CN102915976B - A kind of integrated circuit of resistance to high overload - Google Patents
A kind of integrated circuit of resistance to high overload Download PDFInfo
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- CN102915976B CN102915976B CN201210377217.5A CN201210377217A CN102915976B CN 102915976 B CN102915976 B CN 102915976B CN 201210377217 A CN201210377217 A CN 201210377217A CN 102915976 B CN102915976 B CN 102915976B
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- strutting piece
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Abstract
The present invention relates to the integrated circuit of a kind of resistance to high overload in microelectronic product, comprise shell (3), substrate (4) is connected with in shell (3), shell upper end is provided with seal cover (1), it is characterized in that: seal cover side is provided with strutting piece (2), strutting piece (2) and substrate are formed and compress location fit.The invention has the advantages that: the substrate and the shell assemble method that better inherit hybrid integrated circuit maturation, provide succinct base plate supports guard method simultaneously, significantly improve the resistance to high overload level of underlay substrate and product, there is very strong practicality.
Description
Technical field
The present invention relates to Electronic products manufacturing field, particularly relate to the package assembly in microelectronic product between substrate and metal shell.
Background technology
The resistance to high overload performance of microelectronic product refers to the ability that the anti-high-strength mechanical of product self impacts.Because hybrid integrated circuit substrate surface-assembled has numerous components and parts, compared with discrete component, substrate wants large many with the components and parts overall weight on it, and the impulse inertia power of bearing in overload impact process is also larger.Meanwhile, the substrate direct-assembling of conventional hybrid integrated circuit is at metal shell substrate inner bottom surface, substrate in Y1 direction without any supporting construction, therefore, under high overload impact force action, substrate is easily assembled surface and is come off in shell, thus becomes the weak link of the resistance to high overload of hybrid integrated circuit.Practice shows, it is also the hybrid integrated circuit typical failure of resistance to high overload pattern that circuit substrate comes off from inner surface of outer cover.Through retrieval, not yet find the solution of being correlated with.
Summary of the invention
Object of the present invention easily comes off under high overload percussion to solve hybrid integrated circuit substrate exactly, and the resistance to high overload of substrate bears the low problem of level, the integrated circuit of a kind of resistance to high overload provided.
Present invention employs following technical scheme:
An integrated circuit for resistance to high overload, comprises shell, is connected with substrate in shell, and shell upper end is provided with seal cover, it is characterized in that: seal cover side is provided with strutting piece, and strutting piece and substrate are formed and compress location fit.
On the basis of technique scheme, there is the technical scheme of following further optimization:
Described strutting piece is that be arranged on seal cover side with rectangle frame that is shell inner cavity matched in clearance.
Described strutting piece is that be arranged on seal cover side with one group of supporting bracket that is shell inner cavity matched in clearance, a segment distance of being separated by between every two adjacent supporting brackets.
The invention has the advantages that: the substrate and the shell assemble method that better inherit hybrid integrated circuit maturation, provide succinct base plate supports guard method simultaneously, significantly improve the resistance to high overload level of underlay substrate and product, there is very strong practicality.
Accompanying drawing explanation
Fig. 1 is front view of the present invention;
Fig. 2 is the stereogram of seal cover board in Fig. 1;
Fig. 3 is B-B cutaway view of Fig. 1.
Embodiment:
As shown in Figure 1, the integrated circuit of a kind of resistance to high overload provided by the invention, comprises shell 3, shell 3 underrun insulating cement (or other assembled material, as solder etc.) 5 be assembled with substrate 4, be provided with the circuit element such as chip 8, device 9 in substrate 4, be provided with electrode 6 in substrate 4 through enclosure bottom.Shell upper end is provided with seal cover 1, and the side that seal cover stretches to shell inner cavity is provided with strutting piece 2, and strutting piece 2 and substrate are formed and compress location fit.The bottom surface of described strutting piece 2 be provided with insulating cement 7 between substrate and contact, realize the effectively bonding of supporting construction and substrate by solidification.
As shown in Figure 2, strutting piece can for be arranged on seal cover side with the rectangle frame 2a of shell 3 inner chamber matched in clearance.
As shown in Figure 3, strutting piece can for be arranged on seal cover side with one group of supporting bracket 2b of shell 3 inner chamber matched in clearance, a segment distance of being separated by between every two adjacent supporting brackets.Described supporting bracket 2b also can be arranged on seal cover four limit central part, effectively can alleviate the weight of supporting construction so in the case of necessary.
Claims (3)
1. the integrated circuit of a resistance to high overload, comprise shell (3), shell (3) underrun insulating cement (5) is assembled with substrate (4), chip (8) is provided with in substrate (4), device (9) circuit element, electrode (6) is provided with through enclosure bottom in substrate (4), shell upper end is provided with seal cover (1), it is characterized in that: the side that seal cover stretches to shell inner cavity is provided with strutting piece (2), strutting piece (2) and substrate are formed and compress location fit, the bottom surface of described strutting piece (2) be provided with insulating cement (7) between substrate and contact, the effectively bonding of supporting construction and substrate is realized by solidification.
2. according to the integrated circuit of a kind of resistance to high overload described in claim 1, it is characterized in that: described strutting piece is that be arranged on seal cover side with rectangle frame (2a) that is shell (3) inner chamber matched in clearance.
3. according to the integrated circuit of a kind of resistance to high overload described in claim 1, it is characterized in that: described strutting piece is that be arranged on seal cover side with one group of supporting bracket (2b) that is shell (3) inner chamber matched in clearance, a segment distance of being separated by between every two adjacent supporting brackets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377217.5A CN102915976B (en) | 2012-10-08 | 2012-10-08 | A kind of integrated circuit of resistance to high overload |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377217.5A CN102915976B (en) | 2012-10-08 | 2012-10-08 | A kind of integrated circuit of resistance to high overload |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102915976A CN102915976A (en) | 2013-02-06 |
| CN102915976B true CN102915976B (en) | 2015-07-29 |
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ID=47614291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210377217.5A Active CN102915976B (en) | 2012-10-08 | 2012-10-08 | A kind of integrated circuit of resistance to high overload |
Country Status (1)
| Country | Link |
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| CN (1) | CN102915976B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103441120B (en) * | 2013-08-22 | 2016-01-27 | 华东光电集成器件研究所 | A kind of integrated circuit of closed assembly |
| DE102014217351A1 (en) * | 2014-08-29 | 2016-03-03 | Robert Bosch Gmbh | Module arrangement and transmission control module |
| CN106252340B (en) * | 2016-09-26 | 2019-01-04 | 武汉光迅科技股份有限公司 | A kind of package of optical device device and packaging method |
| CN107248504A (en) * | 2017-06-08 | 2017-10-13 | 安徽晶格尔电子有限公司 | A kind of novel encapsulated shell for circuit devcie |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5353934A (en) * | 1992-08-06 | 1994-10-11 | Dai Nippon Printing Co., Ltd. | Substrate holding case |
| CN2583812Y (en) * | 2002-08-09 | 2003-10-29 | 蒋荣豪 | Plastic packaged electronic element |
| CN202307879U (en) * | 2011-07-15 | 2012-07-04 | 中国航天科技集团公司第九研究院第七七一研究所 | SiP module structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58154250A (en) * | 1982-03-09 | 1983-09-13 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
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2012
- 2012-10-08 CN CN201210377217.5A patent/CN102915976B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5353934A (en) * | 1992-08-06 | 1994-10-11 | Dai Nippon Printing Co., Ltd. | Substrate holding case |
| CN2583812Y (en) * | 2002-08-09 | 2003-10-29 | 蒋荣豪 | Plastic packaged electronic element |
| CN202307879U (en) * | 2011-07-15 | 2012-07-04 | 中国航天科技集团公司第九研究院第七七一研究所 | SiP module structure |
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| Publication number | Publication date |
|---|---|
| CN102915976A (en) | 2013-02-06 |
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