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DE69842001D1 - Galvanisches verfahren zur herstellung einer mehrlagenstruktur - Google Patents

Galvanisches verfahren zur herstellung einer mehrlagenstruktur

Info

Publication number
DE69842001D1
DE69842001D1 DE69842001T DE69842001T DE69842001D1 DE 69842001 D1 DE69842001 D1 DE 69842001D1 DE 69842001 T DE69842001 T DE 69842001T DE 69842001 T DE69842001 T DE 69842001T DE 69842001 D1 DE69842001 D1 DE 69842001D1
Authority
DE
Germany
Prior art keywords
substrate
producing
multilayer structure
electroplating
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69842001T
Other languages
English (en)
Inventor
Adam L Cohen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Southern California USC
Original Assignee
University of Southern California USC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Southern California USC filed Critical University of Southern California USC
Application granted granted Critical
Publication of DE69842001D1 publication Critical patent/DE69842001D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0181—Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0197—Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/032—LIGA process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • ing And Chemical Polishing (AREA)
DE69842001T 1997-04-04 1998-04-03 Galvanisches verfahren zur herstellung einer mehrlagenstruktur Expired - Lifetime DE69842001D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4374297P 1997-04-04 1997-04-04
PCT/US1998/006591 WO1998045504A1 (en) 1997-04-04 1998-04-03 Article, method, and apparatus for electrochemical fabrication

Publications (1)

Publication Number Publication Date
DE69842001D1 true DE69842001D1 (de) 2010-12-30

Family

ID=21928664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69842001T Expired - Lifetime DE69842001D1 (de) 1997-04-04 1998-04-03 Galvanisches verfahren zur herstellung einer mehrlagenstruktur

Country Status (10)

Country Link
US (21) US6027630A (de)
EP (1) EP1015669B1 (de)
JP (8) JP3269827B2 (de)
KR (1) KR100397227B1 (de)
AT (1) ATE488621T1 (de)
AU (1) AU743394B2 (de)
CA (4) CA2572786A1 (de)
DE (1) DE69842001D1 (de)
IL (1) IL132165A (de)
WO (1) WO1998045504A1 (de)

Families Citing this family (354)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599638A (en) * 1993-10-12 1997-02-04 California Institute Of Technology Aqueous liquid feed organic fuel cell using solid polymer electrolyte membrane
US6703150B2 (en) * 1993-10-12 2004-03-09 California Institute Of Technology Direct methanol feed fuel cell and system
EP1015669B1 (de) * 1997-04-04 2010-11-17 University Of Southern California Galvanisches verfahren zur herstellung einer mehrlagenstruktur
JP3780700B2 (ja) * 1998-05-26 2006-05-31 セイコーエプソン株式会社 パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
JP4766579B2 (ja) * 1998-11-30 2011-09-07 アプライド マテリアルズ インコーポレイテッド 電気化学堆積装置
US6555408B1 (en) * 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6436265B1 (en) * 1999-03-29 2002-08-20 Canon Kabushiki Kaisha Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array
TW408417B (en) * 1999-05-03 2000-10-11 Ind Tech Res Inst Planar-shape thin probe having electrostatic actuator manufactured by using sacrificed layer technology and its manufacturing method
JP2000331975A (ja) * 1999-05-19 2000-11-30 Ebara Corp ウエハ洗浄装置
IT1311361B1 (it) * 1999-11-15 2002-03-12 Olivetti Lexikon Spa Testina di stampa monilitica con rete equipotenziale integrata erelativo metodo di fabbricazione.
US6294398B1 (en) 1999-11-23 2001-09-25 The Trustees Of Princeton University Method for patterning devices
US6299741B1 (en) 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6379223B1 (en) 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6454916B1 (en) * 2000-01-05 2002-09-24 Advanced Micro Devices, Inc. Selective electroplating with direct contact chemical polishing
US6352935B1 (en) * 2000-01-18 2002-03-05 Analog Devices, Inc. Method of forming a cover cap for semiconductor wafer devices
AU2001280434A1 (en) * 2000-05-12 2001-11-20 University Of Southern California Reflector for laser interrogation of three-dimensional objects
US6780353B2 (en) * 2000-09-26 2004-08-24 Romain L. Billiet Method for making micromolds
US7511675B2 (en) * 2000-10-26 2009-03-31 Advanced Automotive Antennas, S.L. Antenna system for a motor vehicle
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
GB0102896D0 (en) * 2001-02-06 2001-03-21 Univ Greenwich Improved electrophoretic deposition
US20020110673A1 (en) * 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
US6762124B2 (en) 2001-02-14 2004-07-13 Avery Dennison Corporation Method for patterning a multilayered conductor/substrate structure
US6864589B2 (en) * 2001-03-30 2005-03-08 Sharp Laboratories Of America, Inc. X/Y alignment vernier formed on a substrate
US20040222304A1 (en) * 2001-04-11 2004-11-11 Matthew Adams Method and apparatus for on-demand marking or etching of metal
US6895667B2 (en) * 2001-04-13 2005-05-24 The Trustees Of Princeton University Transfer of patterned metal by cold-welding
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
US7240420B1 (en) * 2001-06-19 2007-07-10 Zyvex Labs, Llc System and method for post-fabrication reduction of minimum feature size spacing of microcomponents
US7070687B2 (en) * 2001-08-14 2006-07-04 Intel Corporation Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
TWI227285B (en) * 2001-10-15 2005-02-01 Univ Southern California Methods of and apparatus for producing a three-dimensional structure
US6815354B2 (en) * 2001-10-27 2004-11-09 Nutool, Inc. Method and structure for thru-mask contact electrodeposition
US20040026366A1 (en) * 2001-11-28 2004-02-12 Andre Sharon Method of manufacturing ultra-precise, self-assembled micro systems
US20070112338A1 (en) * 2005-11-01 2007-05-17 Microfabrica Inc. Microdevices for tissue approximation and retention, methods for using, and methods for making
US20080121343A1 (en) 2003-12-31 2008-05-29 Microfabrica Inc. Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
US20050230261A1 (en) * 2003-06-27 2005-10-20 Cohen Adam L Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US7498714B2 (en) * 2003-09-24 2009-03-03 Microfabrica Inc. Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers
US20050072681A1 (en) * 2001-12-03 2005-04-07 Microfabrica Inc. Multi-step release method for electrochemically fabricated structures
US7686770B2 (en) 2005-10-14 2010-03-30 Microfabrica Inc. Discrete or continuous tissue capture device and method for making
US20050121411A1 (en) * 2002-10-29 2005-06-09 Microfabrica Inc. Medical devices and EFAB methods and apparatus for producing them
US20060282065A1 (en) * 2002-10-29 2006-12-14 Microfabrica, Inc. Microtools and methods for fabricating such tools
US20070198038A1 (en) * 2001-12-03 2007-08-23 Cohen Adam L Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
US20040146650A1 (en) * 2002-10-29 2004-07-29 Microfabrica Inc. EFAB methods and apparatus including spray metal or powder coating processes
US20080105646A1 (en) * 2002-05-07 2008-05-08 Microfabrica Inc. Multi-step Release Method for Electrochemically Fabricated Structures
US9614266B2 (en) 2001-12-03 2017-04-04 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
US7501328B2 (en) * 2003-05-07 2009-03-10 Microfabrica Inc. Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
US8382423B1 (en) 2001-12-03 2013-02-26 Microfabrica Inc. Micro-scale and meso-scale hydraulically or pneumatically powered devices capable of rotational motion
US7239219B2 (en) * 2001-12-03 2007-07-03 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
US20050194348A1 (en) * 2001-12-03 2005-09-08 University Of Southern California Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US7674361B2 (en) 2003-09-24 2010-03-09 Microfabrica Inc. Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures
US7517462B2 (en) * 2003-06-27 2009-04-14 Microfabrica Inc. Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US20050202667A1 (en) * 2001-12-03 2005-09-15 University Of Southern California Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
AU2002360464A1 (en) * 2001-12-03 2003-06-17 Memgen Corporation Miniature rf and microwave components and methods for fabricating such components
US20040004001A1 (en) * 2002-05-07 2004-01-08 Memgen Corporation Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
US20070158200A1 (en) * 2002-10-29 2007-07-12 Microfabrica Inc. Electrochemical fabrication processes incorporating non-platable metals and/or metals that are difficult to plate on
AU2002351289A1 (en) * 2001-12-06 2003-06-23 Memgen Corporation Complex microdevices and appparatus and methods for fabricating such devices
US7372616B2 (en) * 2001-12-06 2008-05-13 Microfabrica, Inc. Complex microdevices and apparatus and methods for fabricating such devices
EP1518822A3 (de) * 2001-12-06 2007-02-28 Microfabrica Inc. Komplexe Mikrobauelemente und Vorrichtungen und deren Herstellungsverfahren.
US7185542B2 (en) * 2001-12-06 2007-03-06 Microfabrica Inc. Complex microdevices and apparatus and methods for fabricating such devices
JP2003260142A (ja) * 2002-03-11 2003-09-16 Kanegafuchi Chem Ind Co Ltd 頭蓋内血管治療用ステント及び製造方法
US20030221968A1 (en) * 2002-03-13 2003-12-04 Memgen Corporation Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
US20030201170A1 (en) * 2002-04-24 2003-10-30 Applied Materials, Inc. Apparatus and method for electropolishing a substrate in an electroplating cell
US20030201185A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. In-situ pre-clean for electroplating process
US20040065554A1 (en) * 2002-05-07 2004-04-08 University Of Southern California Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
US8070931B1 (en) 2002-05-07 2011-12-06 Microfabrica Inc. Electrochemical fabrication method including elastic joining of structures
WO2003095711A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Electrochemically fabricated structures having dielectric or active bases
US9919472B1 (en) 2002-05-07 2018-03-20 Microfabrica Inc. Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures
WO2003095709A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Multistep release method for electrochemically fabricated structures
US20080050524A1 (en) 2006-04-07 2008-02-28 Microfabrica Inc. Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US20060108678A1 (en) 2002-05-07 2006-05-25 Microfabrica Inc. Probe arrays and method for making
US20040065550A1 (en) * 2002-05-07 2004-04-08 University Of Southern California Electrochemical fabrication methods with enhanced post deposition processing
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
WO2003095710A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Methods of and apparatus for electrochemically fabricating structures
US20050142739A1 (en) * 2002-05-07 2005-06-30 Microfabrica Inc. Probe arrays and method for making
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US20060238209A1 (en) * 2002-05-07 2006-10-26 Microfabrica Inc. Vertical microprobes for contacting electronic components and method for making such probes
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
JP4554357B2 (ja) * 2002-05-07 2010-09-29 マイクロファブリカ インク 電気化学的に成型加工され、気密的に封止された微細構造および上記微細構造を製造するための方法および装置
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
WO2003095708A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Methods of and apparatus for molding structures
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US20050029109A1 (en) * 2002-05-07 2005-02-10 Gang Zhang Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
AU2003229025A1 (en) * 2002-05-07 2003-11-11 University Of Southern California Methods and apparatus for monitoring deposition quality during conformable contact mask plasting operations
US20040007469A1 (en) * 2002-05-07 2004-01-15 Memgen Corporation Selective electrochemical deposition methods using pyrophosphate copper plating baths containing ammonium salts, citrate salts and/or selenium oxide
US7384530B2 (en) * 2002-05-07 2008-06-10 Microfabrica Inc. Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials
US20050202660A1 (en) * 2002-05-07 2005-09-15 Microfabrica Inc. Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
US20070045121A1 (en) * 2002-05-07 2007-03-01 Microfabrica Inc. Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
US7611616B2 (en) * 2002-05-07 2009-11-03 Microfabrica Inc. Mesoscale and microscale device fabrication methods using split structures and alignment elements
AU2003229023A1 (en) * 2002-05-07 2003-11-11 University Of Southern California Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US20050045585A1 (en) * 2002-05-07 2005-03-03 Gang Zhang Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
US20050067292A1 (en) * 2002-05-07 2005-03-31 Microfabrica Inc. Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
US20050029225A1 (en) * 2002-05-07 2005-02-10 University Of Southern California Electrochemical fabrication methods with enhanced post deposition processing
US7531077B2 (en) 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US20040065551A1 (en) * 2002-05-07 2004-04-08 University Of Southern California Electrochemical deposition with enhanced uniform deposition capabilities and/or enhanced longevity of contact masks
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
JP4719464B2 (ja) * 2002-05-08 2011-07-06 エージェンシー フォー サイエンス，テクノロジー アンド リサーチ マイクロ／ナノ構造を基板上にインプリントする方法
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
US20030209523A1 (en) * 2002-05-09 2003-11-13 Applied Materials, Inc. Planarization by chemical polishing for ULSI applications
AU2003280468A1 (en) * 2002-06-27 2004-01-19 Memgen Corporation Miniature rf and microwave components and methods for fabricating such components
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US20040118694A1 (en) * 2002-12-19 2004-06-24 Applied Materials, Inc. Multi-chemistry electrochemical processing system
US7229544B2 (en) * 2002-10-01 2007-06-12 University Of Southern California Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
AU2003279763A1 (en) * 2002-10-01 2004-04-23 Microfabrica Inc. Monolithic structures including alignment and/or retention fixtures for accepting components
US7235166B2 (en) * 2002-10-01 2007-06-26 Microfabrica Inc. Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
US20050167894A1 (en) * 2002-10-08 2005-08-04 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US20110092988A1 (en) * 2002-10-29 2011-04-21 Microfabrica Inc. Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
US8454652B1 (en) 2002-10-29 2013-06-04 Adam L. Cohen Releasable tissue anchoring device, methods for using, and methods for making
US20100094320A1 (en) * 2002-10-29 2010-04-15 Microfabrica Inc. Atherectomy and Thrombectomy Devices, Methods for Making, and Procedures for Using
US7291254B2 (en) * 2002-11-26 2007-11-06 Microfabrica, Inc. Method for electrochemically forming structures including non-parallel mating of contact masks and substrates
US7368044B2 (en) * 2002-11-26 2008-05-06 Microfabrica, Inc. Non-conformable masks and methods and apparatus for forming three-dimensional structures
AU2003297814A1 (en) * 2002-12-09 2004-06-30 Acm Research, Inc. Measuring alignment between a wafer chuck and polishing/plating receptacle
US6916409B1 (en) * 2002-12-31 2005-07-12 Advanced Cardiovascular Systems, Inc. Apparatus and process for electrolytic removal of material from a medical device
US6875322B1 (en) 2003-01-15 2005-04-05 Lam Research Corporation Electrochemical assisted CMP
US20040239006A1 (en) * 2003-01-22 2004-12-02 Microfabrica Inc. Silicone compositions, methods of making, and uses thereof
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20060226015A1 (en) * 2003-02-04 2006-10-12 Microfabrica Inc. Method of forming electrically isolated structures using thin dielectric coatings
US20080106280A1 (en) * 2003-02-04 2008-05-08 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US9244101B2 (en) * 2003-02-04 2016-01-26 University Of Southern California Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
ATE475999T1 (de) 2003-03-04 2010-08-15 Rohm & Haas Elect Mat Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
JP3898137B2 (ja) * 2003-03-06 2007-03-28 富士通株式会社 自動出力復帰方法および光通信システム
US7198704B2 (en) * 2003-04-21 2007-04-03 Microfabrica Inc. Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures
US7433811B2 (en) * 2003-05-06 2008-10-07 The Regents Of The University Of California Direct patterning of silicon by photoelectrochemical etching
WO2004101862A1 (en) * 2003-05-07 2004-11-25 Microfabrica Inc. Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
US20050045484A1 (en) * 2003-05-07 2005-03-03 Microfabrica Inc. Electrochemical fabrication process using directly patterned masks
US10297421B1 (en) * 2003-05-07 2019-05-21 Microfabrica Inc. Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7527721B2 (en) * 2003-05-07 2009-05-05 Microfabrica Inc. Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric
TWI297045B (en) * 2003-05-07 2008-05-21 Microfabrica Inc Methods and apparatus for forming multi-layer structures using adhered masks
WO2004101855A2 (en) * 2003-05-07 2004-11-25 Microfabrica Inc. Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
US7244326B2 (en) 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
US7131578B2 (en) 2003-05-28 2006-11-07 Ewi Holdings, Inc. System and method for electronic prepaid account replenishment
US7465661B2 (en) * 2003-05-28 2008-12-16 The United States Of America As Represented By The Secretary Of The Navy High aspect ratio microelectrode arrays
US20050215046A1 (en) * 2003-06-27 2005-09-29 Cohen Adam L Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US20050176238A1 (en) * 2003-06-27 2005-08-11 Microfabrica Inc. Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US7524427B2 (en) * 2003-06-27 2009-04-28 Microfabrica Inc. Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US20050194258A1 (en) * 2003-06-27 2005-09-08 Microfabrica Inc. Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
US20050053849A1 (en) * 2003-07-03 2005-03-10 Microfabrica Inc. Electrochemical fabrication method for producing compliant beam-like structures
JP5248772B2 (ja) * 2003-07-09 2013-07-31 フライズ メタルズ インコーポレイテッド 沈積とパターン化方法
US20190357827A1 (en) 2003-08-01 2019-11-28 Dexcom, Inc. Analyte sensor
ATE551383T1 (de) 2003-09-23 2012-04-15 Univ North Carolina Photohärtbare perfluorpolyether zur verwendung als neue werkstoffe in mikrofluidischen vorrichtungen
US20050145122A1 (en) * 2003-09-24 2005-07-07 Matthew Adams Use of a UV-curable thermal ribbon in conjunction with a porous substrate to form a durable, on-demand electro-chemical stencil
US20050067286A1 (en) * 2003-09-26 2005-03-31 The University Of Cincinnati Microfabricated structures and processes for manufacturing same
US7615141B2 (en) * 2003-10-03 2009-11-10 University Of Washington Electrochemical micromanufacturing system and method
US20050205430A1 (en) * 2003-11-26 2005-09-22 Microfabrica Inc. EFAB methods including controlled mask to substrate mating
EP1538482B1 (de) * 2003-12-05 2016-02-17 Obducat AB Gerät und Methode für grossflÀ¤chige Lithographie
US8774886B2 (en) 2006-10-04 2014-07-08 Dexcom, Inc. Analyte sensor
US20060127581A1 (en) * 2003-12-11 2006-06-15 Aspens Glenn D Method for on-demand direct item marking via a screen printing process
US8521284B2 (en) 2003-12-12 2013-08-27 Cardiac Pacemakers, Inc. Cardiac response classification using multisite sensing and pacing
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
DK1704585T3 (en) * 2003-12-19 2017-05-22 Univ North Carolina Chapel Hill Methods for preparing isolated micro- and nanostructures using soft lithography or printing lithography
US7479213B2 (en) * 2003-12-25 2009-01-20 Ebara Corporation Plating method and plating apparatus
US7623935B2 (en) * 2003-12-31 2009-11-24 University Of Southern California Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
US20050202180A1 (en) * 2003-12-31 2005-09-15 Microfabrica Inc. Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
US20090020433A1 (en) * 2003-12-31 2009-01-22 Microfabrica Inc. Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material
US20080105355A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Probe Arrays and Method for Making
US20160194774A1 (en) * 2003-12-31 2016-07-07 University Of Southern California Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures Incorporating Dielectrics
US20080142369A1 (en) * 2003-12-31 2008-06-19 Microfabrica Inc. Integrated Circuit Packaging Using Electrochemically Fabricated Structures
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
US10641792B2 (en) * 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7430731B2 (en) * 2003-12-31 2008-09-30 University Of Southern California Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
US20060134831A1 (en) * 2003-12-31 2006-06-22 Microfabrica Inc. Integrated circuit packaging using electrochemically fabricated structures
US7833389B1 (en) * 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US9307648B2 (en) * 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US7674103B2 (en) 2005-01-21 2010-03-09 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
JP2005223063A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 配線基板の製造方法及び電子デバイスの製造方法
JP2007527784A (ja) * 2004-02-13 2007-10-04 ザ ユニバーシティ オブ ノース カロライナ アット チャペル ヒル マイクロ流体デバイスを作製するための官能性材料及び新規方法
US8158728B2 (en) 2004-02-13 2012-04-17 The University Of North Carolina At Chapel Hill Methods and materials for fabricating microfluidic devices
US7280644B2 (en) 2004-12-07 2007-10-09 Ewi Holdings, Inc. Transaction processing platform for faciliating electronic distribution of plural prepaid services
US7256107B2 (en) * 2004-05-04 2007-08-14 The Regents Of The University Of California Damascene process for use in fabricating semiconductor structures having micro/nano gaps
EP1594001B1 (de) * 2004-05-07 2015-12-30 Obducat AB Gerät und Verfahren für die Imprint-Lithographie
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
GB0416600D0 (en) * 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices
US6956389B1 (en) 2004-08-16 2005-10-18 Jem America Corporation Highly resilient cantilever spring probe for testing ICs
WO2006023696A2 (en) * 2004-08-19 2006-03-02 Microfabrica, Inc. Integrated circuit packaging using electrochemically fabricated
US7169649B2 (en) * 2004-12-16 2007-01-30 Palo Alto Research Center, Inc. Wafer scale integration of electroplated 3D structures using successive lithography, electroplated sacrificial layers, and flip-chip bonding
US7335463B2 (en) * 2004-12-16 2008-02-26 Palo Alto Research Center, Inc. Electroplated three dimensional ink jet manifold and nozzle structures using successive lithography and electroplated sacrificial layers
CN101156107B (zh) * 2005-02-03 2010-11-24 北卡罗来纳大学查珀尔希尔分校 用于液晶显示器的低表面能聚合物材料
JP4479535B2 (ja) * 2005-02-21 2010-06-09 セイコーエプソン株式会社 光学素子の製造方法
US8216931B2 (en) * 2005-03-31 2012-07-10 Gang Zhang Methods for forming multi-layer three-dimensional structures
US7696102B2 (en) * 2005-03-31 2010-04-13 Gang Zhang Methods for fabrication of three-dimensional structures
JP4624873B2 (ja) * 2005-06-28 2011-02-02 株式会社荏原製作所 めっき方法
US7419630B2 (en) * 2005-04-22 2008-09-02 Sandia Corporation Methods and systems for rapid prototyping of high density circuits
KR20080022111A (ko) * 2005-05-18 2008-03-10 프라이즈 메탈즈, 인크. 기판 상에 동전기적 침착 및 패터닝 공정을 위한 마스크 및방법
FR2885913B1 (fr) * 2005-05-18 2007-08-10 Centre Nat Rech Scient Element composite comprenant un substrat conducteur et un revetement metallique nanostructure.
KR101137862B1 (ko) * 2005-06-17 2012-04-20 엘지디스플레이 주식회사 평판표시소자의 제조방법
WO2007001977A2 (en) * 2005-06-20 2007-01-04 Microcontinuum, Inc. Systems and methods for roll-to-roll patterning
US8273117B2 (en) * 2005-06-22 2012-09-25 Integran Technologies Inc. Low texture, quasi-isotropic metallic stent
WO2007133235A2 (en) * 2005-08-08 2007-11-22 Liquidia Technologies, Inc. Micro and nano-structure metrology
US8231948B2 (en) * 2005-08-15 2012-07-31 The University Of Florida Research Foundation, Inc. Micro-molded integral non-line-of sight articles and method
US7767126B2 (en) * 2005-08-22 2010-08-03 Sipix Imaging, Inc. Embossing assembly and methods of preparation
EP1952431A2 (de) * 2005-11-07 2008-08-06 Applied Materials, Inc. Photovoltaischer kontakt und verdrahtungsaufbau
US20090234417A1 (en) * 2005-11-10 2009-09-17 Electrocore, Inc. Methods And Apparatus For The Treatment Of Metabolic Disorders
DK1948852T3 (da) * 2005-11-18 2019-01-02 Luxembourg Inst Science & Tech List Hovedelektrode og fremgangsmåde til dannelse af hovedelektroden
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7658831B2 (en) * 2005-12-21 2010-02-09 Formfactor, Inc Three dimensional microstructures and methods for making three dimensional microstructures
IL173121A (en) * 2006-01-12 2011-07-31 Dina Katsir Electrodes, membranes, printing plate precursors and other articles including multi-strata porous coatings
EP1984107A4 (de) * 2006-01-26 2013-12-04 California Inst Of Techn Mikrofluidische programmiervorrichtungen mit molekularer information
WO2007100849A2 (en) 2006-02-27 2007-09-07 Microcontinuum, Inc. Formation of pattern replicating tools
DE06405114T1 (de) * 2006-03-15 2008-04-24 Doniar S.A. LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7655126B2 (en) * 2006-03-27 2010-02-02 Federal Mogul World Wide, Inc. Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
US7622382B2 (en) * 2006-03-29 2009-11-24 Intel Corporation Filling narrow and high aspect ratio openings with electroless deposition
US7998323B1 (en) * 2006-06-07 2011-08-16 Actus Potentia, Inc. Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces
US20080181958A1 (en) * 2006-06-19 2008-07-31 Rothrock Ginger D Nanoparticle fabrication methods, systems, and materials
US7876087B2 (en) * 2006-09-12 2011-01-25 Innoconnex, Inc. Probe card repair using coupons with spring contacts and separate atachment points
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
CN101161870B (zh) * 2006-10-11 2010-11-10 富准精密工业(深圳)有限公司 气密性腔体成型方法
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7736928B2 (en) * 2006-12-01 2010-06-15 Applied Materials, Inc. Precision printing electroplating through plating mask on a solar cell substrate
US7704352B2 (en) * 2006-12-01 2010-04-27 Applied Materials, Inc. High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate
US20080128019A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Method of metallizing a solar cell substrate
US20080127490A1 (en) * 2006-12-01 2008-06-05 Lotes Co., Ltd. Manufacture process of connector
US7799182B2 (en) 2006-12-01 2010-09-21 Applied Materials, Inc. Electroplating on roll-to-roll flexible solar cell substrates
KR101253274B1 (ko) * 2006-12-07 2013-04-10 삼성디스플레이 주식회사 도광판 제조용 금형 제조 방법 및 이를 이용한 도광판 제조방법
US8877074B2 (en) * 2006-12-15 2014-11-04 The Regents Of The University Of California Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
US7763326B2 (en) * 2006-12-20 2010-07-27 United Technologies Corporation Photocurable maskant composition and method of use
KR101476438B1 (ko) 2006-12-30 2014-12-24 누보트로닉스, 엘.엘.씨 3차원 미세구조 및 그 형성방법
KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
US20100151031A1 (en) * 2007-03-23 2010-06-17 Desimone Joseph M Discrete size and shape specific organic nanoparticles designed to elicit an immune response
US7514948B2 (en) * 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
GB0715621D0 (en) * 2007-08-10 2007-09-19 Rolls Royce Plc Support architecture
US20100121307A1 (en) * 2007-08-24 2010-05-13 Microfabrica Inc. Microneedles, Microneedle Arrays, Methods for Making, and Transdermal and/or Intradermal Applications
US7918984B2 (en) * 2007-09-17 2011-04-05 International Business Machines Corporation Method of electrodepositing germanium compound materials on a substrate
US8498464B2 (en) * 2007-09-27 2013-07-30 Siemens Medical Solutions Usa, Inc. Intrinsic co-registration for modular multimodality medical imaging systems
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
CN101801558B (zh) * 2007-10-24 2015-04-22 本田技研工业株式会社 板金成型用压模、压模表面的处理方法及车体的生产方法
FR2923078B1 (fr) * 2007-10-26 2017-09-01 Centre Nat De La Rech Scient - Cnrs Procede de fabrication d'un element d'interconnexion mecanique conducteur d'electricite.
JP2009117699A (ja) * 2007-11-08 2009-05-28 Shinko Electric Ind Co Ltd 半導体パッケージ用部品及び半導体パッケージ用部品の製造方法
US20090133788A1 (en) * 2007-11-09 2009-05-28 Firestar Engineering, Llc Nitrous oxide fuel blend monopropellants
KR101689519B1 (ko) * 2007-12-26 2016-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법
JP4913082B2 (ja) * 2008-03-03 2012-04-11 株式会社東芝 三次元構造体の製造方法および三次元構造体
US8078309B1 (en) * 2008-03-31 2011-12-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method to create arbitrary sidewall geometries in 3-dimensions using liga with a stochastic optimization framework
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
JP2009291293A (ja) 2008-06-03 2009-12-17 Olympus Corp 積層構造体、光調節装置、及び積層構造体の製造方法
US8414607B1 (en) 2008-06-23 2013-04-09 Microfabrica Inc. Miniature shredding tool for use in medical applications and methods for making
EP2326266B1 (de) 2008-06-23 2018-05-16 Microfabrica Inc. Miniaturhäcksler für medizinische anwendungen
US9451977B2 (en) 2008-06-23 2016-09-27 Microfabrica Inc. MEMS micro debrider devices and methods of tissue removal
US10939934B2 (en) 2008-06-23 2021-03-09 Microfabrica Inc. Miniature shredding tools for use in medical applications, methods for making, and procedures for using
US9814484B2 (en) 2012-11-29 2017-11-14 Microfabrica Inc. Micro debrider devices and methods of tissue removal
US8795278B2 (en) 2008-06-23 2014-08-05 Microfabrica Inc. Selective tissue removal tool for use in medical applications and methods for making and using
WO2010051311A1 (en) * 2008-10-28 2010-05-06 Solopower, Inc. Improved drum design for web processing
US20100126849A1 (en) * 2008-11-24 2010-05-27 Applied Materials, Inc. Apparatus and method for forming 3d nanostructure electrode for electrochemical battery and capacitor
US9441661B2 (en) 2008-12-31 2016-09-13 Microfabrica Inc. Microscale and millimeter scale devices including threaded elements, methods for designing, and methods for making
US8511960B1 (en) 2008-12-31 2013-08-20 Microfabrica Inc. Microscale and millimeter scale devices including threaded elements, methods for designing, and methods for making
JP5319326B2 (ja) 2009-02-25 2013-10-16 株式会社東芝 凹凸パターンの形成方法および凹凸パターン形成用シート
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
US8362578B2 (en) * 2009-06-02 2013-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Triple-axis MEMS accelerometer
BRPI1009045A2 (pt) 2009-06-24 2019-09-24 Ultradent Products Inc arco ortodôntico de baixa força que tem blocos de engate para tratamento aprimorado
US8262916B1 (en) 2009-06-30 2012-09-11 Microfabrica Inc. Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures
US9131885B2 (en) 2009-07-02 2015-09-15 Dexcom, Inc. Analyte sensors and methods of manufacturing same
CN102483013A (zh) * 2009-07-07 2012-05-30 火星工程有限公司 用于单组元推进剂或预混合双组元推进剂系统的分层多孔逆燃抑制元件
US8041442B2 (en) * 2009-07-27 2011-10-18 Toyota Motor Engineering & Manufacturing North America, Inc. Process for selecting surrogate part
EP2467072B1 (de) 2009-08-18 2016-12-14 Microfabrica Inc. Konzentrische schneidevorrichtungen zur verwendung in minimal invasiven medizinischen verfahren
US20230324436A1 (en) * 2009-10-16 2023-10-12 University Of Southern California Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
DE102009060937A1 (de) * 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
EP2539491B1 (de) * 2009-12-29 2014-03-05 Werner Suedes Verfahren zur herstellung eines verbundkörpers mit einer freitragenden fläche
WO2011091334A2 (en) * 2010-01-22 2011-07-28 Nuvotronics, Llc Thermal management
US8917150B2 (en) * 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8641883B2 (en) * 2010-02-22 2014-02-04 The Regents Of The University Of California Polymer-based high surface area multi-layered three-dimensional structures and method of making same
WO2012007522A2 (en) * 2010-07-15 2012-01-19 Replisaurus Group Sas Separation of master electrode and substrate in ecpr
TW201209197A (en) * 2010-08-24 2012-03-01 Hon Hai Prec Ind Co Ltd Method of coating
US8845912B2 (en) 2010-11-22 2014-09-30 Microcontinuum, Inc. Tools and methods for forming semi-transparent patterning masks
TWI415730B (zh) * 2011-02-17 2013-11-21 The system of masking
FR2972298B1 (fr) * 2011-03-04 2015-07-31 Commissariat Energie Atomique Procede de metallisation de surfaces texturees
ES2847578T3 (es) 2011-04-15 2021-08-03 Dexcom Inc Calibración avanzada de sensor de analito y detección de errores
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) * 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9274395B2 (en) 2011-11-15 2016-03-01 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
US8338283B1 (en) * 2011-12-07 2012-12-25 Innovative Micro Technology Method and apparatus for applying thin liquid coatings
US9903033B2 (en) 2012-07-24 2018-02-27 Uchicago Argonne Llc Nanowire and microwire fabrication technique and product
US20140054178A1 (en) * 2012-08-22 2014-02-27 Thomas W. Valentine Electrode mask for electrowinning a metal
US9233504B2 (en) * 2012-10-29 2016-01-12 Makerbot Industries, Llc Tagged build material for three-dimensional printing
BR102012028367B1 (pt) 2012-11-06 2022-03-22 Timpel S.A Método e aparato para gerar e exibir uma representação simplificada de informações obtidas através de tomografia por impedância elétrica
SG11201504860PA (en) * 2012-12-21 2015-07-30 Agency Science Tech & Res Porous metallic membrane
US20180085995A1 (en) * 2013-01-04 2018-03-29 New York University 3d manufacturing using multiple material deposition and/or fusion sources simultaneously with single or multi-flute helical build surfaces
WO2014113508A2 (en) 2013-01-15 2014-07-24 Microfabrica Inc. Methods of forming parts using laser machining
US9878401B1 (en) 2013-01-15 2018-01-30 Microfabrica Inc. Methods of forming parts using laser machining
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9814543B2 (en) * 2013-02-16 2017-11-14 Ormco Corporation Methods for fabrication of orthodontic appliances and orthodontic appliances made thereby
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
JP2014208395A (ja) * 2013-03-26 2014-11-06 学校法人 関西大学 微小構造体、電子素子、及び微小構造体の製造方法
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
DE202013004745U1 (de) 2013-05-23 2014-08-26 Exentis-Knowledge Ag Anlage zur Herstellung von dreidimensionalen Siebdrucken
US9802360B2 (en) * 2013-06-04 2017-10-31 Stratsys, Inc. Platen planarizing process for additive manufacturing system
WO2015009874A1 (en) 2013-07-16 2015-01-22 Microfabrica Inc. Counterfeiting deterent and security devices systems and methods
US9134602B2 (en) 2013-07-29 2015-09-15 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing an extreme ultraviolet (EUV) mask and the mask manufactured therefrom
US9401337B2 (en) * 2013-12-18 2016-07-26 Taiwan Semiconductor Manufacturing Company, Ltd. Molding structure for wafer level package
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
US10026609B2 (en) 2014-10-23 2018-07-17 Board Of Regents, The University Of Texas System Nanoshape patterning techniques that allow high-speed and low-cost fabrication of nanoshape structures
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
EP3021412A1 (de) * 2014-11-12 2016-05-18 Toto Ltd. Verfahren zur herstellung von festoxidbrennstoffzellen und spendervorrichtung zur herstellung davon
EP3224899A4 (de) 2014-12-03 2018-08-22 Nuvotronics, Inc. Systeme und verfahren zur herstellung von gestapelten schaltungen und übertragungsleitungen
KR102282216B1 (ko) * 2015-02-24 2021-07-27 삼성디스플레이 주식회사 마스크 제조방법
JP6640245B2 (ja) * 2015-04-29 2020-02-05 スリーエム イノベイティブ プロパティズ カンパニー 膨潤性フィルム形成組成物及びそれを用いたナノインプリントリソグラフィの方法
US10308500B2 (en) * 2015-05-22 2019-06-04 Ecole Polytechnique Federale De Lausanne (Epfl) Multilayer MEMS cantilevers
US9933578B1 (en) 2015-06-11 2018-04-03 Microfabrica Inc. Multi-layer monolithic fiber optic alignment structures, methods for making, and methods for using
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
EP3397712A1 (de) * 2015-12-29 2018-11-07 3M Innovative Properties Company Verfahren zur generativen fertigung von haftstoffen und haftartikeln
US10096537B1 (en) 2015-12-31 2018-10-09 Microfabrica Inc. Thermal management systems, methods for making, and methods for using
US20170253988A1 (en) * 2016-03-01 2017-09-07 The Boeing Company Electromodification of Conductive Surfaces
US10197178B2 (en) 2016-03-07 2019-02-05 Honeywell International Inc. Electrohydraulic valve including a vibration-resistant, flexible hermetic seal
US10806557B1 (en) 2016-07-11 2020-10-20 Microfabrica Inc. Tissue scaffolding devices, methods of using, and methods of making
US10131570B2 (en) * 2016-10-15 2018-11-20 Behzad Haghighi Liquid-based masking layer
CN106903383B (zh) * 2017-04-27 2019-11-05 广东工业大学 用于电解加工平面曲折群沟槽的装置及电解加工方法
CN107379966A (zh) * 2017-07-31 2017-11-24 浙江联宜电机有限公司 重型驱动桥
WO2019064424A1 (ja) * 2017-09-28 2019-04-04 シャープ株式会社 マスクの製造方法
US11607842B2 (en) 2017-10-25 2023-03-21 Hewlett-Packard Development Company, L.P. Thermal supports for 3D features formed from particles
US11686012B2 (en) 2017-10-26 2023-06-27 Unison Industries, Llc Mandrel for electroforming
US10927711B2 (en) 2017-10-26 2021-02-23 Unison Industries, Llc Tunable compliant attachment structure
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10961967B1 (en) 2017-12-12 2021-03-30 Microfabrica Inc. Fuel injector systems, fuel injectors, fuel injector nozzles, and methods for making fuel injector nozzles
US20200024763A1 (en) * 2018-07-23 2020-01-23 Microsoft Technology Licensing, Llc Electroform vapor chamber integrated thermal module into pcb layout design
WO2020027810A1 (en) * 2018-07-31 2020-02-06 Hewlett-Packard Development Company, L.P. Thermal supports for formation of 3d object portions
US10515812B1 (en) * 2018-08-13 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of reducing pattern roughness in semiconductor fabrication
US11383302B2 (en) 2018-09-21 2022-07-12 Battelle Energy Alliance, Llc Heat exchangers fabricated by additive manufacturing, related components, and related methods
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
IT201900013626A1 (it) 2019-08-01 2021-02-01 Fluid Metal 3D As Procedimento e sistema di elettroformatura localizzata da getti con retroazione ad anello chiuso in tempo reale
JP7432887B2 (ja) * 2019-11-05 2024-02-19 ニチコン株式会社 アルミニウム箔の表面加工方法
EP3839626B1 (de) * 2019-12-18 2023-10-11 Nivarox-FAR S.A. Verfahren zur herstellung einer uhrkomponente
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
CN113634831A (zh) * 2020-05-11 2021-11-12 光群雷射科技股份有限公司 无缝全像图图案转移方法
JP7049409B2 (ja) * 2020-07-17 2022-04-06 マクセル株式会社 塑性加工用の金型の製造方法
WO2023196427A1 (en) 2022-04-06 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023196425A1 (en) 2022-04-06 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023196431A1 (en) 2022-04-06 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023196428A1 (en) 2022-04-07 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023196438A1 (en) 2022-04-07 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023196436A1 (en) 2022-04-08 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2023211659A1 (en) 2022-04-28 2023-11-02 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2024025700A1 (en) 2022-06-30 2024-02-01 Microfabrica Inc. Compliant probes with enhanced pointing stability and including at least one extension spring or spring segment
US20240074682A1 (en) 2022-09-02 2024-03-07 Dexcom, Inc. Devices and methods for measuring a concentration of a target analyte in a biological fluid in vivo

Family Cites Families (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2306082A (en) * 1940-04-27 1942-12-22 Clarence O Prest Method for line or design reproduction by electrolysis
US2606082A (en) * 1946-11-11 1952-08-05 Separator Ab Self-aligning vertical shaft
US3240685A (en) * 1962-02-23 1966-03-15 Ibm Method and device for selective anodization
BE756431A (fr) * 1969-09-20 1971-03-22 Philips Nv Procede permettant la fabrication d'un corps presentant des proprietes anisotropes magnetiques permanentes
US3697401A (en) * 1970-01-09 1972-10-10 Avco Corp Electrochemical milling process
US3745105A (en) * 1970-11-18 1973-07-10 Auric Corp Apparatus for selective electroplating of sheets
DE2127855A1 (en) 1971-06-04 1972-12-14 Nautschno-issledowatelskij institut po udobrenijam i insektofungizidam imeni professora Ja. W. Semojlowa, Moskau Drying phosphate gypsum - without escape of fluorine by adding calcium oxide/hydroxide/carbonate
US3835017A (en) * 1972-12-22 1974-09-10 Buckbee Mears Co Reusable shields for selective electrodeposition
US3926916A (en) * 1972-12-22 1975-12-16 Du Pont Dielectric composition capable of electrical activation
US4080267A (en) * 1975-12-29 1978-03-21 International Business Machines Corporation Method for forming thick self-supporting masks
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
SU642382A1 (ru) * 1976-07-28 1979-01-15 Предприятие П/Я А-7501 Установка дл локального гальванопокрыти
US4090267A (en) * 1977-03-31 1978-05-23 Casper Cuschera Self caulking toilet drain
US4187553A (en) 1977-12-23 1980-02-05 International Business Machines Corporation Pedestal bubble domain chip and processes for making same
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
ZA811368B (en) * 1980-03-24 1982-04-28 Genentech Inc Bacterial polypedtide expression employing tryptophan promoter-operator
US4294669A (en) * 1980-09-08 1981-10-13 Gte Products Corporation Process for plating selected metal areas
US4370941A (en) 1981-03-23 1983-02-01 Belton Betty R Apparatus for batiking eggs and the like
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
US4404080A (en) * 1982-03-22 1983-09-13 National Semiconductor Corporation Molded plating mask
DE3212152C2 (de) * 1982-04-01 1985-01-17 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim Vorrichtung zum selektiven galvanischen Beschichten eines Bandes
ATE40157T1 (de) * 1982-10-05 1989-02-15 Owen S G Ltd Selektive plattierung.
US4537647A (en) 1982-10-06 1985-08-27 The Boeing Company Method for applying turbulators to wind tunnel models
US4452684A (en) * 1983-03-11 1984-06-05 The Carolinch Company Apparatus for selective electrolytic plating
JPS59191356A (ja) 1983-04-13 1984-10-30 Mitsubishi Electric Corp 半導体装置における金属導電パタ−ンの形成方法
JPS59216453A (ja) * 1983-05-20 1984-12-06 Hitachi Metals Ltd 円筒状永久磁石の製造方法
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
JPH0821567B2 (ja) 1985-03-14 1996-03-04 富士通株式会社 超微細管の製造方法
US4764449A (en) * 1985-11-01 1988-08-16 The Chromaline Corporation Adherent sandblast photoresist laminate
NL8600838A (nl) * 1986-04-02 1987-11-02 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg aanbrengen van een metaalbedekking op in een band samenhangende langwerpige metalen en /of gemetalliseerde voorwerpen.
DE3750709T2 (de) 1986-06-03 1995-03-16 Cubital Ltd Gerät zur Entwicklung dreidimensionaler Modelle.
US4752352A (en) 1986-06-06 1988-06-21 Michael Feygin Apparatus and method for forming an integral object from laminations
JPH01106570U (de) * 1988-01-11 1989-07-18
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate
JPH01255682A (ja) * 1988-04-05 1989-10-12 Mitsui Toatsu Chem Inc イオン交換膜の破損検出方法
US5059359A (en) * 1988-04-18 1991-10-22 3 D Systems, Inc. Methods and apparatus for production of three-dimensional objects by stereolithography
EP0354637B1 (de) * 1988-04-18 1997-06-25 3D Systems, Inc. Stereolithografische CAD/CAM-Datenkonversion
ATE202517T1 (de) * 1988-04-18 2001-07-15 3D Systems Inc Verringerung des stereolithographischen verbiegens
ZA905202B (en) * 1989-07-05 1991-04-24 Fujisawa Pharmaceutical Co Aqueous liquid composition for external use
US4920639A (en) * 1989-08-04 1990-05-01 Microelectronics And Computer Technology Corporation Method of making a multilevel electrical airbridge interconnect
US4954192A (en) 1989-08-30 1990-09-04 Pristine Products Process for applying identification to objects made of porous material
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US4985116A (en) * 1990-02-23 1991-01-15 Mint-Pac Technologies, Inc. Three dimensional plating or etching process and masks therefor
US5999184A (en) * 1990-10-30 1999-12-07 3D Systems, Inc. Simultaneous multiple layer curing in stereolithography
US5209878A (en) * 1990-10-30 1993-05-11 3D Systems, Inc. Surface resolution in three-dimensional objects by inclusion of thin fill layers
US5286573A (en) 1990-12-03 1994-02-15 Fritz Prinz Method and support structures for creation of objects by layer deposition
JP2654871B2 (ja) 1991-04-16 1997-09-17 株式会社三井ハイテック リードフレームの異種金属部分めっき方法
US5209817A (en) * 1991-08-22 1993-05-11 International Business Machines Corporation Selective plating method for forming integral via and wiring layers
US5223110A (en) * 1991-12-11 1993-06-29 Microelectronics And Computer Technology Corporation Apparatus for electroplating electrical contacts
US5478699A (en) * 1992-03-12 1995-12-26 Amtx, Inc. Method for preparing a screen printing stencil
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
US5928839A (en) * 1992-05-15 1999-07-27 Morton International, Inc. Method of forming a multilayer printed circuit board and product thereof
US5512163A (en) 1992-06-08 1996-04-30 Motorola, Inc. Method for forming a planarization etch stop
US5512162A (en) * 1992-08-13 1996-04-30 Massachusetts Institute Of Technology Method for photo-forming small shaped metal containing articles from porous precursors
JP3361556B2 (ja) * 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
FR2696478B1 (fr) 1992-10-05 1994-10-28 Commissariat Energie Atomique Procédé de dépôt électrolytique d'un métal sur un substrat souple faiblement conducteur, dispositif de dépôt électrolytique permettant la réalisation de ce procédé et produit obtenu par ce procédé.
US5378583A (en) * 1992-12-22 1995-01-03 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
DE4307869C2 (de) * 1993-03-12 1996-04-04 Microparts Gmbh Mikrostrukturkörper und Verfahren zu deren Herstellung
US5412265A (en) * 1993-04-05 1995-05-02 Ford Motor Company Planar micro-motor and method of fabrication
JPH0722425A (ja) 1993-07-05 1995-01-24 Fuji Electric Co Ltd 半導体装置の製造方法
US5501162A (en) * 1993-07-19 1996-03-26 Kravets; Alexander Method of fuel combustion
US5435902A (en) 1993-10-01 1995-07-25 Andre, Sr.; Larry E. Method of incremental object fabrication
US5413668A (en) 1993-10-25 1995-05-09 Ford Motor Company Method for making mechanical and micro-electromechanical devices
US5476699A (en) * 1993-11-02 1995-12-19 Hughes Aircraft Company Extrusion interlock assembly
US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
FR2721435B1 (fr) * 1994-06-17 1996-08-02 Asulab Sa Microcontacteur magnétique et son procédé de fabrication.
JPH0821567A (ja) 1994-07-08 1996-01-23 Inax Corp ウォーターハンマー防止装置
JPH0874099A (ja) * 1994-09-09 1996-03-19 Terumo Corp 機械要素および可動部を有する構造体ならびにその製造方法
JP2615429B2 (ja) 1994-09-13 1997-05-28 工業技術院長 ３次元立体形状の創成法
JP3842318B2 (ja) * 1994-10-27 2006-11-08 Ｔｄｋ株式会社 マイクロマシン部品の取り扱い方法
JP3448987B2 (ja) * 1994-10-31 2003-09-22 三菱電機株式会社 微小機構部品の製造方法
JP3448988B2 (ja) * 1994-10-31 2003-09-22 三菱電機株式会社 微小機構部品の製造方法
US5560837A (en) 1994-11-08 1996-10-01 Hewlett-Packard Company Method of making ink-jet component
US5766441A (en) * 1995-03-29 1998-06-16 Robert Bosch Gmbh Method for manfacturing an orifice plate
US5596504A (en) * 1995-04-10 1997-01-21 Clemson University Apparatus and method for layered modeling of intended objects represented in STL format and adaptive slicing thereof
US5641391A (en) * 1995-05-15 1997-06-24 Hunter; Ian W. Three dimensional microfabrication by localized electrodeposition and etching
AU3426697A (en) 1996-02-09 1997-08-28 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College, The High aspect ratio, microstructure-covered, macroscopic surfaces
US5718618A (en) * 1996-02-09 1998-02-17 Wisconsin Alumni Research Foundation Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
US6019784A (en) * 1996-04-04 2000-02-01 Electroformed Stents, Inc. Process for making electroformed stents
JP3580462B2 (ja) * 1996-07-05 2004-10-20 富士写真フイルム株式会社 平版印刷版用アルミニウム支持体の製造方法
US5874011A (en) * 1996-08-01 1999-02-23 Revise, Inc. Laser-induced etching of multilayer materials
US5876424A (en) * 1997-01-23 1999-03-02 Cardiac Pacemakers, Inc. Ultra-thin hermetic enclosure for implantable medical devices
EP1015669B1 (de) * 1997-04-04 2010-11-17 University Of Southern California Galvanisches verfahren zur herstellung einer mehrlagenstruktur
US5945058A (en) * 1997-05-13 1999-08-31 3D Systems, Inc. Method and apparatus for identifying surface features associated with selected lamina of a three-dimensional object being stereolithographically formed
US6505614B1 (en) * 1999-10-14 2003-01-14 Siemens Canada Limited Connection formed by engagement of a tube and a valve surface
JP2001142210A (ja) 1999-11-10 2001-05-25 Fuji Photo Film Co Ltd ポジ型フォトレジスト組成物
US6458263B1 (en) * 2000-09-29 2002-10-01 Sandia National Laboratories Cantilevered multilevel LIGA devices and methods
US20080121343A1 (en) * 2003-12-31 2008-05-29 Microfabrica Inc. Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
US7531077B2 (en) * 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US20060226015A1 (en) * 2003-02-04 2006-10-12 Microfabrica Inc. Method of forming electrically isolated structures using thin dielectric coatings
JP4318187B2 (ja) 2005-11-11 2009-08-19 アルパイン株式会社 機器連結機構

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