CN220861957U - Ultrasonic transducer - Google Patents
Ultrasonic transducer Download PDFInfo
- Publication number
- CN220861957U CN220861957U CN202322587564.7U CN202322587564U CN220861957U CN 220861957 U CN220861957 U CN 220861957U CN 202322587564 U CN202322587564 U CN 202322587564U CN 220861957 U CN220861957 U CN 220861957U
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- wire
- substrate
- ultrasonic transducer
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- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 20
- 239000000565 sealant Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims description 9
- 229920006335 epoxy glue Polymers 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 238000002604 ultrasonography Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
The utility model belongs to the field of ultrasonic transducers, and particularly relates to an ultrasonic transducer; comprising the following steps: the negative electrode of the piezoelectric ceramic plate is adhered to the bottom of the metal shell through an adhesive; the piezoelectric ceramic plate adopts a flanging electrode mode, a negative electrode is led to the same side as the positive electrode through flanging, and one ends of the first lead and the second lead are respectively and correspondingly connected with the negative electrode and the positive electrode which are positioned on the same side; the substrate is arranged at the upper part of the metal shell, two wire through holes are formed in the substrate, and the other ends of the first wire and the second wire penetrate through the wire through holes and are directly led out by adopting filling glue for sealing or indirectly led out through positive and negative connecting columns; the sealant is coated above the substrate, and the substrate is sealed; the utility model reduces the influence of the change of the contact state between the negative electrode of the piezoelectric ceramic plate and the metal shell on the electric connection performance under the high-low temperature environment, and improves the temperature stability of the device.
Description
Technical Field
The utility model belongs to the field of ultrasonic transducers, and particularly relates to an ultrasonic transducer.
Background
The performance of the current commercial ultrasonic sensor can meet most application requirements, but the working temperature range of the commercial device is generally difficult to meet some special application environments, particularly when the high temperature or the low temperature exceeds the upper limit and the lower limit of the working temperature, the performance of the commercial device can be influenced, even the situation such as an electrical open circuit can occur, particularly when the electrical connection is realized by adopting a conductive adhesive and the like, the situation is more likely to occur due to temperature change.
The ultrasonic transducer commonly used on the reversing radar mostly adopts an aluminum shell, and the aluminum shell has the characteristics of easy processing and lower cost; the resonant frequency is lower for the same size; one of the disadvantages of the aluminum shell is that the bonding wire is not easy, the shell is usually directly connected with the negative electrode of the piezoelectric ceramic plate, the adhesive used for connection is not conductive, and the electrical connection is realized only through the negative electrode of the piezoelectric ceramic plate and the tiny protrusions on the aluminum shell, so that the consistency of the resistance between the piezoelectric ceramic plate and the aluminum shell is difficult to ensure by the connection mode, and in order to ensure the electrical connection, the bonding surface of the aluminum shell is usually not subjected to any surface treatment, so that the best bonding effect is difficult to ensure. In addition, as the environmental temperature changes, the contact between the negative electrode of the piezoelectric ceramic plate and the aluminum shell changes due to the different thermal expansion coefficients of the piezoelectric ceramic plate, the aluminum shell and the adhesive, so that the electrical connection resistance of the piezoelectric ceramic plate and the aluminum shell changes obviously, and the performance of the ultrasonic transducer generates larger temperature drift; therefore, a new design is needed to improve the temperature stability of the ultrasonic sensor.
Disclosure of utility model
In order to overcome the defects in the prior art, the utility model provides an ultrasonic transducer, which comprises: a piezoelectric ceramic sheet 1, a negative electrode 2, an adhesive 3, a positive electrode 4, a first lead 5, a substrate 6, a metal case 9, a sound absorbing structure 10, a sealant 11 and a second lead 17; the negative electrode 2 of the piezoelectric ceramic sheet 1 is adhered to the bottom of the metal shell 9 through an adhesive 3; the piezoelectric ceramic plate adopts a flanging electrode mode, the negative electrode 2 is led to the same side as the positive electrode 4 through flanging, and one ends of the first lead 5 and the second lead 17 are correspondingly connected with the negative electrode 2 and the positive electrode 4 which are positioned on the same side respectively; the substrate 6 is arranged at the upper part of the metal shell 9, two wire through holes are formed in the substrate 6, and the other ends of the first wire 5 and the second wire 17 are led out through the wire through holes; the sealant 11 is coated over the substrate 6 to seal the substrate.
Preferably, when the other ends of the first wire 5 and the second wire 17 are led out through the wire through holes, the other ends of the first wire 5 and the second wire 17 pass through the wire through holes and are sealed by the filling glue 20 for direct led out, or are led out indirectly through the positive and negative connecting columns.
Further, the indirect extraction of the other ends of the first wire 5 and the second wire 17 through the positive and negative connection posts means that: welding positive and negative connecting columns in two wire through holes through a metal base 13 respectively, welding the other ends of a first wire 5 and a second wire 17 at the bottoms of the negative and positive connecting columns respectively, and adding a third wire 16 and a fourth wire 19 to the tops of the negative and positive connecting columns respectively; the negative connection post 7 and the metal housing 9 are connected by a conductive layer 12, and the conductive layer 12 is fixed by a conductive adhesive 14.
Preferably, a protrusion is provided on an upper portion of the inner surface of the metal housing 9, and the substrate 6 is placed on the protrusion and the substrate 6 is fixed on the protrusion by using a fixing adhesive 15.
Further, the fixing glue 15 is AB glue that is cured quickly at normal temperature.
Preferably, the substrate 6 is further provided with a vent hole to ensure the balance of the air pressure inside and outside the device.
Preferably, the substrate 6 is a PCB board.
Preferably, the adhesive 3 is an epoxy glue with good fluidity, the sealant 11 is a pouring sealant with low hardness and small curing shrinkage ratio, and the filling glue 20 is an AB glue with high strength and rapid curing.
The beneficial effects of the utility model are as follows: the ultrasonic transducer designed by the utility model adopts a high-reliability electrical connection mode, namely, the flanging electrode is utilized to directly realize the electrical connection between the negative electrode lead and the negative electrode of the piezoelectric ceramic plate in a welding mode, and the negative electrode of the piezoelectric ceramic plate is mechanically and rigidly connected with the metal shell by using an adhesive, so that the influence of the change of the contact state between the negative electrode of the piezoelectric ceramic plate and the metal shell on the electrical connection performance in a high-low temperature environment is reduced, and the temperature stability of the device is improved; in order to improve the shielding property, a structure in which a negative electrode is connected to a housing is additionally proposed, which can reduce external electromagnetic interference.
Drawings
FIG. 1 is a schematic view of an ultrasonic transducer according to the present utility model;
FIG. 2 is a schematic view of a position on a substrate according to the present utility model;
FIG. 3 is a schematic view of an ultrasound transducer according to another preferred embodiment of the present utility model;
FIG. 4 is a schematic view of a substrate position according to another preferred embodiment of the present utility model;
In the figure: 1. a piezoelectric ceramic sheet; 2. a negative electrode; 3. an adhesive; 4. a positive electrode; 5. a first wire; 6. a substrate; 7. a negative connecting column; 8. welding spots; 9. a metal housing; 10. a sound absorbing structure; 11. sealing glue; 12. a conductive layer; 13. a metal base; 14. conducting resin; 15. fixing glue; 16. a third wire; 17. a second wire; 18. a positive connection column; 19. a fourth wire; 20. and (5) filling glue.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides an ultrasonic transducer, as shown in fig. 1 and 2, which comprises the following components: a piezoelectric ceramic sheet 1, a negative electrode 2, an adhesive 3, a positive electrode 4, a first lead 5, a substrate 6, and a second lead 17; the negative electrode 2 of the piezoelectric ceramic sheet 1 is adhered to the bottom of the metal shell 9 through an adhesive 3; the piezoelectric ceramic plate adopts a flanging electrode mode, the negative electrode 2 is led to the same side as the positive electrode 4 through flanging, and one ends of the first lead 5 and the second lead 17 are correspondingly connected with the negative electrode 2 and the positive electrode 4 which are positioned on the same side respectively; the substrate 6 is arranged at the upper part of the metal shell 9, two wire through holes are formed in the substrate 6, and the other ends of the first wire 5 and the second wire 17 are led out through the wire through holes; the sealant 11 is coated over the substrate 6 to seal the substrate.
When the other ends of the first wire 5 and the second wire 17 are led out through the wire through hole, direct led out can be adopted: the other ends of the first wire 5 and the second wire 17 are passed through the wire through-holes and the wire through-holes are sealed with the filler paste 20.
Preferably, a protrusion is provided on an upper portion of the inner surface of the metal housing 9, and the substrate 6 is placed on the protrusion and the substrate 6 is fixed on the protrusion by using a fixing adhesive 15. Preferably, the fixing glue 15 is AB glue which is quickly solidified at normal temperature.
Preferably, the substrate 6 is further provided with a vent hole to ensure the balance of the air pressure inside and outside the device.
Preferably, the substrate 6 is a PCB board.
Preferably, the adhesive 3 is an epoxy glue with good fluidity, the sealant 11 is a pouring sealant with low hardness and small curing shrinkage ratio, and the filling glue 20 is an AB glue with high strength and rapid curing.
As shown in fig. 3 and 4, in some preferred embodiments of the present utility model, if the ultrasound transducer is required to realize shielding, the negative electrode of the piezoelectric ceramic plate needs to be connected with the metal shell; in order to realize that the negative electrode of the piezoelectric ceramic plate is connected with the metal shell, when the other ends of the first lead 5 and the second lead 17 are led out through the lead through hole, indirect lead-out is carried out through the positive and negative connecting columns; specific: two connecting columns (a negative connecting column 7 and a positive connecting column 18) are welded in two wire through holes on the ultrasonic transducer substrate 6 through a metal base 13, the welding point is 8, and the metal base is used for fixing the connecting columns; the other ends of the first wire 5 and the second wire 17 are respectively welded at the bottoms of the corresponding connecting columns, and the third wire 16 and the fourth wire 19 are respectively welded at the tops of the corresponding connecting columns; the negative connection post 7 and the metal housing 9 are connected by a conductive layer 12, and the conductive layer 12 is fixed by a conductive adhesive 14.
In summary, the ultrasonic transducer designed by the utility model adopts a high-reliability electrical connection mode, namely, the flanging electrode is utilized to directly realize the electrical connection between the negative electrode lead and the negative electrode of the piezoelectric ceramic plate in a welding mode, and the negative electrode of the piezoelectric ceramic plate and the metal shell are mechanically and rigidly connected by using an adhesive, so that the influence of the change of the contact state between the negative electrode of the piezoelectric ceramic plate and the metal shell on the electrical connection performance in a high-low temperature environment is reduced, and the temperature stability of the device is improved; in order to improve the shielding property, a structure in which a negative electrode is connected to a housing is additionally proposed, which can reduce external electromagnetic interference.
While the foregoing is directed to embodiments, aspects and advantages of the present utility model, other and further details of the utility model may be had by the foregoing description, it will be understood that the foregoing embodiments are merely exemplary of the utility model, and that any changes, substitutions, alterations, etc. which may be made herein without departing from the spirit and principles of the utility model.
Claims (8)
1. An ultrasonic transducer, comprising: the piezoelectric ceramic chip (1), the negative electrode (2), the adhesive (3), the positive electrode (4), the first lead (5), the substrate (6), the metal shell (9), the sound absorption structure (10), the sealant (11) and the second lead (17); the negative electrode (2) of the piezoelectric ceramic sheet (1) is adhered to the bottom of the metal shell (9) through an adhesive (3); the piezoelectric ceramic plate adopts a flanging electrode mode, the negative electrode (2) is led to the same side as the positive electrode (4) through flanging, and one ends of the first lead (5) and the second lead (17) are correspondingly connected with the negative electrode (2) and the positive electrode (4) which are positioned on the same side respectively; the substrate (6) is arranged at the upper part of the metal shell (9), two wire through holes are formed in the substrate (6), and the other ends of the first wire (5) and the second wire (17) are led out through the wire through holes; a sealant (11) is coated on the substrate (6) to seal the substrate.
2. An ultrasonic transducer according to claim 1, characterized in that, when the other ends of the first wire (5) and the second wire (17) are led out through the wire through hole, the other ends of the first wire (5) and the second wire (17) are led out directly through the wire through hole and sealed by a filling glue (20), or led out indirectly through positive and negative connecting posts.
3. An ultrasonic transducer according to claim 2, characterized in that the indirect extraction of the other ends of the first wire (5) and the second wire (17) through positive and negative connection posts means: welding positive and negative connecting columns in two wire through holes through a metal base (13), respectively welding the other ends of a first wire (5) and a second wire (17) at the bottoms of the negative and positive connecting columns, adding a third wire (16) and a fourth wire (19), and respectively welding the third wire and the fourth wire at the tops of the negative and positive connecting columns; the negative connecting column (7) is connected with the metal shell (9) by adopting the conductive layer (12), and the conductive layer (12) is fixed by adopting the conductive adhesive (14).
4. An ultrasonic transducer according to claim 1, characterized in that the upper part of the inner surface of the metal housing (9) is provided with a protrusion, on which the substrate (6) is placed and to which the substrate (6) is fixed with a fixing glue (15).
5. An ultrasonic transducer according to claim 4, characterized in that the fixing glue (15) is an AB glue which is rapidly cured at ambient temperature.
6. An ultrasonic transducer according to claim 1, characterized in that the substrate (6) is further provided with ventilation holes to ensure the air pressure balance inside and outside the device.
7. An ultrasonic transducer according to claim 1, characterized in that the substrate (6) is a PCB board.
8. The ultrasonic transducer according to claim 1, wherein the adhesive (3) is an epoxy glue with good fluidity, the sealant (11) is a potting glue with low hardness and small curing shrinkage ratio, and the filler glue (20) is an AB glue with high strength and rapid curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322587564.7U CN220861957U (en) | 2023-09-22 | 2023-09-22 | Ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322587564.7U CN220861957U (en) | 2023-09-22 | 2023-09-22 | Ultrasonic transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220861957U true CN220861957U (en) | 2024-04-30 |
Family
ID=90821774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322587564.7U Active CN220861957U (en) | 2023-09-22 | 2023-09-22 | Ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220861957U (en) |
-
2023
- 2023-09-22 CN CN202322587564.7U patent/CN220861957U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |