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DE69816146D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number
DE69816146D1
DE69816146D1 DE69816146T DE69816146T DE69816146D1 DE 69816146 D1 DE69816146 D1 DE 69816146D1 DE 69816146 T DE69816146 T DE 69816146T DE 69816146 T DE69816146 T DE 69816146T DE 69816146 D1 DE69816146 D1 DE 69816146D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69816146T
Other languages
English (en)
Other versions
DE69816146T2 (de
Inventor
Norio Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE69816146D1 publication Critical patent/DE69816146D1/de
Application granted granted Critical
Publication of DE69816146T2 publication Critical patent/DE69816146T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69816146T 1997-02-24 1998-02-23 Poliervorrichtung Expired - Fee Related DE69816146T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5550497A JPH10235552A (ja) 1997-02-24 1997-02-24 ポリッシング装置
JP5550497 1997-02-24

Publications (2)

Publication Number Publication Date
DE69816146D1 true DE69816146D1 (de) 2003-08-14
DE69816146T2 DE69816146T2 (de) 2004-05-27

Family

ID=13000509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69816146T Expired - Fee Related DE69816146T2 (de) 1997-02-24 1998-02-23 Poliervorrichtung

Country Status (5)

Country Link
US (2) US5980685A (de)
EP (1) EP0860238B1 (de)
JP (1) JPH10235552A (de)
KR (1) KR100511882B1 (de)
DE (1) DE69816146T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107756232A (zh) * 2017-11-10 2018-03-06 北京鼎泰芯源科技发展有限公司 一种晶片研磨装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11302878A (ja) * 1998-04-21 1999-11-02 Speedfam-Ipec Co Ltd ウエハ平坦化方法，ウエハ平坦化システム及びウエハ
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
ATE487564T1 (de) 1999-06-15 2010-11-15 Ibiden Co Ltd Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren
JP4489320B2 (ja) * 2001-04-27 2010-06-23 不二越機械工業株式会社 研磨装置
KR100413493B1 (ko) * 2001-10-17 2004-01-03 주식회사 하이닉스반도체 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법
JP2004160573A (ja) * 2002-11-11 2004-06-10 Ebara Corp 研磨装置
US6942544B2 (en) * 2003-09-30 2005-09-13 Hitachi Global Storage Technologies Netherlands B.V. Method of achieving very high crown-to-camber ratios on magnetic sliders
US6913515B2 (en) * 2003-09-30 2005-07-05 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders
KR100864592B1 (ko) * 2008-04-11 2008-10-22 주식회사 케이엔제이 평판 디스플레이 패널의 제조장치
CN104070447A (zh) * 2014-06-25 2014-10-01 周开雄 一种多功能磨具
JP6259366B2 (ja) * 2014-07-09 2018-01-10 株式会社荏原製作所 研磨装置
US10105812B2 (en) 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
KR102363829B1 (ko) 2016-03-24 2022-02-16 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
US11304290B2 (en) * 2017-04-07 2022-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structures and methods
JP2019123053A (ja) 2018-01-18 2019-07-25 三菱重工コンプレッサ株式会社 狭隘部の研磨用治具、研磨用治具の製造方法、研磨方法、およびインペラの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JP3024417B2 (ja) * 1992-02-12 2000-03-21 住友金属工業株式会社 研磨装置
WO1993015878A1 (en) * 1992-02-12 1993-08-19 Sumitomo Metal Industries Limited Abrading device and abrading method employing the same
JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
EP0579298B1 (de) * 1992-06-15 1997-09-03 Koninklijke Philips Electronics N.V. Verfahren zum Herstellen einer Platte mit einer ebenen Hauptoberfläche, Verfahren zum Herstellen einer Platte mit parallelen Hauptoberflächen sowie Vorrichtung zum Durchführen der Verfahren
JP2560611B2 (ja) * 1993-07-26 1996-12-04 日本電気株式会社 保護膜およびその製造方法
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
EP0756917A4 (de) * 1994-04-22 1997-12-17 Toshiba Kk Abnehmbare läppscheibenauflageplatte sowie zugehörige läppmaschine
JPH07297195A (ja) * 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
JP3642611B2 (ja) * 1994-09-08 2005-04-27 株式会社荏原製作所 ポリッシング方法および装置
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
DE69610821T2 (de) * 1995-02-10 2001-06-07 Advanced Micro Devices, Inc. Chemisch-mechanisch polieren mit gebogenen traegern
US5916012A (en) 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
US5840202A (en) * 1996-04-26 1998-11-24 Memc Electronic Materials, Inc. Apparatus and method for shaping polishing pads
US6113466A (en) * 1999-01-29 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling polishing profile in chemical mechanical polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107756232A (zh) * 2017-11-10 2018-03-06 北京鼎泰芯源科技发展有限公司 一种晶片研磨装置

Also Published As

Publication number Publication date
KR19980071615A (ko) 1998-10-26
US5980685A (en) 1999-11-09
EP0860238A3 (de) 2000-05-17
EP0860238A2 (de) 1998-08-26
EP0860238B1 (de) 2003-07-09
US6579152B1 (en) 2003-06-17
DE69816146T2 (de) 2004-05-27
JPH10235552A (ja) 1998-09-08
KR100511882B1 (ko) 2005-10-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee