CN112194881A - 一种带有嵌入铜块的双面线路板的制作方法 - Google Patents
一种带有嵌入铜块的双面线路板的制作方法 Download PDFInfo
- Publication number
- CN112194881A CN112194881A CN202011073239.3A CN202011073239A CN112194881A CN 112194881 A CN112194881 A CN 112194881A CN 202011073239 A CN202011073239 A CN 202011073239A CN 112194881 A CN112194881 A CN 112194881A
- Authority
- CN
- China
- Prior art keywords
- component
- parts
- copper block
- circuit board
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 42
- 239000010949 copper Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000011342 resin composition Substances 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000011265 semifinished product Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 229920013638 modified polyphenyl ether Polymers 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- PHMIILSQQVFWKC-UHFFFAOYSA-N 2-methyl-5-phenyl-1h-imidazole Chemical compound N1C(C)=NC=C1C1=CC=CC=C1 PHMIILSQQVFWKC-UHFFFAOYSA-N 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 3
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 125000005504 styryl group Chemical group 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2471/12—Polyphenylene oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开一种带有嵌入铜块的双面线路板的制作方法，包括有以下步骤：(1)将组分A、组分B、组分C、组分D、组分E、组分F、组分G、组分H、组分I、组分J和组分K依次加入装有机溶剂的容器中搅拌溶解、分散，以配制成树脂组合物胶水；各组分的质量份如下：组分A：55‑60份，组分B：32‑40份，组分C：35‑45份，组分D：15‑18份，组分E：35‑40份，组分F：20‑35份；应用本发明的配方所获得树脂组合物，并配合采用本发明方法制得的线路板具有优异的耐热性、更低的介电常数和介质损耗因数，更好的阻燃性及弯曲强度，更低的吸水率，适用于5G通讯领域，并且铜块不易脱落，使用寿命更长。
Description
技术领域
本发明涉及线路板领域技术，尤其是指一种带有嵌入铜块的双面线路板的制作方法。
背景技术
随着电子工业的发展，电子产品体积越来越小，功率密度越来越大，散热问题显得尤为重要。为解决电路板散热问题，一般采用在电路板上埋入铜块，通过数控铣床方式在铜块上制作控深盲槽，将发热元器件直接贴装到铜块盲槽内的方式，热量通过铜块传导出去，满足散热的需求。
目前带嵌入铜块的线路板其上的铜块容易脱落，使用寿命短，并且目前的线路板普遍难以满足高频高速领域线路板对耐热性、力学性能、加工性、电性能方面的高要求，无法适用于5G通讯领域。因此，有必要研究一种方案以解决上述问题。
发明内容
有鉴于此，本发明针对现有技术存在之缺失，其主要目的是提供一种带有嵌入铜块的双面线路板的制作方法，其能有效解决现有之线路板上的铜块容易脱落并且难以满足高频高速领域线路板对耐热性、力学性能、加工性、电性能方面的高要求的问题。
为实现上述目的，本发明采用如下之技术方案：
一种带有嵌入铜块的双面线路板的制作方法，包括有以下步骤：
(1)将组分A、组分B、组分C、组分D、组分E、组分F、组分G、组分H、组分I、组分J和组分K依次加入装有机溶剂的容器中搅拌溶解、分散，以配制成树脂组合物胶水；各组分的质量份如下：组分A：55-60份，组分B：32-40份，组分C：35-45份，组分D：15-18份，组分E：35-40份，组分F：20-35份，组分G：80-100份，组分H：3-5份；组分I：20-30份,组分J：20-15份，组分K：150-200份，其中，
所述组分A的结构式为：
式一中R为含有2个碳原子的烷基结构，R1为含有6-8个碳原子的苯基机构，n为2或3；
所述组份B的结构式为：
所述组份C的结构式为：
式二中n为5-8的整数；
所述组份D的结构式为：
式三中m为2-3的整数；
所述组份E的结构式为：
式二中n为2-5的整数；
所述组份F为改性聚苯醚树脂，改性聚苯醚树脂的末端活性基团为烯丙基、乙烯基或苯乙烯基，重均分子量为2000-4000；所述组份G为固化剂；所述组分H为促进剂；所述组分I为有机阻燃剂；所述组分J为交联剂；所述组分K为填料；
(2)将玻纤布浸渍上述树脂组合物胶水中，然后在烘箱中烘干，制成半固化状态的粘结片；
(3)将粘结片按设定的张数叠料，并在双面覆以铜箔，形成半成品，然后，在半成品上开设嵌置槽，嵌置槽贯穿半成品的上下表面；
(4)取铜块，并在铜块的外周侧面开设环形卡槽，然后将铜块嵌入嵌置槽中；
(5)然后对嵌入铜块的半成品进行加热加压固化，在加热加压的过程中，物料自动填充之环形卡槽中，使得嵌入的铜块稳固结合固定，从而得到带有嵌入铜块的双面线路板。
优选的，所述有机溶剂为丙酮、丁酮、环己酮、二甲基甲酰胺、丙二醇甲醚、丙二醇甲醚醋酸酯中的一种或几种混合物。
优选的，所述组份G为酚类固化剂、胺类固化剂、酸类或酸酐固化剂、氰酸酯类中的一种或多种。
优选的，所述组分H为2-甲基咪唑、2-乙基-4-甲基咪唑、2-甲基-4-苯基咪唑中的一种或两种以上的混合物。
优选的，所述组分I为十溴二苯乙烷、十溴二苯醚、溴化聚苯乙烯、乙撑双四溴邻苯二甲酰亚胺和氰尿酸三聚氰胺中的至少一种。
优选的，所述组分J为苯乙烯、二乙烯苯、甲基丙烯酸甲酯和丁二烯中的至少一种。
本发明与现有技术相比具有明显的优点和有益效果，具体而言，由上述技术方案可知：
应用本发明的配方所获得树脂组合物，并配合采用本发明方法制得的线路板具有优异的耐热性、更低的介电常数和介质损耗因数，更好的阻燃性及弯曲强度，更低的吸水率，适用于5G通讯领域，并且铜块不易脱落，使用寿命更长。
为更清楚地阐述本发明的结构特征和功效，下面结合附图与具体实施例来对本发明进行详细说明：
附图说明
图1是本发明之较佳实施例的结构示意图。
附图标识说明：
11、粘结片 12、铜箔
101、嵌置槽 20、铜块
21、环形卡槽
具体实施方式
本发明揭示了一种带有嵌入铜块的双面线路板的制作方法，包括有以下步骤：
(1)将组分A、组分B、组分C、组分D、组分E、组分F、组分G、组分H、组分I、组分J和组分K依次加入装有机溶剂的容器中搅拌溶解、分散，以配制成树脂组合物胶水；各组分的质量份如下：组分A：55-60份，组分B：32-40份，组分C：35-45份，组分D：15-18份，组分E：35-40份，组分F：20-35份，组分G：80-100份，组分H：3-5份；组分I：20-30份,组分J：20-15份，组分K：150-200份，其中，
所述组分A的结构式为：
式一中R为含有2个碳原子的烷基结构，R1为含有6-8个碳原子的苯基机构，n为2或3；
所述组份B的结构式为：
所述组份C的结构式为：
式二中n为5-8的整数；
所述组份D的结构式为：
式三中m为2-3的整数；
所述组份E的结构式为：
式二中n为2-5的整数；
所述组份F为改性聚苯醚树脂，改性聚苯醚树脂的末端活性基团为烯丙基、乙烯基或苯乙烯基，重均分子量为2000-4000；所述组份G为固化剂；所述组分H为促进剂；所述组分I为有机阻燃剂；所述组分J为交联剂；所述组分K为填料。所述有机溶剂为丙酮、丁酮、环己酮、二甲基甲酰胺、丙二醇甲醚、丙二醇甲醚醋酸酯中的一种或几种混合物。所述组份G为酚类固化剂、胺类固化剂、酸类或酸酐固化剂、氰酸酯类中的一种或多种，所述组分H为2-甲基咪唑、2-乙基-4-甲基咪唑、2-甲基-4-苯基咪唑中的一种或两种以上的混合物，所述组分I为十溴二苯乙烷、十溴二苯醚、溴化聚苯乙烯、乙撑双四溴邻苯二甲酰亚胺和氰尿酸三聚氰胺中的至少一种，所述组分J为苯乙烯、二乙烯苯、甲基丙烯酸甲酯和丁二烯中的至少一种。所述有机溶剂为丙酮、丁酮、环己酮、二甲基甲酰胺、丙二醇甲醚、丙二醇甲醚醋酸酯中的一种或几种混合物。
(2)将玻纤布浸渍上述树脂组合物胶水中，然后在烘箱中烘干，制成半固化状态的粘结片。
(3)将粘结片11按设定的张数叠料，并在双面覆以铜箔12，形成半成品，然后，在半成品上开设嵌置槽101，嵌置槽101贯穿半成品的上下表面。
(4)取铜块20，并在铜块20的外周侧面开设环形卡槽21，然后将铜块20嵌入嵌置槽101中，环形卡槽21为沿铜块20轴向间隔排布的多个。
(5)然后对嵌入铜块20的半成品进行加热加压固化，在加热加压的过程中，物料自动填充之环形卡槽21中，使得嵌入的铜块20稳固结合固定，从而得到带有嵌入铜块20的双面线路板。
下面以多个实施例对本发明做进一步详细说明，如下表1所示：
表1：各实施例的配方
采用实施例1-6配方制备的树脂组合物制作线路板，线路板的性能测试数据见下表2：
表2：各实施例测试性能
测试方法：
1、玻璃化温度Tg，采用动态机械分析法(DMA)。
2、热分解温度(Td)，按照IPC-TM-650中2.4.26所规定的方法进行测定。
3、介电常数，按照IPC-TM-650中2.5.5.9使用平板法，测定1GHz下的介电常数。
4、介质损耗因数角正切，按照IPC-TM-650中2.5.5.9使用平板法，测定1GHz下的介质损耗因数角正切。
5、阻燃性，参照UL94测定标准。
6、剥离强度，按照IPC-TM-650中2.4.8所规定的方法中“热应力”的实验条件，测试金属盖层的剥离强度。
7、热分层时间T-288，按照IPC-TM-650中2.4.24.1所规定的方法进行测定。
8、吸水率，按照IPC-TM-650中2.6.2.1所规定的方法进行测定。
从上表2可见，应用本发明的实施例所获得树脂组合物制得的线路板具有优异的耐热性、更低的介电常数和介质损耗因数，更好的阻燃性及弯曲强度，更低的吸水率。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。
Claims (6)
1.一种带有嵌入铜块的双面线路板的制作方法，其特征在于：包括有以下步骤：
(1)将组分A、组分B、组分C、组分D、组分E、组分F、组分G、组分H、组分I、组分J和组分K依次加入装有机溶剂的容器中搅拌溶解、分散，以配制成树脂组合物胶水；各组分的质量份如下：组分A：55-60份，组分B：32-40份，组分C：35-45份，组分D：15-18份，组分E：35-40份，组分F：20-35份，组分G：80-100份，组分H：3-5份；组分I：20-30份,组分J：20-15份，组分K：150-200份，其中，
所述组分A的结构式为：
式一中R为含有2个碳原子的烷基结构，R1为含有6-8个碳原子的苯基机构，n为2或3；
所述组份B的结构式为：
所述组份C的结构式为：
式二中n为5-8的整数；
所述组份D的结构式为：
式三中m为2-3的整数；
所述组份E的结构式为：
式二中n为2-5的整数；
所述组份F为改性聚苯醚树脂，改性聚苯醚树脂的末端活性基团为烯丙基、乙烯基或苯乙烯基，重均分子量为2000-4000；所述组份G为固化剂；所述组分H为促进剂；所述组分I为有机阻燃剂；所述组分J为交联剂；所述组分K为填料；
(2)将玻纤布浸渍上述树脂组合物胶水中，然后在烘箱中烘干，制成半固化状态的粘结片；
(3)将粘结片按设定的张数叠料，并在双面覆以铜箔，形成半成品，然后，在半成品上开设嵌置槽，嵌置槽贯穿半成品的上下表面；
(4)取铜块，并在铜块的外周侧面开设环形卡槽，然后将铜块嵌入嵌置槽中；
(5)然后对嵌入铜块的半成品进行加热加压固化，在加热加压的过程中，物料自动填充之环形卡槽中，使得嵌入的铜块稳固结合固定，从而得到带有嵌入铜块的双面线路板。
2.如权利要求1所述的一种带有嵌入铜块的双面线路板的制作方法，其特征在于：所述有机溶剂为丙酮、丁酮、环己酮、二甲基甲酰胺、丙二醇甲醚、丙二醇甲醚醋酸酯中的一种或几种混合物。
3.如权利要求1所述的一种带有嵌入铜块的双面线路板的制作方法，其特征在于：所述组份G为酚类固化剂、胺类固化剂、酸类或酸酐固化剂、氰酸酯类中的一种或多种。
4.如权利要求1所述的一种带有嵌入铜块的双面线路板的制作方法，其特征在于：所述组分H为2-甲基咪唑、2-乙基-4-甲基咪唑、2-甲基-4-苯基咪唑中的一种或两种以上的混合物。
5.如权利要求1所述的一种带有嵌入铜块的双面线路板的制作方法，其特征在于：所述组分I为十溴二苯乙烷、十溴二苯醚、溴化聚苯乙烯、乙撑双四溴邻苯二甲酰亚胺和氰尿酸三聚氰胺中的至少一种。
6.如权利要求1所述的一种带有嵌入铜块的双面线路板的制作方法，其特征在于：所述组分J为苯乙烯、二乙烯苯、甲基丙烯酸甲酯和丁二烯中的至少一种。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011073239.3A CN112194881A (zh) | 2020-10-09 | 2020-10-09 | 一种带有嵌入铜块的双面线路板的制作方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011073239.3A CN112194881A (zh) | 2020-10-09 | 2020-10-09 | 一种带有嵌入铜块的双面线路板的制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112194881A true CN112194881A (zh) | 2021-01-08 |
Family
ID=74013768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011073239.3A Pending CN112194881A (zh) | 2020-10-09 | 2020-10-09 | 一种带有嵌入铜块的双面线路板的制作方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112194881A (zh) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (zh) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用 |
| CN103724997A (zh) * | 2013-12-31 | 2014-04-16 | 福建新世纪电子材料有限公司 | 一种无卤低吸水热固性阻燃树脂组合物及应用 |
| CN106132089A (zh) * | 2016-06-30 | 2016-11-16 | 景旺电子科技(龙川)有限公司 | 一种印制线路板埋铜块方法 |
| CN106589748A (zh) * | 2016-11-30 | 2017-04-26 | 华南协同创新研究院 | 一种用于高频高速领域的覆铜箔基板的树脂组合物及其应用 |
| CN107592725A (zh) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | 一种在高多层印刷线路板上埋铜块的方法 |
| CN109561572A (zh) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | 一种多凸台型半嵌入铜块印制板及其制作方法 |
| CN110996520A (zh) * | 2019-12-19 | 2020-04-10 | 珠海杰赛科技有限公司 | 一种双面电路板嵌入铜块的制作方法 |
| CN111447749A (zh) * | 2020-05-22 | 2020-07-24 | 广东依顿电子科技股份有限公司 | 一种埋铜块的pcb线路板及其生产方法 |
-
2020
- 2020-10-09 CN CN202011073239.3A patent/CN112194881A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914265A (zh) * | 2010-07-24 | 2010-12-15 | 广州美嘉伟华电子材料有限公司 | 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用 |
| CN103724997A (zh) * | 2013-12-31 | 2014-04-16 | 福建新世纪电子材料有限公司 | 一种无卤低吸水热固性阻燃树脂组合物及应用 |
| CN106132089A (zh) * | 2016-06-30 | 2016-11-16 | 景旺电子科技(龙川)有限公司 | 一种印制线路板埋铜块方法 |
| CN106589748A (zh) * | 2016-11-30 | 2017-04-26 | 华南协同创新研究院 | 一种用于高频高速领域的覆铜箔基板的树脂组合物及其应用 |
| CN107592725A (zh) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | 一种在高多层印刷线路板上埋铜块的方法 |
| CN109561572A (zh) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | 一种多凸台型半嵌入铜块印制板及其制作方法 |
| CN110996520A (zh) * | 2019-12-19 | 2020-04-10 | 珠海杰赛科技有限公司 | 一种双面电路板嵌入铜块的制作方法 |
| CN111447749A (zh) * | 2020-05-22 | 2020-07-24 | 广东依顿电子科技股份有限公司 | 一种埋铜块的pcb线路板及其生产方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2011379445B2 (en) | Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same | |
| CN106832226B (zh) | 一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板 | |
| CN108219371B (zh) | 环氧树脂组合物、预浸料、层压板和印刷电路板 | |
| JP2016532759A (ja) | 熱硬化性樹脂組成物及びその用途 | |
| AU2013201482A1 (en) | Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom | |
| CN108485182B (zh) | 一种高频树脂组合物及使用其制作的半固化片和层压板 | |
| CN109749396B (zh) | 一种聚苯醚树脂组合物及其应用 | |
| WO2018120564A1 (zh) | 一种含磷活性酯及其无卤组合物与覆铜箔基板 | |
| EP2706091A1 (en) | Epoxy resin composition, and prepreg and copper clad laminate made therefrom | |
| CN111793327A (zh) | 一种高速高频覆铜板用环氧树脂组合物及其制备方法 | |
| CN105585808A (zh) | 一种低介质损耗高导热树脂组合物及其制备方法及用其制作的半固化片、层压板 | |
| CN106589748A (zh) | 一种用于高频高速领域的覆铜箔基板的树脂组合物及其应用 | |
| EP2770024A1 (en) | Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same | |
| CN103146138A (zh) | 环氧树脂组成物及由其制成的预浸材和印刷电路积层板 | |
| TWI548667B (zh) | A halogen-free thermosetting resin composition, and a prepreg for use and a laminate for printed circuit | |
| EP2770005B1 (en) | Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same | |
| US20140039094A1 (en) | Epoxy resin composition, and prepreg and printed circuit board using the same | |
| TWI596155B (zh) | Halogen-free thermosetting resin composition and prepreg and printed circuit laminate using the same | |
| CN112194881A (zh) | 一种带有嵌入铜块的双面线路板的制作方法 | |
| CN108117723A (zh) | 一种热固性树脂组合物及使用它的预浸料和印制电路用层压板 | |
| CN115028963B (zh) | 一种树脂组合物及高Tg、低Dk/Df高频覆铜板的制作方法 | |
| CN112135427B (zh) | 一种用于动力电池的线路板 | |
| KR20210030900A (ko) | 절연성 유전체막과 그의 제조방법 및 다층 인쇄 회로 기판 | |
| CN112341787B (zh) | 生物基树脂组合物、覆金属箔层压板及印刷线路板 | |
| CN109370497A (zh) | 一种生产高速覆铜板的胶水的制备方法及其产品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210108 |