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DE102011007228B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102011007228B4
DE102011007228B4 DE102011007228.4A DE102011007228A DE102011007228B4 DE 102011007228 B4 DE102011007228 B4 DE 102011007228B4 DE 102011007228 A DE102011007228 A DE 102011007228A DE 102011007228 B4 DE102011007228 B4 DE 102011007228B4
Authority
DE
Germany
Prior art keywords
housing
cover
head
projection
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011007228.4A
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German (de)
English (en)
Other versions
DE102011007228A1 (de
Inventor
Tetsuo Kuroda
Manabu Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102011007228A1 publication Critical patent/DE102011007228A1/de
Application granted granted Critical
Publication of DE102011007228B4 publication Critical patent/DE102011007228B4/de
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE102011007228.4A 2010-05-19 2011-04-12 Halbleitervorrichtung Active DE102011007228B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置
JP2010-115526 2010-05-19

Publications (2)

Publication Number Publication Date
DE102011007228A1 DE102011007228A1 (de) 2011-11-24
DE102011007228B4 true DE102011007228B4 (de) 2019-08-22

Family

ID=44900590

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011007228.4A Active DE102011007228B4 (de) 2010-05-19 2011-04-12 Halbleitervorrichtung

Country Status (3)

Country Link
JP (1) JP5229271B2 (ja)
CN (1) CN102254878B (ja)
DE (1) DE102011007228B4 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7820297B2 (en) 2005-12-23 2010-10-26 3M Innovative Properties Company Multilayer films including thermoplastic silicone block copolymers
JP6848802B2 (ja) 2017-10-11 2021-03-24 三菱電機株式会社 半導体装置
JP6861622B2 (ja) * 2017-12-19 2021-04-21 三菱電機株式会社 半導体装置及び電力変換装置
EP4270469A1 (en) * 2022-04-29 2023-11-01 Infineon Technologies AG Power semiconductor module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
US5646445A (en) 1995-07-07 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having electrodes embedded in an insulating case
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
US6787893B2 (en) 2001-01-23 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
EP1768182A2 (de) 2005-09-27 2007-03-28 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Überstromschutzeinrichtung
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS6329957A (ja) * 1986-07-23 1988-02-08 Seiko Epson Corp 半導体装置の封止形態
JPH02307250A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp 混成集積回路パツケージ
CN100361317C (zh) * 2004-02-27 2008-01-09 矽品精密工业股份有限公司 具有支撑体的感光半导体封装件及其制法
JP4242401B2 (ja) * 2006-06-29 2009-03-25 三菱電機株式会社 半導体装置
CN101101880A (zh) * 2006-07-03 2008-01-09 矽品精密工业股份有限公司 散热型封装结构及其制法
JP4858336B2 (ja) * 2007-07-10 2012-01-18 三菱電機株式会社 電力用半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
US5646445A (en) 1995-07-07 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having electrodes embedded in an insulating case
US6787893B2 (en) 2001-01-23 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
EP1768182A2 (de) 2005-09-27 2007-03-28 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Überstromschutzeinrichtung
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP S63- 164 345 A (Maschinenübersetzung), AIPN [online] JPO [abgerufen am 06.03.2019] *

Also Published As

Publication number Publication date
JP2011243798A (ja) 2011-12-01
CN102254878A (zh) 2011-11-23
CN102254878B (zh) 2015-01-14
DE102011007228A1 (de) 2011-11-24
JP5229271B2 (ja) 2013-07-03

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