the addition of an additional EM expansion module to an EM expansion module. Otherwise, they can be seen particularly well from the illustration in FIG. 2.
• the external knife contact strip EML which is not covered by a further extension module EM, is instead covered by a special end piece ES.
• a special end piece ES Through the end piece ES, protection against contact as well as the sealing required for the desired degree of protection are achieved in the same way. Furthermore, it is thus possible to keep the expansion modules EM essentially identical, so that no special expansion module EM is required as a termination module.
• the desired electrically conductive connection is established by an electrical circuit to which sensors and / or actuators can be connected, which is usually applied together or in connection with the module upper part BMO, EMO at least a part of the contact elements LE, the individual module lower parts BMU, EMU.
• FIG 3 shows a plan view of the module lower parts BMO, EMO which are lined up.
• the internal knife contact strip IML and the external knife contact strip EML can be seen in each case.
• a part of the contact elements LE of the knife contact strips IML, EML is used to forward the at least one supply voltage, another part of the contact elements LE is used to forward the signal voltages.
• a fieldbus line can be connected to the peripheral device PG with the connector plugs AS2, AS3 (not shown in FIG. 4).
• the signal voltages are fed into the base module BM of the peripheral device PG.
• the signal voltages reach the contact elements LE of the internal knife contact strip IML of the base module BM.
• the electrically conductive connections between the contacts (not shown) of the connector plugs AS2, AS3 and the contact elements LE of the internal knife contact strip IML result from the conductor tracks located on the printed circuit boards LP.
• the signal voltages are also applied directly to the external knife contact strip EML and thus spatially already in the area of the extension module EM.
• the signal voltages are forwarded from the external knife contact strip EML of the basic module BM to the internal knife contact strip IML of the extension module EM via conductor tracks of a printed circuit board LP or via other suitable connecting means.
• a printed circuit board LP is arranged in the upper part of the expansion module EMO. When the circuit board LP is placed on the lower part of the expansion module EMU, there is an electrically conductive connection between contact elements of the circuit board LP in the upper part of the expansion module EMO and the U-shaped contact elements LES.
• a bus ASIC is located on the printed circuit board LP.
• An integration of the respective expansion module EM into the data traffic taking place on the bus is guaranteed via the bus ASIC.
• the bus ASIC can also refresh the signal voltages running over the bus.
• the signal voltages arriving in the bus ASIC are of course also forwarded via the corresponding contact elements LES to any further expansion modules EM in the manner described above. If the bus ASIC is dispensed with, an 1: 1 connection of the contact elements LES which transmit the signal voltage via the printed circuit board LP may also be conceivable.
• the forwarding of the load voltages can be illustrated particularly well with reference to FIG. 5.
• the at least one supply voltage is supplied to the base module BM of the peripheral device PG via the connector AS1 (not shown in FIG. 5).
• Is carried out by the not shown contact elements of the connector plug AS1 within the base module BM means of electrically conductive connecting elements VE
• Wei a ⁇ ter Marshall the supply voltages to contact elements LE the internal male contact strip IML of the base module BM.
• the ⁇ sweep contact elements LE that only the forward each tung serve the supply voltage, will be referred to by the reference numeral LEP.
• the techniquess ⁇ are not voltages tet on the module upper part BMO, EMO angeord- designated electrical circuit from the external MesserWalletlei ⁇ ste EML to the internal male contact strip IML usgelei ⁇ , but have appropriate reasonable in the module lower part BMO, EMO ordered, electrically conductive connecting elements VE.
• This has the advantage that the load voltages do not always have to be conducted via the electrical circuit arranged in the upper part of the module BMO, EMO, but are only present there when they are actually needed.
• the corresponding contact element is designed in such a way that the supply voltage can be tapped directly on the printed circuit board LP. In this way, only those supply voltages are actually brought to the electrical circuit which are actually required there. All other supply voltages are looped 1: 1 in the form described above by means of the respective connecting elements VE through the relevant module BM, EM.
• extension modules EM results in a self-assembling bus, which bus can include both signal and supply voltages.
• bus can include both signal and supply voltages.
• By tapping the supply voltages and evaluating the signal voltages a control and / or monitoring of a technical process is possible with the aid of the electrical circuit arranged in the module upper parts BMO, EMO. Since the respective electrical circuit is arranged in the module upper parts BMO, EMO, it is easily exchangeable in the event of maintenance.
• the in the Module tops BMO, EMO located electrical circuit can be electrically connected to the respective module bottom parts EMU, BMU or with the contact elements LE located therein via suitable plug connectors, in particular via TIMER contacts. If necessary, the legs of the U-shaped contact elements LE have branches, for example for multiple tapping of the respective voltage.
• All display and connection elements are arranged on the front side, that is on the module top side BMO, EMO, so that they are easily accessible for the connection of sensors or actuators of the technical process.
• the peripheral device PG can be installed in any position and can therefore be based on the requirements at the place of use or the requirements of the type of application. Because the connections carrying the signal or supply voltage remain completely within the respective module housing, excellent protection against undesired emitted or emitted electromagnetic radiation can be achieved. If the protection of the module housing is insufficient in the case of module housings which are not or only partially metallic, a shield can additionally be applied either to the inside or the outside of the module housing.
• the module lower parts BMU, EMU and / or the module upper parts BMO, EMO have special form-locking elements instead of the modular profile, with which also a form-fitting arrangement of the modules BM , EM would be possible.
• An example of such a form circuit elements would pins that engage corresponding Ausappelun ⁇ gen of the neighboring module BM, EM. If the pins themselves have recesses, it is possible to mount the module BM, EM in the lined up state by inserting pin-shaped or wedge-shaped fastening means into the recesses of the pins. lock on the neighboring module BM, EM.
• the pin-shaped or wedge-shaped fastening means are inserted into corresponding recesses in the module upper part BMO, EMO, the fastening means reaching at least into the recesses of the pins of the adjacent module BM, EM, so that this form ⁇ is locked.

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• Engineering & Computer Science (AREA)
• Automation & Control Theory (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Details Of Connecting Devices For Male And Female Coupling (AREA)
• Connector Housings Or Holding Contact Members (AREA)

Applications Claiming Priority (3)

Publications (1)

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ID=7792433

Family Applications (1)

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• 1996
  • 1996-04-25 DE DE1996116551 patent/DE19616551A1/de not_active Withdrawn
• 1997
  • 1997-03-14 TW TW86103177A patent/TW494717B/zh active
  • 1997-04-15 JP JP9538449A patent/JP2000509207A/ja active Pending
  • 1997-04-15 WO PCT/DE1997/000751 patent/WO1997041715A1/de not_active Application Discontinuation
  • 1997-04-15 EP EP97921610A patent/EP0895707A1/de not_active Ceased
  • 1997-04-24 ID IDP971382A patent/ID16652A/id unknown

Non-Patent Citations (1)

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