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CN1570219B - 电镀组合物及电镀方法 - Google Patents

电镀组合物及电镀方法 Download PDF

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Publication number
CN1570219B
CN1570219B CN2004100639026A CN200410063902A CN1570219B CN 1570219 B CN1570219 B CN 1570219B CN 2004100639026 A CN2004100639026 A CN 2004100639026A CN 200410063902 A CN200410063902 A CN 200410063902A CN 1570219 B CN1570219 B CN 1570219B
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CN
China
Prior art keywords
tin
electrolyte composition
thiocarbamide
composition
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2004100639026A
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English (en)
Chinese (zh)
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CN1570219A (zh
Inventor
R·贝卡
N·D·布朗
K·王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
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Rohm and Haas Electronic Materials LLC
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Publication of CN1570219A publication Critical patent/CN1570219A/zh
Application granted granted Critical
Publication of CN1570219B publication Critical patent/CN1570219B/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B17/00—Accessories for brushes
    • A46B17/04—Protective covers for the bristles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
CN2004100639026A 2003-04-07 2004-04-07 电镀组合物及电镀方法 Expired - Fee Related CN1570219B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46093703P 2003-04-07 2003-04-07
US60/460,937 2003-04-07

Publications (2)

Publication Number Publication Date
CN1570219A CN1570219A (zh) 2005-01-26
CN1570219B true CN1570219B (zh) 2011-04-27

Family

ID=32869682

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004100639026A Expired - Fee Related CN1570219B (zh) 2003-04-07 2004-04-07 电镀组合物及电镀方法

Country Status (7)

Country Link
US (1) US7151049B2 (ja)
EP (1) EP1467004B1 (ja)
JP (1) JP4758614B2 (ja)
KR (1) KR101092328B1 (ja)
CN (1) CN1570219B (ja)
DE (1) DE602004019833D1 (ja)
TW (1) TWI261632B (ja)

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EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
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US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
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EP2476779B1 (en) * 2011-01-13 2013-03-20 Atotech Deutschland GmbH Immersion tin or tin alloy plating bath with improved removal of cupurous ions
US8741765B2 (en) * 2011-03-31 2014-06-03 Globalfoundries Inc. Controlled electroplated solder bumps
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
CN102424995A (zh) * 2011-12-17 2012-04-25 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种锡-铟合金电镀液
CN102517615A (zh) * 2011-12-19 2012-06-27 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种Sn-Ag合金电镀液
CN102644098B (zh) * 2012-04-20 2014-10-29 大连理工大学 一种无氰Au-Sn合金电镀液
US10072347B2 (en) * 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating
EP2722419B1 (en) 2012-10-19 2018-08-15 Rohm and Haas Electronic Materials LLC Thin-tin tinplate
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US8877630B1 (en) * 2013-11-12 2014-11-04 Chipmos Technologies Inc. Semiconductor structure having a silver alloy bump body and manufacturing method thereof
US9368340B2 (en) * 2014-06-02 2016-06-14 Lam Research Corporation Metallization of the wafer edge for optimized electroplating performance on resistive substrates
KR101636361B1 (ko) * 2014-07-31 2016-07-06 주식회사 에이피씨티 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액
KR101722703B1 (ko) * 2015-04-10 2017-04-03 엘티씨에이엠 주식회사 주석-은 솔더 범프 도금액
KR101722704B1 (ko) * 2015-12-16 2017-04-11 엘티씨에이엠 주식회사 주석-은 솔더 범프 고속 도금액 및 이를 이용한 도금 방법
US9809892B1 (en) 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US11280014B2 (en) * 2020-06-05 2022-03-22 Macdermid Enthone Inc. Silver/tin electroplating bath and method of using the same
CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液

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US5378347A (en) * 1993-05-19 1995-01-03 Learonal, Inc. Reducing tin sludge in acid tin plating
EP1001054A2 (en) * 1998-11-05 2000-05-17 C. Uyemura & Co, Ltd Tin-copper alloy electroplating bath and plating process therewith
CN1300881A (zh) * 1999-10-07 2001-06-27 荏原优莱特科技股份有限公司 Sn－Cu合金电镀浴

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639735B (zh) * 2016-07-18 2018-11-01 羅門哈斯電子材料有限公司 銦電鍍組合物及用於電鍍銦之方法

Also Published As

Publication number Publication date
DE602004019833D1 (de) 2009-04-23
EP1467004B1 (en) 2009-03-11
US7151049B2 (en) 2006-12-19
EP1467004A1 (en) 2004-10-13
JP2004308006A (ja) 2004-11-04
KR101092328B1 (ko) 2011-12-09
KR20040087883A (ko) 2004-10-15
US20040253804A1 (en) 2004-12-16
CN1570219A (zh) 2005-01-26
TW200506106A (en) 2005-02-16
JP4758614B2 (ja) 2011-08-31
TWI261632B (en) 2006-09-11

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