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CN201758139U - 新型led光源模组封装结构 - Google Patents

新型led光源模组封装结构 Download PDF

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Publication number
CN201758139U
CN201758139U CN2010202614753U CN201020261475U CN201758139U CN 201758139 U CN201758139 U CN 201758139U CN 2010202614753 U CN2010202614753 U CN 2010202614753U CN 201020261475 U CN201020261475 U CN 201020261475U CN 201758139 U CN201758139 U CN 201758139U
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China
Prior art keywords
metal substrate
light source
source module
reflector
led chip
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Expired - Fee Related
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CN2010202614753U
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English (en)
Inventor
何文铭
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Fujian Wanban optoelectronic Technology Co., Ltd.
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FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
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Priority to CN2010202614753U priority Critical patent/CN201758139U/zh
Priority to PCT/CN2010/077509 priority patent/WO2012006818A1/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

本实用新型提供了一种新型LED光源模组封装结构，属于照明设备的加工领域，其包括金属基板、线路板、反光杯和LED芯片，其特征在于：所述线路板嵌设在金属基板并外露在金属基板的上表面，线路板和金属基板上方固定有反光杯，反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线连接至线路板上。

Description

新型LED光源模组封装结构
【技术领域】
本实用新型涉及一种照明设备，尤其涉及一种LED光源模块。
【背景技术】
LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，传统的大功率LED芯片或者集成程度较高的多芯片LED光源模组的封装结构一般采用金属基板来实现，具体结构一般采用在具有反光杯的高导热金属(如铜、铝等)作为基层，再将绝缘层和电路连接层复合在基层上，形成整个的金属基板，在反光杯中央安装LED芯片，LED芯片连接至电路连接层，再将LED芯片的上表面涂敷一胶水与荧光粉混合层完成封装。上述传统的LED光源模块封装结构中，由于LED芯片和电路连接层之间需要有引线相连接，但LED芯片设置在反光杯内部，而线路板又设置在反光杯之外，因此在生产的过程中，很容易使LED芯片和线路板之间的引线因人为碰断而损坏，大大降低了生产效率，并且生产工序也变得更为复杂，增加生产成本，并且由于传统的金属基板需要采用大面积的绝缘层，导致整个封装结构的散热性能较差，不利于产品的寿命。
【实用新型内容】
本实用新型要解决的技术问题，在于提供一种散热性能更好，并且可以节省生产成本的新型LED光源模组封装结构。
本实用新型是这样实现的：一种新型LED光源模组封装结构，包括金属基板、线路板、反光杯和LED芯片，其特征在于：所述线路板嵌设在金属基板并外露在金属基板的上表面，线路板和金属基板上方固定有反光杯，反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线连接至线路板上。
所述金属基板的上表面设有一电镀的反光层。
所述反光杯为环状，通过注塑或者点塑方式制成。
所述金属基板的一端设有一个卡扣，另一端的相对应位置设有与之适配的卡槽。
本实用新型具有如下优点：采用上述的封装方式，可以使LED芯片和线路板以及它们之间的导线，全部封装在胶水与荧光粉混合层下面，可以在LED芯片封装的工序中就可以直接一步完成，大大提高了生产效率，减少生产过程中导线的损坏，节省了生产成本；其中反光杯除了作为光的反射作用外，还可以将线路板牢固地安装在金属基板内部；同时由于LED芯片可以直接安装固定在金属基板上，可以大大地提高散热性能，提高产品的寿命。
【附图说明】
下面参照附图结合实施例对本实用新型作进一步的说明。
图1是本实用新型的新型LED光源模组封装结构的整体结构示意图。
图2是图1的A-A剖视图。
图3是本实用新型的新型LED光源模组封装结构的侧面示意图。
图4是本实用新型的新型LED光源模组封装结构的金属基板、线路板和反光杯之间的连接结构示意图。
【具体实施方式】
下面结合具体实施例来对本实用新型进行详细的说明。
请参阅图1至图4所示，是本实用新型所述的新型LED光源模组封装结构，包括金属基板1、线路板2、反光杯3和LED芯片4，所述嵌设在金属基板1的中间设有一长条形的凹槽11，凹槽11内嵌设有线路板2，并且该线路板2外露在金属基板1的上表面，线路板2上设有预先制好的连接电路，线路板2的两端分别引出至金属基板1的两端形成正负极，线路板2和金属基板1的上方固定有若干反光杯3，反光杯3内安装若干LED芯片4，该LED芯片4通过绝缘胶粘在反光杯3的底部的金属基板1上的线路板2之外的其余位置，所述LED芯片4的上表面涂敷有一胶水与荧光粉混合层5，LED芯片4通过导线6连接至线路板2上。所述金属基板1的上表面设有一电镀的反光层7，本实施例中该反光层采用镀银层，所述反光杯3为环状，本实施例中采用的是圆环状反光杯，通过注塑或者点塑方式制成。同时本实用新型中也可以采用方形的环状反光杯来实现。所述金属基板1的一端设有一个外宽内窄的卡扣8，另一端的相对应位置设有与之形状相同的卡槽9，这样就可以很方便地将多个同样的模组扣接在一起，如使用在长条型灯条的用途上。

Claims (4)

1.一种新型LED光源模组封装结构，包括金属基板、线路板、反光杯和LED芯片，其特征在于：所述线路板嵌设在金属基板并外露在金属基板的上表面，线路板和金属基板上方固定有反光杯，反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线连接至线路板上。
2.根据权利要求1所述的新型LED光源模组封装结构，其特征在于：所述金属基板的上表面设有一电镀的反光层。
3.根据权利要求1所述的新型LED光源模组封装结构，其特征在于：所述反光杯为环状，通过注塑或者点塑方式制成。
4.根据权利要求1所述的新型LED光源模组封装结构，其特征在于：所述金属基板的一端设有一个卡扣，另一端的相对应位置设有与之适配的卡槽。
CN2010202614753U 2010-07-16 2010-07-16 新型led光源模组封装结构 Expired - Fee Related CN201758139U (zh)

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PCT/CN2010/077509 WO2012006818A1 (zh) 2010-07-16 2010-09-30 Led光源模组封装结构

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958387A (zh) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 新型led光源模组封装结构
CN102856311A (zh) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 Led封装模块及封装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606302B2 (ja) * 2005-01-27 2011-01-05 京セラ株式会社 発光装置
CN200983368Y (zh) * 2006-01-25 2007-11-28 廖本瑜 高亮度led的高散热封装基板
CN100487310C (zh) * 2007-07-06 2009-05-13 深圳市泓亚光电子有限公司 Led平板式多芯大功率光源
US20090059583A1 (en) * 2007-08-28 2009-03-05 Chi-Yuan Hsu Package Structure for a High-Luminance Light Source
CN100555691C (zh) * 2007-09-11 2009-10-28 东南大学 提高功率型发光二极管出光效率的封装结构
TW200941659A (en) * 2008-03-25 2009-10-01 Bridge Semiconductor Corp Thermally enhanced package with embedded metal slug and patterned circuitry
US20100006886A1 (en) * 2008-07-10 2010-01-14 Brilliant Technology Co., Ltd. High power light emitting diode chip package carrier structure
CN101752354A (zh) * 2009-12-18 2010-06-23 中山大学 一种led用封装基板结构及其制作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958387A (zh) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 新型led光源模组封装结构
CN102856311A (zh) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 Led封装模块及封装方法
CN102856311B (zh) * 2012-03-22 2015-09-30 创维液晶器件(深圳)有限公司 Led封装模块及封装方法

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Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

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