CN2583812Y - Plastic packaged electronic element - Google Patents
Plastic packaged electronic element Download PDFInfo
- Publication number
- CN2583812Y CN2583812Y CN02263701.XU CN02263701U CN2583812Y CN 2583812 Y CN2583812 Y CN 2583812Y CN 02263701 U CN02263701 U CN 02263701U CN 2583812 Y CN2583812 Y CN 2583812Y
- Authority
- CN
- China
- Prior art keywords
- chip
- utility
- model
- plastic
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 31
- 239000000565 sealant Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses an electronic component made of mechanical waves transmitted on the surface of a piezoelectric wafer. The utility model comprises a support sheet, wherein, one side of the support sheet is provided with a plurality of leading wire pins, one surface of the support sheet is provided with a chip, and the electrodes of the chip are connected with the leading wire pins. The utility model is characterized in that plastic outer shells are arranged out of the support sheet and the chip, and a gap is formed between the chip and the plastic outer shells. Sealed layers are soaked out of the plastic outer shells. The plastic packaged electronic component of the utility model has the advantages of small size, favorable sealing performance, low cost, stable quality and wide ranges of application.
Description
Technical field
The utility model relates to a kind of electronic devices and components.Specifically, be that a kind of energy is by propagating at the made electronic devices and components of the mechanical wave on piezoelectric chip surface.
Background technology
Can as Surface Acoustic Wave Filter, require to leave the gap between its chip and encapsulating material by propagating at the made electronic devices and components of the mechanical wave on piezoelectric chip surface according to its characteristic.At present, the SAW (Surface Acoustic Wave) filter method for packing generally adopts the encapsulation of metal base and pipe cap to form.This structure SAW, because its base and pipe cap are metal material, not only volume is big, and the production cost height.Again because its base and pipe cap are metal material, and encapsulation is buckled on the base by pipe cap and realizes that make the sealing property of product be difficult to assurance, rate of finished products is lower, and product quality is very unstable.
In addition, along with the miniaturization requirement of people to electronic product, manufacturer adopts double-sided printed-circuit board more and more.Adopt double-sided printed-circuit board, can therefore, can realize dwindling the purpose of electronic product volume at its two sides welding electronic component.And the electronic devices and components of metal shell encapsulation are when being inserted on this double-sided printed-circuit board, the lead-in wire on the easy contact circuit plate of its metal shell, thus cause short circuit or short, complete machine is broken down.Therefore,, only be applicable to the printed circuit board (PCB) of single face, be not suitable on the double-sided printed-circuit board that the scope of application is not wide with the electronic devices and components of metal shell encapsulation.
Summary of the invention
The purpose of this utility model is to provide a kind of electronic devices and components of Plastic Package.This components and parts, volume is little, good seal performance, production cost are low, constant product quality, the scope of application are wide.
Above-mentioned purpose of the present utility model is realized by following technical solution:
The electronic devices and components of Plastic Package of the present utility model comprise supporting spring, one side this supporting spring has some terminal pins, it simultaneously has chip, and the electrode on the chip is connected with terminal pin.Its design feature is that said supporting spring and chip outside have plastic casing, and is gapped between chip and plastic casing.The plastic casing outside also is impregnated with sealant.
Adopt such scheme, have the following advantages:
Because the electronic devices and components of Plastic Package of the present utility model, Plastic Package is adopted in its supporting spring and chip outside, and the plastic casing outside is impregnated with sealant, not only can dwindle the volume of product, also thoroughly overcome the shortcoming that encapsulates easy gas leakage with metal base and pipe cap, and can reduce production costs.Again owing to adopt plastic casing, and the plastic casing outside is impregnated with sealant, and good seal performance both can improve the rate of finished products of product, can improve product quality stability and reliability again.
In addition, because electronic devices and components of the present utility model adopt the plastic casing encapsulation, and be impregnated with one deck sealant again in the plastic casing outside, plastic casing and sealant are again insulating material, even the lead-in wire of the housing contacts of electronic devices and components to the printed circuit board (PCB), can not cause short circuit or short yet, complete machine is broken down.Both be applicable to single-clad board, be applicable to double-sided printed-circuit board again, scope of application broad.
Description of drawings
Fig. 1 is the electronic devices and components structural representation of Plastic Package of the present utility model;
Fig. 2 is the A-A cross-sectional schematic of Fig. 1.
Embodiment
See Fig. 1, Fig. 2, the electronic devices and components of Plastic Package of the present utility model contain the supporting spring 3 as base.There are five terminal pins 6 in the bottom of this supporting spring, and it simultaneously is fixed with chip 4, is connected by welding wire 5 between the electrode on the chip 4 and the terminal pin 6.There is plastic casing the outside of supporting spring 3 and chip 4, leaves gap 8 between chip 4 and plastic casing.For strengthening sealing effectiveness, make electronic devices and components air tight, also be impregnated with one deck sealant 1 in the outside of plastic casing.Said sealant 1 can be an epoxy resin layer, also can be other any insulation material layer that can play sealing function.
For ease of processing, said plastic casing can be made of two parts, promptly is made of bedframe 2 and cover plate 7, and cover plate 7 is held in the oral area of bedframe 2.Supporting spring 3 wherein is fixed on the base plate of bedframe 2 inboards, and after making cover plate 7 be buckled in bedframe 2 oral areas, 4 of cover plate 7 and chips leave gap 8.
Claims (2)
1. the electronic devices and components of Plastic Package comprise supporting spring (3), one side this supporting spring has some terminal pins (6), it simultaneously has chip (4); Electrode on the chip (4) is connected with terminal pin (6); It is characterized in that there is plastic casing said supporting spring (3) and chip (4) outside, leaves gap (8) between chip (4) and plastic casing; The plastic casing outside also is impregnated with sealant (1).
2. the electronic devices and components of Plastic Package according to claim 1 is characterized in that said plastic casing is made of bedframe (2) and cover plate (7); Supporting spring (3) is fixed on the inboard base plate of bedframe (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02263701.XU CN2583812Y (en) | 2002-08-09 | 2002-08-09 | Plastic packaged electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02263701.XU CN2583812Y (en) | 2002-08-09 | 2002-08-09 | Plastic packaged electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2583812Y true CN2583812Y (en) | 2003-10-29 |
Family
ID=33730034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02263701.XU Expired - Lifetime CN2583812Y (en) | 2002-08-09 | 2002-08-09 | Plastic packaged electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2583812Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915976A (en) * | 2012-10-08 | 2013-02-06 | 华东光电集成器件研究所 | Anti-high-overload integrated circuit |
-
2002
- 2002-08-09 CN CN02263701.XU patent/CN2583812Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915976A (en) * | 2012-10-08 | 2013-02-06 | 华东光电集成器件研究所 | Anti-high-overload integrated circuit |
| CN102915976B (en) * | 2012-10-08 | 2015-07-29 | 华东光电集成器件研究所 | A kind of integrated circuit of resistance to high overload |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NONE WUXI BAOKE ELECTRONICS CO., LTD. Free format text: FORMER OWNER: JIANG RONGHAO Effective date: 20050805 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20050805 Address after: Road building Liyuan Economic Development Zone in Jiangsu city of Wuxi province No. 1058 214072 Patentee after: Wuxi Baoke Electronics Co., Ltd. Address before: Liang Xiang Long Shan Cun Lei River town in Jiangsu province Wuxi City, No. 287, 214063 Patentee before: Jiang Ronghao |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120809 Granted publication date: 20031029 |