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DE1694504B2 - Process for the epitaxial growth of silicon carbide - Google Patents

Process for the epitaxial growth of silicon carbide

Info

Publication number
DE1694504B2
DE1694504B2 DE1694504A DE1694504A DE1694504B2 DE 1694504 B2 DE1694504 B2 DE 1694504B2 DE 1694504 A DE1694504 A DE 1694504A DE 1694504 A DE1694504 A DE 1694504A DE 1694504 B2 DE1694504 B2 DE 1694504B2
Authority
DE
Germany
Prior art keywords
torr
growth
silicon carbide
gases
hydrocarbons
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1694504A
Other languages
German (de)
Other versions
DE1694504C3 (en
DE1694504A1 (en
Inventor
Ekkehard 7030 Boeblingen Ebert
Werner Dr. 7031 Dachtel Spielmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
Original Assignee
IBM Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH filed Critical IBM Deutschland GmbH
Priority to DE1694504A priority Critical patent/DE1694504C3/en
Publication of DE1694504A1 publication Critical patent/DE1694504A1/en
Publication of DE1694504B2 publication Critical patent/DE1694504B2/en
Application granted granted Critical
Publication of DE1694504C3 publication Critical patent/DE1694504C3/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)

Description

Die Erfindung betrifft ein Verfahren zum epitaktitchen Aufwachsen von Silziumcarbid auf einem kn- «tallinen Keimkristall aus Siliziumcarbid durch pyrolytisches Zersetzen von Silizium und Kohlenstoff enthaltenden Gasen, wobei ein chlorfreie Silane: und allphatische Kohlenwasserstoffe enthaltendes Gas verwendet wird, nach Patent 1 467 085.The invention relates to a method for epitaxial pitching Growth of silicon carbide on a knalline seed crystal of silicon carbide by pyrolytic Decomposition of gases containing silicon and carbon, being a chlorine-free silane: and allphatic Hydrocarbon-containing gas is used, according to patent 1,467,085.

Bei dem im Hauptpatent 1 467 085 beschriebenen Verfahren wird dem Reaktionsgefäß ein Gemisch aus gasförmigen. Sil.zium und Kohlenwasserstoff enthatenden Substanzen unter normalem Druck mittels eines strömenden inerten Tränengases zugauhrt. Dieses Verfahren besitzt gegenüber dem älteren verfahren, bei dem Siliziumtetrachlond (SiCl4) und Tetrachlorkohlenstoff (CCl4) mit Wasserstoff reduziertIn the process described in the main patent 1,467,085, the reaction vessel is a mixture of gaseous. Substances containing silicon and hydrocarbons are added under normal pressure by means of a flowing inert tear gas. This process has the advantage over the older process in which silicon tetrachloride (SiCl 4 ) and carbon tetrachloride (CCl 4 ) are reduced with hydrogen

werden, verschiedene Vorteile. Der bedeutendste Vorzug besteht darin, daß der Wasserstoff sowie to der pyrolythischen Zersetzung sich bildende schad-will have various advantages. The most important advantage is that the hydrogen as well as to damaged by pyrolytic decomposition

15 Die Erfindung wird an Hand des in der Figur schaubildlich dargestellten Ausführungsbeispieles be- 15 The invention is based on the exemplary embodiment shown diagrammatically in the figure.

SC Im Reaktionsgefäß 1, das aus Quarz besteht, ist . * G a_nit_ oder Tantalblock 2 angeordnet. Auf aer γ ΗίΛ1οοΐς 2 liegt der einkristalline SiIiaem ,1J0^6J11141 auf desSen Oberfläche im Epi- SC In reaction vessel 1, which is made of quartz, is. * G a _ nit _ o the tantalum block 2 arranged. On aer γ ΗίΛ1οο ΐς 2 lies the monocrystalline SiIiaem, 1 J 0 ^ 6 J 11141 on the surface in the epi-

»5 °H°'^ eine einkristalline Schicht aufgebracht Bik ^ ^ somit auch der Keim4 »5 ° H ° '^ a monocrystalline layer applied Bik ^ ^ thus also the germ4

30 J^en miuds der induktionsspule 5 auf eine Tem- 30 J ^ en miuds the induction coil 5 on a tem-

nprot,ir von etwa 1400° C erhitzt. PeuRohr 6 ^nJ ein Gasgemisch, bestehend uur und p { ^ ώ ^ npr ot, ir heated to about 1400 ° C. P eutube 6 ^ n J e in gas mixture, consisting of uur and p { ^ ώ ^

aus. Μοηω· .^ das unniiUelbar über der the end. Μοηω · . ^ The unniiUelbar above the

^"1JJJ* des 5 auf etwa i400° C erhitzten SiC-^ " 1 JJJ * of the 5 SiC heated to about 40 0 ° C

"ff"" . siHziumCarbid und Wasserstoff unter epi-Keims 4^m von SiC auf den Keim zer."ff"". siHziumC arbid and hydrogen under epi-Keims 4 ^ m of SiC on the Keim zer .

taktiscnem /λtactiscnem / λ

tarn. wirkende Gasgemische werden durchcamouflage. acting gas mixtures are through

DSLd mit dem durch das Rohr 6 rfW Beispielsweise wird für DS Ld with the rfW through the pipe 6, for example, is used for

Phosphorhydrid Phos-Phosphorus hydride phosphorus

Ä5!XÄ1^^^ er.Ä5! XÄ1 ^^^ he.

zielte Wachstumsgeschwindigkeit der emknstallinen Schicht ist jedoch nicht wesenthch hoher als^nach dem älteren Verfahren. Eine Erhöhung der Wachs tumsgeschwindigkeit wäre aber sehr erwünscht da beispielsweise bei langsamem Wachstum der Schienten wegen der auftretenden Diffusionserschemungen keine pn-übergänge m der gewünschten Scharfe er- 5c Wahrend d.rThe targeted growth rate of the crystalline layer is, however, not significantly higher than that obtained with the older method. Increasing the wax would tumsgeschwindigkeit but very desirable because, for example with slow growth of the ski ducks because of occurring Diffusionserschemungen no pn junctions m the desired Sharp ER- 5 c During dr

«nem«Nem

g des Aufw^hspn»- ^ die g Absaugle]tung8 ^6.g des Aufw ^ hspn »- ^ the g suction line 8 ^ 6 .

Reaktionsgefäß ein Unter- Rea ktionsgefäß an under-

der Aschen einem Torr und ,. Dadurch werden die g en Gase of ashes a torr and,. This releases the gases

gt> ohne daß die Verwendung gt> without the use

während des Aufwachsprozesses im Reaktionsgefäß genau eingestellt werden.can be set precisely during the growth process in the reaction vessel.

Hierzu 1 Blatt Zeichnungen1 sheet of drawings

Claims (2)

Patentansprüche:Patent claims: 1 Verfahren zum epitaktischen Aufwachsen von Süiziumcarbid auf einem kristallinen Keimkristall aus Siliziumcarbid durch pyrolyüscnes Zersetzen von Silicium und Kohlenwasserstoff enthaltenden Gasen, wobei ein chlorfreie biiane und aliphatische Kohlenwasserstoffe enthaltendes Gas verwendet wird, nach Patent 146/ υ»3, dadurch gekennzeichnet, daß während des Aufwachsprozesses im Reaktionsgefäß ein Unterdruck aufrechterhalten wird, der zwischen einem Torr und einem hundertstel Torr liegt. ^1 Process for the epitaxial growth of silicon carbide on a crystalline seed crystal from silicon carbide by pyrolytic decomposition of silicon and hydrocarbons containing gases, with a chlorine-free biiane and gas containing aliphatic hydrocarbons is used, according to patent 146 / υ »3, thereby characterized in that a negative pressure in the reaction vessel during the growth process is maintained, which is between one Torr and one hundredth Torr. ^ 2. Verfahren nach Anspruch 1, dadurcu gekennzeichnet, daß die Wachstamsgeschwindigkeit über die Größe des Unterrockes gesteuert wird.2. The method according to claim 1, dadurcu characterized that the rate of growth is controlled by the size of the petticoat. ein Unterdruck aufrechterhalten wird, der zwischen einem Torr und einem hundertstel Torr hegt. Durch ,. Maßnahme ist es gelungen, eine etwa zehnmal höhere Wachstumsrate gegenüber dem bisherigen du ^ ^ erreichen. Beim Aufwachsen von poly-a negative pressure between one torr and one hundredth of a torr is maintained. By ,. ACTION has been able to achieve about ten times higher growth rate than the previous you ^ ^. When growing up poly- a V^ siC smd beispielsweise sogar Wachs"* on 1Oo μ pro Minute erzielt worden. En JJJr* Vorteil des Verfahrens besteht darin, daß w ^ Kohlenwasserstoffe sowie die Dotieui ffe entha]tenden Gase durch den Unterdrucka V ^ sm d Sic example, even wax "* on 1O o μ been achieved per minute. En * JJJr advantage of the method is that w ^ Hydrocarbons rstoffe and Dotieui entha ffe] te the gases through the vacuum ίο ε Reaktionsraum gesaugt werden. Dadurch kön- ^ bisher verwendeten inerten Trägergase, dieίο ε Rea ktionsraum be sucked. This kön- ^ inert carrier gases used so far, the ^ verwendeten Substanzen hochrein sein müswi ^ ^^ ^ Venabien verteuern, wegfallen.^ The substances used must be highly pure, ^ ^^ ^ make Venabia more expensive, no longer apply. vorteilhafte Ausbildung des erfindungsgemä-Verfanrens besteht darin, daß die Wachsrumsge- _ „^ ^ Grße deg Unterdrucks geadvantageous embodiment of the inventive Verfanren s is that the Wachsrumsge- _ "^ ^ Gr" SSE ° ge underpressure
DE1694504A 1964-12-05 1964-12-05 Process for the epitaxial growth of silicon carbide Expired DE1694504C3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1694504A DE1694504C3 (en) 1964-12-05 1964-12-05 Process for the epitaxial growth of silicon carbide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1694504A DE1694504C3 (en) 1964-12-05 1964-12-05 Process for the epitaxial growth of silicon carbide

Publications (3)

Publication Number Publication Date
DE1694504A1 DE1694504A1 (en) 1971-04-29
DE1694504B2 true DE1694504B2 (en) 1973-09-20
DE1694504C3 DE1694504C3 (en) 1974-05-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE1694504A Expired DE1694504C3 (en) 1964-12-05 1964-12-05 Process for the epitaxial growth of silicon carbide

Country Status (1)

Country Link
DE (1) DE1694504C3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1008965B (en) * 1954-12-23 1957-05-23 Schaeffler Ohg Industriewerk Window cage for bearing needles
DE1023932B (en) * 1956-04-06 1958-02-06 Duerkoppwerke Ag Needle roller cage
CA980555A (en) * 1972-05-01 1975-12-30 Torrington Company (The) Bearing cage and method for producing a bearing cage

Also Published As

Publication number Publication date
DE1694504C3 (en) 1974-05-09
DE1694504A1 (en) 1971-04-29

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