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DE69302400D1 - Testanordnung mit filmadaptor fuer leiterplatten - Google Patents

Testanordnung mit filmadaptor fuer leiterplatten

Info

Publication number
DE69302400D1
DE69302400D1 DE69302400T DE69302400T DE69302400D1 DE 69302400 D1 DE69302400 D1 DE 69302400D1 DE 69302400 T DE69302400 T DE 69302400T DE 69302400 T DE69302400 T DE 69302400T DE 69302400 D1 DE69302400 D1 DE 69302400D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
adapter
tested
test points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69302400T
Other languages
English (en)
Other versions
DE69302400T2 (de
Inventor
Paul Mang
Hubert Driller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mania Technologie Belgium Nv Gent Be
Original Assignee
Mania & Co 61276 Weilrod De GmbH
Mania GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6472318&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69302400(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mania & Co 61276 Weilrod De GmbH, Mania GmbH and Co filed Critical Mania & Co 61276 Weilrod De GmbH
Priority to DE69302400T priority Critical patent/DE69302400T2/de
Application granted granted Critical
Publication of DE69302400D1 publication Critical patent/DE69302400D1/de
Publication of DE69302400T2 publication Critical patent/DE69302400T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/082Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18End pieces terminating in a probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00Coupling parts supported only by co-operation with counterpart
    • H01R31/06Intermediate parts for linking two coupling parts, e.g. adapter

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Pens And Brushes (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
DE69302400T 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten Expired - Fee Related DE69302400T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE69302400T DE69302400T2 (de) 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4237591A DE4237591A1 (de) 1992-11-06 1992-11-06 Leiterplatten-Prüfeinrichtung mit Folienadapter
DE69302400T DE69302400T2 (de) 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten
PCT/EP1993/001468 WO1994011743A1 (en) 1992-11-06 1993-06-09 Printed circuit board testing device with foil adapter

Publications (2)

Publication Number Publication Date
DE69302400D1 true DE69302400D1 (de) 1996-05-30
DE69302400T2 DE69302400T2 (de) 1996-08-14

Family

ID=6472318

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4237591A Withdrawn DE4237591A1 (de) 1989-11-13 1992-11-06 Leiterplatten-Prüfeinrichtung mit Folienadapter
DE69302400T Expired - Fee Related DE69302400T2 (de) 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE4237591A Withdrawn DE4237591A1 (de) 1989-11-13 1992-11-06 Leiterplatten-Prüfeinrichtung mit Folienadapter

Country Status (7)

Country Link
EP (1) EP0667962B1 (de)
JP (1) JP2755486B2 (de)
KR (1) KR950704689A (de)
AT (1) ATE137338T1 (de)
CA (1) CA2148106C (de)
DE (2) DE4237591A1 (de)
WO (1) WO1994011743A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
DE9401114U1 (de) * 1994-01-24 1995-02-16 Siemens AG, 80333 München Anschlußmodul
EP0792462B1 (de) * 1994-11-15 2004-08-04 Formfactor, Inc. Testkarte und ihre anwendung
DE19511565A1 (de) * 1995-03-29 1996-10-02 Atg Test Systems Gmbh Prüfadapter
EP0886894B1 (de) * 1995-05-26 2005-09-28 Formfactor, Inc. Kontakträger zum bestücken von substraten mit federkontakten
DE19535733C1 (de) * 1995-09-26 1997-04-17 Atg Test Systems Gmbh Prüfadapter
JP3099873B2 (ja) * 1996-12-05 2000-10-16 日本電産リード株式会社 プリント基板検査装置およびユニバーサル型プリント基板検査装置の使用方法
DE29616272U1 (de) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter zum Prüfen von elektrischen Leiterplatten
TW360790B (en) 1996-10-28 1999-06-11 Atg Test Systems Gmbh Printed circuit board test apparatus and method
DE19644725C1 (de) * 1996-10-28 1998-04-02 Atg Test Systems Gmbh Vorrichtung und Verfahren zum Prüfen von Leiterplatten
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
DE19703982B4 (de) * 1997-02-03 2004-06-09 Atg Test Systems Gmbh & Co.Kg Verfahren zum Prüfen von Leiterplatten
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
JP3865115B2 (ja) 1999-09-13 2007-01-10 Hoya株式会社 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード
DE10043728C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
DE10043726C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
JP2013148464A (ja) * 2012-01-19 2013-08-01 Rato High Tech Corp 回路基板の試験治具構造

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE45427T1 (de) * 1983-11-07 1989-08-15 Martin Maelzer Adapter fuer ein leiterplattenpruefgeraet.
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
DE3441578A1 (de) * 1984-11-14 1986-05-22 Riba-Prüftechnik GmbH, 7801 Schallstadt Leiterplatten-pruefeinrichtung
DE8809592U1 (de) * 1987-08-26 1988-09-22 Siemens AG, 1000 Berlin und 8000 München Rangierleiterplatte für einen Leiterplattenprüfautomat

Also Published As

Publication number Publication date
JPH08504504A (ja) 1996-05-14
WO1994011743A1 (en) 1994-05-26
DE69302400T2 (de) 1996-08-14
JP2755486B2 (ja) 1998-05-20
EP0667962B1 (de) 1996-04-24
KR950704689A (ko) 1995-11-20
CA2148106A1 (en) 1994-05-26
DE4237591A1 (de) 1994-05-11
ATE137338T1 (de) 1996-05-15
CA2148106C (en) 1999-06-22
EP0667962A1 (de) 1995-08-23

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: MANIA TECHNOLOGIE BELGIUM N.V., GENT, BE

8328 Change in the person/name/address of the agent

Representative=s name: RUSCHKE HARTMANN MADGWICK & SEIDE PATENT- UND RECH

8339 Ceased/non-payment of the annual fee